EP0218159A1 - Support en aluminium anodisé, procédé pour sa préparation et plaque d'impression lithographique contenant ledit support - Google Patents
Support en aluminium anodisé, procédé pour sa préparation et plaque d'impression lithographique contenant ledit support Download PDFInfo
- Publication number
- EP0218159A1 EP0218159A1 EP86113305A EP86113305A EP0218159A1 EP 0218159 A1 EP0218159 A1 EP 0218159A1 EP 86113305 A EP86113305 A EP 86113305A EP 86113305 A EP86113305 A EP 86113305A EP 0218159 A1 EP0218159 A1 EP 0218159A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- support
- micrometers
- aluminum
- lithographic printing
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 32
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000002360 preparation method Methods 0.000 title description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims abstract description 30
- 230000005855 radiation Effects 0.000 claims abstract description 18
- 239000003792 electrolyte Substances 0.000 claims abstract description 17
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims abstract description 15
- 238000007743 anodising Methods 0.000 claims abstract description 14
- 229910019142 PO4 Inorganic materials 0.000 claims abstract description 8
- 235000021317 phosphate Nutrition 0.000 claims abstract description 8
- 150000003013 phosphoric acid derivatives Chemical class 0.000 claims abstract description 8
- 230000003647 oxidation Effects 0.000 claims abstract description 5
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 5
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 4
- 230000001590 oxidative effect Effects 0.000 claims abstract description 4
- 238000005299 abrasion Methods 0.000 abstract description 13
- 150000001875 compounds Chemical class 0.000 description 12
- 125000004432 carbon atom Chemical group C* 0.000 description 11
- 239000010410 layer Substances 0.000 description 10
- 239000000203 mixture Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 5
- 229920000728 polyester Polymers 0.000 description 4
- -1 silver halide Chemical class 0.000 description 4
- TXXHDPDFNKHHGW-UHFFFAOYSA-N (2E,4E)-2,4-hexadienedioic acid Natural products OC(=O)C=CC=CC(O)=O TXXHDPDFNKHHGW-UHFFFAOYSA-N 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- TXXHDPDFNKHHGW-CCAGOZQPSA-N cis,cis-muconic acid Chemical compound OC(=O)\C=C/C=C\C(O)=O TXXHDPDFNKHHGW-CCAGOZQPSA-N 0.000 description 3
- 239000008199 coating composition Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 125000001475 halogen functional group Chemical group 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004115 Sodium Silicate Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 238000002048 anodisation reaction Methods 0.000 description 2
- 239000003518 caustics Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229920002401 polyacrylamide Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 2
- 229910052911 sodium silicate Inorganic materials 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- TXXHDPDFNKHHGW-WZNPJAPVSA-N (2E,4Z)-2,4-hexadienedioic acid Natural products OC(=O)C=C\C=C\C(O)=O TXXHDPDFNKHHGW-WZNPJAPVSA-N 0.000 description 1
- 125000006569 (C5-C6) heterocyclic group Chemical group 0.000 description 1
- AAFXQFIGKBLKMC-KQQUZDAGSA-N (e)-3-[4-[(e)-2-carboxyethenyl]phenyl]prop-2-enoic acid Chemical compound OC(=O)\C=C\C1=CC=C(\C=C\C(O)=O)C=C1 AAFXQFIGKBLKMC-KQQUZDAGSA-N 0.000 description 1
- WOHLSTOWRAOMSG-UHFFFAOYSA-N 2,3-dihydro-1,3-benzothiazole Chemical compound C1=CC=C2SCNC2=C1 WOHLSTOWRAOMSG-UHFFFAOYSA-N 0.000 description 1
