[go: up one dir, main page]

WO2002040592A3 - Moldable silicone elastomers having selective primerless adhesion - Google Patents

Moldable silicone elastomers having selective primerless adhesion Download PDF

Info

Publication number
WO2002040592A3
WO2002040592A3 PCT/US2001/044668 US0144668W WO0240592A3 WO 2002040592 A3 WO2002040592 A3 WO 2002040592A3 US 0144668 W US0144668 W US 0144668W WO 0240592 A3 WO0240592 A3 WO 0240592A3
Authority
WO
WIPO (PCT)
Prior art keywords
adhesion
selective
silicon
silicone elastomers
moldable silicone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2001/044668
Other languages
French (fr)
Other versions
WO2002040592A2 (en
WO2002040592A8 (en
Inventor
Rick A Ziebell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bryant Rubber Corp
Original Assignee
Bryant Rubber Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/715,963 external-priority patent/US6663967B1/en
Application filed by Bryant Rubber Corp filed Critical Bryant Rubber Corp
Priority to AU2002228667A priority Critical patent/AU2002228667A1/en
Priority to EP01989788A priority patent/EP1337589A2/en
Publication of WO2002040592A2 publication Critical patent/WO2002040592A2/en
Publication of WO2002040592A3 publication Critical patent/WO2002040592A3/en
Publication of WO2002040592A8 publication Critical patent/WO2002040592A8/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)

Abstract

Organopolysiloxane compositions that cure by the addition reaction of silicon-bonded lower alkenyl radicals with silicon-bonded hydrogen atoms and which exhibit select adhesion to a variety of substrates. The compositions comprise an adhesion promoting mixture comprising an epoxy-functional compound, soluble polydiorganosiloxanes, polycycloorganosiloxanes (linear and cyclic) and hydroxy end blocked hydrocarbons (glycols) thus giving release characteristics to metal substrates while maintaining adhesion to a thermoplastic substrate. Additionally, an additive may be used to produce surface lubricity after curing.
PCT/US2001/044668 2000-11-17 2001-11-19 Moldable silicone elastomers having selective primerless adhesion Ceased WO2002040592A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU2002228667A AU2002228667A1 (en) 2000-11-17 2001-11-19 Moldable silicone elastomers having selective primerless adhesion
EP01989788A EP1337589A2 (en) 2000-11-17 2001-11-19 Moldable silicone elastomers having selective primerless adhesion

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/715,963 2000-11-17
US09/715,963 US6663967B1 (en) 2000-11-17 2000-11-17 Moldable silicone elastomers having selective primerless adhesion
US09/997,473 US6783858B2 (en) 2000-11-17 2001-11-19 Moldable silicone elastomers having selective primerless adhesion
US09/997,473 2001-11-19

Publications (3)

Publication Number Publication Date
WO2002040592A2 WO2002040592A2 (en) 2002-05-23
WO2002040592A3 true WO2002040592A3 (en) 2002-10-03
WO2002040592A8 WO2002040592A8 (en) 2002-11-21

Family

ID=27109447

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/044668 Ceased WO2002040592A2 (en) 2000-11-17 2001-11-19 Moldable silicone elastomers having selective primerless adhesion

Country Status (2)

Country Link
EP (1) EP1337589A2 (en)
WO (1) WO2002040592A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11629253B1 (en) 2020-02-17 2023-04-18 Dow Silicones Corporation Elastomeric silicone materials and their applications

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5585445A (en) * 1994-08-11 1996-12-17 Shin-Etsu Chemical Co. Ltd. Hydrosilation
EP0757080A2 (en) * 1995-08-04 1997-02-05 Dow Corning Toray Silicone Company Ltd. Curable organosiloxane compositions and semiconductor devices
US5792812A (en) * 1994-12-26 1998-08-11 Shin-Etsu Chemical Co., Ltd. Thermoplastic resin compoistions for use in integral molding with silicone rubber and integrally molded parts
EP0878285A1 (en) * 1996-07-08 1998-11-18 Toshiba Silicone Co., Ltd. Process for the production of patterned moldings of silicone rubber
US5879809A (en) * 1995-12-15 1999-03-09 Mitsubishi Engineering-Plastics Corporation Thermoplastic resin/oil-bleeding silicone rubber integrally molded articles
US6127503A (en) * 1997-11-05 2000-10-03 Shin-Etsu Chemical Co., Ltd. Adhesive silicone compositions

