EP1757168A1 - Element chauffant, son procede de fabrication, article dote d'un tel element et son procede de fabrication - Google Patents
Element chauffant, son procede de fabrication, article dote d'un tel element et son procede de fabricationInfo
- Publication number
- EP1757168A1 EP1757168A1 EP05775284A EP05775284A EP1757168A1 EP 1757168 A1 EP1757168 A1 EP 1757168A1 EP 05775284 A EP05775284 A EP 05775284A EP 05775284 A EP05775284 A EP 05775284A EP 1757168 A1 EP1757168 A1 EP 1757168A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- resin
- dielectric
- layer
- heating element
- charges
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 64
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000010410 layer Substances 0.000 claims abstract description 129
- 229920005989 resin Polymers 0.000 claims abstract description 70
- 239000011347 resin Substances 0.000 claims abstract description 70
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 239000011241 protective layer Substances 0.000 claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 210000003298 dental enamel Anatomy 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 239000004697 Polyetherimide Substances 0.000 claims description 8
- 239000004642 Polyimide Substances 0.000 claims description 8
- 239000000945 filler Substances 0.000 claims description 8
- 229920001601 polyetherimide Polymers 0.000 claims description 8
- 229920001721 polyimide Polymers 0.000 claims description 8
- 229920012287 polyphenylene sulfone Polymers 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000011231 conductive filler Substances 0.000 claims description 6
- 238000010411 cooking Methods 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 238000007650 screen-printing Methods 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920002312 polyamide-imide Polymers 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 125000001174 sulfone group Chemical group 0.000 claims description 4
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 230000000181 anti-adherent effect Effects 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 150000001247 metal acetylides Chemical class 0.000 claims description 3
- 150000004767 nitrides Chemical class 0.000 claims description 3
- 229920000570 polyether Polymers 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000004927 clay Substances 0.000 claims description 2
- 229910052570 clay Inorganic materials 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 230000008021 deposition Effects 0.000 claims description 2
- 238000010292 electrical insulation Methods 0.000 claims description 2
- 229910002804 graphite Inorganic materials 0.000 claims description 2
- 239000010439 graphite Substances 0.000 claims description 2
- 229910052735 hafnium Inorganic materials 0.000 claims description 2
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010445 mica Substances 0.000 claims description 2
- 229910052618 mica group Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 239000010453 quartz Substances 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 239000000454 talc Substances 0.000 claims description 2
- 229910052623 talc Inorganic materials 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 229910052726 zirconium Inorganic materials 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 229910052500 inorganic mineral Inorganic materials 0.000 claims 1
- 239000011707 mineral Substances 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 12
- 229910000838 Al alloy Inorganic materials 0.000 description 8
- 238000010304 firing Methods 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000011246 composite particle Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002320 enamel (paints) Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 235000000396 iron Nutrition 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- -1 polyphenylene Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/262—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an insulated metal plate
Definitions
- Heating element its manufacturing process, article having such an element and its manufacturing method
- the present invention relates to a heating element intended to be deposited on a metal substrate, for example aluminum or aluminum alloy, and its method of manufacture.
- the invention also relates to an article provided with such a heating element and the method of manufacturing such an article.
- the use of the heating elements according to the invention can be envisaged for the manufacture of cooking utensils or cooking utensils, iron soles, cups of kettles, etc.
- the heating element of the present invention must be able to deliver high power, with a power / surface ratio of at least 1 W / cm 2 and up to values of the order of 40 W / cm 2 . If desired, this type of heating element must be able to distribute the heat uniformly over an entire surface and this, whether the power is high or low.
- Such heating elements consist of enamels which are obtained from an enamel frit subjected to a firing temperature of the order of 85O 0 C. Given this manufacturing constraint, they are deposited on a substrate metal capable of withstanding such temperatures, for example of the steel, stainless steel or alumina type. Such enamels are not against not suitable for a deposit on an aluminum substrate.
- the object of the present invention is therefore to overcome all the disadvantages mentioned above by providing a heating element intended to be deposited on a metal substrate, for example aluminum or aluminum alloy, or even stainless steel , capable of delivering high powers, in particular with a surface / power ratio of up to values of the order of 40 W / cm 2 while retaining good dielectric performance and / or capable of delivering a homogeneous heat on a whole surface.
