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DE602004003698D1 - Verfahren zum auffüllen von mikroblindlöchern - Google Patents

Verfahren zum auffüllen von mikroblindlöchern

Info

Publication number
DE602004003698D1
DE602004003698D1 DE602004003698T DE602004003698T DE602004003698D1 DE 602004003698 D1 DE602004003698 D1 DE 602004003698D1 DE 602004003698 T DE602004003698 T DE 602004003698T DE 602004003698 T DE602004003698 T DE 602004003698T DE 602004003698 D1 DE602004003698 D1 DE 602004003698D1
Authority
DE
Germany
Prior art keywords
electrolyte
bath
withdrawn
filling
galvanic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004003698T
Other languages
English (en)
Other versions
DE602004003698T2 (de
Inventor
Akif Oezkoek
Ottmar Roelfs
Oswald Igel
Herko Genth
Kai-Jens Matejat
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Publication of DE602004003698D1 publication Critical patent/DE602004003698D1/de
Application granted granted Critical
Publication of DE602004003698T2 publication Critical patent/DE602004003698T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Peptides Or Proteins (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
DE602004003698T 2003-06-03 2004-06-01 Verfahren zum auffüllen von mikroblindlöchern Expired - Lifetime DE602004003698T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10325101A DE10325101A1 (de) 2003-06-03 2003-06-03 Verfahren zum Auffüllen von µ-Blind-Vias (µ-BVs)
DE10325101 2003-06-03
PCT/EP2004/005874 WO2004107834A1 (en) 2003-06-03 2004-06-01 Process for filing micro-blind vias

Publications (2)

Publication Number Publication Date
DE602004003698D1 true DE602004003698D1 (de) 2007-01-25
DE602004003698T2 DE602004003698T2 (de) 2007-04-12

Family

ID=33482448

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10325101A Withdrawn DE10325101A1 (de) 2003-06-03 2003-06-03 Verfahren zum Auffüllen von µ-Blind-Vias (µ-BVs)
DE602004003698T Expired - Lifetime DE602004003698T2 (de) 2003-06-03 2004-06-01 Verfahren zum auffüllen von mikroblindlöchern

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE10325101A Withdrawn DE10325101A1 (de) 2003-06-03 2003-06-03 Verfahren zum Auffüllen von µ-Blind-Vias (µ-BVs)

Country Status (9)

Country Link
EP (1) EP1629704B1 (de)
JP (1) JP4392019B2 (de)
KR (1) KR20060004981A (de)
CN (1) CN1799294B (de)
AT (1) ATE348499T1 (de)
DE (2) DE10325101A1 (de)
MY (1) MY134649A (de)
TW (1) TWI350860B (de)
WO (1) WO2004107834A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004045451B4 (de) * 2004-09-20 2007-05-03 Atotech Deutschland Gmbh Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer
EP2000013B1 (de) * 2006-03-30 2010-10-13 ATOTECH Deutschland GmbH Elektrolytisches verfahren zum füllen von löchern und vertiefungen mit metallen
DE102007036651A1 (de) * 2007-07-25 2009-01-29 A.C.K. Aqua Concept Gmbh Karlsruhe Prozessrecycling galvanischer Bäder
JP4957906B2 (ja) * 2007-07-27 2012-06-20 上村工業株式会社 連続電気銅めっき方法
JP5471276B2 (ja) * 2009-10-15 2014-04-16 上村工業株式会社 電気銅めっき浴及び電気銅めっき方法
CN102427684B (zh) * 2011-11-08 2014-04-23 汕头超声印制板（二厂）有限公司 一种高密度互连印制电路板的制造方法
TWI539033B (zh) * 2013-01-07 2016-06-21 Chang Chun Petrochemical Co Electrolytic copper foil and its preparation method
EP2943601B1 (de) * 2013-01-10 2020-08-12 Coventya Inc. Vorrichtung und verfahren zur bewahrung der effizienz der badplattierung von dreiwertigem chrom
US11047064B2 (en) 2013-01-10 2021-06-29 Coventya, Inc. Apparatus and method to maintaining trivalent chromium bath plating
CN103118506B (zh) * 2013-01-22 2016-05-04 金悦通电子（翁源）有限公司 一种焊盘上导通孔的电镀填孔方法
JP2017210644A (ja) * 2016-05-24 2017-11-30 メルテックス株式会社 溶解性銅陽極、電解銅めっき装置、電解銅めっき方法、及び酸性電解銅めっき液の保存方法
CN111705344A (zh) * 2020-07-01 2020-09-25 孙颖睿 一种用于脉冲镀铜工艺的工作液补充方法
CN119481358B (zh) * 2024-11-15 2025-08-22 广东工业大学 一种可用于高倍率锡金属负极和锡锰电池的水系电解液

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4344387C2 (de) * 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens
DE19525509C2 (de) * 1994-07-22 1997-10-02 Lpw Anlagen Gmbh Anwendung der UV/H¶2¶O¶2¶-Oxidationsbehandlung zur betriebsmäßigen Wiederverwendungs- oder Weiterverwendungsaufbereitung eines Bades für die galvanotechnische Beschichtung von Gegenständen mit metallischen Überzügen
US5523001A (en) * 1994-12-30 1996-06-04 At&T Corp. Treatment of electroless plating waste streams
DE19810859A1 (de) * 1998-03-13 1999-09-16 A C K Aqua Concept Gmbh Wasser Kombinationsverfahren zur Behandlung eines schäumend eingestellten galvanischen Bads
DE19915146C1 (de) * 1999-01-21 2000-07-06 Atotech Deutschland Gmbh Verfahren zum galvanischen Bilden von Leiterstrukturen aus hochreinem Kupfer bei der Herstellung von integrierten Schaltungen
JP2001267726A (ja) * 2000-03-22 2001-09-28 Toyota Autom Loom Works Ltd 配線基板の電解メッキ方法及び配線基板の電解メッキ装置
US6942779B2 (en) * 2000-05-25 2005-09-13 Mykrolis Corporation Method and system for regenerating of plating baths
US6881319B2 (en) * 2000-12-20 2005-04-19 Shipley Company, L.L.C. Electrolytic copper plating solution and method for controlling the same
EP1264918B1 (de) * 2001-06-07 2011-11-23 Shipley Co. L.L.C. Verfahren zur elektrolytischen Kupferplatierung
JP4510369B2 (ja) * 2002-11-28 2010-07-21 日本リーロナール有限会社 電解銅めっき方法

Also Published As

Publication number Publication date
DE10325101A1 (de) 2004-12-30
CN1799294A (zh) 2006-07-05
JP2006526890A (ja) 2006-11-24
JP4392019B2 (ja) 2009-12-24
MY134649A (en) 2007-12-31
TW200508422A (en) 2005-03-01
DE602004003698T2 (de) 2007-04-12
EP1629704A1 (de) 2006-03-01
KR20060004981A (ko) 2006-01-16
WO2004107834A1 (en) 2004-12-09
TWI350860B (en) 2011-10-21
CN1799294B (zh) 2012-02-08
ATE348499T1 (de) 2007-01-15
EP1629704B1 (de) 2006-12-13

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