- GQYDZBRCPSLDOG-UHFFFAOYSA-N 2-(1-ethylbenzo[e][1,3]benzothiazol-2-ylidene)-1-phenylethanone Chemical compound S1C2=CC=C3C=CC=CC3=C2N(CC)C1=CC(=O)C1=CC=CC=C1 GQYDZBRCPSLDOG-UHFFFAOYSA-N 0.000 description 1
- BLPUXJIIRIWMSQ-QPJJXVBHSA-N 2-[(e)-3-phenylprop-2-enylidene]propanedioic acid Chemical compound OC(=O)C(C(O)=O)=C\C=C\C1=CC=CC=C1 BLPUXJIIRIWMSQ-QPJJXVBHSA-N 0.000 description 1
- WPRWWXUEGMTZQP-UHFFFAOYSA-N 2-[3-(2-nitrophenyl)prop-2-enylidene]propanedioic acid Chemical compound OC(=O)C(C(O)=O)=CC=CC1=CC=CC=C1[N+]([O-])=O WPRWWXUEGMTZQP-UHFFFAOYSA-N 0.000 description 1
- NHIAQXYBZPJUOI-UHFFFAOYSA-N 2-[3-(furan-2-yl)prop-2-enylidene]propanedioic acid Chemical compound OC(=O)C(C(O)=O)=CC=CC1=CC=CO1 NHIAQXYBZPJUOI-UHFFFAOYSA-N 0.000 description 1
- SKHJNYCDXYHLBP-UHFFFAOYSA-N 2-but-2-enylidenepropanedioic acid Chemical compound CC=CC=C(C(O)=O)C(O)=O SKHJNYCDXYHLBP-UHFFFAOYSA-N 0.000 description 1
- FPKCTSIVDAWGFA-UHFFFAOYSA-N 2-chloroanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3C(=O)C2=C1 FPKCTSIVDAWGFA-UHFFFAOYSA-N 0.000 description 1
- BLPUXJIIRIWMSQ-UHFFFAOYSA-N 2-cinnamylidenepropanedioic acid Chemical class OC(=O)C(C(O)=O)=CC=CC1=CC=CC=C1 BLPUXJIIRIWMSQ-UHFFFAOYSA-N 0.000 description 1
- RFHPMEOKJKCEFR-UHFFFAOYSA-N 2-cyclohexyloxyethanol Chemical compound OCCOC1CCCCC1 RFHPMEOKJKCEFR-UHFFFAOYSA-N 0.000 description 1
- RZPFVRFSYMUDJO-UHFFFAOYSA-N 2h-naphthalen-1-one Chemical compound C1=CC=C2C(=O)CC=CC2=C1 RZPFVRFSYMUDJO-UHFFFAOYSA-N 0.000 description 1
- IWYYIZOHWPCALJ-UHFFFAOYSA-N 4-methyl-1-oxidopyridin-1-ium Chemical compound CC1=CC=[N+]([O-])C=C1 IWYYIZOHWPCALJ-UHFFFAOYSA-N 0.000 description 1
- HUKPVYBUJRAUAG-UHFFFAOYSA-N 7-benzo[a]phenalenone Chemical compound C1=CC(C(=O)C=2C3=CC=CC=2)=C2C3=CC=CC2=C1 HUKPVYBUJRAUAG-UHFFFAOYSA-N 0.000 description 1
- JNUKQXQMMIRLJW-UHFFFAOYSA-O CC[S+]1C(C=CC2=CC=CC=C22)=C2NC1=CC(C1=CC=CC=C1)=O Chemical compound CC[S+]1C(C=CC2=CC=CC=C22)=C2NC1=CC(C1=CC=CC=C1)=O JNUKQXQMMIRLJW-UHFFFAOYSA-O 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 241001422033 Thestylus Species 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 125000001118 alkylidene group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- ILRRQNADMUWWFW-UHFFFAOYSA-K aluminium phosphate Chemical compound O1[Al]2OP1(=O)O2 ILRRQNADMUWWFW-UHFFFAOYSA-K 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 150000008425 anthrones Chemical class 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000004104 aryloxy group Chemical group 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- KXNQKOAQSGJCQU-UHFFFAOYSA-N benzo[e][1,3]benzothiazole Chemical compound C1=CC=C2C(N=CS3)=C3C=CC2=C1 KXNQKOAQSGJCQU-UHFFFAOYSA-N 0.000 description 1
- NIDNOXCRFUCAKQ-UHFFFAOYSA-N bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic acid Chemical compound C1C2C=CC1C(C(=O)O)C2C(O)=O NIDNOXCRFUCAKQ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- KFUJUTFTRXYQMG-UHFFFAOYSA-N bis[4-(dimethylamino)phenyl]methanethione Chemical compound C1=CC(N(C)C)=CC=C1C(=S)C1=CC=C(N(C)C)C=C1 KFUJUTFTRXYQMG-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- RHDGNLCLDBVESU-UHFFFAOYSA-N but-3-en-4-olide Chemical compound O=C1CC=CO1 RHDGNLCLDBVESU-UHFFFAOYSA-N 0.000 description 1
- 125000002837 carbocyclic group Chemical group 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 210000004027 cell Anatomy 0.000 description 1