- a heating element intended to be deposited on a metal substrate, for example aluminum or aluminum alloy, or even stainless steel , capable of delivering high powers, in particular with a surface / power ratio of up to values of the order of 40 W / cm 2 while retaining good dielectric performance and / or capable of delivering a homogeneous heat on a whole surface.
- the heating element must have a simple structure and have a very good homogeneity.
- the present invention thus relates to a heating element intended to be deposited on a metal substrate, preferably aluminum or aluminum alloy.
- this element comprises, from the substrate, at least one dielectric layer comprising a resin and dielectric fillers, at least one resistive layer comprising a resin and electrically conductive fillers, at least one conductive layer which is intended for electrical connection of said to least one resistive layer and which comprises a resin and electrically conductive fillers and at least one final protective layer comprising a resin and dielectric fillers, said dielectric, resistive, conductive and final protection layers comprising the same resin, said resin being a organic resin.
- the heating element according to the invention is therefore produced by the superposition of layers, each layer having a composition specifically adapted to the desired function for said layer.
- the choice of the resin is determined by the conditions of manufacture of the heating element and end use of the latter.
- an exclusively organic resin resistant to high temperatures for example at least 200-250 ° C., will be chosen in operating mode of the heating element.
- the resin present in the dielectric, resistive, conductive and final protection layers comprises at least one compound selected from a polyamide imide (PAI), a polyimide (PI), a polyether sulfone (PES), a polyether imide (PEI), a polyphenylene sulfone (PPS), a silicone and an epoxy resin.
- PAI polyamide imide
- PI polyimide
- PES polyether sulfone
- PPS polyphenylene sulfone
- silicone an epoxy resin
- this method comprises the following steps:
- each of said dielectric, resistive, conductive and final protection layers comprising the same resin, said resin being an organic resin.
- the use of a single organic resin allows to consider a single cooking step.
- each of the dielectric, resistive, conductive and final protection layers is performed by screen printing.
- the present invention also relates to an article provided with a heating element according to the invention deposited on a metal substrate, in particular aluminum or aluminum alloy.
- the heating element according to the invention surprisingly has a certain flexibility enabling it to remain operational when the metal substrate on which the heating element is deposited has to be constrained.
- the invention is aimed in particular at an article or culinary utensil comprising a heating element according to the invention and, on the face of the substrate not comprising said heating element, an enamel coating or a non-stick coating, in particular a resin-based coating.
- fluorocarbon for example based on PTFE.
- the invention finally relates to a method of manufacturing an article, in particular a culinary article, comprising a first step of depositing an enamel or non-adhesive coating, in particular based on resin fluorocarbon, for example based on PTFE, on one of the mutually opposite faces of a metal substrate, in particular aluminum or aluminum alloy, and a second deposition step on the other side of the substrate, a heating element manufactured in accordance with the method of the present invention.
- FIG. 1 represents a schematic cross-sectional view of the structure of a heating element according to the invention deposited on a substrate
- Figure 2 shows the heating element of Figure 1 deposited on the substrate, itself covered with a coating, for example a release coating.
- a substrate 1 made of aluminum or aluminum alloy.
- the substrate 1 is commonly a disk but any other form can of course be considered.
- the face 1a of the substrate 1 is covered by at least one continuous dielectric layer 2 and formed of resin and dielectric charges.
- the dielectric layer 2 is covered by a resistive layer 3 formed of resin and electrically conductive charges.
- the resistive layer 3 is in the form of a track whose dimensions such as length and thickness can of course be adapted according to the desired resistance.
- the track forming the resistive layer 3 may for example be in the form of a spiral of which only the sections of each convolution are shown in FIGS. 1 and 2.
- On the resistive layer 3 is deposited at least one conductive layer 4 formed of resin and fillers. electrically conductive.
- This conductive layer 4 which covers only a small portion of the resistive layer 3, is intended for the electrical connection of the resistive layer 3.
- At least one final protective layer 5, formed of resin and dielectric fillers, is deposited on the entire surface except on the conductive layer 4.
- this final protective layer 5 thus covers the resistive layer 3 as well as certain zones 2a of the dielectric layer 2, said zones 2a being situated at the location of the interstices 3a left free by the resistive layer 3, when it is in the form of a track.
- the heating element 6 consists of the assembly formed of the dielectric 2, resistive 3, conductive 4 and final protection 5 layers.
- the dielectric layers 2, resistive 3, conductive 4 and final protection 5 comprise the same organic resin.
