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EP2775791B1 - Appareil de cuisson - Google Patents

Appareil de cuisson Download PDF

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Publication number
EP2775791B1
EP2775791B1 EP14401015.4A EP14401015A EP2775791B1 EP 2775791 B1 EP2775791 B1 EP 2775791B1 EP 14401015 A EP14401015 A EP 14401015A EP 2775791 B1 EP2775791 B1 EP 2775791B1
Authority
EP
European Patent Office
Prior art keywords
sensor
cooking
filter
designed
radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP14401015.4A
Other languages
German (de)
English (en)
Other versions
EP2775791A1 (fr
Inventor
Holger Ernst
Hermann KARAGÖZOGLU
Martin Liess
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miele und Cie KG
Original Assignee
Miele und Cie KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of EP2775791A1 publication Critical patent/EP2775791A1/fr
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Publication of EP2775791B1 publication Critical patent/EP2775791B1/fr
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/06—Control, e.g. of temperature, of power
    • H05B6/062—Control, e.g. of temperature, of power for cooking plates or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C7/00—Stoves or ranges heated by electric energy
    • F24C7/08—Arrangement or mounting of control or safety devices
    • F24C7/082—Arrangement or mounting of control or safety devices on ranges, e.g. control panels, illumination
    • F24C7/083—Arrangement or mounting of control or safety devices on ranges, e.g. control panels, illumination on tops, hot plates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/0252—Domestic applications
    • H05B1/0258—For cooking
    • H05B1/0261—For cooking of food
    • H05B1/0266—Cooktops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2213/00—Aspects relating both to resistive heating and to induction heating, covered by H05B3/00 and H05B6/00
    • H05B2213/07—Heating plates with temperature control means

Definitions

  • the present invention relates to a cooking device comprising a hob with a cooking surface and a heater provided for heating at least one cooking area and a sensor device for detecting at least one physical state characterizing a state of the cooking area.
  • a prerequisite for an automatic operation of a cooking device is sometimes an accurate detection of various parameters that are characteristic of the cooking process, such. B. the temperature of the food.
  • the heating source is automatically controlled in an automatic function of a cooking device, for. B. to avoid overheating of the food.
  • the reproducibility and the accuracy of the recorded parameters is therefore important for the functionality of the automatic function and thus an important quality feature of a modern cooking appliance with automatic functions.
  • One way of determining temperature during cooking and cooking processes is, for example, a temperature sensor integrated in the food container.
  • a temperature sensor integrated in the food container.
  • the user must use special food containers and could not use his previous cookware.
  • a temperature sensor which is placed with the food in the cookware, since the sensor must be "fished out" of the food later and should not be eaten by mistake.
  • the cooking device comprises at least one hob with at least one cooking point and at least one heating device which is provided for heating at least one cooking area.
  • At least one sensor device is provided for detecting at least one physical variable characterizing a state of the cooking region.
  • the sensor device has at least one sensor unit for non-contact detection of heat radiation.
  • at least one filter device is provided, which is thermally conductively connected to at least part of the sensor device.
  • the filter device is designed and suitable for reflecting electromagnetic radiation as a function of the wavelength and transmitting it as a function of the wavelength.
  • at least one at least partially adhesive connecting means is provided.
  • the connecting means is designed and suitable for at least partially thermally conducting the filter device to at least part of the sensor device.
  • the cooking device according to the invention has many advantages.
  • a significant advantage is that at least one filter device is provided, which is thermally conductively connected to at least a part of the sensor device. This allows heat to be dissipated from the filter device to the sensor device. Due to the dissipation of the heat, for example, the intrinsic heat of the filter device is erroneously prevented from being detected by the sensor device.
  • a further advantage is that at least one at least partially adhesive connecting means is provided for the thermally conductive connection. With such a connecting means, the filter device z. B. be mounted firmly on the sensor device.
  • this compound is also suitable for the dissipation of heat at the same time. A special, often complex connection for the dissipation of heat can therefore be saved.
  • the filter device is in particular designed and suitable for transmitting at least one wavelength range, while radiation outside this range is substantially reflected.
  • the filter device may also be designed and suitable for reflecting and / or transmitting electromagnetic radiation as a function of the polarization and / or the angle of incidence.
  • the filter device is designed as an optical filter or comprises such.
  • the connecting means has a metallic component.
  • the bonding agent has a proportion of silver and / or silver-containing compounds. Also possible are other metals or metal compounds with a corresponding thermal conductivity.
  • the connecting means is at least partially formed as an adhesive or has such.
  • a heat-resistant or heat-resistant adhesive is provided. This allows a particularly reliable connection of the filter device with the sensor device.
  • the connecting means has a high thermal conductivity and in particular a thermal conductivity of at least 0.5 W ⁇ m-1 ⁇ K-1.
  • the connecting means particularly preferably has a thermal conductivity of at least 1 W ⁇ m-1 ⁇ K-1. Also possible are other suitable thermal conductivities.
  • the filter device is designed and suitable for substantially transmitting electromagnetic radiation of at least one wavelength range and substantially for reflecting electromagnetic radiation of at least one other wavelength range and in particular radiation outside the transmitted range.
  • the filter device may be at least partially formed as a bandpass filter and / or a long-pass filter or at least include such.
  • a short-pass filter or the like is also possible.
  • a band elimination filter which substantially reflects electromagnetic radiation of a wavelength range and substantially transmits electromagnetic radiation of at least one other wavelength range and in particular radiation outside the reflected range.
  • the filter device may be designed and adapted to substantially transmit electromagnetic radiation from at least two different wavelength ranges and to substantially reflect electromagnetic radiation of at least one other wavelength range.
  • the filter device can be provided as a dichroic filter and / or trichroic filter.
  • the filter device comprises at least two filter layers with a different refractive index.