- 210000002421 cell wall Anatomy 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- TXXHDPDFNKHHGW-HSFFGMMNSA-N cis,trans-muconic acid Chemical compound OC(=O)\C=C\C=C/C(O)=O TXXHDPDFNKHHGW-HSFFGMMNSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- MGNZXYYWBUKAII-UHFFFAOYSA-N cyclohexa-1,3-diene Chemical group C1CC=CC=C1 MGNZXYYWBUKAII-UHFFFAOYSA-N 0.000 description 1
- MJZUVTBSHJXHRG-UHFFFAOYSA-N cyclohexa-1,3-diene-1,3-dicarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=CCC1 MJZUVTBSHJXHRG-UHFFFAOYSA-N 0.000 description 1
- BQYOGZXCESFTRX-UHFFFAOYSA-N cyclohexa-1,3-diene-1,4-dicarboxylic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)CC1 BQYOGZXCESFTRX-UHFFFAOYSA-N 0.000 description 1
- ACPRBIUWOJNRAM-UHFFFAOYSA-N cyclohexa-1,5-diene-1,4-dicarboxylic acid Chemical compound OC(=O)C1CC=C(C(O)=O)C=C1 ACPRBIUWOJNRAM-UHFFFAOYSA-N 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- 150000001989 diazonium salts Chemical class 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 1
- 229920003063 hydroxymethyl cellulose Polymers 0.000 description 1
- 229940031574 hydroxymethyl cellulose Drugs 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Inorganic materials [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- WVIICGIFSIBFOG-UHFFFAOYSA-N pyrylium Chemical compound C1=CC=[O+]C=C1 WVIICGIFSIBFOG-UHFFFAOYSA-N 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 150000003557 thiazoles Chemical class 0.000 description 1
- 150000003549 thiazolines Chemical class 0.000 description 1
- ANRHNWWPFJCPAZ-UHFFFAOYSA-M thionine Chemical compound [Cl-].C1=CC(N)=CC2=[S+]C3=CC(N)=CC=C3N=C21 ANRHNWWPFJCPAZ-UHFFFAOYSA-M 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- TXXHDPDFNKHHGW-ZPUQHVIOSA-N trans,trans-muconic acid Chemical compound OC(=O)\C=C\C=C\C(O)=O TXXHDPDFNKHHGW-ZPUQHVIOSA-N 0.000 description 1
- 150000004961 triphenylmethanes Chemical class 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/06—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
- C25D11/08—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used containing inorganic acids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N3/00—Preparing for use and conserving printing surfaces
- B41N3/03—Chemical or electrical pretreatment
- B41N3/034—Chemical or electrical pretreatment characterised by the electrochemical treatment of the aluminum support, e.g. anodisation, electro-graining; Sealing of the anodised layer; Treatment of the anodic layer with inorganic compounds; Colouring of the anodic layer
Definitions
- This invention relates to a novel phosphoric acid anodized aluminum support for use in a lithographic printing plate, to a method for the preparation of such support, and to a lithographic printing plate comprising the support which exhibits improved abrasion resistance.
- U.S. patent 3,511,661 discloses a lithographic printing plate comprising a phosporic acid anodized aluminum surface.
- the aluminum surface stratum comprises a cellular pattern of aluminum oxide consisting of cells with porous openings about 20x10 9m - 75 ⁇ 10 -9 m in average diameter, thus providing a surface sufficiently porous to achieve good adhesion.
- the surface stratum comprises about 10 to 200 mg/m 2 aluminum phosphate.
- U. S. patent 4,229,266 relates to the use of a mixture of sulfuric acid and phosphoric acid in forming the anodic layer of a lithographic printing plate. According to this patent, only relatively thin layers are obtained when phosphoric acid alone is used as the electrolyte in the anodizing process, due to the strong redissolving capacity of phosphoric acid towards aluminum oxide, and this is said to result in inferior abrasion resistance for phosphoric acid anodized layers.