- this resin comprises at least one compound chosen from a polyamide imide (PAI), a polyimide (PI), a polyether sulphone (PES), a polyether imide (PEI), a polyphenylene sulphone (PPS), a silicone and a epoxy resin.
- PAI polyamide imide
- PI polyimide
- PES polyether sulphone
- PEI polyether imide
- PPS polyphenylene sulphone
- the dielectric charges of any dielectric layer 2 may comprise at least one element chosen from mica, alumina, silica, clay, quartz, talc, glass and boron nitride.
- the particle size of the dielectric charges is decisive, in particular in the case where each dielectric layer 2 is applied by screen printing, so as not to seal the cells of the screen.
- the dielectric charges have a mean dimension of less than 25 ⁇ m, preferably less than 10 ⁇ m.
- the weight proportion of dielectric charges included in any dielectric layer 2 is adjusted to obtain electrical insulation between the resistive layer 3 and the substrate 1 when a potential difference of at least 1250 V is applied between said resistive layer 3 and substrate 1 for at least one minute.
- any dielectric layer 2 comprises from 30 to 70% by weight, preferably from 40 to 50% by weight, of dielectric charges and from 30 to 70% by weight, preferably from 50 to 60% by weight. weight, of pure resin or in solution, said solution comprising at least 10% by weight of pure resin.
- weight proportions make it possible to obtain a sufficiently fluid composition to envisage the application by screen-printing of each dielectric layer 2.
- each dielectric layer 2 retains after cooking a certain flexibility allowing it to withstand the external stresses which can be exercised during the final elaboration of the article.
- the electrically conductive fillers included in the composition of any resistive layer 3, but also of any conductive layer 4, comprise at least one element chosen from inorganic, metallic, ceramic or composite particles with electrical conduction properties. It is thus possible to choose, as electrically conductive fillers, particles of silver, copper, graphite, carbon, nickel, palladium, nitrides or carbides, and in particular nitrides and carbides of zirconium, hafnium or of titanium. Among the composite particles, particular mention may be made of coated particles such as glass particles coated with metal, for example coated with silver.
- the particle size of the electrically conductive charges is adapted to the mode of application envisaged for the application of each resistive layer 3 and of each conductive layer 4.
- the electrically conductive charges of each resistive layer 3 and of each conductive layer 4 have an average dimension of less than 20 ⁇ m, and preferably of between 1 and 5 ⁇ m.
- the thickness of any resistive layer 3 and the proportion by weight of electrically conductive charges included in this resistive layer 3 are preferably adapted to provide, as a function of the width and the length of the resistive track thus constituted in this resistive layer 3, a resistance of 5 to 1000 ⁇ .
- any resistive layer 3 comprises from 50 to 85% by weight, preferably from 60 to 70% by weight, of electrically conductive charges and from 15 to 50% by weight, preferably from 30 to 40% by weight. by weight, of pure resin or in solution, said solution comprising at least 10% by weight of pure resin.
- Each conductive layer 4 comprises a weight proportion of electrically conductive charges of at least 70%, the weight ratio of electrically conductive charges on pure resin being greater than or equal to 9.
- the final protective layer 5 has the same composition as the dielectric layer 2.
- the heating element 6 has some flexibility. This could not be achieved with the heating elements of the state of the art which consist of enamels, the latter breaking under the effect of a stress, even low. For example, when the assembly consisting of the substrate 1 and the heating element 6 is stressed, no breakage of the heating element 6 is observed to a radius of curvature of the order 210 mm for an aluminum substrate 1 of about 2 mm thick and a heating element 6 having a thickness of about 500 microns.
- the method of manufacturing the heating element 6 comprises the following steps:
- the metal substrate such as aluminum or aluminum alloy
- the metal substrate is applied to at least one dielectric layer 2 formed of resin and dielectric fillers
- at least one resistive layer 3 formed of resin and electrically conductive fillers is applied, this resistive layer 3 being applied to the at least one dielectric layer 2 deposited in the preceding step, either on the dielectric layer 2, as in the embodiment shown in FIGS. 1 and 2, or on at least one of the dielectric layers 2, it being specified that the last dielectric layer 2 applied is necessarily coated with at least one resistive layer 3
- At least one conductive layer 4 formed of resin and electrically conductive charges is applied.
