EP2566801A2 - Fil de sciage à abrasif fixe et revêtement de protection déposable - Google Patents
Fil de sciage à abrasif fixe et revêtement de protection déposableInfo
- Publication number
- EP2566801A2 EP2566801A2 EP11716896A EP11716896A EP2566801A2 EP 2566801 A2 EP2566801 A2 EP 2566801A2 EP 11716896 A EP11716896 A EP 11716896A EP 11716896 A EP11716896 A EP 11716896A EP 2566801 A2 EP2566801 A2 EP 2566801A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- wire
- organic coating
- fixed abrasive
- sawing wire
- coating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000011253 protective coating Substances 0.000 title description 2
- 239000002245 particle Substances 0.000 claims abstract description 50
- 238000000576 coating method Methods 0.000 claims abstract description 44
- 239000011248 coating agent Substances 0.000 claims abstract description 41
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000002904 solvent Substances 0.000 claims abstract description 5
- 239000011247 coating layer Substances 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 28
- 239000010410 layer Substances 0.000 claims description 27
- 229920000642 polymer Polymers 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000002826 coolant Substances 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 6
- 230000001680 brushing effect Effects 0.000 claims description 4
- 238000001125 extrusion Methods 0.000 claims description 4
- 229920000609 methyl cellulose Polymers 0.000 claims description 4
- 239000001923 methylcellulose Substances 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000002202 Polyethylene glycol Substances 0.000 claims description 3
- 238000007766 curtain coating Methods 0.000 claims description 3
- 238000009503 electrostatic coating Methods 0.000 claims description 3
- 229920001223 polyethylene glycol Polymers 0.000 claims description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 2
- 239000005977 Ethylene Substances 0.000 claims description 2
- 229920002319 Poly(methyl acrylate) Polymers 0.000 claims description 2
- 229920002125 Sokalan® Polymers 0.000 claims description 2
- 229920002472 Starch Polymers 0.000 claims description 2
- 229920006187 aquazol Polymers 0.000 claims description 2
- 229920001222 biopolymer Polymers 0.000 claims description 2
- 229920001577 copolymer Polymers 0.000 claims description 2
- -1 di- ethyleenglycol Substances 0.000 claims description 2
- 238000007598 dipping method Methods 0.000 claims description 2
- 150000004676 glycans Polymers 0.000 claims description 2
- 239000012943 hotmelt Substances 0.000 claims description 2
- 239000000017 hydrogel Substances 0.000 claims description 2
- 229920001282 polysaccharide Polymers 0.000 claims description 2
- 239000005017 polysaccharide Substances 0.000 claims description 2
- 150000004804 polysaccharides Polymers 0.000 claims description 2
- 229920002689 polyvinyl acetate Polymers 0.000 claims description 2
- 239000011118 polyvinyl acetate Substances 0.000 claims description 2
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims description 2
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims description 2
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims description 2
- 102000004169 proteins and genes Human genes 0.000 claims description 2
- 108090000623 proteins and genes Proteins 0.000 claims description 2
- 235000019698 starch Nutrition 0.000 claims description 2
- 239000008107 starch Substances 0.000 claims description 2
- 229920001169 thermoplastic Polymers 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 239000004634 thermosetting polymer Substances 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 15
- 238000004804 winding Methods 0.000 description 14
- 229910052799 carbon Inorganic materials 0.000 description 13
- 238000005520 cutting process Methods 0.000 description 13
- 239000010432 diamond Substances 0.000 description 10
- 239000004372 Polyvinyl alcohol Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 229920002451 polyvinyl alcohol Polymers 0.000 description 9
- 229940068984 polyvinyl alcohol Drugs 0.000 description 9
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 229910003460 diamond Inorganic materials 0.000 description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 6
- 239000002002 slurry Substances 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910002092 carbon dioxide Inorganic materials 0.000 description 3
- 239000001569 carbon dioxide Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000012044 organic layer Substances 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 2
- 229910000975 Carbon steel Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- 230000001464 adherent effect Effects 0.000 description 2
- 230000002457 bidirectional effect Effects 0.000 description 2
- 229910002091 carbon monoxide Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000000197 pyrolysis Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910005091 Si3N Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 1
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000003467 diminishing effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910000159 nickel phosphate Inorganic materials 0.000 description 1
- JOCJYBPHESYFOK-UHFFFAOYSA-K nickel(3+);phosphate Chemical compound [Ni+3].[O-]P([O-])([O-])=O JOCJYBPHESYFOK-UHFFFAOYSA-K 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
- B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
- B65H75/18—Constructional details
- B65H75/28—Arrangements for positively securing ends of material
- B65H75/285—Holding devices to prevent the wound material from unwinding
Definitions
- the invention relates to a fixed abrasive sawing wire as is used during sawing of hard and brittle materials.