- a lithographic printing plate having improved abrasion resistance and a support surface sufficiently porous to achieve adequate adhesion.
- the invention provides an anodized aluminum support, for use in a lithographic printing plate, comprising an anodic surface stratum consisting essentially of oxides and phosphates of aluminum having an average thickness greater than 0.50 micrometers.
- the anodic stratum is present in a coverage of greater than 600 milligrams per square meter of support and has a web-like surface structure characterized by the presence of a multiplicity of interlacing filaments having average widths within the range of from about 0.03 to about 0.15 micrometers.
- the invention further provides a method of preparing such support by anodically oxidizing at least one surface of an aluminum plate in an aqueous electrolyte comprising phosphoric acid, characterized in that the electrolyte comprises from about 15 to 30% phosphoric acid by weight, and the anodic oxidation is carried out at an anodizing voltage of at least about 50 volts at an electrolyte temperature of from about 25°C to about 50°C and at an anodizing condition of at least 2.5 amp. min/dm .
- a lithographic printing plate in accordance with the present invention comprises a radiation sensitive layer and the above-described anodized aluminum support.
- the lithographic printing plate of this invention exhibits improved resistance to abrasion.
- the support material comprises an aluminum or aluminum alloy plate.
- Suitable aluminum alloys include alloys with zinc, silicon, chromium, copper, manganese, magnesium, chromium, zinc, lead, bismuth, nickel, iron or titanium which may contain negligible amounts of impurities.
- the surface of the aluminum plate is preferably subjected to chemical cleaning such as degreasing with solvents or alkaline agents for the purpose of exposing a clean surface free of grease, )rust or dust which is usually present on the aluminum surface.
- chemical cleaning such as degreasing with solvents or alkaline agents for the purpose of exposing a clean surface free of grease, )rust or dust which is usually present on the aluminum surface.
- the surface is grained. Suitable graining methods include glass bead graining, ball graining, sand blasting, brush graining and electrolytic graining.
- the support can be treated with an aluminum etching agent and a desmutting acid bath.
- An anodized stratum is then formed on at least one surface of the aluminum plate.
- An electric current is passed through the support immersed as a cathode in an electrolytic solution containing phosphoric acid.
- the anodized surface stratum consists essentially of oxides and phosphates of aluminum and is present in a coverage of greater than 600 milligrams per square meter of support.
- the average thickness of the surface stratum is greater than 0.50 micrometers. In a preferred embodiment of this invention, the surface stratum has an average thickness greater than 0.70 micrometers.
- the oxides and phosphates of aluminum preferably are present in a coverage of greater than 800 milligrams per square meter of support.
- the support of this invention has a web-like surface structure characterized by the presence of a multiplicity of interlacing filaments as depicted in Figure 3.
- the interlacing filaments have average widths within the range of from about 0.03 to about 0.15 micrometers, more preferably within the range of from about 0.05 to about 0.12 micrometers. If the average widths of the interlacing filaments exceed about 0.15 micrometers, poor adhesion results between the surface of the support and the radiation sensitive layer. Lithographic printing plates prepared from supports containing interlacing filaments having average widths less than 0.03 micrometers exhibit good adhesion but poor sensitivity performance.
- the above-described support of this invention is prepared in a process of anodically oxidizing at least one surface of an alumimum plate in an aqueous electrolyte comprising phosphoric acid.
- the aqueous electrolyte comprises from about 15 to 30%, preferably 17-22% phosphoric acid by weight.
- the anodic oxidation is carried out at an anodizing voltage of at least 50 volts, and preferably at an anodizing voltage of at least 70 volts.
- An anodizing condition of at least 2.5 amp ⁇ min/dm is required to provide the above described anodized stratum.
- the anodization preferably takes place at an anodizing condition greater than 3.0 amp ⁇ min/dm 2 .
- a range of typical anodizing times is from about 15 seconds to 3 minutes.
- the electrolyte temperature during anodization can range from about 25 0 C to about 50°C, however, the preferred electrolyte temperature range is from about 30°C to 40°C. Below 25°C, an extremely high voltage is required, and hot spots result. Above 50 C, the rate of dissolution of the anodized stratum is too great.