  • the filter device is at least partially formed as an interference filter or comprises at least one such filter.
  • a plurality of filter layers with dielectric properties and with alternately higher and lower refractive indices are provided.
  • the filter layers are very thin and preferably 1 nm to 100 nm. It can also be provided at least one carrier layer and / or at least one intermediate layer.
  • the filter device is at least partially thermally conductively arranged on at least one sensor unit.
  • the filter device is in particular thermally bonded to at least one area of the sensor unit.
  • At least one filter device can be provided for each sensor unit. But is also possible a common filter device for multiple sensor units.
  • the hob has at least one carrier device, which is suitable and designed for positioning at least one Gargut methodologiesers.
  • the sensor device can be arranged at least partially below the carrier device and adjacent to at least one part of the heating device.
  • a part of the heating device may for example be at least one induction coil of an induction device. In such an arrangement, the sensor device is protected and stored to save space and also is not disturbing in the way when the cooking device is used.
  • the filter device is in particular designed and suitable for transmitting electromagnetic radiation of a wavelength range which is also at least partially transmissible by the carrier device.
  • the filter device is designed and suitable for transmitting infrared radiation, which is also at least partially transmittable by the carrier device.
  • a further filter device may be provided, which is designed and suitable for transmitting infrared radiation which is at least partially reflected by the carrier device.
  • the support means may comprise at least one glass plate or glass ceramic plate and / or the like or be formed as such.
  • the support device may also be at least partially formed as a so-called ceran field.
  • the sensor device comprises at least one thermal compensation device.
  • the thermal compensation device has in particular at least one coupling device which is suitable and designed to at least partially thermally conductively connect at least one of the at least one sensor unit to the thermal compensation device.
  • Such a configuration is particularly advantageous because temperature peaks can be compensated thereby and the sensor unit is thus subject to relatively constant conditions over time.
  • sensor units for non-contact detection of at least one characteristic parameter for temperatures is such thermal compensation advantageous for the reliability of detection.
  • the thermal compensation device is in particular made of a material with a high heat capacity and / or a high thermal conductivity and preferably of a metallic material, such as a copper material.
  • heat from the filter device is at least partially derivable from the thermal compensation device.
  • the filter device is directly or indirectly thermally coupled to the thermal compensation device.
  • the filter device can be coupled to a sensor unit, which in turn is coupled to the thermal compensation device.
  • At least two sensor units and at least two filter devices are provided.
  • the one filter device is assigned to a sensor unit and is designed and suitable for transmitting electromagnetic radiation of a wavelength range.
  • the other filter device is associated in particular with another sensor unit and is designed and suitable for transmitting electromagnetic radiation of another wavelength range.
  • a filter device essentially transmits electromagnetic radiation in the wavelength range of the short and / or middle infrared and in particular of 3 ⁇ m to 5 ⁇ m wavelength.
  • the other filter device then transmits z.
  • at least one filter device is provided for each sensor unit.
  • the invention makes it possible by the construction of serving as sensor units Thermopilefilter and the filter adhesive significantly improved measurement accuracy.
  • thermopile filters In the course of development of the invention has been shown that special requirements must be met for high accuracy. Surprisingly, the construction of the thermopile filters, and in particular the type and type of filter adhesive, greatly contribute to meeting such requirements for the measurement technique to provide the desired high accuracy.
  • thermopiles used in particular as sensor units are specially selected for their wavelength-selective coating and their base material for this application.
  • the radiation to be measured is absorbed very little and preferably as little as possible by the filter used as a filter device.
  • the filters and the sensor units can be additionally heated, which can also falsify the measurement signal due to the self-radiation of the filter. For this reason, it is preferable to choose a coating which reflects as far as possible and does not absorb those wavelengths which are not to be measured (ie not transmitted).
  • Such a coating is only approximately, d. H. In practice, radiation is still proportionately absorbed. In order to keep the described effect of Meßsignalverfabschung preferably low and in particular as small as possible, it is advantageous if the filter material is such that the resulting heat can be dissipated properly and in particular as quickly as possible.
  • the heat dissipation was improved in the constructive solution by using as a base material z.
  • B. a silicon of at least 0.2 mm thickness was chosen.
  • a particularly highly heat-conductive adhesive used as a filter filter is connected to the housing of the sensor unit.
  • the sensor unit is also irradiated to a small extent by heat radiation from the filter since the real absorption coefficient is never zero. The fact that it is chosen as small as possible, a negative effect can be largely reduced.
  • the FIG. 1 shows a cooking device 1 according to the invention, which is designed here as part of a cooking appliance 100.
  • the cooking appliance 1 or the cooking appliance 100 can be designed both as a built-in appliance and as a self-sufficient cooking appliance 1 or stand-alone cooking appliance 100.
  • the cooking device 1 here comprises a hob 11 with four cooking zones 21.
  • Each of the cooking zones 21 here has at least one heatable cooking area 31 for cooking food.
  • a heating device 2 not shown here, is provided in total for each hotplate 21.
  • the heating devices 2 are designed as induction heating sources and each have an induction device 12 for this purpose. But it is also possible that a cooking area 31 is not associated with any particular cooking area 21, but represents any location on the hob 11. It can the Cooking region 31 a plurality of induction devices 12 and in particular a plurality of induction coils and be formed as part of a so-called full-surface induction unit.
  • a pot can be placed anywhere on the hob 11, wherein during cooking only the corresponding induction coils are driven in the pot or are active.
  • Other types of heaters 2 are also possible, such as gas, infrared or somehowsshreddedettin.
  • the cooking device 1 can be operated here via the operating devices 105 of the cooking appliance 100.
  • the cooking device 1 can also be designed as a self-sufficient cooking device 1 with its own operating and control device. Also possible is an operation via a touch-sensitive surface or a touch screen or remotely via a computer, a smartphone or the like.
