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DK2840593T3 - Forbedret afbryderindretning og fremgangsmåde til fremstilling dertil - Google Patents

Forbedret afbryderindretning og fremgangsmåde til fremstilling dertil Download PDF

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Publication number
DK2840593T3
DK2840593T3 DK13778876.6T DK13778876T DK2840593T3 DK 2840593 T3 DK2840593 T3 DK 2840593T3 DK 13778876 T DK13778876 T DK 13778876T DK 2840593 T3 DK2840593 T3 DK 2840593T3
Authority
DK
Denmark
Prior art keywords
switch device
improved switch
manufacture therefor
therefor
manufacture
Prior art date
Application number
DK13778876.6T
Other languages
English (en)
Inventor
Kai Cheng
Original Assignee
Enkris Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enkris Semiconductor Inc filed Critical Enkris Semiconductor Inc
Application granted granted Critical
Publication of DK2840593T3 publication Critical patent/DK2840593T3/da

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311Gate electrodes for field-effect devices
    • H10D64/411Gate electrodes for field-effect devices for FETs
    • H10D64/511Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/517Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers
    • H10D64/519Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers characterised by their top-view geometrical layouts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/28008Making conductor-insulator-semiconductor electrodes
    • H01L21/28264Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being a III-V compound
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/015Manufacture or treatment of FETs having heterojunction interface channels or heterojunction gate electrodes, e.g. HEMT
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/40FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
    • H10D30/47FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
    • H10D30/471High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
    • H10D30/473High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having confinement of carriers by multiple heterojunctions, e.g. quantum well HEMT
    • H10D30/4732High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having confinement of carriers by multiple heterojunctions, e.g. quantum well HEMT using Group III-V semiconductor material
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/66Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/661Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon having vertical doping variation
    • H10D64/662Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon having vertical doping variation the conductor further comprising additional layers, e.g. multiple silicon layers having different crystal structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/66Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/68Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
    • H10D64/681Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator having a compositional variation, e.g. multilayered
    • H10D64/685Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator having a compositional variation, e.g. multilayered being perpendicular to the channel plane
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/66Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/68Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
    • H10D64/691Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator comprising metallic compounds, e.g. metal oxides or metal silicates 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/66Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/68Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
    • H10D64/693Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator the insulator comprising nitrogen, e.g. nitrides, oxynitrides or nitrogen-doped materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/85Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
    • H10D62/8503Nitride Group III-V materials, e.g. AlN or GaN
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/66Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Chemical & Material Sciences (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
DK13778876.6T 2012-04-20 2013-03-29 Forbedret afbryderindretning og fremgangsmåde til fremstilling dertil DK2840593T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201210118172XA CN102709321A (zh) 2012-04-20 2012-04-20 增强型开关器件及其制造方法
PCT/CN2013/073432 WO2013155929A1 (zh) 2012-04-20 2013-03-29 增强型开关器件及其制造方法

Publications (1)

Publication Number Publication Date
DK2840593T3 true DK2840593T3 (da) 2021-07-19

Family

ID=46901969

Family Applications (1)

Application Number Title Priority Date Filing Date
DK13778876.6T DK2840593T3 (da) 2012-04-20 2013-03-29 Forbedret afbryderindretning og fremgangsmåde til fremstilling dertil

Country Status (6)

Country Link
US (1) US9812540B2 (da)
EP (1) EP2840593B1 (da)
CN (2) CN108807526B (da)
DK (1) DK2840593T3 (da)
SG (1) SG11201406749WA (da)
WO (1) WO2013155929A1 (da)

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CN108807526B (zh) 2012-04-20 2021-12-21 苏州晶湛半导体有限公司 增强型开关器件及其制造方法
US9070705B2 (en) * 2013-03-15 2015-06-30 Semiconductor Components Industries, Llc HEMT semiconductor device and a process of forming the same
TWI653742B (zh) * 2014-05-30 2019-03-11 台達電子工業股份有限公司 半導體裝置與其之製造方法
US9613908B2 (en) * 2014-12-15 2017-04-04 Applied Materials, Inc. Ultra-thin dielectric diffusion barrier and etch stop layer for advanced interconnect applications
TWI641133B (zh) * 2015-03-31 2018-11-11 晶元光電股份有限公司 半導體單元
DE102015212048A1 (de) * 2015-06-29 2016-12-29 Robert Bosch Gmbh Transistor mit hoher Elektronenbeweglichkeit
CN107230619A (zh) * 2016-03-25 2017-10-03 北京大学 增强型氮化镓晶体管的制作方法
JP6594272B2 (ja) * 2016-09-02 2019-10-23 株式会社東芝 半導体装置及びその製造方法
CN106373884B (zh) * 2016-09-08 2019-12-24 西安电子科技大学 复合栅介质GaN基绝缘栅高电子迁移率晶体管的制作方法
US10510903B2 (en) 2016-11-29 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Impact ionization semiconductor device and manufacturing method thereof
CN110100313B (zh) 2017-06-09 2020-11-17 苏州晶湛半导体有限公司 一种增强型开关器件及其制造方法
CN112740417B (zh) 2018-09-30 2023-10-10 苏州晶湛半导体有限公司 一种半导体结构及其制造方法
WO2020191628A1 (zh) * 2019-03-26 2020-10-01 苏州晶湛半导体有限公司 一种半导体结构及其制造方法
CN112310209A (zh) * 2019-08-01 2021-02-02 广东美的白色家电技术创新中心有限公司 一种场效应晶体管及其制备方法
WO2021102681A1 (zh) * 2019-11-26 2021-06-03 苏州晶湛半导体有限公司 半导体结构及其制作方法
WO2021184299A1 (zh) * 2020-03-19 2021-09-23 苏州晶湛半导体有限公司 半导体结构及其制作方法
CN111739801B (zh) * 2020-06-22 2021-08-10 中国科学院上海微系统与信息技术研究所 一种SOI基p-GaN增强型GaN功率开关器件的制备方法
CN111739800B (zh) * 2020-06-22 2021-08-10 中国科学院上海微系统与信息技术研究所 一种SOI基凹栅增强型GaN功率开关器件的制备方法
CN113013242A (zh) * 2021-01-29 2021-06-22 西安电子科技大学 基于n-GaN栅的p沟道GaN基异质结场效应晶体管
CN115219578B (zh) * 2022-07-20 2023-11-17 江南大学 一种用于检测新冠病毒的GaN传感器及检测方法
CN115223871A (zh) * 2022-08-03 2022-10-21 徐州金沙江半导体有限公司 一种GaN增强型HEMT器件的制备方法
CN116247080A (zh) * 2023-02-27 2023-06-09 深圳市汇芯通信技术有限公司 氮极性面氮化镓晶体管及其制造方法

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Also Published As

Publication number Publication date
CN102709321A (zh) 2012-10-03
EP2840593A1 (en) 2015-02-25
CN108807526A (zh) 2018-11-13
EP2840593A4 (en) 2015-12-23
EP2840593B1 (en) 2021-05-05
CN108807526B (zh) 2021-12-21
SG11201406749WA (en) 2014-11-27
WO2013155929A1 (zh) 2013-10-24
US20150053921A1 (en) 2015-02-26
US9812540B2 (en) 2017-11-07

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