- at least one final protective layer 5 formed of resin and dielectric charges is applied. It is of course possible to carry out a preliminary step of mechanical or chemical treatment of the face 1a of the substrate 1 to allow optimized attachment of the first dielectric layer 2 to the substrate 1.
- each of the dielectric layers 2, resistive 3, conductive 4 and final protection 5 is preferably made by screen printing, thus allowing excellent control of the thickness of each of the layers 2, 3, 4 and 5.
- a single baking step is carried out to obtain the polymerization of the resin used in the composition of said layers 2, 3, 4 and 5. Thanks to this single stage of cooking, one obtains a saving of energy, a gain of handling even a gain of place.
- the thickness of the set of dielectric layers 2 is between 30 and 300 ⁇ m and preferably between 90 and 150 ⁇ m.
- heating element 6 shown in FIGS. 1 and 2 comprising a dielectric layer 2, a resistive layer 3, a dielectric layer 4 and a final protective layer 5, it is quite possible to produce a heating element that requires the application of two, three or more of one or the other dielectric layers 2, resistive 3, conductive 4 and final protection 5 to obtain the thicknesses mentioned above.
- This variant is more particularly applicable for the realization of the dielectric layer 2.
- a superposition of several dielectric layers 2 is made to reach the thickness indicated above for all of the dielectric layers 2.
- FIG. 2 shows the heating element 6 deposited on the face 1a of the substrate 1 illustrated in FIG. 1.
- the face Ib of the substrate 1 is coated with a coating 7.
- This coating 7 can be made enamel or be anti-adhesive, it may be based on fluorocarbon resin, for example based on PTFE. Multiple applications using the heating element 6 according to the invention can be envisaged.
- Non-limiting, include cookware, kettles, irons.
Landscapes
- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0406380A FR2871650B1 (fr) | 2004-06-11 | 2004-06-11 | Element chauffant, son procede de fabrication, article dote d'un tel element et son procede de fabrication |
| PCT/FR2005/001365 WO2006003282A1 (fr) | 2004-06-11 | 2005-06-03 | Element chauffant, son procede de fabrication, article dote d'un tel element et son procede de fabrication |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP1757168A1 true EP1757168A1 (fr) | 2007-02-28 |
Family
ID=34945987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP05775284A Withdrawn EP1757168A1 (fr) | 2004-06-11 | 2005-06-03 | Element chauffant, son procede de fabrication, article dote d'un tel element et son procede de fabrication |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8481902B2 (fr) |
| EP (1) | EP1757168A1 (fr) |
| JP (1) | JP2008502116A (fr) |
| CN (1) | CN100515145C (fr) |
| FR (1) | FR2871650B1 (fr) |
| RU (1) | RU2378803C2 (fr) |
| WO (1) | WO2006003282A1 (fr) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2917958B1 (fr) * | 2007-06-29 | 2009-09-11 | Seb Sa | Article culinaire emaille anti-rayures et procede de fabrication d'un tel article. |
| ES2698073T3 (es) | 2008-04-22 | 2019-01-30 | Datec Coating Corp | Elemento calefactor de película gruesa, aislada, termoplástica a altas temperaturas |
| FR2934591B1 (fr) * | 2008-07-29 | 2011-02-11 | Seb Sa | Article comprenant un revetement ceramique et procede de fabrication d'un tel article mettant en oeuvre un laser. |
| FR2935246B1 (fr) * | 2008-08-29 | 2010-09-03 | Seb Sa | Article culinaire comportant un revetement antiadhesif a proprietes ameliorees d'anti-adherence |
| FR2937235B1 (fr) | 2008-10-16 | 2010-11-12 | Seb Sa | Articule culinaire comportant un revetement antiadhesif presentant des proprietes ameliorees d'adherence au support |
| FR2937236B1 (fr) * | 2008-10-16 | 2010-11-26 | Seb Sa | Article culinaire comportant un revetement antiadhesif presentant des proprietes ameliorees d'adherence au support |
