EP1337589A2 - Elastomeres de silicone moulables presentant une adhesivite selective sans primaire - Google Patents
Elastomeres de silicone moulables presentant une adhesivite selective sans primaireInfo
- Publication number
- EP1337589A2 EP1337589A2 EP01989788A EP01989788A EP1337589A2 EP 1337589 A2 EP1337589 A2 EP 1337589A2 EP 01989788 A EP01989788 A EP 01989788A EP 01989788 A EP01989788 A EP 01989788A EP 1337589 A2 EP1337589 A2 EP 1337589A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- composition
- parts
- weight
- centipoises
- organopolysiloxane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229920002379 silicone rubber Polymers 0.000 title description 12
- 239000000203 mixture Substances 0.000 claims abstract description 108
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 63
- 229910052751 metal Inorganic materials 0.000 claims abstract description 44
- 239000002184 metal Substances 0.000 claims abstract description 44
- 150000001875 compounds Chemical class 0.000 claims abstract description 35
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 23
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 14
- 239000004416 thermosoftening plastic Substances 0.000 claims abstract description 14
- 229930195733 hydrocarbon Natural products 0.000 claims abstract description 13
- 239000000654 additive Substances 0.000 claims abstract description 12
- 125000004122 cyclic group Chemical group 0.000 claims abstract description 11
- 150000002334 glycols Chemical class 0.000 claims abstract description 11
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 10
- 150000002430 hydrocarbons Chemical class 0.000 claims abstract description 9
- 230000000996 additive effect Effects 0.000 claims abstract description 5
- -1 acryl Chemical group 0.000 claims description 34
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 25
- 239000004971 Cross linker Substances 0.000 claims description 20
- 239000003054 catalyst Substances 0.000 claims description 18
- 239000004593 Epoxy Substances 0.000 claims description 17
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 claims description 16
- 229920000642 polymer Polymers 0.000 claims description 16
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 16
- 229920001971 elastomer Polymers 0.000 claims description 14
- 229920002554 vinyl polymer Polymers 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 125000003342 alkenyl group Chemical group 0.000 claims description 11
- 239000002131 composite material Substances 0.000 claims description 11
- 238000000465 moulding Methods 0.000 claims description 11
- 239000000806 elastomer Substances 0.000 claims description 10
- 239000003112 inhibitor Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 239000002318 adhesion promoter Substances 0.000 claims description 8
- 125000004432 carbon atom Chemical group C* 0.000 claims description 8
- 238000009826 distribution Methods 0.000 claims description 7
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims description 6
- 239000000945 filler Substances 0.000 claims description 6
- 229910021485 fumed silica Inorganic materials 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 125000001424 substituent group Chemical group 0.000 claims description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 5
- 229920001577 copolymer Polymers 0.000 claims description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 5
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 5
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 claims description 5
- BUCJHJXFXUZJHL-UHFFFAOYSA-N 1-ethylcyclohexan-1-ol Chemical compound CCC1(O)CCCCC1 BUCJHJXFXUZJHL-UHFFFAOYSA-N 0.000 claims description 4
- 239000004215 Carbon black (E152) Substances 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 4
- 125000001931 aliphatic group Chemical group 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 230000009257 reactivity Effects 0.000 claims description 4
- 229910052990 silicon hydride Inorganic materials 0.000 claims description 4
- 239000012530 fluid Substances 0.000 claims description 3
- NYMPGSQKHIOWIO-UHFFFAOYSA-N hydroxy(diphenyl)silicon Chemical class C=1C=CC=CC=1[Si](O)C1=CC=CC=C1 NYMPGSQKHIOWIO-UHFFFAOYSA-N 0.000 claims description 3
- 229930195734 saturated hydrocarbon Natural products 0.000 claims description 3
- 125000000725 trifluoropropyl group Chemical group [H]C([H])(*)C([H])([H])C(F)(F)F 0.000 claims description 3
- 229930195735 unsaturated hydrocarbon Natural products 0.000 claims description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 150000001335 aliphatic alkanes Chemical group 0.000 claims description 2
- 150000001336 alkenes Chemical class 0.000 claims description 2
- 125000002355 alkine group Chemical group 0.000 claims description 2
- 125000003545 alkoxy group Chemical group 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims description 2
- 229940045985 antineoplastic platinum compound Drugs 0.000 claims description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 2
