EP3047257A1 - Dispositif à capteur pour surveiller l'état d'un lubrifiant et procédé de fabrication du dispositif à capteur - Google Patents
Dispositif à capteur pour surveiller l'état d'un lubrifiant et procédé de fabrication du dispositif à capteurInfo
- Publication number
- EP3047257A1 EP3047257A1 EP14744090.3A EP14744090A EP3047257A1 EP 3047257 A1 EP3047257 A1 EP 3047257A1 EP 14744090 A EP14744090 A EP 14744090A EP 3047257 A1 EP3047257 A1 EP 3047257A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- sensor device
- measuring
- lubricant
- die
- dome
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
- G01N21/4738—Diffuse reflection, e.g. also for testing fluids, fibrous materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
- G01N21/4738—Diffuse reflection, e.g. also for testing fluids, fibrous materials
- G01N21/474—Details of optical heads therefor, e.g. using optical fibres
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/55—Specular reflectivity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/85—Investigating moving fluids or granular solids
- G01N21/8507—Probe photometers, i.e. with optical measuring part dipped into fluid sample
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/26—Oils; Viscous liquids; Paints; Inks
- G01N33/28—Oils, i.e. hydrocarbon liquids
- G01N33/2888—Lubricating oil characteristics, e.g. deterioration
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16N—LUBRICATING
- F16N2250/00—Measuring
- F16N2250/34—Transparency; Light; Photo sensor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
- G01N21/4738—Diffuse reflection, e.g. also for testing fluids, fibrous materials
- G01N2021/4764—Special kinds of physical applications
- G01N2021/4769—Fluid samples, e.g. slurries, granulates; Compressible powdery of fibrous samples
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
- G01N21/314—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry with comparison of measurements at specific and non-specific wavelengths
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
- G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
- G01N21/3577—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing liquids, e.g. polluted water
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/55—Specular reflectivity
- G01N21/552—Attenuated total reflection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/062—LED's
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/063—Illuminating optical parts
- G01N2201/0638—Refractive parts
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/068—Optics, miscellaneous
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
Definitions
- the invention relates to a sensor device for monitoring a lubricant state in a lubricant chamber with the features of the preamble of claim 1. Furthermore, the invention relates to a method for manufacturing the sensor device.
- Rolling bearings comprise a plurality of rolling elements, which roll on tracks in operation.
- it is common to supply rolling bearings with a lubricant.
- the lubricant can deteriorate in operation due to continuous load, aging or thermal influences in the quality or lost by splitting etc.
- a consequence of the deteriorated lubricant or the reduced amount of lubricant is that the friction increases in the rolling bearing and thereby, inter alia, the life of the bearing is lowered.
- the document WO 2009/030202 A1 introduces a measuring device and a method for analyzing the lubricant of a roller bearing.
- the measuring device comprises a plurality of transmitting diodes, which transmit a light in the near infrared region to a measuring point behind a measuring window which is in contact with the lubricant. Furthermore, the measuring device comprises a receiving device which receives the reflected light of the transmitter diodes. Since certain wavelength ranges are meaningful for quality conditions of the lubricant, a statement about the quality and / or quantity of the lubricant in the rolling bearing can be made by evaluating a spectrum of the light reflected by the measuring point.
- the document DE 10 2010 015 084 A1 which forms probably the closest prior art, relates to a sensor part for an infrared sensor and a method for its production.
- the sensor part is used e.g. for use in the measuring device of the aforementioned document.
- the sensor part comprises a contoured board, wherein the transmitter diodes are arranged on a round board section.
- the transmitter diodes are designed as so-called DIEs.
- the sensor part is accommodated in a casing which is filled with a silicone-based gel which is permeable to IR radiation and thus to the measuring radiation so that the mutual position of the transmitter diodes and the receiving device no longer changes, being displaced to the second oxygen and water vapor and, thirdly, the optical transition between the transmitter diodes designed as DIEs to the environment is improved.
- the invention has for its object to provide a sensor device which can be operated functionally reliable in an advantageous production.
- the invention is also based on the object to disclose a method for manufacturing the sensor device.