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5585445A (en) * 1994-08-11 1996-12-17 Shin-Etsu Chemical Co. Ltd. Hydrosilation
US5792812A (en) * 1994-12-26 1998-08-11 Shin-Etsu Chemical Co., Ltd. Thermoplastic resin compoistions for use in integral molding with silicone rubber and integrally molded parts
EP0757080A2 (en) * 1995-08-04 1997-02-05 Dow Corning Toray Silicone Company Ltd. Curable organosiloxane compositions and semiconductor devices
US5879809A (en) * 1995-12-15 1999-03-09 Mitsubishi Engineering-Plastics Corporation Thermoplastic resin/oil-bleeding silicone rubber integrally molded articles
EP0878285A1 (en) * 1996-07-08 1998-11-18 Toshiba Silicone Co., Ltd. Process for the production of patterned moldings of silicone rubber
US6127503A (en) * 1997-11-05 2000-10-03 Shin-Etsu Chemical Co., Ltd. Adhesive silicone compositions

Also Published As

Publication number Publication date
WO2002040592A2 (en) 2002-05-23
EP1337589A2 (en) 2003-08-27
WO2002040592A8 (en) 2002-11-21

Similar Documents

Publication Publication Date Title
WO2007016617A3 (en) Silicone compositions, methods of manufacture, and articles formed therefrom
MY134509A (en) Curable organopolysiloxane composition and a semiconductor device made with the use of this composition
TW200513499A (en) Silicones having improved surface properties and curable silicone compositions for preparing the silicones
WO2009111122A3 (en) Silsesquioxane resins
PL1620491T3 (en) Moisture curable organosiloxane compositions
MY156257A (en) Curable organopolysiloxane composition and semiconductor device
DE602004032121D1 (en) NETWORKED ORGANOPOLYSILOXANIC RESIN COMPOSITION FOR OPTICALLY CONDUCTIVE COMPONENTS, OPTICALLY CONDUCTIVE COMPONENTS AND THEIR MANUFACTURING METHOD
TW200736342A (en) Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones
MX2007013518A (en) Treatment of substrates for improving ink adhesion to the substrates.
DE60329112D1 (en) SILICONE RESIN HARDENED BY HYDROSILYLATION WITH HIGH TOUGHNESS
MY150435A (en) Composition for forming silicon-containing fine pattern and method for forming fine pattern using the same
ATE521655T1 (en) ALDEHYDE FUNCTIONAL SILOXANES
EP1063270A3 (en) Adhesion primer for use with RTV silicones
WO2004071765A3 (en) Paper release compositions having improved adhesion to paper and polymeric films
WO2004046267A3 (en) Silicone release coatings
ATE342569T1 (en) PREPARATION OF A CONDUCTIVE LIQUID SILICONE RUBBER COMPOSITION
DE602005016594D1 (en)
DE602005019574D1 (en) HARDENABLE ORGANOPOLYSILOXANE COMPOSITION
ATE456625T1 (en) SILICONE RUBBER COMPOSITION
TW200517438A (en) Epoxy resin composition and semiconductor device
EP0915142A3 (en) Adhesive silicone compositions
ATE412706T1 (en) CURED ORGANOPOLYSILOXANE COMPOSITION
TW200712158A (en) Self-adhesive organopolysiloxane composition
KR101225391B1 (en) Addition-Curable Silicone Rubber Composition and Cohesive Rubber Sheet
DE60227952D1 (en) LIQUID, ALKOXYSILYL GROUP-CONTAINING SILICONE RESINS, PROCESS FOR THE PRODUCTION THEREOF, AND CURABLE RESIN COMPOSITIONS

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

AK Designated states

Kind code of ref document: A3

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG UZ VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
AK Designated states

Kind code of ref document: C1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG UZ VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: C1

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

WWE Wipo information: entry into national phase

Ref document number: 2001989788

Country of ref document: EP

Ref document number: 2002543595

Country of ref document: JP

WWP Wipo information: published in national office

Ref document number: 2001989788

Country of ref document: EP

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Ref document number: JP