  • the cooking appliance 100 is here designed as a stove with a cooking chamber 103, which can be closed by a cooking chamber door 104.
  • the cooking chamber 104 can be heated by various heating sources, such as a Um Kunststoffsagenmaschine.
  • Other heating sources such as a top heat radiator and a bottom heat radiator and a microwave heat source or a vapor source and the like may be provided.
  • the sensor device 3 can detect a variable, via which the temperature of a pot can be determined, which is turned off in the cooking area 31.
  • each cooking area 31 and / or each cooking place 21 can be assigned a sensor device 3.
  • the sensor device 3 is operatively connected to a control device 106 here.
  • the control device 106 is designed to control the heating devices 2 as a function of the parameters detected by the sensor device 3.
  • the cooking device 1 is preferably designed for an automatic cooking operation and has various automatic functions.
  • a soup can be boiled briefly and then kept warm, without a user having to supervise the cooking process or set a heating level.
  • he sets the pot with the soup on a hob 21 and selects the corresponding automatic function via the operating device 105, here z.
  • the operating device 105 here z.
  • the temperature of the pot bottom is determined during the cooking process.
  • the control device 106 sets the heating power of the heating device 2 accordingly.
  • the temperature of the bottom of the pot is monitored continuously, so that when the desired temperature or when boiling the soup, the heating power is regulated down.
  • the automatic function it is also possible by the automatic function to perform a longer cooking process at one or more different desired temperatures, for. B. to slowly let rice pudding draw.
  • a cooking device 1 is shown in a sectional side view very schematic.
  • the cooking device 1 here has a carrier device 5 designed as a glass ceramic plate 15.
  • the glass ceramic plate 15 may in particular be designed as a ceramic hob or the like or at least comprise such. Also possible are other types of support means 5.
  • On the glass ceramic plate 15 is here a cookware or food containers 200, such as a pot or a pan, in which food or food can be cooked.
  • a sensor device 3 is provided which detects heat radiation in a detection region 83 here.
  • the detection area 83 is provided in the installed position of the cooking device 1 above the sensor device 3 and extends upward through the glass ceramic plate 15 to the food container 200 and beyond, if there is no food container 200 is placed there.
  • an induction device 12 for heating the cooking area 31 is attached below the glass ceramic plate 15, an induction device 12 for heating the cooking area 31 is attached.
  • the induction device 12 is here annular and has in the middle a recess in which the sensor device 3 is mounted.
  • Such an arrangement of the sensor device 3 has the advantage that it is still in the detection range 83 of the sensor device even if the food container 200 is not centered on the cooking point 21.
  • the sensor device 3 may also not be arranged centrally in the induction device. If an induction device has, for example, a dual-circuit induction coil, then at least one sensor device 3 can be arranged in a space provided between the two induction coils of the induction device.
  • the FIG. 3 shows a schematic cooking device 1 in a sectional side view.
  • the cooking device 1 has a glass ceramic plate 15, below which the induction device 12 and the sensor device 3 are mounted.
  • the sensor device 3 has a first sensor unit 13 and another sensor unit 23. Both sensor units 13, 23 are suitable for non-contact detection of thermal radiation and designed as a thermopile or thermopile.
  • the sensor units 13, 23 are each equipped with a filter device 43, 53 and provided for detecting heat radiation emanating from the cooking area 31.
  • the heat radiation goes for example From the bottom of a Gargut essenceers 200, penetrates the glass ceramic plate 15 and reaches the sensor units 13, 23.
  • the sensor device 3 is advantageously mounted directly below the glass ceramic plate 15 in order to capture as large a proportion of emanating from the cooking area 31 heat radiation without great losses.
  • the sensor units 13, 23 are provided close to the glass ceramic plate 15.
  • a magnetic shielding device 4 which consists of a ferrite body 14 here.
  • the ferrite body 14 is essentially designed here as a hollow cylinder and surrounds the sensor units 13, 23 in an annular manner.
  • the magnetic shielding device 4 shields the sensor device 3 against electromagnetic interactions and in particular against the electromagnetic field of the induction device 12. Without such shielding, the magnetic field generated by induction device 12 during operation could undesirably heat parts of sensor device 3 as well, resulting in unreliable temperature sensing and inferior measurement accuracy.
  • the magnetic shielding device 4 thus considerably improves the accuracy and reproducibility of the temperature detection.
  • the magnetic shielding device 4 may also consist at least in part of at least one at least partially magnetic material and an at least partially electrically non-conductive material.
  • the magnetic material and the electrically non-conductive material may be arranged alternately and in layers. Also possible are other materials or materials which have at least partially magnetic properties and also have electrically insulating properties or at least low electrical conductivity.
  • the sensor device 3 has at least one optical screen device 7, which is provided to shield radiation influences and in particular heat radiation, which act on the sensor units 13, 23 from outside the detection zone 83.
  • the optical shield device 7 is designed here as a tube or a cylinder 17, wherein the cylinder 17 is hollow and the sensor units 13, 23 surrounds approximately annular.
  • the cylinder 17 is made of stainless steel here. This has the advantage that the cylinder 17 has a reflective surface which reflects a large proportion of the much heat radiation or absorbs as little heat radiation as possible. The high reflectivity of the surface on the outside of the cylinder 17 is particularly advantageous for the shielding against thermal radiation.
  • the high reflectivity of the surface on the inside of the cylinder 17 is also advantageous in order to direct thermal radiation from (and in particular only out) the detection area 83 to the sensor units 13, 23.
  • the optical screen device 7 can also be configured as a wall, which surrounds the sensor device 13, 23 at least partially and preferably annularly.
  • the cross section may be round, polygonal, oval or rounded. Also possible is a configuration as a cone.
  • an insulation device 8 for thermal insulation is provided, which is arranged between the optical shield device 7 and the magnetic shielding device 4.