- water content, turbidity, thermal and / or mechanical wear and / or temperature of the lubricant can be monitored by the sensor device.
- the spectrum in the NIR (near infrared region) and / or the MIR (middle infrared region) is used as the measurement radiation for monitoring.
- a possible measuring method is described in the aforementioned document WO 2009/030202 A1, the disclosure of which with regard to the measuring method is incorporated by reference in the present specification.
- the sensor device comprises a transmitter platform, wherein a plurality of diode devices is arranged as transmitter devices for a measuring radiation on the transmitter platform.
- the transmitter platform is designed in particular as a section of a printed circuit board.
- the diode devices are designed to emit measuring radiation in the NIR and / or MIR range. Particularly preferably, at least two different diode devices are provided as transmitting devices, the different diode devices differing by the spectrum of the emitted measuring radiation.
- the transmitter platform is arranged in a measuring space of the sensor device.
- the sensor device further comprises a measuring window device, which forms a transition from the measuring space into the lubricant space.
- the measuring window device can be designed, for example, as a glass pane, in particular as a sapphire glass pane. In operation, it is particularly preferred that the measuring window device directly and / or has physical contact with the lubricant in the lubricant space.
- the sensor device has at least one receiver device, e.g. a receiving diode, which is also arranged in the measuring space and designed to receive measuring radiation that has been reflected by the measuring window device.
- the measuring radiation is emitted by the transmitting devices in the direction of the measuring window device.
- the measuring radiation is scattered and / or reflected, the spectrum and / or the intensity of the measuring radiation being changed by the influence of the lubricant adjacent to the measuring window device as a function of the state of the lubricant.
- By monitoring the change in the spectrum and / or the intensity of the measuring radiation can be deduced on the state of the lubricant.
- it is possible to deduce the state of the lubricant by means of a ratio of the reflected measuring radiation of the transmitting devices with the first spectrum and the reflected measuring radiation of the transmitting devices with the second spectrum.
- At least one of the diode devices preferably some and in particular all diode devices, which are designed as transmitting devices, comprise - if appropriate in each case - a so-called DIE.
- the DIE is the name of a single, unhoused semiconductor chip in semiconductor technology. It can also be called a "nude chip”. It is usually diced by sawing or breaking the finished wafer into rectangular pieces, each containing a complete, functional component. Dice means "cube” in the English language, but since the wafers are very thin, the DIEs do not look cube-shaped, but their shape is preferably flat parallelepipeds.
- the diode devices are designed as a "bare chip” or "bare die”. in the Specifically, the at least one diode device is realized housing-free.
- the sensor device has at least one dome, wherein the dome is placed on the at least one diode device and wherein the dome and the DIE are connected via a contact surface.
- the contact surface is arranged on an upper side of the DIE, wherein a light-emitting diode region of the diode device is arranged on the same upper side.
- the dome is connected exclusively to the DIE via the contact surface on the surface of the DIE.
- the advantage of the invention is to be seen in the fact that a very high packing density or a very large spacing of the diode devices can be achieved with each other by the dome very narrow in width extension. This gap between the diode devices is necessary because it is needed by tools for DrahtbondWallettechnik and thus for Drahtbondtechnikmaschinemaschinemaschinee Furthermore, the connection of the dome has the advantage that heat removal from the diode device in the lateral direction to the diode device is not hindered by the dome.
- the dome performs the function of matching the refractive indices of the diode device to the environment. Thus, can be dispensed with the fluid filling of the sensor device for this function.
- the sensor device is provided in the measuring chamber with an air atmosphere.
- the sensor device is - compared to the prior art - age-resistant and thus more reliable.
- thermal problems in the heating of the fluid are excluded, so that the functionality of the sensor device is improved.
- the dome is formed as a lying drop and / or in a hemispherical shape with a flattened bottom surface, wherein the bottom surface of the dome the Contact surface to the DIE forms.
- the dome can be applied in original form, in particular liquid, wherein the shape of the dome is formed by the surface tension itself, so that no further shaping measures for the dome are necessary.