- the above-described support can be coated, if desired, with a thin coating of a hydrophilic material.
- the hydrophilic coating contributes to improving the water receptivity of the non-printing areas of the processed plate.
- the hydrophilic coating is coated by known techniques in a subbing amount. It is particularly advantageous to use a water-soluble permanently hydrophilic material which can be coated from an aqueous dispersion.
- a solution containing polyacrylamide is especially advantageous for this purpose, as are solutions containing carboxymethyl cellulose, polyvinylphosphonic acid, sodium silicate and combinations of these.
- hydrophilic interlayers include polyvinylalcohol, copolymers of maleic anhydride with ethylene, vinyl acetate, styrene or vinyl methyl ether, polyacrylic acid, hydroxymethyl cellulose and polyvinyl pyrrolidone.
- a particularly useful hydrophilic subbing composition is described in U.S. patent 3,860,426.
- the lithographic printing plate of this invention comprises a radiation sensitive layer and the above-described support.
- a radiation sensitive coating is placed directly on the support or, preferably, over one or more subbing layers.
- Supports prepared in accordance with the teaching of this invention are sufficiently porous to achieve good adhesion.
- Various radiation sensitive materials suitable for forming images for use in the lithographic printing process can be used. Almost any radiation sensitive layer is suitable which after exposure, if necessary followed by developing and/or fixing, provides an area in imagewise distribution which may be used for printing.
- Radiation sensitive materials useful in this invention are well known in the art, and include silver halide emulsions, as described in Research Disclosure, publication 17643, paragraph XXV, Dec., 1978 and references noted therein; quinone diazides (polymeric and non-polymeric), as described in U.S. patent 4,141,733 (issued February 27, 1979 to Guild) and references noted therein; light sensitive polycarbonates, as described in U.S. patent 3,511,611 (issued May 12, 1970 to Rauner et al) and references noted therein; diazonium salts, diazo resins, cinnamal-malonic acids and functional equivalents thereof and others described in U.S.
- Particularly useful radiation sensitive materials are photocrosslinkable polymers, such as polyesters, containing the photosensitive group as an integral part of the polymer backbone.
- preferred photocrosslinkable polymers are polyesters prepared from one or more compounds represented by the following formulae: wherein R 2 is one or more alkyl of 1 to 6 carbon atoms, aryl of 6 to 12 carbon atoms, aralkyl of 7 to 20 carbon atoms, alkoxy of 1 to 6 carbon atoms, nitro, amino, acrylic, carboxyl, hydrogen or halo and is chosen to provide at least one condensation site; and R 3 is hydroxy, alkoxy of 1 to 6 carbon atoms, halo or oxy if the compound is an acid anhydride.
- a preferred compound is p-phenylene diacrylic acid or a functional equivalent thereof.
- R 3 is as defined above, and R 4 is alkylidene of 1 to 4 carbon atoms, aralkylidene of 7 to 16 carbon atoms, or a 5- to 6-membered heterocyclic ring.
- Particularly useful compounds of formula (B) are cinnamylidenemalonic acid, 2-butenylidenemalonic acid, 3-pentenylidenemalonic acid, o-nitrocinnamylidenemalonic acid, naphthylallylidenemalonic acid, 2-furfurylideneethylidenemalonic acid and functional equivalents thereof.
- R 3 is as defined above; and R 5 is hydrogen or methyl.
- Particularly useful compounds of formula (C) are trans,trans-muconic acid, cis,trans-muconic acid, cis,cis-muconic acid, ⁇ , ⁇ '-cis,trans- dimethylmuconic acid, ⁇ , ⁇ '-cis,cis-dimethyl- muconic acid and functional equivalents thereof.
- R 3 is as defined above; and Z represents the atoms necessary to form an unsaturated, bridged or unbridged carbocyclic nucleus of 6 or 7 carbon atoms. Such nucleus can be substituted or unsubstituted.