  • the insulation device 8 consists here of an air layer 18, which is between the ferrite 14 and the cylinder 17.
  • the insulation device 8 in particular a heat conduction from the ferrite 14 to the cylinder 17 is counteracted.
  • the insulation device 8 has, in particular, a thickness of between approximately 0.5 mm and 5 mm and preferably a thickness of 0.8 mm to 2 mm and particularly preferably a thickness of approximately 1 mm.
  • the isolation device 8 may also be at least one medium with a correspondingly low heat conduction, such. B. include a foam material and / or a polystyrene plastic or other suitable insulating material.
  • the sensor units 13, 23 are arranged here in a thermally conductive manner on a thermal compensation device 9 and in particular are coupled in a thermally conductive manner to the thermal compensation device 9.
  • the thermal compensation device 9 has for this purpose two coupling devices 29, which are formed here as depressions, in which the sensor units 13, 23 are embedded accurately. This ensures that the sensor units 13, 23 are at a common and relatively constant temperature level.
  • the thermal compensation device 9 ensures a homogeneous temperature of the sensor unit 13, 23, when it heats up during operation of the cooking device 1. An unequal own temperature can lead to artefacts during the detection, in particular in the case of sensor units 13, 23 designed as thermopiles.
  • a spacing between cylinder 17 and thermal compensation device 9 is provided.
  • the copper plate 19 may also be provided as the bottom 27 of the cylinder 17.
  • the thermal compensation device 9 is designed here as a solid copper plate 19.
  • the thermal compensation device 9 is also possible at least in part another material with a correspondingly high heat capacity and / or a high thermal conductivity.
  • the sensor device 3 here has a radiation source 63, which can be used to determine the reflection properties of the measuring system or the emissivity of a food container 200.
  • the radiation source 63 is embodied here as a lamp 111, which emits a signal in the wavelength range of the infrared light and the visible light.
  • the radiation source 63 may also be formed as a diode or the like.
  • the lamp 111 is used here in addition to the reflection determination for signaling the operating state of the cooking device 1.
  • a region of the thermal compensation device 9 or the copper plate 19 is formed as a reflector 39.
  • the copper plate 19 has a concave-shaped depression, in which the lamp 111 is arranged.
  • the copper plate 19 is also coated with a gold-containing coating to increase the reflectivity.
  • the gold-containing layer has the advantage that it also protects the thermal compensation device 9 from corrosion.
  • the thermal compensation device 9 is attached to a holding device 10 designed as a plastic holder.
  • the holding device 10 has a connecting device 20, not shown here, by means of which the holding device 10 can be latched to a support means 30.
  • the support device 30 is formed here as a printed circuit board 50. On the support means 30 and the circuit board 50 also other components may be provided, such. B electronic components, control and computing devices and / or mounting or mounting elements.
  • a sealing device 6 is provided between the glass ceramic plate 15 and the induction device 12, which is designed here as a micanite layer 16.
  • the micanite layer 16 is used for thermal insulation, so that the induction device 12 is not heated by the heat of the cooking area 31.
  • a micanite layer 16 for thermal insulation between the ferrite body 14 and the glass-ceramic plate 15 is provided here. This has the advantage that the heat transfer from the hot in the glass ceramic plate 15 to the ferrite 14 is severely limited. As a result, hardly any heat emanates from the ferrite body 14, which could be transmitted to the insulation device 8 or the optical screen device. The micanite layer 16 thus counteracts an undesirable heat transfer to the sensor device 3, which increases the reliability of the measurements.
  • the microlayer 16 seals the sensor device 3 dust-tight against the remaining regions of the cooking device 1.
  • the micanite layer 16 has a thickness between about 0.2 mm and 4 mm, preferably from 0.2 mm to 1.5 mm and particularly preferably a thickness of 0.3 mm to 0.8 mm.
  • the cooking device 1 has on the underside a cover 41, which is designed here as an aluminum plate and covers the Indu Vietnameseseicardi 12.
  • the Abdeckeicardi 41 is connected to a housing 60 of the sensor device 3 via a screw 122.
  • the sensor device 3 is arranged elastically relative to the glass ceramic plate 15.
  • a damping device 102 is provided which has a spring device 112 here.
  • the spring device 112 is connected at a lower end to the inside of the housing 60 and at an upper end to the printed circuit board 50.
  • the spring device 112 presses the printed circuit board 50 with the ferrite body 14 and the micanite layer 16 mounted thereon upwards against the glass ceramic plate 15.
  • Such an elastic arrangement is particularly advantageous since the sensor device 3 should be arranged as close as possible to the glass ceramic plate 15 for metrological reasons , This directly adjacent arrangement of the sensor device 3 on the glass ceramic plate 15 could cause damage to the glass ceramic plate 15 in the event of impacts or impacts. Due to the elastic reception of the sensor device 3 relative to the carrier device 5, shocks or impacts are damped on the glass ceramic plate 15 and thus reliably prevent such damage.
  • the first sensor unit 13 is equipped with a filter device 43 which is very permeable to radiation in this wavelength range, while the filter device 43 substantially reflects radiation from other wavelength ranges.
  • the filter devices 43, 53 are here each formed as an interference filter 433 and in particular designed as a bandpass filter or as a long-pass filter.
  • a detection of the radiation in the wavelength range between 3 .mu.m and 5 .mu.m and in particular in the range of 3.1 .mu.m to 4.2 .mu.m be provided, wherein the respective sensor unit and filter device is then respectively formed or adapted accordingly.
  • the determination of a temperature from a specific radiant power is a known method.
  • the decisive factor is that the emissivity of the body is known, from which the temperature is to be determined. In the present case, therefore, the emissivity of the pot bottom must be known or determined for a reliable temperature determination.