- the dome in this embodiment forms a converging lens, so that the measuring radiation is focused and / or focused in the direction of the measuring window device.
- the DIE has a substrate with side surfaces or is formed as this, wherein between the side surfaces and the top outer edges are formed and wherein the contact surface bounded on the top of the DI Es and thus of the substrate and delimited by the side surfaces is.
- the outer edges between the top and the side surfaces in the manufacture of the dome by applying in liquid form as encapsulation flow barriers for potting Due to the limitation of the dome by the outer edges of the top, the contact surface is reduced or limited as a flat base of the dome and formed by the surface tension of the potting compound a dome with a small radius of curvature and thus with high optical refractive index.
- the optical attenuation of the measuring radiation when passing through the dome is kept low.
- the transmitter platform is formed as a printed circuit board (board), wherein the DIE is fixed on the circuit board, for example via gluing and is electrically connected via wire bonding with wires to the circuit board.
- the terminal areas of at least one wire for wire bonding are arranged on the contact surface, so that the dome in addition to the optical effect converts a fixation of the wire, so that the reliability is increased.
- This structural design also reflects a preferred embodiment of the method for manufacturing the Sensor device, wherein first the DIE is mounted on the circuit board, then connected via wire bonding to the circuit board and after the wire bonding of the dome is placed.
- the sensor device has a housing section that is in particular cylindrical, wherein the measuring space with the transmitter devices and the at least one receiver device is arranged in the measuring space.
- the measuring space is formed as an interior of the housing portion.
- the measuring window device closes off the housing section at a free end.
- the sensor device has a plug-in housing, in particular a pin-like plug-in housing, wherein the plug-in housing comprises the housing section.
- the housing portion forms part of the plug-in housing.
- the transmitter platform with the transmitter devices and / or the at least one receiver device can be accommodated in a capsule or in a stand structure in the housing section in order to be able to fix the mechanical positioning of the transmitter and receiver devices relative to one another.
- the plug-in housing preferably has a maximum diameter of less than 10 mm and in particular less than 6 mm. Consequently, the transmitter platform is formed in the maximum diameter smaller than 10 mm, in particular smaller than 6 mm.
- the transmitting devices must be made very small, so that they can be integrated into the sensor device. It is preferred that at least two, preferably at least or exactly four or six diode devices are arranged on the transmitter platform.
- the diode devices are in two Divide groups of diode devices, which differ with respect to the spectrum of the emitted measurement radiation. In operation, it is possible for the two groups of diode devices to be operated alternately, so that the at least one receiver device receives the modified spectrum of the first measurement radiation and subsequently the modified spectrum of the second measurement radiation as reflected measurement radiation from the measurement window device.
- each of the groups has three diode devices, so that the measurement window device can be illuminated uniformly or homogeneously.
- the or a further receiver device is arranged on the transmitter platform.
- the further receiver device can be designed as a reference receiver device in order to be able to calculate out effects which are based on aging or contamination of the diode device in the measurement evaluation.
- the integration of the or the other receiver device on the transmitter platform, the space on the transmitter platform is further reduced, so that the need for miniature diode devices amplified.
- the transmitter platform forms a portion of a flexible printed circuit board (flex board), wherein the flexible circuit board also has a receiver platform, which is arranged parallel to the transmitter platform in the mounted state in the direction of the optical axis of the sensor device.
- the connection between the transmitter platform and receiver platform is given by further sections of the flexible printed circuit board.
- Another object of the invention relates to a method for manufacturing the sensor device as described above or according to one of the preceding claims, wherein in a first step, the DIE or DIEs of the at least one diode device is placed on the transmitter platform and connected to the transmitter platform and wherein in a subsequent step the dome is placed on the Which is put on.
- the dome is applied to the die as potting compound.
- the potting compound and thus the material of the dome are, for example, a plastic, in particular a UV-curing plastic. Alternatively, a resin may be used.
- the diode device is electrically contacted by means of wire bonding with the transmitter platform designed as a printed circuit board.
- the wire bonding is in particular a thermocompression bonding (TC bonding), a thermosonic ball wedge bonding (TS bonding) or ultrasonic wedge-wedge bonding (US bonding).
