DE3826522A1 - PCB - Google Patents
PCBInfo
- Publication number
- DE3826522A1 DE3826522A1 DE19883826522 DE3826522A DE3826522A1 DE 3826522 A1 DE3826522 A1 DE 3826522A1 DE 19883826522 DE19883826522 DE 19883826522 DE 3826522 A DE3826522 A DE 3826522A DE 3826522 A1 DE3826522 A1 DE 3826522A1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- printed circuit
- epoxy resin
- particles
- preqregs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000002245 particle Substances 0.000 claims abstract description 16
- 239000003365 glass fiber Substances 0.000 claims abstract description 12
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 8
- 238000004519 manufacturing process Methods 0.000 claims abstract description 3
- 239000003822 epoxy resin Substances 0.000 claims description 15
- 229920000647 polyepoxide Polymers 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 claims description 5
- 239000000835 fiber Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000010949 copper Substances 0.000 description 3
- 238000001311 chemical methods and process Methods 0.000 description 2
- 239000011152 fibreglass Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0251—Non-conductive microfibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
- H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
Die Erfindung betrifft eine Leiterplatte mit den Merkmalen des Oberbegriffs des Anspruchs 1.The invention relates to a circuit board with the features of the preamble of claim 1.
Es ist allgemein bekannt, daß bei der Fertigung von hochwertigen Leiterplatten, insbesondere Multilayer-Leiterplatten, mit Epoxidharz getränkte Glasfasergewebe einlagen, sogenannte Preqregs, metallene mit Freistellbohrungen versehene Metallinnenlagen und Kupferzwischenlagen in mehreren Schichten, je nach Anzahl der für die entsprechende elektronische Schaltung die die Leiterplatte später aufnehmen soll, benötigten Verbindungen, übereinander gestapelt und in einem Polymerisationsvorgang miteinander verbunden werden.It is well known that when manufacturing high quality circuit boards, in particular multilayer printed circuit boards, glass fiber fabric impregnated with epoxy resin Deposits, so-called Preqregs, metal with cut-outs Metal inner layers and copper intermediate layers in several layers, depending on the number the one for the corresponding electronic circuit which the circuit board later required connections, stacked one above the other and in one Polymerization process are linked together.
Weiter ist bekannt, daß bei dem Polymerisationsvorgang das Epoxidharz aus den Preqregs austritt und sich zwischen den Preqregs und den Metallinnenlagen sowie in den Freistellbohrungen der Metallinnenlagen ablagert.It is also known that the epoxy resin from the Preqregs emerges and between the Preqregs and the metal inner layers as well as in the free holes in the metal inner layers.
Nach dem Polymerisationsvorgang werden die Leiterplatten gebohrt und durch kontaktiert. After the polymerization process, the circuit boards are drilled and through contacted.
Die so hergestellten Leiterplatten, wie sie z. B. für militärische Zwecke oder für Raumfahrtzwecke verwendet werden, werden in einem Qualifikations verfahren unter anderem einem vielmals zu durchfahrenden Temperaturwechseltest unterzogen, bei dem Temperaturen von -65°C bis +125°C erreicht werden.The printed circuit boards thus produced, as z. B. for military purposes or used for space purposes will be in a qualification process, among other things, a temperature change test that has to be carried out many times subjected to temperatures of -65 ° C to + 125 ° C.
Nach diesem Temperaturwechseltest zeigen sich oftmals Schwachstellen an den Durchkontaktierungen. Die in einem chemischen Verfahren angebrachten Durch kontaktierungen lösen sich im Bereich der Freistellbohrungen von der Epoxidharz verbindungsmasse und es bilden sich Unterbrechungen, die die Leiterplatte un brauchbar machen.After this temperature change test, weak points often appear on the Vias. The through attached in a chemical process Contacts detach from the epoxy resin in the area of the cut-out holes connecting mass and there are interruptions that un the circuit board make usable.
Aufgabe der Erfindung ist es, mit wenigem zusätzlichen Aufwand eine Leiterplatte zu schaffen, bei der dieser Nachteil vermieden wird.The object of the invention is a circuit board with little additional effort to create, in which this disadvantage is avoided.
Die Lösung dieser Aufgabe wird durch das im ersten Patentanspruch angegebene Merkmal gelöst.The solution to this problem is given by the one specified in the first claim Feature solved.
Weitere Verbesserungen werden durch die Unteransprüche erreicht.Further improvements are achieved through the subclaims.
Die Oberflächen der mit Epoxidharz getränkten Preqregs werden bei der erfin dungsgemäßen Leiterplatte, vor oder während der Schichtung, zusätzlich mit nichtleitenden formfesten Partikeln, z. B. Glasfaserpartikeln, ein oder beidsei tig bestreut oder kurzzeitig mit einer oder beiden Oberflächen in einen mit Glasfaserpartikeln gefüllten Behälter gelegt.The surfaces of the Preqregs impregnated with epoxy resin are invented by circuit board according to the invention, before or during layering, additionally with non-conductive dimensionally stable particles, e.g. B. glass fiber particles, one or both sprinkled or briefly with one or both surfaces in one Glass fiber filled container placed.