  • the sensor device 3 here has the advantage that it is designed to determine the emissivity of a Gargut variousers 200. This is particularly advantageous, since thus any cookware can be used and not just a specific food container whose emissivity must be known in advance.
  • the lamp 111 emits a signal, in particular a light signal, which has a proportion of heat radiation in the wavelength range of the infrared light.
  • the radiant power or thermal radiation of the lamp 111 passes through the glass ceramic plate 15 on the bottom of the pot and is partially reflected there and partially absorbed.
  • the radiation reflected from the bottom of the pot passes through the glass-ceramic plate 15 back to the sensor device 3, where it is detected by the first sensor unit 13.
  • the own thermal radiation of the pot bottom and the thermal radiation of the glass ceramic plate 15 reach the first sensor unit 13.
  • the lamp 111 is switched off and only the heat radiation of the pot bottom and the glass ceramic plate 15 is detected .
  • the proportion of the reflected signal radiation, from which the emissivity of the pot bottom can be determined, then results in principle as the difference between the previously detected total radiation with the lamp 111 switched on minus the heat radiation of the pot bottom and the glass ceramic plate with the lamp 111 switched off.
  • At least one reference value with regard to reflected radiation and the associated emissivity is deposited in a memory unit which cooperates with the sensor device and is not shown in the figures, wherein the memory unit can be arranged, for example, on the printed circuit board 50.
  • the respective Actual emissivity of the pot bottom is then determined based on a comparison of the reflected signal radiation with the at least one reference value.
  • the proportion of the signal radiation absorbed by the bottom of the pot is determined. This results according to methods known per se from the radiation power emitted by the lamp 111 less the signal radiation reflected from the bottom of the pot.
  • the radiation power of the lamp 111 is either fixed and thus known or is determined for example by a measurement with the other sensor unit 23.
  • the other sensor unit 23 detects a wavelength range of the signal radiation, which is almost completely reflected by the glass ceramic plate 15.
  • the emitted radiation power can be determined in a very suitable approximation, whereby inter alia a wavelength dependence of the radiation line or the spectrum of the lamp 111 must be taken into account.
  • the degree of absorption of the pot bottom can be determined in a known manner. Since the absorption capacity of a body corresponds in principle to the emissivity of a body, the desired emissivity can be derived from the degree of absorption of the pot bottom. With the knowledge of the emissivity and the amount of thermal radiation, which emanates from the bottom of the pot, the temperature of the pot bottom can be determined very reliably.
  • the emissivity is preferably continuously redefined in the shortest possible intervals. This has the advantage that a subsequent change in the emissivity does not lead to a falsified measurement result.
  • a change in the emissivity may occur, for example, when the cookware bottom has different emissivities and is displaced on the cooking surface 21. Different emissivities are very common in cookware trays observed because z. B. already light soiling, corrosion or even different coatings or coatings can have a major impact on the emissivity.
  • the lamp 111 is also used here for signaling the operating state of the cooking device 1 in addition to the determination of the emissivity or the determination of the reflection behavior of the measuring system.
  • the signal of the lamp 111 also includes visible light, which is perceptible by the glass-ceramic plate 15.
  • the lamp 111 indicates to a user that an automatic function is in operation.
  • Such an automatic function can, for. B. be a cooking operation, in which the heater 2 is controlled automatically in dependence of the determined pot temperature. This is particularly advantageous because the lighting up of the lamp 111 does not confuse the user. The user knows from experience that the lighting is an operation indicator and belongs to the normal appearance of the cooking device 1.
  • the lamp 111 may also light up in a certain duration and at certain intervals. It is possible z. B. also that different operating states can be output via different flashing frequencies. Different signals are also possible via different on / off sequences.
  • a sensor device 3 with a radiation source 63 which is suitable for displaying at least one operating state, is provided for each cooking point 21 or each (possible) cooking region 31.
  • At least one arithmetic unit may be provided for the necessary calculations for determining the temperature and for the evaluation of the detected variables.
  • the arithmetic unit can be at least partially provided on the circuit board 50.
  • the control device 106 it is also possible, for example, for the control device 106 to be designed accordingly, or at least one separate arithmetic unit is provided.
  • the FIG. 4 shows a development in which below the glass ceramic plate 15, a security sensor 73 is attached.
  • the safety sensor 73 is designed here as a temperature-sensitive resistor, such as a thermistor, in particular an NTC sensor, and thermally conductively connected to the glass ceramic plate 15.
  • the safety sensor 73 is provided here to be able to detect a temperature of the cooking area 31 and in particular of the glass ceramic plate 15. If the temperature exceeds a certain value, there is a risk of overheating and the heaters 2 are switched off.
  • the safety sensor 73 is operatively connected to a safety device, not shown here, which can trigger a safety state depending on the detected temperature.
  • a security condition has z. B. the shutdown of the heaters 2 and the cooking device 1 result.
  • the safety sensor 73 is assigned here as a further sensor unit 33 of the sensor device 3.
  • the values detected by the safety sensor 73 are also taken into account for the determination of the temperature by the sensor device 3.
  • the values of the safety sensor 73 are used. So z. B. the temperature, which was determined by means of the other sensor unit 23 on the detected thermal radiation, are compared with the temperature detected by the safety sensor 73. This adjustment can on the one hand serve to control the function of the sensor device 3, but on the other hand can also be used for a tuning or adjustment of the sensor device 3.
  • a sensor device 3 is likewise shown, in which a safety sensor 73 is assigned as a further sensor unit 33 to the sensor device 3. Unlike the one in the FIG. 4 described embodiment, but no other sensor unit 23 is provided here. The task of the other sensor unit 23 is taken over here by the safety sensor 73.
  • the safety sensor 73 serves to determine the temperature of the Glass ceramic plate 15. For example, with knowledge of this temperature from the heat radiation, which detects the first sensor unit 13, the proportion of a pot bottom can be determined.