- Particularly useful compounds of formula (D) are 4-cyclohexene-l,2-dicarboxylic acid, 5-norbornene-2,3-dicarboxylic acid, hexachloro-5[2:2:1]-bicycloheptene-2,3-dicarboxylic acid and functional equivalents thereof. These and other useful compounds are described in Canadian patent 824,096 (issued September 30, 1969 to Mench et al). R 3 is as defined above; and R 6 is hydrogen, alkyl of 1 to 12 carbon atoms, cycloalkyl of 5 to 12 carbon atoms or aryl of 6 to 12 carbon atoms.
- R 6 can be substituted, where possible, with such substituents as do not interfere with the condensation reaction, such as halo, nitro, aryl, alkoxy, aryloxy, etc.
- the carbonyl groups are attached to the cyclohexadiene nucleus meta or para to each other, and preferably para.
- Particularly useful compounds of formula (E) are 1,3-cyclohexadiene-1,4-dicarboxylic acid, 1,3-cyclohexadiene-1,3-dicarboxylic acid. 1,5-cyclohexadiene-1,4-dicarboxylic acid and functional equivalents thereof. These and other useful compounds are described in Belgian patent 754,892 (issued October 15, 1970).
- the radiation-sensitive coating can be prepared by dispersing the radiation sensitive composition or polymer in any suitable solvent or combination of solvents used in the art.
- Suitable sensitizers include anthrones, such as 1-carbethoxy-2-keto-3-methyl-2-azabenzanthrone, benzanthrone; nitro sensitizers; triphenylmethanes; quinones; cyanine dye sensitizers; naphthone sensitizers such as 6-methoxybeta-2-furyl-2-acrylonaphthone; pyrylium or thiapyrylium salts, such as 2,6 bis(p-ethoxyphenyl)-4-(p-n-amyloxyphenyl)-thiapyrylium perchlorate and 1,3,5-triphenyl-pyrylium fluoroborate; furanone; 4-picoline-N-oxide; anthraquinones such as 2-chloroanthraquinone; thiazoles such as 2-benzoylcarbethoxymethylene- l-methyl
- a number of other addenda can be present in the coating composition and ultimately form a part of the lithographic plate.
- dyes or pigments may be included to obtain colored images to aid in recognition.
- Other components which can be advantageously included in the coating composition are materials which serve to improve film formation, coating properties, adhesion of the coatings to the support, mechanical strength and stability.
- the lithographic printing plate of the present invention can be exposed by conventional methods, for example through a transparency or a stencil, to an imagewise pattern of actinic radiation.
- Suitable radiation sources include sources rich in visible radiation and sources rich in ultraviolet radiation.
- Carbon arc lamps, mercury vapor lamps, fluorescent lamps, tungsten filament lamps, photoflood lamps, lasers and the like are useful herein.
- the exposed lithographic printing plate can be developed using conventional developer and developing techniques.
- the developer composition is applied to the surface of the plate for a period of time sufficient to remove the polymer from non-image areas of the plate.
- gentle mechanical action aids in removing the polymer composition from these areas.
- swabbing is a useful method of applying the developer composition to the plate.
- the developer composition is typically used at room temperature but it can be employed at elevated temperatures up to about 32°C.
- a second application can be applied, followed by either a single or double application of a desensitizing composition.
- the plate is then dried.
- a 12 mil (0.3 mm) aluminum plate Is Immersed in a caustic solution to remove oil and dirt from the surface.
- the surface is grained with a brush and a slurry of abrasive media. Loose residue is removed by etching in a caustic solution followed by an acid desmutting bath.
- the aluminum plate is then anodized in a phosphoric acid electrolyte under the conditions listed below.
- the anodized plate was treated in a 3% solution of PQ-D sodium silicate sold by PQ Corporation.
- the Si0 2 to Na 2 0 ratio was about 2:1.
- the anodized plate was immersed in a bath having a temperature of 82°C for about 45 seconds.
- the silicated anodized plate was rinsed, dried and coated with a polyacrylamide subbing layer as described in U.S. patent 3,860,426.
- the plate was then coated with a radiation sensitive coating as described in U.S. Patent No. 3,030,208, a condensation of hydroxyethoxycyclohexane and p-phenylenediethoxy acrylate.
- the physical properties of the anodized aluminum support are set forth in the following table.
- the abrasion resistance of the non-image portion of each plate was measured as follows. A diamond stylus was dragged across the plate surface and the weight on the stylus increased until a continuous scratch could be seen across the oxide surface penetrating into the underlying aluminum. The abrasion resistance is thus reported as minimum grams required to produce a continuous scratch.
