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EP2125983A1 - Élément plat collant sous l'effet de la chaleur - Google Patents

Élément plat collant sous l'effet de la chaleur

Info

Publication number
EP2125983A1
EP2125983A1 EP08708586A EP08708586A EP2125983A1 EP 2125983 A1 EP2125983 A1 EP 2125983A1 EP 08708586 A EP08708586 A EP 08708586A EP 08708586 A EP08708586 A EP 08708586A EP 2125983 A1 EP2125983 A1 EP 2125983A1
Authority
EP
European Patent Office
Prior art keywords
channel
adhesive
surface element
heat
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08708586A
Other languages
German (de)
English (en)
Inventor
Marc Husemann
Frank Hannemann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tesa SE
Original Assignee
Tesa SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesa SE filed Critical Tesa SE
Publication of EP2125983A1 publication Critical patent/EP2125983A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/403—Adhesives in the form of films or foils characterised by release liners characterised by the structure of the release feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24628—Nonplanar uniform thickness material
    • Y10T428/24661—Forming, or cooperating to form cells

Definitions

  • the invention relates to a heat-activated bubble-free bonding surface element with at least one heat-activable adhesive having at least one side surface which is aligned parallel to the main extent of the surface element and adapted for bonding the surface element with a substrate, and a method for producing a such heat-activated bubble-free bonding surface element. Furthermore, the invention relates to a method for producing a bubble-free bonding by means of such a heat-activated bubble-free adhesive surface element.
  • adhesions are often used, by means of which compounds are obtained whose properties can be selectively controlled by the choice of the adhesives used.
  • Usual is the use of single-sided or double-sided adhesive surface elements such as adhesive labels, adhesive tapes, adhesive films and the like.
  • Adhesive articles of this kind have adhesive layers of adhesive compositions on one side surface or on both side surfaces, that is to say surface adhesive coatings or adhesive films by means of which adherence of the adhesive article to the substrate is to be achieved, ie on the substrate or the adhesive base.
  • highly specific adhesives has the consequence that many of the systems used as adhesives require special measures for processing, so that the desired bonding can actually be obtained.
  • Reversible heat-activatable adhesives are, for example, those based on thermoplastic polymers, whereas, for example, reactive adhesives are used as irreversible adhesives in which thermally activatable chemical reactions occur, for example crosslinking reactions, so that they are particularly suitable for the permanent high-strength bonding of substrates.
  • the fluid Since the fluid is released in each case in the context of equilibrium reactions, it can not escape at once, but rather is generated in the adhesive during the entire bonding process and then accumulates at the bonding plane between the adhesive and the substrate, ie at the adhesive surface.
  • the fluid accumulations occur there usually in the form of bubble-like inclusions, which reduce the size of the bond area and also mechanically lift the adhesive, so that the strength of the bond is reduced overall.
  • the deterioration of the bonding stability is, of course, the more pronounced the thicker the coating of the adhesive applied to the substrate and the greater the amount of fluid thus produced during activation.
  • An object of the present invention is therefore to provide a heat-activated adhesive surface element which eliminates these disadvantages and which in particular ensures a bubble-free bonding in a simple manner.
  • a surface element of the type mentioned in which the side surface comprises a channel element which comprises at least one adapted for transporting a fluid channel, wherein the at least one channel is recessed open to the side surface in the side surface and continuously from a Edge portion of the side surface extends to a further edge portion of the side surface.
  • the surface element has a planar design, that is to say that its height extent is small with respect to one or both side expansions.
  • a thread-like surface element whose length is substantially greater than the height and width thereof
  • a band-shaped surface element whose length and width substantially greater than its height, wherein in addition its length is greater than its width, and in a film or label-like surface element Length and width substantially greater than its height, the length and width of which are approximately the same order of magnitude.
  • the plane of the surface element along its length and width corresponds to the main extent of the surface element.
  • such a surface element generally has two side surfaces that are aligned parallel to the major extent of the surface element.
  • a bondable surface element is provided with an adhesive layer whose outer side is connected to the substrate.
  • the adhesive layer comprises at least one heat-activatable adhesive which, when activated, is at the activation temperature, at a temperature above the
  • Room temperature to build a high bond strength to the surface of the substrate is capable of and maintains this high bond strength after activation even at temperatures below the activation temperature, for example at room temperature.
  • the side surface is then in direct contact with the surface of the substrate and forms together with this part of the substrate, the surface of the bond, so the bonding plane.
  • a special embodiment of the one side surface of the surface element is now provided by at least one channel element being arranged there. If a gaseous or liquid fluid is present between the adhesive layer and the substrate and forms a bubble, the channel element makes it possible to move this fluid from the interior of the bonding plane to its edge. Transport of fluid (ie, the removal of the fluid) from the bonding plane is accomplished by creating a pressure differential between the interior and exterior of the fluid-filled bladder, such as in the form of external pressure during strikeout, due to the inherent stress of the adhesive layer, or additional Carrier or when applying a vacuum to the volume outside the bladder. As a result of this pressure differential, the fluid present in the bladder within the channel member is exhausted toward the lower total pressure location.
  • the channel element comprises at least one channel which extends in the bonding plane parallel to the main extent and adapted for transporting the fluid through this channel, so that the fluid can then be transported over the channel without the surface element lifts and there to A local separation of the bond comes when the surface element has been bonded to the substrate.
  • the at least one channel is recessed open into the side surface and thus exposed to the side surface, so that any fluid accumulations, which are located in the interface between the substrate and the surface element, enter the channel and so also on this channel to Edge of the surface element can be transported.
  • the at least one channel runs continuously from one edge section of the side face to another edge section of the side face, so that the fluid transported to the edge of the plane element can leave the channel at an edge region and is thus permanently removed from the bonding plane in a simple manner.