  • the other sensor unit 23 may be referred to as a second sensor unit.
  • the further sensor unit 33 may be referred to as a third sensor unit. In the embodiment according to Fig. 5 only the first sensor unit and the third sensor unit are provided.
  • FIG. 6 Another embodiment of a cooking device 1 is in the FIG. 6 shown.
  • a common sealing device 6 for the induction device 12 and the ferrite body 14 of the sensor device 3 is provided.
  • the sealing device 6 is designed as a micanite layer 16 which has a recess in the detection area 83 of the sensor device 3.
  • the FIG. 7 shows a schematic, magnetic shielding 4, which is formed as a hollow, cylindrical ferrite body 14.
  • a schematic, magnetic shielding 4 which is formed as a hollow, cylindrical ferrite body 14.
  • the wall of the ferrite body 14 has a thickness of about 1 mm to 10 mm and in particular from 2 mm to 5 mm, and particularly preferably from 2.5 mm to 4 mm and in particular of 3 mm or more.
  • FIG. 8 is an optical shield device 7 shown schematically, which is designed here as a cylinder 17.
  • the cylinder has here three locking devices 80, which are suitable for connection to a holding device 10.
  • a thermal compensation device 9 is in the FIG. 9 shown.
  • the thermal compensation device 9 is designed as a copper plate 19.
  • the copper plate has a thickness of 0.5 mm to 4 mm or even 10 mm or more, and more preferably from 0.8 mm to 2 mm, and more preferably 1 mm or more.
  • the copper plate 19 here has two coupling devices 29.
  • the coupling device 29 is suitable and provided to receive a sensor unit 13, 23 thermally conductive.
  • the copper plate 19 has a reflector device 39, which can reflect the radiation of a radiation source 63 and, in particular, can focus.
  • FIG. 10 shows a holding device 10, which is designed as a plastic holder.
  • the holding device 10 preferably has a thickness between 0.3 mm and 3 mm or even 6 mm, and particularly preferably a thickness of 1 mm or more.
  • the holding device 10 includes, for example, three connecting devices, of which only two connecting devices 20 are visible in the figure, by means of which the holding device 10 z. B. is connectable to a support device 30.
  • the holding device 10 has three Receiving devices 40 which are formed here as webs.
  • the recording devices 40 are suitable for receiving the optical screen device 7 and arranging it at a defined distance from the magnetic shielding device 4. To carry out contacts receiving openings 70 are provided.
  • the holding device 10 may also have further, not shown receptacles 40 which z. B.
  • Such receiving devices 40 are provided in particular for the defined arrangement of a magnetic shielding device 4, an optical shield device 7, a thermal compensation device 9, an insulation device 8 and / or a support device 30.
  • a sensor unit 13 for non-contact detection of heat radiation is listed.
  • the sensor unit 13 is designed as a thermopile or thermopile.
  • the sensor unit 13 has contacts in order to connect them, for example, to a printed circuit board 50 or board.
  • a filter device 43 is arranged here.
  • FIG. 12a shows a formed as a thermopile sensor unit 13 with a filter device 43 in a sectioned, schematic side view.
  • the filter device 43 is arranged here on the region in which the thermal radiation impinges on the sensor unit 13 and is detected.
  • the filter device 43 is here attached to the sensor unit 13 with an adhesive connection means 430 in a thermally conductive manner.
  • the connecting means 430 here is an adhesive with a thermal conductivity of at least 1 W m -1 K -1 (W / (mK)) and preferably of 0.5 W m -1 K -1 (W / (mK)). Also possible and preferred is a thermal conductivity of more than 4 W m -1 K -1 (W / (mK)).
  • heat can be dissipated from the filter device 43 to the sensor unit 43.
  • the dissipation of the heat prevents the sensor unit 13 from detecting the self-heat of the filter device 43, which would lead to a falsified measurement result.
  • the heat from the filter device 43 via the sensor unit 13 can also be forwarded to the thermal compensation device 9 or the copper plate 19.
  • Such indirect dissipation of the heat from the filter device 43 via the sensor unit 13 to the copper plate 19 is also particularly favorable since the copper plate 19 has a high heat capacity.
  • the adhesive may be, for example, a thermosetting, one-component, solvent-free silver-filled epoxy conductive adhesive. Due to the proportion of silver or silver-containing compounds a very favorable thermal conductivity is achieved. Also possible is a proportion of other metals or metal compounds with a corresponding thermal conductivity. Such an adhesive ensures a thermally conductive connection, which is durable and stable even at the temperatures to be expected in a cooking device 1.
  • the filter device 43 is designed as an interference filter 433 and here has four filter layers 432 with a different refractive index and with dielectric properties. In this case, filter layers 432 with higher and lower refractive indices are alternately stacked and connected.
  • the filter layers 432 are, in particular, very thin, preferably a few nanometers to 25 nm.
  • the carrier layer for the filter layers 432 here is a filter base 431 made of a silicon-containing material with a thickness of more than 0.2 mm.
  • the filter device 43 is designed and suitable for transmitting a wavelength range in the infrared spectrum and for substantially reflecting radiation outside this range.
  • FIG. 12b shows a further embodiment of a sensor unit 13 with a filter device 43, wherein the filter device 43 is glued here only partially on the sensor device 13.
  • the region in which the heat radiation strikes and is detected on the sensor unit 13 is surrounded here by a raised edge region.
  • the connecting means 430 was applied only in an edge region. This has the advantage that the heat radiation to be detected does not have to pass through the connection means 430 before it strikes the sensor unit 13.