- 239000005350 fused silica glass Substances 0.000 claims description 2
- 229910052736 halogen Inorganic materials 0.000 claims description 2
- 150000002367 halogens Chemical class 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 2
- 125000005375 organosiloxane group Chemical group 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- 150000003057 platinum Chemical class 0.000 claims description 2
- 150000003058 platinum compounds Chemical class 0.000 claims description 2
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 claims description 2
- 239000010453 quartz Substances 0.000 claims description 2
- 229920006395 saturated elastomer Polymers 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 239000006082 mold release agent Substances 0.000 claims 1
- 230000001737 promoting effect Effects 0.000 abstract description 5
- 238000007259 addition reaction Methods 0.000 abstract 1
- 238000007792 addition Methods 0.000 description 7
- 230000000704 physical effect Effects 0.000 description 7
- 229920001187 thermosetting polymer Polymers 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 229920002565 Polyethylene Glycol 400 Polymers 0.000 description 4
- 238000009472 formulation Methods 0.000 description 4
- 239000005060 rubber Substances 0.000 description 4
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 230000001050 lubricating effect Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 239000004945 silicone rubber Substances 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- 239000004944 Liquid Silicone Rubber Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 229920005645 diorganopolysiloxane polymer Polymers 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920001921 poly-methyl-phenyl-siloxane Polymers 0.000 description 2
- 229920000307 polymer substrate Polymers 0.000 description 2
- 229920006375 polyphtalamide Polymers 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 229940058015 1,3-butylene glycol Drugs 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920004511 Dow Corning® 200 Fluid Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000004954 Polyphthalamide Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- ZPECUSGQPIKHLT-UHFFFAOYSA-N bis(ethenyl)-dimethoxysilane Chemical compound CO[Si](OC)(C=C)C=C ZPECUSGQPIKHLT-UHFFFAOYSA-N 0.000 description 1
- FSIJKGMIQTVTNP-UHFFFAOYSA-N bis(ethenyl)-methyl-trimethylsilyloxysilane Chemical compound C[Si](C)(C)O[Si](C)(C=C)C=C FSIJKGMIQTVTNP-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 235000019437 butane-1,3-diol Nutrition 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- CBVJWBYNOWIOFJ-UHFFFAOYSA-N chloro(trimethoxy)silane Chemical compound CO[Si](Cl)(OC)OC CBVJWBYNOWIOFJ-UHFFFAOYSA-N 0.000 description 1
- 238000013037 co-molding Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 229920006334 epoxy coating Polymers 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000001815 facial effect Effects 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 238000006459 hydrosilylation reaction Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
Definitions
- the present invention relates both to a method for improving the primerless adhesion of cured silicone elastomers and to curable (and cured) high strength, organopolysiloxane molding compositions useful to produce cured silicone rubber articles that exhibit excellent adhesion to thermoplastic resins such as, but not limited to, PBT and PPA, while not significantly adhering to metal substrates.
- Moldable primerless organopolysiloxane compositions are known and used.
- One problem with all such compositions is that due to the adhesion additives in the compositions they also adhere to metal surfaces.
- the typical mold is metal. It is difficult to selectively adhere to thermoplastic substrates without deleterious effects.
- the kinetics and thermochemistry of the molding process and the compositions used in such processes are such that only small lightweight composite plastic and silicone elastomer articles of manufacture can be made by molding techniques because of the difficulty of removing the article from the metal mold.
- Organopolysiloxane compositions useful for molding typically contain alkenyl polymers, fillers, and other additives.
- the compositions contain a platinum catalyst, a hydride crosslinker and cure inhibitors. These can be one or two component systems that are mixed prior to the molding process. These heat cured (i.e. high consistency or millable rubber) or liquid injection molded silicone rubbers are commonly available without additives that improve adhesion.
- Typical molding compositions generally include the following ingredients:
- organohydrogenpolysiloxane crosslinker containing at least two silicon-bonded hydrogens per molecule and having a viscosity ranging from 80 to 1 ,000 centipoises at 25°C;
- Additional components may include extending fillers, coloring agents, and additives to impart increased performance with respect to certain physical properties such as oil resistance, heat aging, abrasion resistance and the like.