- At least one wire is bonded on the one hand to a diode contact point of the diode device and on the other hand to a transmitter contact point of the transmitter platform, in particular of the printed circuit board.
- the diode contact point is particularly preferably covered by the dome or potted by the potting compound.
- the wire has a diameter smaller than 50 ⁇ for bonding.
- Figure 1 is a schematic three-dimensional representation of a Sensor device as an embodiment of the invention
- Figure 2 is a schematic representation of the measuring principle of the sensor device in Figure 1;
- Figure 3 is a schematic three-dimensional representation of a sensor part of the sensor device in the preceding figures
- FIG. 4 shows a schematic lateral plan view of a diode device of the sensor device of the preceding figures.
- FIG. 1 shows a schematic three-dimensional representation of a sensor device 1 for monitoring a lubricant state in a lubricant space as an embodiment of the invention.
- the sensor device 1 comprises a plug-in housing 2, which is provided at one end for the transmission of signals and for power supply with a cable 3.
- the plug-in housing 2 has, for example, an outer diameter of 5 mm and a length of 40 mm, so that the sensor device is realized as a miniature sensor.
- the male housing 2 is inserted with its free end in a lubricant space, so that the free end has physical contact with the lubricant in the lubricant space.
- the plug-in housing 2 may be used to monitor grease in a rolling bearing, e.g. a large roller bearing, are used, wherein the plug-in housing 2 is positioned by an opening in the rolling bearing with its free end in or on the Wälzoresraum with the grease.
- the design as a miniature sensor has the advantage that the sensor device 1 can be arranged at almost any desired positions of a lubricant-containing device without great design effort.
- the free end of the sensor device 1 forms a housing section 4, which is closed off at the end with a measuring window device 5.
- a measuring capsule is constructed from individual rings 6 a, b, c, which form spacer and stabilizing rings, arranged adjacent to the measuring window device 5.
- an evaluation device 7 takes over the local power supply and the processing or pre-processing of signals in the sensor device 1.
- FIG. 2 shows a schematic representation of the sensor device 1 in the region of the housing section 4 in order to describe the measuring method.
- a printed circuit board 8 is arranged, which comprises a transmitter platform 9 and a receiver platform 10.
- the transmitter platform 9 and the receiver platform 10 are aligned perpendicular to the longitudinal extension of the plug-in housing 2.
- the receiver platform 10 is not formed over the entire surface, so that the measuring window device 5 is only partially covered by the receiver platform 10.
- the housing section 4 is closed by measuring window device 5, which is formed of sapphire glass. In operation, the measuring window device 5 contacts a lubricant 1 1 in a lubricant space 12.
- the printed circuit board 8 with the transmitter platform 9 and the receiver platform 10, on the other hand, is arranged in a measuring space 13, the lubricant space 12 and measuring space 13 being separated from one another by the measuring window device 5.
- a plurality of diode devices 14 is arranged, which can emit a measuring radiation 15.
- the diode devices 14 are oriented so that they send the measuring radiation 15 in the direction of the measuring window device 5 and thus in the direction of the lubricant 1 1.
- a Receiver device 16 is arranged as a measuring detector, which is oriented so that this can be recorded by the measuring window device 5 reflected measurement radiation 15.
- the reflection of the measuring radiation 15 results, on the one hand, due to a reflection of the measuring radiation 15 through the lubricant 11 or through the measuring window device 5.
- the reflected measuring radiation 15 is diffuse scattered measuring radiation 15.
- Measuring radiation 15 is scattered or reflected directly on the underside of the receiver platform 10 and reflected in another receiver device 17 which is arranged on the transmitter platform 9 between the diode devices 14 and operates as a reference detector.
- the inner diameter d in the housing section 4 shown is 4.0 mm.
- the diode devices 14 emit the measuring radiation 15 in different wavelength ranges and are activated, for example, alternately to one another. By comparing the intensity of the reflected from the lubricant 1 1 measuring radiation 15 can be concluded that the absorption of certain spectral regions in the measuring radiation 15 and thus to the state of the lubricant 1 1.