| EP2206801A1 (fr) * | 2008-12-24 | 2010-07-14 | Seb Sa | Ustensiles de cuisson composites comprenant un revêtement de protection vitreux |
| FR2951348B1 (fr) * | 2009-10-12 | 2012-02-03 | Tornier Sa | Element chauffant et appareil chirurgical le mettant en oeuvre |
| FR2974993B1 (fr) | 2011-05-13 | 2014-04-11 | Seb Sa | Recipient de chauffe pour le chauffage d'aliments et appareil transportable comprenant un tel recipient de chauffe |
| CN113007106B (zh) | 2011-07-13 | 2023-08-11 | 费雪派克医疗保健有限公司 | 叶轮和马达组件 |
| JP5896142B2 (ja) * | 2012-03-23 | 2016-03-30 | 東芝ライテック株式会社 | セラミックヒータおよび定着装置 |
| DE212013000256U1 (de) | 2012-12-18 | 2015-07-22 | Fisher & Paykel Healthcare Ltd. | Impeller und Rotor Baugruppe |
| FR3008030B1 (fr) * | 2013-07-02 | 2017-02-17 | Valeo Systemes Thermiques | Dispositif de chauffage de fluide pour vehicule automobile et appareil de chauffage et/ou de climatisation correspondant |
| US9518946B2 (en) * | 2013-12-04 | 2016-12-13 | Watlow Electric Manufacturing Company | Thermographic inspection system |
| PL229757B1 (pl) | 2015-02-06 | 2018-08-31 | Esmoking Inst Spolka Z Ograniczona Odpowiedzialnoscia | Elektroniczne urządzenie do wytwarzania aerozolu, moduł parownika oraz sposób wytwarzania aerozolu |
| JP6518012B2 (ja) * | 2015-10-29 | 2019-05-22 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 被覆されたアイロンがけプレート及び被覆されたアイロンがけプレートを形成する方法 |
| JP6675543B2 (ja) * | 2016-02-05 | 2020-04-01 | 北川工業株式会社 | 熱伝導部材、熱伝導部材の製造方法及びシリコーン混合物 |
| EP3443294B1 (fr) | 2016-04-15 | 2022-02-16 | Hewlett-Packard Development Company, L.P. | Pièces de cellule de charge imprimées de façon tridimensionnelle |
| EP3615820B1 (fr) | 2017-04-23 | 2024-12-04 | Fisher & Paykel Healthcare Limited | Support de palier, ventilateur comprenant un tel support de palier |
| CN109561526B (zh) * | 2017-09-26 | 2023-04-25 | 杜邦电子公司 | 加热元件和加热装置 |
| US10991998B2 (en) * | 2019-01-28 | 2021-04-27 | GM Global Technology Operations LLC | Thermal interface member and method of making the same |
| US20230262846A1 (en) * | 2020-06-24 | 2023-08-17 | Datec Coating Corporation | Screen printed thick film metal heater with protective top dielectric layer |
Family Cites Families (60)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB926001A (en) * | 1958-02-17 | 1963-05-15 | Right Hon The Earl Of Straffor | Improvements in radiant electrical resistance heaters and the production thereof |
| US3108170A (en) * | 1958-02-17 | 1963-10-22 | Maxwell K Murphy | Heating element |
| GB926002A (en) * | 1958-02-17 | 1963-05-15 | Right Hon The Earl Of Straffor | Improvements in radiant electrical resistance heaters and the production thereof |
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-
2004
- 2004-06-11 FR FR0406380A patent/FR2871650B1/fr not_active Expired - Fee Related
-
2005
- 2005-06-03 CN CNB2005800190289A patent/CN100515145C/zh not_active Expired - Fee Related
- 2005-06-03 US US11/629,231 patent/US8481902B2/en not_active Expired - Fee Related
- 2005-06-03 WO PCT/FR2005/001365 patent/WO2006003282A1/fr not_active Ceased
- 2005-06-03 JP JP2007526487A patent/JP2008502116A/ja active Pending
- 2005-06-03 EP EP05775284A patent/EP1757168A1/fr not_active Withdrawn
- 2005-06-03 RU RU2006143564/09A patent/RU2378803C2/ru not_active IP Right Cessation
Non-Patent Citations (1)
| Title |
|---|
| See references of WO2006003282A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2871650A1 (fr) | 2005-12-16 |
| US8481902B2 (en) | 2013-07-09 |
| US20080290088A1 (en) | 2008-11-27 |
| FR2871650B1 (fr) | 2006-09-22 |
| JP2008502116A (ja) | 2008-01-24 |
| RU2378803C2 (ru) | 2010-01-10 |
| WO2006003282A1 (fr) | 2006-01-12 |
| CN1973577A (zh) | 2007-05-30 |
| RU2006143564A (ru) | 2008-07-27 |
| CN100515145C (zh) | 2009-07-15 |
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