  • the channel element has a multiplicity of channels. In this way, it is possible to derive a large amount of fluid quickly and in a particularly simple manner from the bonding plane between the adhesive and the substrate to the edge of the surface element. This is about then Advantage, if within a short period of time a larger amount of fluid in the
  • Bonding layer forms or accumulates and this is therefore easy to remove so as not to affect the strength of the bond as a whole permanently.
  • the channels are interconnected via one or more crossing points.
  • the channels are interconnected via one or more crossing points.
  • the channels have a substantially equal depth and a substantially equal width.
  • a heat-activated adhesive surface element is obtained, which is particularly uniformly resilient, so that it is avoided that a point tears preferentially under uneven loading of the surface element.
  • the channels have different depths and / or different widths, so that the surface element contains, for example, very small, small, medium, large and very large channels.
  • mechanically less loadable sections are created on the surface element by introducing channels with very large dimensions, at which the surface element preferably tears under uneven loading and would not exist in an arrangement of uniformly medium-sized channels. Nevertheless, in this way a stable surface element can be obtained, since overall the number of medium, large and very large channels can be kept low.
  • the width of a channel is at least 100 nm and at most 2 mm.
  • the formation of such small structures with conventional manufacturing techniques consuming and therefore economically not useful.
  • Total area of the channel element in the side surface makes up more than 2% of the total area of the side surface and at most 65% of the total area of the side surface, preferably more than 5% of the total area of the side surface. If the channel element has a total area of less than 2% of the total area of the side surface, then there are only a few channels with a small width overall, so that the
  • the surface element may also comprise a permanent support. As a result, the surface element is given a high overall resilience to mechanical effects.
  • the surface element may have a second side surface, which is arranged opposite the previously described side surface, which is aligned parallel to the main extent of the surface element and which is also adapted for bonding the surface element to a second substrate.
  • this second side surface may have a second channel element which comprises at least one channel adapted for transporting the fluid, which is recessed into the second side surface open towards the second side surface and runs continuously from one edge section of the second side surface to a further edge section of the second side surface.
  • the surface element comprises a temporary carrier which has a raised ridge element which is designed to be complementary to the at least one channel and which engages in the at least one channel.
  • a temporary carrier which has a raised ridge element which is designed to be complementary to the at least one channel and which engages in the at least one channel.
  • this embodiment simplifies the production of the channel element in the adhesive layer, in that the channel element can be produced with the aid of the temporary carrier in a shaping step.
  • this embodiment also provides a particularly simple method for producing the heat-activated bubble-free bonding surface element, in which a heat-activatable adhesive is applied to an upper side of the temporary support such that the ridge elements on the top of the temporary support during application of the adhesive on the temporary carrier in the adhesive form the channel element formed complementary to the ridge elements and thereby engage in the at least one channel of the channel element.
  • the channel element can be produced in a simple manner using the temporary carrier and the burr elements arranged thereon as a casting mold or embossing die without having to carry out separate structuring steps on the adhesive layer.
  • the second channel element can also be embossed onto the second side of the planar element without a separate structuring step by finally winding the surface element connected to the temporary carrier on a roll in such a way that the heat is transferred to a roller.
  • activatable adhesive on the second side surface of the surface element thereby pressed against a second ridge element on a second, the above-described top side opposite top of the temporary carrier whereby the complementary to the second ridge element formed second channel element is embossed into the adhesive and in the at least one channel engages the second channel element.
  • a method for producing a bubble-free bond by means of the previously described heat-activated bubble-free adhesive surface element is therefore proposed. So far, it is customary to promote the accumulating in the connection plane fluid under strong pressure to the edge of the surface element out. This method has some drawbacks in practice, since the pressure to be applied, which is required for fluid transport, must be large enough to temporarily loosen the hot-state bonding locally during the passage of the fluid and then re-bond it
  • a further object of the invention is therefore to provide a method which eliminates the disadvantages mentioned and, in particular, enables a simplified fluid transport along the bond plane, without resulting in a reduction of the bond strength.
  • This object is achieved by a method in which the surface element is applied under pressure to the substrate in a hot lamination step in such a way that fluid trapped in the bonding surface between the surface element and the substrate is conducted away from the bond surface via the channel element.
  • the heat-activated adhesive is formed and also adapted for a bubble-free connection.
  • a bubble-free connection is any full-surface bonding to a substrate in which no bubbles are present in the bond plane, and this can be achieved without aftertreatment, or at most with very simple aftertreatment.
  • the surface element according to the invention is adapted to at least one of the two parallel to the main extent of the surface element aligned side surfaces, optionally on both side surfaces, for bonding the surface element to the substrate.
  • Such an adaptation includes any measure required for bonding, such as the arrangement of an adhesive directly and accessible on this side surface as well as the selection of an adhesive and adhesive coating adapted to the specific substrate, for instance by means of a roughness of the surface of the substrate sufficient thickness of the adhesive layer or adapted to form a large bond strength with the substrate composition of the adhesive can be achieved.
  • Suitable heat-activatable adhesives are all customary heat-activatable adhesives. Such adhesives may have different polymer structures. Below are just some examples of some typical
  • Such monomers are, for example, acrylic monomers comprising acrylic and methacrylic acid esters having alkyl groups consisting of 1 to 14 carbon atoms.
  • Other usable monomers also in small amounts as an additive to the main monomer in question, are
  • Examples of such further monomers are hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate, allyl alcohol, maleic anhydride, itaconic anhydride, itaconic acid, acrylamide and glyceridyl methacrylate, benzyl acrylate, benzyl methacrylate, phenyl acrylate, phenyl methacrylate, t-butylphenyl acrylate, t-butylphenyl methacrylate, phenoxyethyl acrylate, phenoxyethyl methacrylate, 2-butoxyethyl methacrylate, 2-butoxyethyl acrylate, dimethylaminoethyl methacrylate, dimethylaminoethyl acrylate, diethylaminoethyl methacrylate, diethylaminoethyl acrylate, cyano
  • aromatic vinyl compounds wherein the aromatic nuclei are preferably C4 to C18 building blocks and may also contain heteroatoms such as styrene, 4-vinylpyridine, N-vinylphthalimide, methylstyrene, 3,4-dimethoxystyrene or 4 - Vinylbenzoic acid, although this list is not exhaustive.