- Such a type of wire is called a 'fixed abrasive sawing wire': the abrasive particles are firmly attached to a carrier wire. Usually fine diamond particles (typically 10 to 50 ⁇ size) are used as abrasive particles. Such a wire retains its cutting action much longer as the wire does not get worn by the abrasive - the abrasive is fixed to the wire - contrary to the loose abrasive sawing process wherein the wire also wears like the piece that is being sawn.
- Wire sawing inherently results in a loss of - sometimes precious - work piece material. There is therefore also a constant strive to keep the 'kerf loss' (the amount of work piece material lost as sawing debris) as low as possible.
- Currently used fixed abrasive sawing wires have a smallest circumscribed outer diameter (i.e. the smallest diameter of an imaginary circle surrounding the abrasive particles) range between 310 ⁇ for cropping and ingot shaping down to 145 ⁇ for wafering.
- the wire can be driven unidirectional i.e. the wire always moves in the same direction during cutting.
- wafer parametric uses such as for the semicon industry
- the process can be driven bidirectional.
- fresh wire is drawn from the spool over a forward length FL in the forward direction, then the sawing direction is reversed over a backward length BL.
- FL is larger than BL.
- 'Bidirectional sawing' is sometimes called 'back- and forward sawing', 'reciprocal sawing' or 'pilgrim-mode sawing'.
- Fixed abrasive sawing wires are nowadays uniquely used in pilgrim mode where the backward length BL is only marginally less than the forward length FL. Hence the same wire length is used multiple times i.e. has a high use rate.
- the high use rate of the wire implies that only very little wire is taken into the web at each cycle and used wire is wound back on fresh wire many times before entering the web. For example, before a fresh length (FL-BL) of wire enters the web completely - and does not return anymore to payoff spool - it has been rewound BL/(FL-BL) times on the pay-off spool. This easily amounts to over 100, even 200 back windings on the pay-off spool, depending on the pilgrim mode used. Note that for the purpose of this application the spool from which the wire is consumed will be called the 'pay-off spool' (even though it temporarily acts as a spool on which wire is wound up i.e. receives wire) while the spool receiving the used wire will be called the 'take-up spool' (although it intermittently used as a spool delivering wire).
- the 'self-damage' problem can be prevented by a machine design such as exemplified in EP0261695, US3942508 or US5052366 that collects used wire in a pulley array system and thereby also reduces the wire tension from the cutting head to the spool, but such designs are more complicated and expensive.
- - Fixation can be done through a mechanical bond: by pressing diamond particles in a soft sheath high tensile wire such as e.g. described in application with application number EP2010/055678 of the current applicant.
- a soft sheath high tensile wire such as e.g. described in application with application number EP2010/055678 of the current applicant.
- a metallurgical bond has also been considered e.g. by brazing or
- organic bound abrasive particles resin bond
- inorganically bound abrasive particles indented in a metallic layer, brazed particles, electrolytic or electroless plated particles.
- the object of the invention is primarily to eliminate the self-damage
- the object is more specifically to eliminate this problem with the least possible adaptations of the process or the machine.
- the basic principle of the invention is to protect the fixed abrasive sawing wire from self-damage by putting a layer of an easy removable and disposable organic coating around it.
- a fixed abrasive sawing wire is presented.
- Fixed abrasive sawing wires are generally built around a high tensile element which is mostly steel such as plain carbon steel or stainless steel. Most preferred is a steel core that is made of plain carbon steel (with a minimum carbon content of 0.70 wt% carbon) or a stainless steel.
- a steel core that is made of plain carbon steel (with a minimum carbon content of 0.70 wt% carbon) or a stainless steel.
- Preferred diameters and tensile strength of the core of the fixed abrasive sawing wire are: if diameter is smaller than... then tensile strength is larger than...
- the tensile strength is the breaking load of the wire (in newton) divided by the cross sectional surface area (in mm 2 ).
- abrasive particles On the core metal wire abrasive particles are fixed.