- the functional properties of the resulting rubber elastomer depend not only on the levels of components but also on the properties of the filler, additives, and type of curing catalyst. Consequently, the elastomer property profile is highly dependent on the chemical nature of the various constituent components as well as the relative proportions of those components. For example, a heat additive increases the temperature range of the resulting rubber. Such improvements however, do not necessarily increase the adhesion stability and some times fail to adhere after heat soak. ln seeking to increase the selective adhesion of silicone compositions to thermoplastic and thermoset substrates, it is frequently desirable to increase the ability of the silicone to be released from a mating part or surface for which the molded composite may come in contact.
- a typical method of improving the lubricity of a silicone composition is simply to add a liquid component to the formulation that has limited solubility in the elastomer and thus the compound bleeds out over time.
- a liquid component such as copolymers of polydimethylsiloxanes, diphenylsiloxane or methylphenylsiloxane, and fluorosiloxanes such as silicones containing trifluoropropyl substituted siloxanes.
- a diorganopolysiloxane composition of soluble polydiorganosiloxanes, polycycloorganosiloxanes (linear and cyclic) and/or hydroxy end blocked hydrocarbons (glycols) of a specific molecular distribution preferably having a viscosity of 10 to 1 ,000 centipoises at 25°C; and an epoxy functional compound, thus giving release characteristics to metal substrates while maintaining adhesion to the thermoplastic substrate.
- the preferred embodiment of the present invention provides for a curable silicone elastomer composition
- a curable silicone elastomer composition comprising:
- glycols examples include polyethylene glycol (e.g., PEG 400) and 1 ,3 butylene glycol PEG 400 is preferred.
- the foregoing composition may also include a silicone soluble in the curable elastomer composition.
- the silicone is less soluble in the curable elastomer composition when the curable composition has been cured. As a result, the silicone bleeds out of cured composition to improve lubricity.
- the present invention provides a composition that selectively adheres to a substrate that may be a thermoset or a thermoplastic, but not to a metal such as aluminum or steel.
- a substrate may be a thermoset or a thermoplastic, but not to a metal such as aluminum or steel.
- the thermoset or thermoplastic substrates may be filled polymers with glass or clays.
- the silicone compositions of the present invention release readily from metal substrates after they have been overmolded, transfer molded or injection molded.
- the present invention further provides for the incorporation of an adhesion promoter and a self-bleed additive that allows lubrication of the surfaces of the cured silicone simultaneously with adhesion to the overmolded, transfer molded or injection molded substrate.
- the formulations of the present invention demonstrate that compositions containing both an adhesion promoter and a self-bleed additive for lubricity can simultaneously achieve the contradictory goals of adhesion to a substrate used in overmolding, transfer or injection molding and release from a second substrate where the silicone was not bonded to the substrate by the action of the adhesion promoter and the co-molding process of overmolding, transfer molding or injection molding.
- This invention utilizes the release characteristics of soluble polydiorganosiloxanes, polycycloorganosiloxanes (linear and cyclic), and/or hydroxy end blocked hydrocarbons (glycols) of specific molecular distribution preferably having viscosity of 10 to 1 ,000 centipoises at 25°C.
- the two (2) additives that provide the selective adhesion properties are:
- polybutylene glycols provide better release to metals during molding than poly-dimethyl siloxanes alone.
- a silicone soluble in the curable elastomer composition can be added.
- the silicone is selected such that it is less soluble in the curable elastomer composition when the curable composition has been cured. As a result, the silicone bleeds out of the cured composition.
- one preferred embodiment of the present invention comprises a curable organopolysiloxane composition having selective adhesion to a metal substrate.
- the composition should preferably include the following components:
- (C) a catalytically effective amount of a platinum group metal catalyst; (D) from 0.01 to 3 parts by weight of a cure inhibitor, preferably of the type 4 or 5, ethyl cyclohexan-1 -ol;
- G up to about 1 0 parts by weight based upon the total composition of soluble polydiorganosiloxanes, polycycloorganosiloxanes (linear and cyclic) and/or hydroxy end blocked hydrocarbons (glycols) of a specific molecular distribution having a viscosity of 50 to 1 ,000 centipoises at 25°C.