- the anodic layers of examples 1-15 and comparative examples A-D all exhibited a web-like surface structure characterized by the presence of a multiplicity of interlacing filaments having average widths within the range of from about 0.03 to about 0.15 micrometers.
- comparative examples A-D exhibited inferior abrasion resistance in comparison with examples 1-15, as a result of the fact that they were prepared under conditions outside the scope of the process of this invention and, in consequence thereof, did not exhibit the thickness and coverage of the novel anodized aluminum support materials of this invention.
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Printing Plates And Materials Therefor (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US786012 | 1985-10-10 | ||
| US06/786,012 US4647346A (en) | 1985-10-10 | 1985-10-10 | Anodized aluminum support, method for the preparation thereof and lithographic printing plate containing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP0218159A1 true EP0218159A1 (fr) | 1987-04-15 |
| EP0218159B1 EP0218159B1 (fr) | 1990-06-13 |
Family
ID=25137339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP86113305A Expired - Lifetime EP0218159B1 (fr) | 1985-10-10 | 1986-09-26 | Support en aluminium anodisé, procédé pour sa préparation et plaque d'impression lithographique contenant ledit support |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4647346A (fr) |
| EP (1) | EP0218159B1 (fr) |
| JP (1) | JPH0767867B2 (fr) |
| DE (1) | DE3671921D1 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001053570A1 (fr) * | 2000-01-17 | 2001-07-26 | Jury Removich Zalygin | Enrobage ceramique a couches minces et procede de fabrication associe, surface de frottement formee sur l'enrobage ceramique a couches minces et procede de realisation de cette derniere |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4865951A (en) * | 1987-10-22 | 1989-09-12 | Eastman Kodak Company | Bilayered anodized aluminum support, method for the preparation thereof and lithographic printing plate containing same |
| JP2652804B2 (ja) * | 1989-04-27 | 1997-09-10 | 富士写真フイルム株式会社 | 感光性平版印刷版 |
| US5240590A (en) * | 1989-07-19 | 1993-08-31 | Seagate Technology, Inc. | Process for forming a bearing surface for aluminum alloy |
| JPH0411259A (ja) * | 1990-04-27 | 1992-01-16 | Fuji Photo Film Co Ltd | 湿し水不要感光性平版印刷版 |
| US5269904A (en) * | 1992-06-05 | 1993-12-14 | Northrop Corporation | Single tank de-oxidation and anodization process |
| DE69512321T2 (de) | 1994-06-16 | 2000-05-11 | Kodak Polychrome Graphics Llc, Norwalk | Lithographische Druckplatten mit einer oleophilen bilderzeugenden Schicht |
| JP3522923B2 (ja) * | 1995-10-23 | 2004-04-26 | 富士写真フイルム株式会社 | ハロゲン化銀感光材料 |
| US6014929A (en) * | 1998-03-09 | 2000-01-18 | Teng; Gary Ganghui | Lithographic printing plates having a thin releasable interlayer overlying a rough substrate |
| ATE259005T1 (de) * | 2001-10-11 | 2004-02-15 | Franz Oberflaechentechnik Gmbh | Erzeugung eines metallisch leitfähigen oberflächenbereichs auf oxidierten al-mg- legierungen |
| JP2004338186A (ja) * | 2003-05-14 | 2004-12-02 | Fuji Photo Film Co Ltd | 平版印刷版用支持体および平版印刷版原版 |
| JP4868020B2 (ja) * | 2008-12-26 | 2012-02-01 | 株式会社デンソー | アルミニウムの陽極酸化方法、および陽極酸化アルミニウム |
| US8869075B2 (en) | 2012-12-18 | 2014-10-21 | Globalfoundries Inc. | Locally optimized coloring for cleaning lithographic hotspots |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0161461A2 (fr) * | 1984-04-13 | 1985-11-21 | Hoechst Aktiengesellschaft | Procédé d'oxydation anodique d'aluminium et son application comme matériau de support pour plaques d'impression offset |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1051991A (fr) * | ||||