- the abrasive particles can be superabrasive particles such as diamond (natural or artificial, the latter being somewhat more preferred because of their lower cost and their grain friability), cubic boron nitride or mixtures thereof.
- particles such as tungsten carbide (WC), silicon carbide (SiC), aluminium oxide (AI2O3) or silicon nitride (Si3N ) can be used: although they are softer, they are considerably cheaper than diamond. However, most preferred remains diamond.
- the abrasive particles are firmly attached or fixed to the core wire by
- fixation layer that is inorganic.
- inorganic any type of fixation layer that does not rely on a carbon or silicon chemistry to hold the particles.
- the fixation layer is organic.
- inorganic fixation layers are:
- ⁇ Fixation by means of indentation of abrasive particles into a soft layer surrounding the core wire followed by covering the abrasive particles by means of a metallic coating such as described in WO 2010/125083 and WO 2010/092151 .
- the first soft layer is a copper layer and the covering layer is nickel.
- solder is a low temperature melting solder such as a tin-silver or, tin-zinc solder to limit the thermal loading of the core wire.
- a high temperature resistance wire can be used such as tungsten wire as described in US 6102024.
- a metal layer is an inorganic layer.
- the inorganic coating is then a metal coating, most preferred being a nickel metal coating.
- a metal coating most preferred being a nickel metal coating.
- An example of a preferred fixed abrasive sawing wire is described in US 7704127 or EP2277660.
- the inorganic fixation layer is metallic in nature wherein different layers are used for different functionalities.
- Metals that are preferred for indentation layers are soft such as zinc, copper, brass, low carbon, metals used for fixing the abrasive particles are mostly nickel or nickel alloys (nickel phosphate, nickel cobalt etc.).
- the fixed abrasive sawing wire with the abrasive particles attached to it in an inorganic coating layer is further covered with an organic coating layer.
- the organic coating layer is not intended to fix the abrasive particles in place.
- the organic coating layer is intended to protect the fixed abrasive sawing wire from self-damage. As the organic layer is on the wire prior to use but has disappeared after use, used wire that is wound back on fresh wire will not be damaged by the fresh wire as this used wire lands in a 'cushion' formed by the organic coating layer of the fresh wire. Conversely the fresh wire that is on the spool is protected by the organic coating layer from the used wire - substantially without organic coating layer - landing on it at high tension.
- the function of the organic coating layer is merely for protection of the wire during transport it is of no use for the sawing function of the wire and should not interfere with this function.
- 'transport of the wire' should be considered broadly in that not only the physical transport of a coil of wire in its entirety is meant, but also if only a part of the wire is transported on or off the carrier i.e. winding on and winding off wire are also considered as 'transport' of the wire.
- the primary function of the organic coating layer is 'to protect the wire during transport from self-damage'.
- organic coating layer - as organic coating layers generally have high self-friction coefficients - is that the different windings in the spool are held immovable to one another. In this way entanglement of the wires during transport or during threading of the wire web is prevented. Therefore tacky, sticky types of organic coating layers are preferred.
- Such coatings have the advantage that transverse movement of wires relative to one another is prevented: it is precisely this scratching by the abrasive particles, oblique to the axis of the wire, that are most harmful to the wire and makes it break prematurely.
- the organic coating layer can be removed just prior to the use of the fixed abrasive sawing wire.
- a removal method step must be provided on the pay-off spool or between the pay-off spool and the wire web that removes the organic coating on its first entry into the web.
- the choice of the organic material for the organic coating layer is very important.
- the coating should be inexpensive, easy to apply, soft, non-adherent or at the most slightly adherent to metals and most important easy to remove and this by preference in an environmentally friendly way.
- polar media examples include water, polyethyleneglycol, alcohol, di-ethyleenglycol, or mixtures thereof. These are also the liquids that are used as a basis in the coolants that are used for fixed abrasive sawing wire.
- Particularly preferred polymers that can be used for the organic coating layer are therefore poly vinylpyrrolidone, polyvinyl acetate, poly (acrylic acid), poly (methyl acrylate), methylcellulose, polyvinyl alcohol, or ethylene/vinyl alcohol copolymers, polyethyloxazolines or mixtures thereof, as they easily dissolve in polar media such as the ones cited.
- Most preferred are polyvinyl alcohol and methylcellulose.