  • the monomers are chosen so that the resulting polymers can be used as heat-activatable adhesives.
  • the monomers are selected in accordance with the above, and the quantitative composition of the monomer mixture is chosen such that the desired T G, A value for the polymer according to equation (G1) in analogy to the equation presented by Fox (see TG Fox, Bull. Am. Phys. Soc., 1 (1956) 123) as follows:
  • n the running number over the monomers used
  • w n the mass fraction of the respective monomer n (in% by weight)
  • T G the respective glass transition temperature of the homopolymer from the respective monomer n (in K).
  • the adhesives may also be based on polyolefins, in particular poly- ⁇ -olefins, whose softening range is above 30 0 C and which solidify again during cooling after bonding.
  • polyolefin-based adhesives have about static glass transition temperatures T GA or melting points T S, A SUS a range between 35 0 C and 180 0 C.
  • the adhesive power of these polymers can be further increased by targeted addition.
  • polyimide or polyvinyl acetate copolymers can be used as adhesion-promoting additives for this purpose.
  • the static glass transition temperature T GA or the melting point T S, A for the heat-activable adhesive is further limited. If the temperature is too low, there is a risk that the surface element already softens during delivery or during transport at elevated temperatures and merges with underlying webs, so that the surface element can not be detached.
  • the molecular weight and the composition of the comonomers can be varied. In order to set a low static glass transition temperature T G, A or a low melting point T S, A , for example, polymers with a medium or low
  • Polyethylene and polyethylene copolymers can be applied, for example, as aqueous dispersions in the form of a layer.
  • the composition of the particular mixture to be used in turn depends on the desired static glass transition temperature T G, A or the desired melting point T S, A of the resulting heat-activable adhesive.
  • a heat-activatable adhesive can also be formed on the basis of elastomeric base polymers and at least one modification resin.
  • elastomeric base polymer it is possible to use all suitable elastomeric polymers, for example rubbers, nitrile rubbers, epoxidized nitrile rubbers, polychloroisoprenes and polyacrylates.
  • the rubbers may be natural rubbers or synthetic rubbers.
  • synthetic rubber are all conventional synthetic rubber systems in question, such as those based on
  • Polyvinyl butyral polyvinyl formal, nitrile rubbers, nitrile butadiene rubbers, hydrogenated nitrile butadiene rubbers, polyacrylate rubbers, chloroprene rubbers, ethylene-propylene-diene rubbers, methyl-vinyl silicone rubbers, fluorosilicone rubbers, tetrafluoroethylene-propylene copolymer rubbers, butyl rubbers or styrene
  • Butadiene rubbers The synthetic rubbers are usually chosen so that they have a softening or glass transition temperature from a temperature range of -80 0 C to 0 0 C.
  • nitrile butadiene rubbers include Europrene TM from Eni Chem, or Krynac TM from Bayer, or Breon TM and Nipol N TM from Zeon.
  • Polyvinylformals may be obtained, for example, as Formvar TM from Ladd Research.
  • Polyvinyl butyrals are available as Butvar TM from Solutia, under Pioloform TM from Wacker and under Mowital TM from Kuraray.
  • hydrogenated nitrile butadiene rubbers for example, the products Therban TM from Bayer and Zetpol TM from Zeon are available.
  • Polyacrylate rubbers are, for example, commercially available as Nipol AR TM from Zeon.
  • Baypren TM from Bayer is available as chloroprene rubbers.
  • Ethylene-propylene-diene rubbers can be obtained, for example, as Keltan TM from DSM, as Vistalon TM from Exxon Mobil and as Buna EP TM from Bayer.
  • Methyl vinyl silicone rubbers are available as Silastic TM from Dow Corning and Silopren TM from GE Silicones.
  • fluorosilicone rubber for example, Silastic TM GE Silicones in question.
  • Butyl rubbers are available as Esso Butyl TM from Exxon Mobil.
  • Buna S TM from Bayer Europrene TM from Eni Chem and Polysar S TM from Bayer can be used.
  • thermoplastic polymers are preferably selected from the group of the following polymers: polyurethanes, polystyrenes, acrylonitrile-butadiene-styrene terpolymers, polyesters, hard polyvinyl chlorides, flexible polyvinyl chlorides, polyoxymethylenes, polybutylene terephthalates, polycarbonates, fluorinated polymers such as polytetrafluoroethylene, polyamides, ethylene vinyl acetates, Polyvinyl acetates, polyimides, polyethers, copolyamides, copolyesters, polyolefins such as polyethylene, polypropylene, polybutene, polyisobutene and poly (meth) acrylates.
  • the thermoplastic polymers are usually so chosen to have a softening or glass transition temperature of one
  • Modification resins which can be used are all resins which influence the adhesive properties of the adhesive, in particular the adhesive force-increasing resins and
  • Reactive resins As the adhesive force-increasing resin, any known tackifier resins can be used.
  • the proportion of the modification resins to the adhesive is usually between 25 and 75 wt .-%, based on the mass of the total mixture of elastomeric polymer and modification resin.
  • thermoplastic material (soluble) resins can be used, in particular aliphatic, aromatic or alkylaromatic hydrocarbon resins, hydrocarbon resins based on pure monomers, hydrogenated hydrocarbon resins, functional hydrocarbon resins and natural resins.
  • the adhesive may comprise a reactive resin which is capable of crosslinking with itself, with other reactive resins and / or with the at least one nitrile rubber of the adhesive.
  • Reactive resins in an adhesive affect the adhesive properties of this adhesive as a result of chemical reactions.