  • a sensor device 3 is shown in a plan view. For clarity and distinctiveness, some parts or areas are shaded. It can be clearly seen that the sensor device 3 has a concentric structure according to the onion shell principle. Inside there is a thermal compensation device 9 or a copper plate 19, on which two sensor units 13, 23 and designed as a lamp 111 radiation source 63 are arranged. So that no unwanted heat radiation from the side of the sensor units 13, 23 is incident, the sensor units 13, 23 are surrounded by an optical screen device 7 and a cylinder 17. The cylinder 17 is spaced from the copper plate 19, so that as possible no heat transfer between the cylinder 17 and copper plate 19 can take place. The cylinder 17 is surrounded by a magnetic shielding device 4 and a ferrite body 14, respectively. The ferrite body 14 represents the outermost layer of the sensor device 3 and shields it against electromagnetic interactions.
  • the sensor device 3 is preferably provided as close as possible below a carrier device 5, a sealing device 6 or a micanite layer 16 lies on the ferrite body 14, which considerably reduces a heat transfer from the carrier device 5 to the ferrite body 14.
  • an insulation device 8 is formed between the ferrite body 14 and the cylinder 17, an insulation device 8 is formed.
  • the insulation device 8 is here an air layer 18.
  • the air layer 18 counteracts a heat transfer from the ferrite body 14 to the cylinder 17.
  • the sensor units 13, 23 in the interior of the sensor device 3 are thus very effective against interference, such.
  • B. a magnetic field of an induction device 12, heat radiation from outside the detection range 83 and heating by Heat conduction, protected.
  • Such a configured, shell-like arrangement of the listed components significantly increases the reliability of the measurements performed with the sensor device 3.
  • FIG. 14 shows a sensor device 3 in an exploded view.
  • the items are here shown spatially separated from each other, whereby the arrangement of the items within the sensor device 3 is clearly visible.
  • the concentric or onion-like structure is also clearly visible here. In addition to an improved measurement accuracy, such a structure also allows a particularly production-friendly and cost-effective installation of the sensor device 3.
  • a sensor unit 13, 23 may already be adhesively bonded to a filter device 43, 53 in a thermally conductive manner.
  • the circuit board 50 may already be partially equipped with electronic components prior to assembly. Preferably z. B. the radiation source 63 already contacted with the circuit board 50.
  • the holding device 10 designed as a plastic holder is first mounted on the supporting device 30 designed as a printed circuit board 50.
  • the holding device 10 at least one connecting device 20, not shown here, which is connected to the circuit board 50 and z. B. can be locked.
  • a holding device 10 with three connecting devices 20 is in the FIG. 10 shown.
  • the provided here as a copper plate 19 thermal compensation device 9 is inserted into the holding device 10.
  • the sensor units 13, 23 designed as thermopiles or thermopiles are then passed through receiving openings 70 in the copper plate 19, the holding device 10 and the printed circuit board 50.
  • the mounting of the holding device 10, the copper plate 19 and the sensor units 13, 23 can also be performed in any other order. So z. B. first inserted the copper plate 19 in the holding device 10, then the sensor units 13, 23 inserted and subsequently the holding device 10 is locked to the circuit board 50. The contacting of the sensor units 13, 23 with the printed circuit board 50 can be done at any time during assembly.
  • the contacting of the radiation source 63 designed as a lamp 111 with the printed circuit board 50 can also be done at any assembly time. It is preferred to contact the lamp 111 first with the printed circuit board 50 and then to start with the mounting option described above.
  • the optical screen device 7 designed as a cylinder 17.
  • the cylinder 17 has three latching devices 80, which are latched to the three receiving devices 40 of the holding device 10.
  • the ferrite body 14 formed magnetic shield 4 is mounted on the holding device 10.
  • the holding device 10 preferably has a further, not shown here receiving device 40, which may be formed as a recess, survey, web and / or annular groove or the like.
  • the sealing device 6 designed as micanite layer 16 is fastened to the magnetic shielding device 4.
  • Other suitable mounting sequences for the cylinder 17, the ferrite body 14 and the sealing device 6 may be provided.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Food Science & Technology (AREA)
  • Electric Stoves And Ranges (AREA)
  • Radiation Pyrometers (AREA)
  • Induction Heating Cooking Devices (AREA)

Claims (13)

  1. Dispositif de cuisson (1), comprenant au moins une table de cuisson (11) avec au moins un emplacement de cuisson (21) et au moins un dispositif chauffant (2) prévu pour le chauffage d'au moins une zone de cuisson (31),
    et au moins un dispositif de capteur (3) pour la détection d'au moins une grandeur physique caractérisant un état de la zone de cuisson (31), le dispositif de capteur (3) présentant au moins une unité de capteur (13) pour la détection sans contact de rayonnement thermique, caractérisé en ce
    qu'il est prévu au moins un dispositif de filtrage (43) raccordé de façon thermiquement conductrice à au moins une partie du dispositif de capteur (3),
    le dispositif de filtrage (43) étant constitué et approprié pour réfléchir le rayonnement électromagnétique en fonction de la longueur d'onde et pour le transmettre en fonction de la longueur d'onde,
    et au moins un moyen de raccordement (430) au moins partiellement adhésif étant prévu, qui est constitué et approprié pour raccorder de façon thermiquement conductrice le dispositif de filtrage (43) au moins partiellement à au moins une partie du dispositif de capteur (3).
  2. Dispositif de cuisson (1) selon la revendication 1, caractérisé en ce que le moyen de raccordement (430) présente une fraction métallique.
  3. Dispositif de cuisson (1) selon l'une des revendications précédentes, caractérisé en ce que le moyen de raccordement (430) présente au moins une colle ou est au moins partiellement constitué en tant que tel.
  4. Dispositif de cuisson (1) selon l'une des revendications précédentes, caractérisé en ce que le moyen de raccordement (430) présente une conductibilité thermique élevée et en particulier une conductibilité thermique d'au moins 0,5 W x m-1 x K-1.