- FIG. 3 shows the printed circuit board 8 as a sensor part in a schematic three-dimensional representation. It can be seen that the printed circuit board 8 is formed in one piece.
- the transmitter platform 9 is formed almost circular, the receiver platform 10, however, is realized in three axes, with the axes each span V-shaped.
- Transmitter platform 9 and receiver platform 10 each have through openings 20, which are aligned congruently and which each carry bolts 18, so that their relative position is fixed to each other. on the bolt 18 also the individual ring 6 a, b, c are lined up.
- the transmitter platform 9 On the transmitter platform 9 are a total of six diode devices 14th arranged, but which are positioned so that they are not hidden by the receiver platform 10 in the direction of the measuring window device 5.
- the electronic components namely the diode devices 14 and the further receiver device 17, are positioned very close to one another.
- FIG. 4 shows a detailed detail in a side view of the transmitter platform 9 with a diode device 14.
- the diode device 14 comprises a so-called DIE 22, that is to say, for example. cuboid piece of a wafer.
- the DIE 22 includes a substrate 23 in which the light-emitting diode region 24 is disposed.
- the diode region 24 is formed, for example, as a p-region.
- the transition from the DIE 22 to the ambient air in the measurement space 13 is critical because of the high refractive index difference between the DIE 22 and the ambient air. For this reason, a dome 25 is placed on the DIE 22, with the dome 25 with its full contact surface 26 on a light emitting top of the DI Es 22.
- the dome 25 is made by applying liquid plastic, which is eg UV-curable, on the DIE 22. Upon application, a hemispherical shape of the mandrel 25 results automatically, so that the mandrel 25 is at the same time designed as a collecting or focusing lens for the measuring radiation 15 which is emitted by the DIE 22 or by the diode region 24.
- the printed circuit board 8 is first equipped, for example, in a planar state in a first step with the DIEs 22 and bonded via wires 27 to the printed circuit board 8.
- the wires 27 have a diameter smaller than 50 ⁇ , so that the contact can be carried out very space-saving.
- potting compound is applied to the top of the DI Es 22 and cured so that the dome 25 is formed.
- the potting compound envelops in particular at least one diode contact point 21 of the diode region 24, so that it is mechanically secured.
- the circuit board 8 is brought from the two-dimensional or unwound form by forming in the three-dimensional shape shown in Figure 3 and further installed.
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Immunology (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Food Science & Technology (AREA)
- Medicinal Chemistry (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
Abstract
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE201310110320 DE102013110320B3 (de) | 2013-09-19 | 2013-09-19 | Sensorvorrichtung zur Überwachung eines Schmierstoffzustands sowie Verfahren zur Fertigung der Sensorvorrichtung |
| PCT/EP2014/066005 WO2015039792A1 (fr) | 2013-09-19 | 2014-07-25 | Dispositif à capteur pour surveiller l'état d'un lubrifiant et procédé de fabrication du dispositif à capteur |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP3047257A1 true EP3047257A1 (fr) | 2016-07-27 |
Family
ID=51225550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP14744090.3A Withdrawn EP3047257A1 (fr) | 2013-09-19 | 2014-07-25 | Dispositif à capteur pour surveiller l'état d'un lubrifiant et procédé de fabrication du dispositif à capteur |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9989460B2 (fr) |