- Polyvinyl alcohol readily dissolves in water, has excellent film forming capabilities, and is non-toxic. Methylcellulose precipitates in a polar medium when the medium is heated, which provides a convenient way of removing it.
- Biopolymers are also a good choice as they are biodegradable and are generally mechanically not very strong and some of them easily dissolve in water. Noteworthy examples are: caserne, starch derivates, hydrogels, poly saccharide or protein based polymers.
- Alternative polymers are polymers that are not dissolvable in polar media such as thermoplastic polymers, hot melt polymers, or thermosetting polymers. These are somewhat less preferred - although not impossible per se - for the intended use.
- the amount of organic coating layer present on the fixed abrasive sawing wire must not be much. It must be sufficient to cover the diamonds and to prevent the wires from slipping over one another. It suffices that the diameter of the smallest circumscribed circle of said fixed abrasive sawing wire inclusive said organic coating layer is larger than the diameter of the smallest circumscribed circle that only encloses said abrasive particles. Too much coating will result in too much waste (either in the removal apparatus or in the coolant). Not enough coating will not bring the advantageous effect of protection of the fixed abrasive sawing wire.
- a method to protect a fixed abrasive sawing wire during transport comprises the steps of:
- the thus coated fixed abrasive wire is collected on a carrier such as a spool, packed and transferred to the sawing machine.
- the organic coating layer is removed prior to or during use of the fixed abrasive sawing wire.
- the wire can be coated in a number of ways: coating can be done by
- Extrusion can be through an extrusion head, but can also be very basic by guiding the fixed abrasive sawing wire through a pot containing the polymer followed by stripping off superfluous material in a rubber die (of diameter larger than the smallest circumscribed circle).
- 'Curtain coating' is the method whereby the wire is guided through laminar flowing curtain of the pure or dissolved polymer. Electrostatic coating is already complicated.
- the methods can be applied on a single wire during producing the wire, but there are other possibilities to do this more efficiently.
- the carrier can be intruded with polymer coating from the outside inward by pressing the polymer through the wire pack and pumping air out of the core of the spool. In this way the fixed abrasive wire is well protected during transport.
- Possible methods for removing the organic coating layer are:
- pealing By means of pealing off e.g. by first rolling the wire against a roll so that the coating cuts slits itself through. Another preferred way of pealing is that the organic coating is also tacky to itself, but less to the sawing wire. During winding, the organic coating layers of the different windings will glue to each other. At unwinding, the organic layer will preferably remain attached to the other organic layers and the wire will be ripped out of the coating. The organic coating then remains on the spool, and must be removed at the spool.
- the coating e.g. by leading it through a narrow matching slit.
- the slit can easily be made by letting the wire saw through a thin piece of material - preferably the material to be sawn - at the start-up of the machine. Once the slit has been formed, cutting of the work piece can start.
- the organic coating can be such that the coating dissolves in the coolant that is used in the sawing process. This has the additional advantages that no machine adaptations are necessary. Provisions will have to be made to remove the organic coating from the coolant as it accumulates in the coolant.
- FIGURE 1 shows a cross section of the inventive fixed abrasive sawing wire.
- FIGURE 2 shows a cross section of the spool with the wires as they are used during the sawing.
- Figure 1 shows a fixed abrasive sawing wire 100 with a core metal wire
- abrasive particles 104 are microdiamonds with a median size of 9 ⁇ with a range from 6 to 12 m (5% and 95% limits of the particle size distribution).
- Such wire is commercially available.
- Protrusion of the abrasive particles is about 7 ⁇ which is large compared to the overall diameter of the wire.
- Circle 108 describes the circle with the smallest diameter D 0 that
- the wire has been coated with a layer 1 10 of poly vinylalcohol (PVA)
- ⁇ Mowiflex TC obtainable from Kuraray by running it through a dip tank and winding it on a wire spool.
- the PVA forms a soft layer in between the wires thereby fixing the layers more in place, as shown in Figure 2, 206.
