EP1323004A4 - Composition de resine photosensible destinee a des plaques flexographiques - Google Patents

Composition de resine photosensible destinee a des plaques flexographiques

Info

Publication number: EP1323004A4
Authority: EP; European Patent Office
Prior art keywords: resin composition; photosensitive resin; flexographic printing; printing plates; flexographic
Prior art date: 2000-08-30
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Withdrawn

Application number

EP01959539A

Other languages

German (de)

English (en)

Other versions

EP1323004A1 (fr

Inventor

Douglas Leach

Rosemarie Palmer-Sungail

Annabel Younghi Lee

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

MacDermid Inc

Original Assignee

MacDermid Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-08-30

Filing date

2001-08-02

Publication date

2005-06-08

2001-08-02 Application filed by MacDermid Inc filed Critical MacDermid Inc

2003-07-02 Publication of EP1323004A1 publication Critical patent/EP1323004A1/fr

2005-06-08 Publication of EP1323004A4 publication Critical patent/EP1323004A4/fr

Status Withdrawn legal-status Critical Current

Classifications

- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/035—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyurethanes

Landscapes

Physics & Mathematics (AREA)
Spectroscopy & Molecular Physics (AREA)
General Physics & Mathematics (AREA)
Photosensitive Polymer And Photoresist Processing (AREA)
Polymerisation Methods In General (AREA)
Macromonomer-Based Addition Polymer (AREA)

EP01959539A 2000-08-30 2001-08-02 Composition de resine photosensible destinee a des plaques flexographiques Withdrawn EP1323004A4 (fr)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
US65174600A	2000-08-30	2000-08-30
PCT/US2001/024547 WO2002019035A1 (fr)	2000-08-30	2001-08-02	Composition de resine photosensible destinee a des plaques flexographiques
US651746		2010-01-04

Publications (2)

Publication Number	Publication Date
EP1323004A1 EP1323004A1 (fr)	2003-07-02
EP1323004A4 true EP1323004A4 (fr)	2005-06-08

Family

ID=24614063

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP01959539A Withdrawn EP1323004A4 (fr)	2000-08-30	2001-08-02	Composition de resine photosensible destinee a des plaques flexographiques

Country Status (5)

Country	Link
EP (1)	EP1323004A4 (fr)
JP (1)	JP2004514159A (fr)
AU (1)	AU2001281085A1 (fr)
TW (1)	TW588216B (fr)
WO (1)	WO2002019035A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP2420889A1 (fr) *	2009-04-14	2012-02-22	Sumitomo Bakelite Co., Ltd.	Composition de résine photosensible, film adhésif et dispositif de réception de lumière
JP2011093308A (ja)	2009-09-30	2011-05-12	Fujifilm Corp	レーザー彫刻用樹脂組成物、レーザー彫刻用レリーフ印刷版原版とその製造方法、及び、レリーフ印刷版とその製版方法
CN108780274B (zh) *	2016-03-16	2021-07-13	东洋纺株式会社	可水显影的柔性印刷用感光性树脂组合物、及由该组合物得到的柔性印刷用感光性树脂原版
EP3665232A4 (fr)	2017-08-10	2021-04-07	Sun Chemical Corporation	Compositions durcissables par uv comprenant des photo-initiateurs à base d'oxyde d'acylphosphine
ES2917376T3 (es) *	2017-09-05	2022-07-08	Toyo Boseki	Composición de resina fotosensible revelable en agua para uso en impresión flexográfica, placa original de resina fotosensible para uso en impresión flexográfica que se produce a partir de la composición y su uso mediante impresión flexográfica con tinta UV o barniz UV
US11359102B2 (en)	2018-03-27	2022-06-14	Sun Chemical Corporation	UV-curable compositions comprising cleavage type photoinitiators

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP1020766A1 (fr) *	1999-01-14	2000-07-19	Macdermid Incorporated	Composition photosensible à base de résine pour des plaques d'impressions flexographiques

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB2235927B (en) *	1989-09-14	1992-10-21	Asahi Chemical Ind	A sulfonic acid group-containing polyurethane and a photosensitive resin composition containing the same
JP3060656B2 (ja) *	1990-11-26	2000-07-10	セイコーエプソン株式会社	液晶表示素子
US5939205A (en) *	1996-04-16	1999-08-17	Toyo Boseki Kabushiki Kaisha	Gas barrier resin film
KR100566042B1 (ko) *	1997-10-07	2006-05-25	간사이 페인트 가부시키가이샤	포지티브형전착포토레지스트조성물및패턴의제조방법

2001
- 2001-08-02 EP EP01959539A patent/EP1323004A4/fr not_active Withdrawn
- 2001-08-02 AU AU2001281085A patent/AU2001281085A1/en not_active Abandoned
- 2001-08-02 JP JP2002523094A patent/JP2004514159A/ja active Pending
- 2001-08-02 WO PCT/US2001/024547 patent/WO2002019035A1/fr not_active Ceased
- 2001-08-29 TW TW90121296A patent/TW588216B/zh not_active IP Right Cessation

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP1020766A1 (fr) *	1999-01-14	2000-07-19	Macdermid Incorporated	Composition photosensible à base de résine pour des plaques d'impressions flexographiques

Also Published As

Publication number	Publication date
JP2004514159A (ja)	2004-05-13
EP1323004A1 (fr)	2003-07-02
TW588216B (en)	2004-05-21
WO2002019035A1 (fr)	2002-03-07
AU2001281085A1 (en)	2002-03-13

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Legal Events

Date	Code	Title	Description
2003-05-16	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
2003-07-02	17P	Request for examination filed	Effective date: 20030328
2003-07-02	AK	Designated contracting states	Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
2003-07-02	AX	Request for extension of the european patent	Extension state: AL LT LV MK RO SI
2004-05-26	RBV	Designated contracting states (corrected)	Designated state(s): DE ES FR GB IT
2005-06-08	A4	Supplementary search report drawn up and despatched	Effective date: 20050426
2010-10-20	17Q	First examination report despatched	Effective date: 20100917
2011-06-17	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN
2011-07-20	18D	Application deemed to be withdrawn	Effective date: 20110128