| EP (1) | EP3047257A1 (fr) |
| CN (1) | CN105556286A (fr) |
| DE (1) | DE102013110320B3 (fr) |
| WO (1) | WO2015039792A1 (fr) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102013220457A1 (de) * | 2013-10-10 | 2015-04-16 | Schaeffler Technologies Gmbh & Co. Kg | Sensoreinheit zum Bestimmen von Eigenschaften eines Schmiermittels sowie Maschinenelement und Maschinenanordnung |
| CN104792529A (zh) * | 2015-04-12 | 2015-07-22 | 北京化工大学 | 基于状态空间模型的滚动轴承寿命预测方法 |
| DE102022114935A1 (de) | 2022-06-14 | 2023-12-14 | Hamilton Bonaduz Ag | Schlanker ATR-Sensor mit Mess- und Referenzsignal |
| CN115615960B (zh) * | 2022-12-14 | 2023-03-21 | 中节能(达州)新材料有限公司 | 一种玻璃微珠涂层反光性能测试平台 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060073625A1 (en) * | 2004-10-04 | 2006-04-06 | Mitsunori Harada | Method for manufacturing semiconductor light emitting device |
| EP2312658A2 (fr) * | 2008-07-03 | 2011-04-20 | Samsung LED Co., Ltd. | Puce à diode électroluminescente (del) et dispositif à del pourvu de ladite puce |
| EP2523029A1 (fr) * | 2010-01-06 | 2012-11-14 | Fujikura, Ltd. | Structure de couplage optique et module de transmission et de réception optique |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2142179A1 (de) * | 1971-08-23 | 1973-03-01 | Mobil Oil Deutschland | Vorrichtung zum pruefen von schmieroel |
| US6949771B2 (en) * | 2001-04-25 | 2005-09-27 | Agilent Technologies, Inc. | Light source |
| US7172903B2 (en) * | 2002-03-12 | 2007-02-06 | Exxonmobil Research And Engineering Company | Method for on-line monitoring of lubricating oil using light in the visible and near IR spectra |
| DE102007042254A1 (de) | 2007-09-06 | 2009-04-02 | Carl Freudenberg Kg | Messvorrichtung und Verfahren zur Analyse des Schmiermittels eines Lagers |
| JP2009099925A (ja) * | 2007-09-27 | 2009-05-07 | Tokyo Electron Ltd | アニール装置 |
| JP5345363B2 (ja) * | 2008-06-24 | 2013-11-20 | シャープ株式会社 | 発光装置 |
| DE102010005057A1 (de) * | 2010-01-20 | 2011-07-21 | Schaeffler Technologies GmbH & Co. KG, 91074 | Vorrichtung zum Überwachen des Zustandes eines Schmiermittels in einem Lager |
| DE102010015084B4 (de) * | 2010-04-15 | 2020-12-10 | Schaeffler Technologies AG & Co. KG | Sensorteil für einen Infrarot-Sensor sowie Verfahren zu dessen Herstellung |
| DE102010031919B4 (de) * | 2010-07-22 | 2020-12-03 | Schaeffler Technologies AG & Co. KG | Messsonde für einen Sensor zur Analyse eines Mediums mittels Infrarotspektroskopie und Verfahren zur Herstellung der Messsonde |
| US20120097985A1 (en) * | 2010-10-21 | 2012-04-26 | Wen-Huang Liu | Light Emitting Diode (LED) Package And Method Of Fabrication |
| JP5839436B2 (ja) * | 2010-12-02 | 2016-01-06 | ナブテスコ株式会社 | 光学センサ |
| JP2013197294A (ja) * | 2012-03-19 | 2013-09-30 | Toshiba Lighting & Technology Corp | 照明装置 |
-
2013
- 2013-09-19 DE DE201310110320 patent/DE102013110320B3/de not_active Expired - Fee Related
-
2014
- 2014-07-25 US US15/022,071 patent/US9989460B2/en not_active Expired - Fee Related
- 2014-07-25 CN CN201480051981.0A patent/CN105556286A/zh active Pending
- 2014-07-25 WO PCT/EP2014/066005 patent/WO2015039792A1/fr not_active Ceased
- 2014-07-25 EP EP14744090.3A patent/EP3047257A1/fr not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060073625A1 (en) * | 2004-10-04 | 2006-04-06 | Mitsunori Harada | Method for manufacturing semiconductor light emitting device |
| EP2312658A2 (fr) * | 2008-07-03 | 2011-04-20 | Samsung LED Co., Ltd. | Puce à diode électroluminescente (del) et dispositif à del pourvu de ladite puce |
| EP2523029A1 (fr) * | 2010-01-06 | 2012-11-14 | Fujikura, Ltd. | Structure de couplage optique et module de transmission et de réception optique |
Non-Patent Citations (1)
| Title |
|---|