  • all conventional reactive resins can be used as reactive resins, for example epoxy resins, phenolic resins, terpene-phenolic resins, melamine resins, resins with isocyanate groups or mixtures of these resins.
  • the epoxy resins comprise the entire group of epoxy compounds.
  • the epoxy resins may be monomers, oligomers or polymers.
  • Polymeric epoxy resins can aliphatic, cycloaliphatic, aromatic or heterocyclic nature.
  • Epoxy resins usually have at least two epoxide groups which can be used for crosslinking.
  • the molecular weight of the epoxy resins varies from 100 g / mol to at most 10,000 g / mol for polymeric epoxy resins.
  • the epoxy resins include all common epoxides, such as the reaction product of bisphenol A and epichlorohydrin, the reaction product of phenol and formaldehyde (called novolak resins) and epichlorohydrin, glycidyl ester or the reaction product of epichlorohydrin and p-aminophenol.
  • Such epoxy resins are commercially available, for example, as Araldite TM 6010, CY-281 TM, ECN TM 1273, ECN TM 1280, MY 720, RD-2 from Ciba Geigy, as DER TM 331, DER TM 732, DER TM 736, DEN TM 432, DEN TM 438, DEN TM 485 from Dow Chemical, as Epon TM 812, 825, 826, 828, 830, 834, 836, 871, 872,1001, 1004, 1031 etc. and as HPT TM 1071, HPT TM 1079 the latter from Shell Chemical.
  • Examples of commercial aliphatic epoxy resins are, for example, vinylcyclohexanedioxides such as ERL-4206, ERL-4221, ERL 4201, ERL-4289 or ERL-0400 from Union Carbide Corp.
  • novolac resins which can be used are Epi-Rez TM 5132 from Celanese, ESCN-001 from Sumitomo Chemical, CY-281 from Ciba Geigy, DEN TM 431, DEN TM 438, Quatrex 5010 from Dow Chemical, RE 305S from Nippon Kayaku, Epiclon TM N673 from DaiNipon Ink Chemistry or Epikote TM 152 from Shell Chemical.
  • phenolic resins conventional phenolic resins may be used, such as YP 50 from Toto Kasei, PKHC from Union Carbide Corp. or BKR 2620 from Showa Union Gosei Corp. Phenolic resole resins can also be used as reactive resins, alone or in combination with other phenolic resins.
  • terpene phenolic resins all conventional terpene phenolic resins can be used, for example NIREZ TM 2019 from Arizona Chemical.
  • Melamine resins can be any of the common melamine resins, such as Cymel TM 327 and 323 from Cytec.
  • resins with isocyanate groups there can be used conventional resins functionalized with isocyanate groups, for example Coronate TM L from Nippon Polyurethane Ind., Desmodur TM N3300 or Mondur TM 489 from
  • the adhesive may optionally also contain crosslinkers and accelerators.
  • Suitable accelerators are any suitable accelerators known to those skilled in the art, such as imidazoles, commercially available as 2M7, 2E4MN, 2PZ-CN, 2PZ-CNS, P0505 and L07N from Shikoku Chem. Corp. and as Curezol 2MZ from Air Products, as well as amines, especially tertiary amines.
  • Suitable crosslinkers are all suitable crosslinkers known to the person skilled in the art, for example hexamethylenetetramine (HMTA).
  • the adhesive may optionally also contain further constituents, for example plasticizers, fillers, nucleating agents, blowing agents, adhesion-increasing additives and thermoplastic additives, compounding agents and / or anti-aging agents.
  • plasticizers for example plasticizers, fillers, nucleating agents, blowing agents, adhesion-increasing additives and thermoplastic additives, compounding agents and / or anti-aging agents.
  • plasticizers it is possible to use all suitable plasticizers known to the person skilled in the art, for example those based on polyglycol ethers, polyethylene oxides, phosphate esters, aliphatic carboxylic esters and benzoic esters, aromatic carboxylic esters, relatively high molecular weight diols, sulfonamides and adipic acid esters.
  • Fillers which can be used are all suitable fillers known to the person skilled in the art, for example fibers, carbon black, metal oxides such as zinc oxide and titanium dioxide, chalk, silicic acid, silicates, solid spheres, hollow spheres or microspheres made of glass or other materials.
  • anti-aging agents it is possible to use all suitable anti-aging agents known to the person skilled in the art, for example those based on primary and secondary antioxidants or light stabilizers.
  • adhesion-increasing additives it is possible to use all suitable adhesion-increasing additives known to the person skilled in the art, for example polyvinylformal, polyvinylbutyral, polyacrylate rubber, chloroprene rubber, ethylene-propylene-diene rubber, methyl-vinyl-silicone rubber, fluorosilicone rubber, tetrafluoroethylene.
  • polyvinylformal polyvinylbutyral
  • polyacrylate rubber chloroprene rubber
  • ethylene-propylene-diene rubber methyl-vinyl-silicone rubber
  • fluorosilicone rubber fluorosilicone rubber
  • tetrafluoroethylene tetrafluoroethylene
  • Propylene copolymer rubber butyl rubber or styrene-butadiene rubber.
  • Polyvinylformals are available on Formvar TM from Ladd Research. Polyvinyl butyrals are available as Butvar TM from Solutia, under Pioloform TM from Wacker and under Mowital TM from Kuraray. Polyacrylate rubbers are available under Nipol AR TM from Zeon. Chloroprene rubbers are available under Baypren TM from Bayer. Ethylene-propylene-diene rubbers are available under Keltan TM from DSM, under Vistalon TM from Exxon Mobil and under Buna EP TM from Bayer. Methyl vinyl silicone rubbers are available from Silastic TM from Dow Corning and Silopren TM from GE Silicones.