- the organopolysiloxane polymer contains at least two silicon-bonded lower alkenyl groups in each molecule and is a straight chain organopolysiloxane having a viscosity of about 100,000 to about 10,000,000 centipoises at 25°C, or mixtures of such organopolysiloxanes, and the lower alkenyl groups are vinyl.
- organopolysiloxanes include Dow Corning Q42901 and Q42903 gums, with an average pendant vinyl content ranging from .01 to .20 mole percent with .80 to .20 mole percent being preferable.
- the organohydrogenpolysiloxane crosslinker has organic substituents bonded to silicon atoms, which are methyl, and the concentration of organohydrogenpolysiloxane provides about 0.2 to about 0.02 silicon-bonded hydrogen atoms for each silicon-bonded alkenyl radical in the organopolysiloxane polymer, and wherein the crosslinker has the formula:
- each R is independently chosen from a hydrogen or monovalent hydrocarbon radical free of aliphatic unsaturation containing 1 to about 8 carbon atoms, and x varies so that the crosslinker has a viscosity ranging from about 80 to 1 ,000 centipoises at 25°C.
- each R is independently chosen from as a methyl, ethyl, vinyl, hydroxy, propyl, and 3,3,3-trifluoropropyl, and/or a branch chain of polydiorganosiloxane group and is itself a straight chain where x is given to create a viscosity of 10,000 to 10,000,000 centipoises at 25° C.
- cross linkers include Dow Corning 1 107 and 63570 cross- linkers with Dow Corning silbond 7608 being preferable.
- the platinum group metal catalyst is selected from the group consisting of platinum metal, platinum compounds, platinum complexes and mixtures thereof.
- the platinum group metal catalyst is chloroplatinic acid complexed with a liquid olefin or an organosiloxane containing ethylenically unsaturated hydrocarbon radicals bonded to silicon. More preferably, the platinum group metal catalyst is a neutralized complex of chloroplatinic acid or platinum dichloride with divinyltetramethyldisiloxane.
- the platinum group metal catalyst provides about 0.1 to about 500 parts by weight platinum group metal per million parts of the combined weights of organopolysiloxane and organohydrogenpolysiloxane.
- the platinum group metal catalyst provides about 1 to about 50 parts by weight platinum group metal per million parts of the combined weights of organopolysiloxane and organohydrogenpolysiloxane.
- the cure inhibitor compound is an acetylene alcohol derivative such as ethenylcyclohexanol or pyradien alcohol having the following general formula:
- R' is an alkyne unsaturated hydrocarbon chain, branched or unbranched, and R is a saturated hydrocarbon linear or cyclic with hydroxy groups pendant or end blocked with hydroxy saturation indicated by x, which is 1 to complete hydroxy saturation of the R group.
- adhesion promoter is a hydroxinated silicone compound is of the formula:
- R is any hydrocarbon alkyl or alkenyl radical linear or branched comprising not more than 1 0 carbon atoms
- R' is any mixture of any alkyl, alkenyl, aliphatic, or aromatic radical, linear or branched, up to 1 2 carbon atoms
- z is of sufficient number to create a viscosity of about 50 to about 1 0,000 centipoises at 25°C.
- parts per weight are used. Examples include 1 -hydroxy 2,3 methyl end blocked vinylmethylsiloxane (DP 10 to 1 2 with 2 to 4 pendant vinyl groups) .
- the epoxy-functional compound is of the formula:
- RO refers to a saturated linear alkoxy group and R' is an alkane, substituted or unsubstituted
- R" is an oxirynic derivative containing 6-1 5 carbon atoms.
- this compound is glycidoxypropyltrimethoxysilane.
- Others include methacrylvinylpolysilane, chlorotrimethoxysilane, vinyltrimethoxysilane, and divinyldimethoxysilane. In generally from .01 to 30, preferably from .05 to 1 .0 and more preferably from .10 to .60, parts by weight are used.
- the polydiorganosiloxanes include Dow Corning 200 fluid.
- Viscosity grades 50 to 200 are preferable and grades 50 to 10,000 in general.
- An example of polycycloorganosiloxanes includes Dow Corning 244 fluid and other cyclic siloxanes from D4 to D10 (DP units), preferably D 4 and D5.