| See also references of WO2015039792A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| US20160223459A1 (en) | 2016-08-04 |
| US9989460B2 (en) | 2018-06-05 |
| WO2015039792A1 (fr) | 2015-03-26 |
| DE102013110320B3 (de) | 2014-09-25 |
| CN105556286A (zh) | 2016-05-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE602004009894T2 (de) | Implantierbarer chemischer Sensor | |
| DE69221306T2 (de) | Methode zur photometrischen (in vitro) bestimmung des gehaltes eines analyts in einer probe | |
| EP3047257A1 (fr) | Dispositif à capteur pour surveiller l'état d'un lubrifiant et procédé de fabrication du dispositif à capteur | |
| EP2057446A2 (fr) | Filtre optique et procédé de fabrication de celui-ci, ainsi que dispositif d'étude de rayonnement électromagnétique | |
| DE102012107578B4 (de) | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements sowie Messvorrichtung mit einem lichtemittierenden, optoelektronischen Bauelement | |
| WO2012146640A1 (fr) | Dispositif pour mesurer des paramètres d'état | |
| DE102014002788A1 (de) | Multifunktionales optisches Mikro-Sensor-System | |
| EP1393046A2 (fr) | Detecteur de transmission | |
| WO2012031988A1 (fr) | Dispositif de contrôle interne d'une pièce présentant un perçage cylindrique creux | |
| EP3127405A1 (fr) | Procédé de fabrication d'une carte de circuit imprimé équipée d'au moins un composant optoélectronique | |
| DE102010031919B4 (de) | Messsonde für einen Sensor zur Analyse eines Mediums mittels Infrarotspektroskopie und Verfahren zur Herstellung der Messsonde | |
| AT518369B1 (de) | Verfahren und ICT-Einrichtung zum Überprüfen von zumindest zwei LEDs enthaltenden Modulen einer Beleuchtungseinrichtung | |
| DE102019208430A1 (de) | Nicht-invasiver optischer Detektor für innere Substanzen | |
| EP1695067B1 (fr) | Détecteur de turbidité | |
| EP3097346B1 (fr) | Moyen d'éclairage avec caractéristiques de radiation prédéterminée et procédé de fabrication d'un élément optique | |
| DE10206464A1 (de) | Verfahren zur Herstellung einer Sensor- oder Aktuatoranordnung sowie Sensor- oder Aktuatoranordnung | |
| DE3302089C2 (de) | Vorrichtung zur Messung der optischen Brechzahl von Flüssigkeiten | |
| WO2012038346A1 (fr) | Capteur destiné à la surveillance d'un milieu | |
| DE112018004522T5 (de) | Chemischer Sensor und Verfahren zum Bilden desselben | |
| DE102016105988A1 (de) | Konverter zur teilweisen Konversion einer Primärstrahlung und lichtemittierendes Bauelement | |
| EP2442080A1 (fr) | Dispositif et procédé destinés à l'inspection de récipients | |
| DE102016114542A1 (de) | Detektionsanordnung und Verfahren zur Herstellung von Detektionsanordnungen | |
| EP1478915B1 (fr) | Appareil pour essais de dureté d'un diamant Vickers transparent, éclairé par des guides d'ondes optiques | |
| EP3282244B1 (fr) | Dispositif de détermination de la concentration d'un analyte dans un milieu gazeux | |
| DE4341466C2 (de) | Vorrichtung zur Erkennung einer gasgeförderten dünnen Flüssigkeitsschicht in einer transparenten Rohrleitung |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| 17P | Request for examination filed |
Effective date: 20160419 |
|
| AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
| AX | Request for extension of the european patent |
Extension state: BA ME |
|
| RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: SCHAEFFLER TECHNOLOGIES AG & CO. KG |
|
| DAX | Request for extension of the european patent (deleted) | ||
| 17Q | First examination report despatched |
Effective date: 20200131 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
| 18D | Application deemed to be withdrawn |
Effective date: 20200611 |
|
| P01 | Opt-out of the competence of the unified patent court (upc) registered |
Effective date: 20230523 |