  • Fluorosilicone rubbers are available under Silastic TM from GE Silicones. Butyl rubbers are available under Esso Butyl TM from Exxon Mobil. Styrene-butadiene rubbers are available under Buna S TM from Bayer, Europrene TM from Eni Chem, and Polysar S TM from Bayer.
  • thermoplastic additives it is possible to use all suitable thermoplastics known to the person skilled in the art, for example thermoplastic materials from the group of polyurethanes, polystyrene, acrylonitrile-butadiene-styrene terpolymers, polyesters, hard polyvinyl chlorides, flexible polyvinyl chlorides, polyoxymethylenes, polybutylene terephthalates, polycarbonates, fluorinated Polymers such as polytetrafluoroethylene, polyamides, ethylene vinyl acetates, polyvinyl acetates, polyimides, polyethers, copolyamides, copolyesters, poly (meth) acrylates and polyolefins such as polyethylene, polypropylene, polybutene and polyisobutene.
  • thermoplastic materials from the group of polyurethanes, polystyrene, acrylonitrile-butadiene-styrene terpolymers, polyesters, hard polyvinyl chlor
  • the adhesive force of the heat-activated adhesive surface element can be increased by further targeted addition, for example by using polyimine copolymers and / or polyvinyl acetate copolymers as adhesion-promoting additives.
  • the surface element comprises at least one channel element on the side surface.
  • This channel element has one or more channels, which may have any suitable arrangements, so that in the simplest case, the channel element thus consists of only a single channel.
  • a channel is meant any substantially elongated groove-like depression, which is suitable for fluid removal.
  • the channel cross section may have all the usual profiles, such as a semicircle, a half oval, a triangle, a rectangle or square, a trapezoid, an irregular shape or the like.
  • the channel or channels are in this case embedded in the adhesive layer, so that the inner
  • Cavity of each channel is exposed on the side surface and is accessible from the side surface. In this way, any fluid that is present in the bonding between the adhesive on the side surface and the surface of the substrate, from there into the at least one channel can get in directly.
  • the at least one channel runs continuously from one edge section of the side face to a further edge section of the side face.
  • each region in an outer edge side surface of the surface element which is arranged substantially perpendicular to the main extent of the surface element.
  • To such edge side surfaces such a channel is not delimited by a wall, but rather open.
  • any fluid can escape via the opening in the edge side surface from the channel space formed by the channel and the substrate surface during the bonding and thus leave the surface element and the bonding plane permanently.
  • the arrangement is of one
  • a channel is considered in which fluid transport may be from one end of the channel to a second end of the channel. At this second end, the fluid can then either leave the surface element directly or be forwarded into further channels, which are connected to the channel and over which it can then leave the surface element.
  • the term “continuous” includes a plurality of channels not connected to each other with blind end sections, through which fluid can be transported only to one open end of each channel, but at least two different edge sections on the outer edge side surfaces of the surface element having such openings at least one channel only has to pass through it until any fluid has been removed from the bonding plane during the bonding of the surface element on the substrate and a bubble-free bond is obtained, after which the channel can either continue to be continuous or become impassable, for example because of this a later viscous flow of the adhesive completely or locally clogged.
  • these can have any suitable geometries. For example, a plurality of parallel mutually extending channels, which are not connected to each other, form the channel element.
  • the channel element may also consist of a multi-branching channel forming a dendrimeric or branched channel system.
  • other arrangements of the channels are also possible, so that, for example, also network or grid-like channel arrangements can form a channel system according to the invention.
  • channels are connected to one another via one or more crossing points, so that the fluid conveyed via the channel element can pass from one channel to another channel.
  • the channel element may also have multiple channel systems side by side.
  • FIGS. 1 to 4. Some typical examples of structures of a channel element according to the invention are shown schematically in FIGS. 1 to 4. Show it
  • Fig. 3 shows a third structure of the channel element
  • the major extent of the surface element is in each case parallel to the representation plane, and the outer edge side surfaces of the rectangular surface element are reproduced as thin outer boundary lines.
  • the thicker black lines represent the arrangement of the channels within the channel element, respectively, and the white areas thus represent the adhesive areas of the side surface of the area element that are in contact with the substrate.
  • a coherent lattice-like structure of a plurality of interconnected channels is shown, which meet at the intersection points at right angles to each other. All channels of this structure have the same width,
  • FIG. 2 likewise shows a coherent lattice-like structure comprising a plurality of interconnected channels.
  • the structure reproduced here is constructed irregularly with respect to that of FIG. 1, so that the channels meet at different points and distances at the crossing points. Also in this structure all channels have the same width.
  • a non-contiguous structure of a plurality of individual channels is shown, which are arranged in a preferred direction. Also, this structure is irregular, so that the channels have partial curves with different radii of curvature. Also in this structure all channels have the same width.
  • FIG. 4 shows a coherent grid-like structure made up of a plurality of interconnected channels which meet at right angles to each other at the points of intersection. In contrast to the structure of FIG. 1, however, the channels of this structure have different widths.
  • channel elements according to the invention can also be constructed trapezoidal, triangular or the like.
  • the channels may have any suitable dimensions;
  • the channels may have a substantially equal depth and a substantially equal width, or different channels may have different depths and / or different widths.
  • the latter embodiment comprises systems with bimodal, trimodal or polymodal channel dimensions in which there are two different, three different or many different channel cross sections.
  • the maximum depth of a channel is thereby limited by the thickness of the adhesive layer, whereas the width of a channel is at least 100 nm and at most 2 mm.
  • the total area of the channel element lying on the side surface should account for more than 2% of the total area of the side surface of the surface element and at most 65% of the total area of the side surface of the surface element, preferably more than 5% of the total area of the side surface.
  • the channels must also be adapted for transporting a fluid. This includes any necessary and / or effective action that enables or enhances fluid transport through the channels of the channel member. This may for example be an adaptation of the geometry of the channel, such as an adjustment of the dimensions of the channel or an adjustment of the shape of the cross section of the channel, as well as an adjustment of the nature of the channel walls. The latter is necessary, for example, if the adhesive is to be heated to such high temperatures for activation that the viscosity of the adhesive decreases sharply.