| US3208849A (en) * | 1963-06-24 | 1965-09-28 | Sperry Rand Corp | Planographic printing plate having a fibrous alumina coating thereon |
| US3511661A (en) * | 1966-07-01 | 1970-05-12 | Eastman Kodak Co | Lithographic printing plate |
| GB1244723A (en) * | 1967-11-15 | 1971-09-02 | Howson Algraphy Ltd | Improvements in or relating to presensitised lithographic printing plates |
| ZA6807938B (fr) * | 1967-12-04 | |||
| US3808000A (en) * | 1972-03-28 | 1974-04-30 | Grace W R & Co | Printing plate and method of preparation |
| JPS4912903A (fr) * | 1972-05-15 | 1974-02-04 | ||
| JPS5432424B2 (fr) * | 1972-06-03 | 1979-10-15 | ||
| US3860426A (en) * | 1972-12-22 | 1975-01-14 | Eastman Kodak Co | Subbed lithographic printing plate |
| US4127451A (en) * | 1976-02-26 | 1978-11-28 | The Boeing Company | Method for providing environmentally stable aluminum surfaces for adhesive bonding and product produced |
| JPS5437522A (en) * | 1977-08-30 | 1979-03-20 | Hitachi Denshi Ltd | Camma correction circuit |
| DE2836803A1 (de) * | 1978-08-23 | 1980-03-06 | Hoechst Ag | Verfahren zur anodischen oxidation von aluminium und dessen verwendung als druckplatten-traegermaterial |
| JPS5722035A (en) * | 1980-07-15 | 1982-02-04 | Matsushita Electric Works Ltd | Metal mold for compression forming |
| JPS5722032A (en) * | 1980-07-17 | 1982-02-04 | Toshiba Mach Co Ltd | Extrusion by multiple shaft extruder and screw used for it |
| US4542089A (en) * | 1981-09-08 | 1985-09-17 | Minnesota Mining And Manufacturing Company | Lithographic substrate and its process of manufacture |
| US4581996A (en) * | 1982-03-15 | 1986-04-15 | American Hoechst Corporation | Aluminum support useful for lithography |
| DE3328049A1 (de) * | 1983-08-03 | 1985-02-21 | Hoechst Ag, 6230 Frankfurt | Verfahren zur einstufigen anodischen oxidation von traegermaterialien aus aluminium fuer offsetdruckplatten |
| JPS6072792A (ja) * | 1983-09-29 | 1985-04-24 | Fuji Photo Film Co Ltd | 平版印刷版用支持体 |
| JPS60101539A (ja) * | 1983-11-08 | 1985-06-05 | Fuji Photo Film Co Ltd | 感光性平版印刷版 |
| US4596189A (en) * | 1984-03-01 | 1986-06-24 | Surface Science Corp. | Lithographic printing plate |
-
1985
- 1985-10-10 US US06/786,012 patent/US4647346A/en not_active Expired - Lifetime
-
1986
- 1986-09-26 EP EP86113305A patent/EP0218159B1/fr not_active Expired - Lifetime
- 1986-09-26 DE DE8686113305T patent/DE3671921D1/de not_active Expired - Fee Related
- 1986-10-09 JP JP61239393A patent/JPH0767867B2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0161461A2 (fr) * | 1984-04-13 | 1985-11-21 | Hoechst Aktiengesellschaft | Procédé d'oxydation anodique d'aluminium et son application comme matériau de support pour plaques d'impression offset |
Non-Patent Citations (1)
| Title |
|---|
| TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, vol. 62, part 2, August 1985, pages 41-46, Birmingham, GB; D.J. ARROWSMITH et al.: "Phosphoric acid anodizing of aluminium" * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001053570A1 (fr) * | 2000-01-17 | 2001-07-26 | Jury Removich Zalygin | Enrobage ceramique a couches minces et procede de fabrication associe, surface de frottement formee sur l'enrobage ceramique a couches minces et procede de realisation de cette derniere |
Also Published As
| Publication number | Publication date |
|---|---|
| US4647346A (en) | 1987-03-03 |
| JPH0767867B2 (ja) | 1995-07-26 |
| EP0218159B1 (fr) | 1990-06-13 |
| DE3671921D1 (de) | 1990-07-19 |
| JPS6299198A (ja) | 1987-05-08 |
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