- the molecular distribution should be such as to produce a viscosity at 25°C of 50 to 1 ,000, preferably 50 to 500 centipoises, and more preferably 50 to 200 centipoises.
- the epoxy- functional compound is glycidoxypropyltrimethoxysilane.
- the epoxy-functional compound comprises about 0.01 to 10 parts by weight per 100 weight parts of organopolysiloxane polymer.
- composition according to the present invention can include a filler selected from the group consisting of fumed silica, treated fumed silica, precipitated silica, treated precipitated silica, fused silica, and finely divided quartz and mixtures thereof.
- a composite is formed having bonded thereto a cured organopolysiloxane composition.
- the composition preferably contains the following components:
- G up to about 10 parts by weight based of a soluble polydiorganosiloxanes, polycycloorganosiloxanes (linear and cyclic) and/or hydroxy end blocked hydrocarbons (glycols); of a specific molecular distribution having a viscosity of 50 to 1 ,000 centipoises at 25°C.
- a composite containing an epoxy-coated substrate having bonded thereto a cured organopolysiloxane composition is formed.
- the composition preferably comprises:
- G up to about 10 parts by weight based of a soluble polydiorganosiloxanes and polycycloorganosiloxanes (linear and cyclic) and/or hydroxy end blocked hydrocarbons (glycols) of specific molecular distribution having a viscosity of 50 to 1 ,000 centipoises at 25°C.
- the substrate is metal.
- the epoxy coating comprises chemistries used in cast, form in place, or vacuum bag cures. Moldable epoxy composites are preferable.
- a silicone soluble in the curable elastomer composition is added.
- the silicone is less soluble in the curable elastomer composition when the curable composition has been cured. In such case, the silicone bleeds out of the cured composition.
- the silicone is selected from the following or mixtures thereof:
- phenyl containing siloxanes such as copolymers of diphenylsiloxane with diorganosiloxanes and copolymers of methylphenylsiloxane with diorganosiloxanes, polydimethylsiloxanes, having a viscosity ranging between about 10 to about 10,000 centipoises at 25°C, preferably ranging from about 100 to about 1000 centipoises at 25°C; and
- fluorosiloxanes such as silicones containing trifluoropropyl substituted siloxanes, having a viscosity ranging between 100 to about 10,000 centipoises at 25°C, preferably ranging from about 100 to about 1000 centipoises at 25°C.
- Examples of the foregoing include phenyl siloxanes commonly sold as Dow Corning 550 Fluid or GE SF-1 1 54 and those for fluorosiloxanes FS-149, FS1 50-10M FS1 57 all of various viscosities and purity grades. These components lubricate without adversely affecting the adhesion of the composition to a substrate.
- the resins to which the cured inventive composition can be bonded include Nylon, polyphenylene, polyphthalamide, polyphenylene ether, polyamide and polyimid thermoplastic resins that may or may not be glass filled, mineral filled, or carbon filled.
- thermoset resins such as epoxy, silicone or others that are manufactured by coating a substrate or by direct casting can be bonded to the cured organopolysiloxane composition in of the present invention.
- the resin is PBA or PBT.
- Additional components may include extending fillers, coloring agents, and additives to impart increased performance with respect to certain physical properties such as oil resistance, heat aging, abrasion resistance and the like.
- compositions have selective adhesion to polymer substrates and do not have significant adhesion to metal surfaces.
- the significance of selective adhesion preferably is such that the adhesion to metal in general is such that the composition sticks to a resin or epoxy coated substrate, but not to metal.
- the adhesion to metal is less than half the adhesion to the target polymer substrate and more preferably has no cohesion failure to the metal as determined by lap shear testing.
- Curable silicone rubber compositions were prepared from a high consistency silicone rubber base. Adhesion components E through G were added in amounts shown in Table 1 . Samples of these materials were made by curing the composition at 1 50° C for 3 minutes. These samples were tested per ASTM D81 6. The results are listed in Table 1 . Table 1
- Adhesion Components % cohesion failure to listed substrate
- Component E - adhesion promoter Glycidoxypropyltrimethoxysilane
- Component F - epoxy functional compound Hydroxyl End Blocked, specifically Polydimethylvinylsiloxane
- Component G - Polydioganosiloxane Polydimethylsiloxane 100CS
- Example Runs 1 -8 show additions of adhesion promoting compounds.