  5. Dispositif de cuisson (1) selon l'une des revendications précédentes, caractérisé en ce que le dispositif de filtrage (43) est constitué et approprié pour transmettre essentiellement le rayonnement électromagnétique d'au moins une plage de longueur d'onde et pour réfléchir essentiellement le rayonnement électromagnétique d'au moins une autre plage de longueur d'onde.
  6. Dispositif de cuisson (1) selon l'une des revendications précédentes, caractérisé en ce que le dispositif de filtrage (43) est constitué et approprié pour transmettre essentiellement le rayonnement électromagnétique d'au moins deux plages de longueur d'onde différentes et pour réfléchir essentiellement le rayonnement électromagnétique d'au moins une autre plage de longueur d'onde.
  7. Dispositif de cuisson (1) selon l'une des revendications précédentes, caractérisé en ce que le dispositif de filtrage (43) comprend au moins deux couches de filtrage (432) avec un indice de réfraction différent et/ou présente un filtre d'interférence (433) ou est constitué en tant que tel.
  8. Dispositif de cuisson (1) selon l'une des revendications précédentes, caractérisé en ce que le dispositif de filtrage (43) est disposé au moins partiellement de façon au moins partiellement thermiquement conductrice sur au moins une unité de capteur (13) et est en particulier collé de façon thermiquement conductrice.
  9. Dispositif de cuisson (1) selon l'une des revendications précédentes, caractérisé en ce que la table de cuisson (11) présente au moins un dispositif de support (5) qui est approprié et constitué pour le positionnement d'au moins un récipient de produit à cuire, et en ce que le dispositif de capteur (3), dans la position de montage de la table de cuisson (11), est disposé au moins partiellement au-dessous du dispositif de support (5) et au voisinage d'au moins une partie du dispositif chauffant (2).
  10. Dispositif de cuisson (1) selon l'une des revendications précédentes, caractérisé en ce que le dispositif de filtrage (43) est constitué et approprié pour transmettre le rayonnement électromagnétique d'une plage de longueur d'onde qui peut être transmise au moins partiellement également par le dispositif de support (5).
  11. Dispositif de cuisson (1) selon l'une des revendications précédentes, caractérisé en ce que le dispositif de capteur (3) comprend au moins un dispositif d'équilibrage thermique (9), le dispositif d'équilibrage thermique (9) présentant au moins un dispositif de couplage (29) qui est approprié et constitué pour raccorder au moins partiellement de façon thermiquement conductrice l'unité de capteur (13) au dispositif d'équilibrage thermique (9).
  12. Dispositif de cuisson (1) selon l'une des revendications précédentes, caractérisé en ce que la chaleur du dispositif de filtrage (43) peut être détournée au moins partiellement vers le dispositif d'équilibrage thermique (9).
  13. Dispositif de cuisson (1) selon l'une des revendications précédentes, caractérisé en ce qu'au moins deux unités de capteur (13, 23) et au moins deux dispositifs de filtrage (43, 53) sont prévus, un dispositif de filtrage (43) étant affecté à une unité de capteur (13) et étant constitué et approprié pour transmettre le rayonnement électromagnétique d'une plage de longueur d'onde, et l'autre dispositif de filtrage (53) étant affecté à une autre unité de capteur (23) et étant constitué et approprié pour transmettre le rayonnement électromagnétique d'une autre plage de longueur d'onde.
EP14401015.4A 2013-03-04 2014-02-03 Appareil de cuisson Active EP2775791B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102013102117.4A DE102013102117A1 (de) 2013-03-04 2013-03-04 Kocheinrichtung

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EP2775791A1 EP2775791A1 (fr) 2014-09-10
EP2775791B1 true EP2775791B1 (fr) 2015-07-01

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DE (1) DE102013102117A1 (fr)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4331574C2 (de) * 1993-09-16 1997-07-10 Heimann Optoelectronics Gmbh Infrarot-Sensormodul
DE19856140A1 (de) * 1998-12-04 2000-06-08 Bsh Bosch Siemens Hausgeraete Sensorgesteuertes Kochfeld mit unterhalb der Kochfeldplatte angeordneter Sensoreinheit
US6169486B1 (en) * 1999-07-19 2001-01-02 General Electric Company Monitoring and control system for monitoring the temperature of a glass ceramic cooktop
JP2004063451A (ja) * 2002-06-07 2004-02-26 Ishizuka Electronics Corp 誘導加熱調理器の放射温度検知装置および該装置用演算装置
DE102004002058B3 (de) * 2004-01-15 2005-09-08 Miele & Cie. Kg Verfahren zur Steuerung eines Kochprozesses bei einem Kochfeld und Kochfeld zur Durchführung des Verfahrens
DE102004015255A1 (de) * 2004-03-29 2005-10-13 BSH Bosch und Siemens Hausgeräte GmbH Kochsensorik
DE102006026907A1 (de) * 2006-06-09 2008-01-03 BSH Bosch und Siemens Hausgeräte GmbH Induktionskochmulde und Verfahren zur Ermittlung einer Temperatur eines Bodens eines Zubereitungsbehälters
US20100065551A1 (en) * 2007-03-12 2010-03-18 Hiroshi Tominaga Induction cooking device
DE102007013839A1 (de) 2007-03-22 2008-09-25 BSH Bosch und Siemens Hausgeräte GmbH Kochfeldsensorvorrichtung
ATE479316T1 (de) 2007-06-05 2010-09-15 Miele & Cie Verfahren zur kochfeldsteuerung und kochfeld zur durchführung des verfahrens
DE102008022387A1 (de) * 2008-05-06 2009-11-12 Miele & Cie. Kg Kochfeld mit einer Kochfeldplatte sowie Verfahren zur Steuerung eines Kochprozesses
JP5506406B2 (ja) * 2010-01-04 2014-05-28 三菱電機株式会社 誘導加熱調理器

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EP2775791A1 (fr) 2014-09-10

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