- a circle 1 12 can be defined with the smallest diameter Di that circumscribes the fixed abrasive sawing wire inclusive the organic coating layer 1 10. Di is larger than D 0 . Circle 1 12 is not necessarily concentric to circle 108. About 1 mg of residual carbon was measured per gram of wire in the carbon pyrolysis test.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Cette invention concerne un fil de sciage sur lequel des particules abrasives sont solidement fixées et recouvertes ultérieurement d'un revêtement organique destiné à protéger les fils les uns des autres pendant le transport et l'emploi. Le revêtement organique est tel qu'il se dissout facilement dans un solvant, de préférence dans de l'eau. En variante, ce revêtement organique es si faible qu'il peut être facilement retiré par frottement mécanique. Le mieux est que le revêtement organique disparaisse pendant l'emploi, c'est-à-dire pendant le sciage. La fonction des particules organiques est de protéger le fil de sciage à revêtement abrasif fixe pendant le transport et tout particulièrement pendant l'emploi lorsque le fil est ré-enroulé sur lui-même après utilisation en va-et-vient.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP11716896A EP2566801A2 (fr) | 2010-05-04 | 2011-04-26 | Fil de sciage à abrasif fixe et revêtement de protection déposable |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP10161854 | 2010-05-04 | ||
| EP11716896A EP2566801A2 (fr) | 2010-05-04 | 2011-04-26 | Fil de sciage à abrasif fixe et revêtement de protection déposable |
| PCT/EP2011/056579 WO2011138192A2 (fr) | 2010-05-04 | 2011-04-26 | Fil de sciage à abrasif fixe et revêtement de protection déposable |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP2566801A2 true EP2566801A2 (fr) | 2013-03-13 |
Family
ID=42932007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP11716896A Withdrawn EP2566801A2 (fr) | 2010-05-04 | 2011-04-26 | Fil de sciage à abrasif fixe et revêtement de protection déposable |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP2566801A2 (fr) |
| CN (2) | CN103180236B (fr) |
| BE (1) | BE1019676A3 (fr) |
| TW (1) | TW201208795A (fr) |
| WO (2) | WO2011138189A1 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105283261A (zh) * | 2013-05-14 | 2016-01-27 | 原子能与替代能源委员会 | 磨料锯切线、其产生方法和其用途 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101548147B1 (ko) | 2009-08-14 | 2015-08-28 | 생-고뱅 어브레이시브즈, 인코포레이티드 | 연신체에 연마입자가 결합된 연마제품 |
| TW201404527A (zh) | 2012-06-29 | 2014-02-01 | 聖高拜磨料有限公司 | 研磨物品及形成方法 |
| TW201402274A (zh) | 2012-06-29 | 2014-01-16 | Saint Gobain Abrasives Inc | 研磨物品及形成方法 |
| TWI664057B (zh) | 2015-06-29 | 2019-07-01 | 美商聖高拜磨料有限公司 | 研磨物品及形成方法 |
| CN106625893B (zh) * | 2016-11-25 | 2022-11-22 | 江苏诚益达智能科技有限公司 | 一种新型清洁手锯 |
| CN112079160B (zh) * | 2020-08-27 | 2025-02-18 | 浙江嘉丽包装科技有限公司 | 一种具有自动收卷功能的pet塑钢带包装设备 |
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2011
- 2011-04-26 CN CN201180022174.2A patent/CN103180236B/zh not_active Expired - Fee Related
- 2011-04-26 WO PCT/EP2011/056569 patent/WO2011138189A1/fr not_active Ceased
- 2011-04-26 EP EP11716896A patent/EP2566801A2/fr not_active Withdrawn
- 2011-04-26 WO PCT/EP2011/056579 patent/WO2011138192A2/fr not_active Ceased
- 2011-05-02 TW TW100115348A patent/TW201208795A/zh unknown
- 2011-05-02 BE BE2011/0256A patent/BE1019676A3/nl not_active IP Right Cessation
- 2011-05-04 CN CN2011201370703U patent/CN202241640U/zh not_active Expired - Lifetime
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| Title |
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| See references of WO2011138192A2 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105283261A (zh) * | 2013-05-14 | 2016-01-27 | 原子能与替代能源委员会 | 磨料锯切线、其产生方法和其用途 |
| CN105283261B (zh) * | 2013-05-14 | 2017-12-08 | 原子能与替代能源委员会 | 磨料锯切线、其产生方法和其用途 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011138192A3 (fr) | 2015-07-02 |
| WO2011138192A2 (fr) | 2011-11-10 |
| CN103180236B (zh) | 2015-07-08 |
| BE1019676A3 (nl) | 2012-09-04 |
| CN103180236A (zh) | 2013-06-26 |
| WO2011138189A1 (fr) | 2011-11-10 |
| CN202241640U (zh) | 2012-05-30 |
| TW201208795A (en) | 2012-03-01 |
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