  • the surface element may comprise a permanent carrier or may be formed without a carrier.
  • a carrier-free training such as a transfer adhesive tape with two different adhesives or with only one adhesive, is useful if the surface element is to have a total as small a height as possible, such as in bonding in the miniature area.
  • the training with an additional carrier for example, particularly favorable when a particularly high mechanical stability of the surface element is required, such as highly loaded compounds and to improve the punchability when using surface elements as stampings.
  • Such a permanent carrier can be made of any materials known to those skilled in the art, for example, polymers such as polyester, polyethylene, polypropylene including modified polypropylene such as biaxially oriented polypropylene (BOPP), polyamide, polyimide, polyvinyl chloride or polyethylene terephthalate, as well as natural products; These can be used as woven, knitted, non-woven, nonwovens, papers, foams, films and be formed or the like of combinations thereof, such as laminates or
  • a permanent carrier when used, it can be provided on one or both sides with an adhesion promoter, a so-called "primer".
  • Conventional primer systems can be used as such adhesion promoters, for example heat-seal adhesives based on polymers such as ethylvinyl acetate or functionalized ethylvinylacetates or also reactive polymers.
  • functional groups it is possible to use all customary adhesion-promoting groups, for example epoxide, aziridine, isocyanate or maleic anhydride groups.
  • the adhesion promoters may also be accompanied by additional crosslinking components, for example melamine resins or melamine-formaldehyde resins.
  • adhesion promoters based on polyvinylidene chloride and copolymers of vinylidene dichloride, in particular with vinyl chloride are well suited (for example Saran from the Dow Chemical Company).
  • the surface element can be equipped either on one side or on both sides adhesive, that is, either only one of the aligned parallel to the main extent of the surface element side surfaces is equipped with an adhesive layer or in addition, the second side surface, in the surface element on the one side surface opposite lying side.
  • the adhesives of the adhesive layers on the two side surfaces may in the latter case be identical or different, depending on the intended use and the substrates to be bonded.
  • an inventive surface element could also represent a carrier-free transfer adhesive tape, which consists of a single adhesive in an adhesive layer.
  • the second adhesive layer may also be suitable
  • Channel element wherein the second channel element may be identical or different from the first channel element.
  • the blended adhesive is applied to a support.
  • the application of the adhesives can directly on the
  • Surface element can be performed - for example, on a permanent support or another, surface spreading adhesive layer.
  • the application may also be indirect, such as using a temporary carrier such as a process liner or a release liner.
  • temporary carrier it is possible to use all temporary carriers known to the person skilled in the art, for example release films, release coatings or release papers.
  • Release films are, for example, adhesion-reduced films based on polyethylene, polypropylene (also oriented polypropylene such as biaxially oriented polypropylene), polyethylene terephthalate, polyethylene naphthalate, polyvinyl chloride, polyester, polyimide or mixtures of these materials.
  • Release varnishes are often silicone varnishes or fluorinated varnishes to reduce adhesion.
  • release papers all known to those skilled suitable release papers, such as those based on high-pressure polyethylene (LDPE) produced in low pressure polyethylene (HDPE), glassine or glassine.
  • the release agent may be additionally equipped with a release layer for further adhesion reduction.
  • Suitable for a release layer are all customary materials known to the person skilled in the art, for example silicone release lacquers or fluorinated release lacquers.
  • one of the two sides of such a release liner to be coated has a lower release force than the other side, so that the adhesive adheres better on this one side.
  • rewinding of the adhesive can be avoided during the unwinding of surface elements mounted on rollers, since it is easier to detach from the other side than from one side.
  • the application of the adhesive to the surface element is carried out by conventional methods by means of conventional devices, such as a melt nozzle or an extrusion die.
  • the surface element is coated on one side with the adhesive.
  • a sheet-like adhesive coating obtained in this way from the applied adhesive can cover the surface element on one side over the entire surface or can only be applied locally.
  • the adhesive can be applied from a solution.
  • Solvents which are preferably used are solvents in which at least one of the components of the adhesive has good solubility.
  • any solvent present may be removed, for example in a concentration extruder under reduced pressure.
  • single-screw extruders or twin-screw extruders can be used which distill off the solvent in the same vacuum stage or in different vacuum stages and optionally have a preheating of the feed.
  • the adhesive can be applied to one side of a carrier and in a second step, the same or a different adhesive to the other side of the carrier.
  • the one or more adhesives may also be applied to a release agent in a first step and the same or another adhesive in a second coating step from the solution or melt directly to the one adhesive, not the release agent covered side of an adhesive. In the latter way, a carrier-free surface element is obtained, for example a transfer adhesive tape.
  • both adhesive layers are first applied separately to a temporary carrier or a release agent and then joined together in a subsequent step.
  • two adhesive coatings applied to temporary substrates can be laminated directly to one another in a hot lamination process under pressure and temperature, for example by means of a hot roll laminator with one or two heated rolls.
  • both adhesive layers can also be joined directly to each other or to a common carrier in a common process step, for example as part of a coextrusion.
  • the channel element can be introduced in a final step into the surface of the adhesive on the side surface of the surface element by means of conventional structuring methods, such as lithographic processes, wet chemical etching, laser ablation, galvanic process steps or a mechanical process, such as milling or embossing external stamp or embossing rollers.
  • conventional structuring methods such as lithographic processes, wet chemical etching, laser ablation, galvanic process steps or a mechanical process, such as milling or embossing external stamp or embossing rollers.
  • the channel element is transferred to the heat-activatable adhesive via a corresponding inverse or complementary formation of the temporary carrier.
  • a temporary carrier has a raised ridge element which is designed to be complementary to the at least one channel and which engages in the at least one channel.