- Example Run 9 shows that addition of polymethylphenylsiloxane as a lubricant does not deleteriously affect adhesion.
- Table 2 demonstrates that, as in High Consistency Rubber (“HCR”) HCR, Liquid Silicone Rubber (“LSR”) has improved adhesion by addition of components E and F.
- HCR High Consistency Rubber
- LSR Liquid Silicone Rubber
- addition of component G and H in combination with component E and F maintains adhesion to plastic but does not adhere significantly to steel.
- the composition is said to be a selective adhesion promoting material with good adhesion to thermoplastics and thermosets yet not to metal surfaces and can be self lubricating.
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- Chemical Kinetics & Catalysis (AREA)
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Abstract
L'invention concerne des compositions d'organopolysiloxane qui durcissent sous l'effet de la réaction d'addition de radicaux d'alcényle inférieur à liaison silicium avec des atomes d'hydrogène à liaison silicium et qui présentent une adhésivité sélective sur différents substrats. Ces compositions contiennent un mélange stimulant l'adhésion constitué d'un composé à fonction époxy, de polydiorganosiloxanes solubles, de polycycloorganosiloxanes (linéaires et cycliques) et d'hydrocarbures à extrémité bloc hydroxy (glycols), conférant ainsi des caractéristiques de libération à des substrats métalliques tout en conservant les caractéristiques d'adhésion à un substrat thermoplastique. Un additif peut en outre être utilisé afin de conférer à ces compositions un pouvoir lubrifiant de surface après le durcissement.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US997473 | 1992-12-28 | ||
| US715963 | 2000-11-17 | ||
| US09/715,963 US6663967B1 (en) | 2000-11-17 | 2000-11-17 | Moldable silicone elastomers having selective primerless adhesion |
| PCT/US2001/044668 WO2002040592A2 (fr) | 2000-11-17 | 2001-11-19 | Elastomeres de silicone moulables presentant une adhesivite selective sans primaire |
| US09/997,473 US6783858B2 (en) | 2000-11-17 | 2001-11-19 | Moldable silicone elastomers having selective primerless adhesion |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP1337589A2 true EP1337589A2 (fr) | 2003-08-27 |
Family
ID=27109447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP01989788A Withdrawn EP1337589A2 (fr) | 2000-11-17 | 2001-11-19 | Elastomeres de silicone moulables presentant une adhesivite selective sans primaire |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP1337589A2 (fr) |
| WO (1) | WO2002040592A2 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115103881B (zh) | 2020-02-17 | 2025-10-10 | 美国陶氏有机硅公司 | 弹性体硅酮材料和其应用 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3011617B2 (ja) * | 1994-08-11 | 2000-02-21 | 信越化学工業株式会社 | シリコーン−エポキシ樹脂組成物 |
| TW296401B (fr) * | 1994-12-26 | 1997-01-21 | Shinetsu Chem Ind Co | |
| TW334469B (en) * | 1995-08-04 | 1998-06-21 | Doconitele Silicon Kk | Curable organosiloxane compositions and semiconductor devices |
| JP3144290B2 (ja) * | 1995-12-15 | 2001-03-12 | 三菱エンジニアリングプラスチックス株式会社 | 熱可塑性樹脂とオイルブリード性シリコーンゴムとの一体成形体 |
| KR100469649B1 (ko) * | 1996-07-08 | 2005-06-02 | 니폰샤신인사츠가부시키가이샤 | 도안이부착된실리콘고무성형품의제조방법 |
| JP3511127B2 (ja) * | 1997-11-05 | 2004-03-29 | 信越化学工業株式会社 | 接着性シリコーン組成物 |
-
2001
- 2001-11-19 EP EP01989788A patent/EP1337589A2/fr not_active Withdrawn
- 2001-11-19 WO PCT/US2001/044668 patent/WO2002040592A2/fr not_active Ceased
Non-Patent Citations (1)
| Title |
|---|
| See references of WO0240592A3 * |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2002040592A3 (fr) | 2002-10-03 |
| WO2002040592A2 (fr) | 2002-05-23 |
| WO2002040592A8 (fr) | 2002-11-21 |
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