  • the adhesive may also be applied as an at least partially liquid substance - that is, in a molten state or as a monomer or partially polymerized precursor before crosslinking - onto the structured temporary support and transferred there to the more solid state (such as by cooling or cooling) Post-crosslinking), so that the channel element is formed in this shaping casting step upon solidification of the adhesive in the side surface.
  • the topography of the temporary carrier may in this case be designed in accordance with the channel systems described above and have contiguous elevations as a ridge element, which may have any desired structure, such as round or angular. These surveys occupy at least 2% and at most 65% of the total area of the temporary carrier, preferably more than 5% thereof.
  • the non-raised surface of the temporary carrier may have all the usual structures, with planar formation being practical for most applications. However, according to the desired surface finish of the adhesive layer or easier removability of the temporary support from the adhesive layer, the planar surface may also have a microroughness, but then below the height of the
  • the at least one burr element can be applied to the surface of the temporary carrier by any shaping and shape-changing methods.
  • the structure of the ridge element can be embossed into the surface of the temporary carrier by means of an embossing roller, this embossing optionally being carried out at high temperatures.
  • the at least one burr element can also be produced by other methods, for example in lithographic processes, wet-chemical etching, laser ablation, in galvanic process steps or a mechanical process, for example by means of a milling device. If it is intended to apply a release lacquer to the temporary support to be more easily peeled from the adhesive for use, the release lacquer may be applied either prior to the formation of the structure of the fin element or after the formation of the structure.
  • the release coating can also be used to produce the ridge element, for example, by the paint after the application forms the ridge element itself.
  • the temporary carrier can have on one side such a burr element, so that for a double-sided glued surface element each side surface of the surface element must be provided with its own temporary support (so-called double-liner product).
  • both sides of the temporary carrier can each have a ridge element or a plurality of ridge elements, so that only a single double-sided structured temporary carrier is required for a double-sided adhesive surface element (so-called single-liner product).
  • the production of the channel element via a temporary carrier provided with at least one burr element can be carried out in any suitable manner.
  • the adhesive can be applied directly to the surface of the temporary carrier and thereby form the channel element.
  • the application of the adhesive can be carried out from aqueous or organic solution, wherein any solvent residues can be removed in a drying line, such as a heating channel or IR channel.
  • the heat-activatable adhesive assumes the structure of the channel element complementary to the structure of the ridge element.
  • the heat-activatable adhesive can also be applied from the melt to the structured temporary carrier.
  • the channel element in this case can only be formed in the adhesive if the viscosity of the molten adhesive is low. In the case of a high viscosity of the melt, this can additionally require impressing the flash element into the adhesive with subsequent pressing of the temporary backing onto the adhesive, for example by means of pressure rolls or pressure rolls.
  • the heat-activatable adhesive may also be clad on the structured temporary carrier.
  • the lamination In order to transfer the structure from the burr element to the adhesive under these conditions, the lamination must be carried out under pressure, for example using one or more laminating rollers, such as rubberized rollers.
  • the structure of a ridge element can also be introduced into the adhesive during winding and storage of the surface element in roll form by, for example, winding the surface element provided with the temporary support under high winding tension onto a roll core, so that the structure of the ridge element with high efficiency complementary forms in the adhesive.
  • This method is also suitable for intensifying a weak structuring of the adhesive during storage.
  • the methods described above are also suitable for applying a channel element to the second side surface of the planar element.
  • the temporary carrier is first connected on one side with the surface element according to one of the methods described above and then wound on a roll for storage such that the heat-activatable adhesive on the second side surface of the surface element so strong against the second ridge element on the second top of is pressed temporary carrier that due to the contact pressure, the second channel element in the
  • Adhesive is impressed and thereby forms the second channel element complementary.
  • the sheet-like surface element thus produced can be brought into desired shapes by punching or any other suitable method, such as Rings, bows or stripes.
  • Surface element is depending on the application usually in a range of about 10 microns to about 10 mm, more precisely, from 25 microns and up to 1 mm.
  • a (flat) bonding is carried out by means of hot lamination. If, for example, a first substrate is to be connected to a second substrate, then in a first step the heat-activatable adhesive together with the structured temporary carrier can be laminated onto the first substrate by means of a roll laminator. Subsequently, the temporary carrier is removed and brought the thus exposed second adhesive of the surface element with the second substrate in contact. Finally, the second bond is produced by means of a roll laminator.
  • the individual steps can also be carried out in a different order.
  • the temporary carrier may first be removed and the first substrate, the planar element and the second substrate may be arranged in the desired position relative to each other, and then finally passed through the heating roller laminator as a sandwich-type loose composite for bonding both adhesive surfaces.
  • the throughput speeds are 0.5 to 50 m / min, often 2 to 10 m / min.
  • the heating rollers of the roller laminator can be heated from the inside or else from an external heat source.
  • the composite of substrate or substrates and surface element can also be heated in a first step without pressure - for example, in a heating section - and then joined together by a self-heated roller laminator under pressure.
  • thermoplastic adhesives Two different heat-activatable adhesives were prepared as follows: A solution of a polymer mixture in methyl ethyl ketone was prepared in a kneader.
  • the polymer blend consisted of 50% by weight of a nitrile rubber (Example 1: Breon N36 C80 from Zeon, Example 2: Nipol N1094-80 from Zeon) and 40% by weight of a phenol novolac resin (Durez 33040), which was treated with 8 wt .-% hexamethylenetetramine (Rohm and Haas) and with 10 wt .-% of a phenolic resole resin (9610 LW of Bakelite) was mixed. After a kneading time of 20 h, a solution containing 30% by weight of the polymer mixture was obtained.
  • a structured temporary support was used, which was constructed in three layers.
  • the temporary carrier contained as paper core a glassine paper with a basis weight of 100 g / m 2 .
  • the paper core was coated directly with low-pressure polyethylene (HDPE) with a layer thickness of 20 ⁇ m. Since the adhesive force of the heat-activable adhesive on the temporary support is very low at room temperature, it was coated with an adhesion-promoting silicone-based agent with a mass application of 1.9 g / m 2 , which was sufficient to 20% by weight Contained "blunt" silicone as a so-called controlled release agent.
  • HDPE low-pressure polyethylene
  • Burr element produced by means of an embossing step.
  • the temporary carrier was passed through a gap of a structured metal embossing roller and a rubberized roller so that the polyethylene coated side of the carrier was in contact with the metal embossing roller.
  • the roll temperature of the two rolls was 160 0 C and the pressure of this Gravierrollenlaminators was 8 bar / cm.
  • the metal roll here had a milled diamond-shaped structure whose diamonds had an edge length of 4 mm.
  • a channel system was created on the embossing roll, the channels of which were continuously formed and bounded on both sides by rhombuses.
  • the width of the channels was 50 microns and the depth of the channels 25 microns.
  • a double-sided adhesive surface element provided with a channel element on both sides was prepared as a transfer adhesive tape which contained no permanent support and whose two side surfaces had the same adhesive.
  • the above-described 30% solution of the heat-activable adhesive was spread on the structured side surface of the temporary carrier and dried at 100 0 C for 10 min. After drying, an adhesive layer having a layer thickness of 200 ⁇ m was obtained.
  • a second temporary support which was identical to the first temporary support, was laminated using a Schurollenlaminators at 120 0 C with a contact pressure of 2 bar and a rolling speed of 1 m / min such that the second structured side surface of the second temporary Carrier was directed to the exposed unstructured side of the adhesive.
  • a thermally-bonded surface element provided with two temporary supports was obtained as a double-liner product.
  • the temporary carrier was unilaterally pulled off a square heat-activated adhesive surface element with a side length of 50 cm and the surface element with the thus exposed adhesive mass side on the previously cleaned Surface of the respective substrate launched. Subsequently, the second became temporary
  • a test specimen composite was produced by laminating a transparent polyethylene terephthalate film from SKC with a thickness of 50 ⁇ m by means of a heat-activated adhesive surface element with an aluminum sheet of 0.15 mm thickness. After the hot lamination, the appearance of the bond through the transparent film was inspected for occurrence of fluid inclusions in the joint plane.
  • the peel strength was investigated on a test piece composite of two polyimide-copper laminates.
  • the surface element was laminated on one of its two side surfaces on the polyimide side of a laminate of a polyimide film and a copper foil. Subsequently, on the second exposed side surface of the sheet member, the polyimide side of a second laminate of a polyimide film and a copper foil was laminated. In this way, a test composite of two polyimide-copper laminates was obtained, which were connected to each other via an adhesive joint of a heat-activated adhesive surface element.
  • This test composite was then brought to a measurement temperature of 23 0 C and equilibrated at a humidity of 50%.
  • the test specimen composite was pulled apart at a feed rate of 50 mm / min at a draw angle of 180 ° by means of a tensile load tester (Zwick GmbH & Co. KG).
  • the area-related energy (in N / cm) required to release the bond and separate the test pieces from each other was obtained.
  • the respective data value for the maximum tensile load at this temperature was the average of three individual measurements each.
  • the bond strength as a dynamic shear strength was analogous to
  • DIN EN 1465 determined using two aluminum sheets, each having a thickness of 0.1 mm.
  • the bond strength results as the area-related maximum force (in N / mm 2 ).

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

La présente invention concerne un élément plat qui colle sans bulle sous l'effet de la chaleur. Cet élément comporte au moins un matériau adhésif activable sous l'effet de la chaleur et présente sur une face latérale un élément à canal. Ledit élément à canal comporte au moins un canal conçu pour transporter un fluide. Ce canal est encastré dans la face latérale de l'élément plat, ouvert vers la face latérale, et s'étend en continu d'une section de bord de la face latérale à une autre section de bord de la face latérale. Cette structure de canal formée par le ou les canaux permet d'évacuer du plan de collage des fluides liquides ou gazeux qui se forment ou s'accumulent dans la surface de collage, de manière à améliorer la solidité du collage. Cette invention concerne également des procédés de fabrication et d'application de cet élément plat.
EP08708586A 2007-02-28 2008-02-01 Élément plat collant sous l'effet de la chaleur Withdrawn EP2125983A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007010171A DE102007010171A1 (de) 2007-02-28 2007-02-28 Hitze-aktiviert verklebendes Flächenelement
PCT/EP2008/051280 WO2008104439A1 (fr) 2007-02-28 2008-02-01 Élément plat collant sous l'effet de la chaleur

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EP2125983A1 true EP2125983A1 (fr) 2009-12-02

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EP (1) EP2125983A1 (fr)
JP (1) JP2010519394A (fr)
KR (1) KR20100014630A (fr)
CN (1) CN101668824A (fr)
DE (1) DE102007010171A1 (fr)
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WO (1) WO2008104439A1 (fr)

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KR101584845B1 (ko) * 2011-11-14 2016-01-14 주식회사 엘지화학 접착 필름
DE102012215345A1 (de) * 2012-08-29 2014-03-06 Tesa Se Gerilltes Klebeband
DE102013105728A1 (de) * 2013-06-04 2014-12-04 POLIFILM EXTRUSION GmbH Mehrschichtfolie mit thermisch aktivierbarer Kleberschicht
USD747583S1 (en) * 2013-10-24 2016-01-12 Schroeder & Tremayne, Inc. Drying mat
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US20080202682A1 (en) 2008-08-28
JP2010519394A (ja) 2010-06-03
DE102007010171A1 (de) 2008-09-04
CN101668824A (zh) 2010-03-10
KR20100014630A (ko) 2010-02-10
TW200846440A (en) 2008-12-01

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