Die weitere Verarbeitung der so behandelten Preqregs mit den anderen zu einer Leiterplatte oder Multilayer-Leiterplatte gehörenden Teilen erfolgt in der bekannten Weise.The further processing of the preqregs treated in this way with the others into one Printed circuit board or multilayer printed circuit board parts are made in the known way.
Die am Preqreg haftenden Glasfaserpartikel werden beim Polymerisationsvorgang zusammen mit dem aus den Preqregs austretenden Epoxidharz in die Freiräume zwischen den Preqregs und den Metallinnenlagen und in den Freistellbohrungen der Metallinnenlagen abgelagert. Bei dem nachfolgenden Bohren der Leiterplatte entsteht eine rauhe Bohrungsoberfläche durch die in die Epoxidharzverbindungs masse eingelagerten Glasfaserpartikel, die nun als kleine Glasfaserpinsel in die Bohrung hineinragen. The glass fiber particles adhering to the Preqreg become during the polymerization process into the open spaces together with the epoxy resin emerging from the Preqregs between the Preqregs and the metal inner layers and in the cut-out holes of the metal inner layers deposited. When subsequently drilling the circuit board A rough bore surface is created by the in the epoxy resin connection mass of embedded glass fiber particles, which are now used as small glass fiber brushes protrude the hole.
Diese rauhe Bohrungsoberfläche gewährleistet eine bessere Anbindung der nach dem Bohren vorzunehmenden Cu-Durchkontaktierung an die Epoxidharzverbindungs masse und vermeidet damit das Reißen der Durchkontaktierung.This rough bore surface ensures a better connection to the the Cu via to be drilled to the epoxy resin connection mass and thus avoids tearing of the via.
Die Erfindung wird nachfolgend anhand des in der Zeichnung dargestellten Ausführungsbeispiels näher erläutert.The invention is described below with reference to the drawing Embodiment explained in more detail.
Die Fig. 1 zeigt in einem Ausführungsbeispiel eine Vergrößerung eines Aus schnitts der Lagen einer Multilayer-Leiterplatte. Bei der Schichtung der Multilayer-Leiterplatte werden die einzelnen Lagen, z.B. in der in Fig. 1 gezeigten Weise, übereinander gestapelt. Vor dem Stapeln werden die Metallinnen lagen 2 mit Freistellbohrungen 6 versehen. Die mit Epoxidharz getränkten Preqregs 1 werden vor oder während der Schichtung mit nichtleitenden formfesten Partikeln, z.B. mit Glasfaserpartikeln, ein- oder beidseitig bestreut oder kurzzeitig mit einer oder beiden Oberflächen in einen mit nichtleitenden formfesten Partikeln, z. B. mit Glasfaserpartikeln, gefüllten Behälter gelegt. Fig. 1 shows an embodiment of an enlargement of a section of the layers of a multilayer circuit board. When the multilayer circuit board is layered, the individual layers are stacked one above the other, for example in the manner shown in FIG. 1. Before stacking, the inner metal layers 2 were provided with cut-out holes 6 . The Preqregs 1 impregnated with epoxy resin are sprinkled with non-conductive, dimensionally stable particles, for example with glass fiber particles, on one or both sides or briefly with one or both surfaces in one with non-conductive, dimensionally stable particles, for. B. filled with fiberglass filled containers.
Bei dem nach der Schichtung folgenden Polymerisationsvorgang wird die Leiter platte bei starkem Druck erhitzt und das Epoxidharz mit den an der Oberfläche der Preqregs 1 haftenden Glasfaserpartikeln 3 zwischen Preqregs 1 und Metallin nenlage 2 und in die Freistellbohrungen 6 der Metallinnenlagen 2 gepreßt. Nach dem Polymerisationsvorgang wird die Leiterplatte mit den für die Durchkontak tierungen 5 benötigten Bohrungen versehen und gereinigt.Wherein after the lamination following polymerization the conductor plate heated at high pressure and the epoxy resin with the adhesive on the surface of Preqregs 1 fiberglass particles 3 between Preqregs 1 and Metallin nenlage 2 and pressed into the clearance holes 6 of the metal inner layers. 2 After the polymerization process, the circuit board is provided with the holes required for the through contacts 5 and cleaned.
Die in die Epoxidharzverbindungsmasse eingelagerten Glasfaserpartikel 3 stehen nun aus der Epoxidharzverbindungsmasse der Bohrung hervor.The glass fiber particles 3 embedded in the epoxy resin compound now protrude from the epoxy resin compound of the bore.
In einem nachfolgenden chemischen Vorgang werden die Bohrungen mit Cu-Durch kontaktierungen 5 versehen, die mit den Enden der Glasfaserpartikel 3 fest verbunden sind, wie eine in Fig. 1, links unten, gezeigte weitere Vergrößerung eines Teils einer Wand der Durchkontaktierung 5 deutlich zeigt.In a subsequent chemical process, the bores are provided with Cu through contacts 5 , which are firmly connected to the ends of the glass fiber particles 3 , as a further enlargement of part of a wall of the via 5 shown in FIG. 1, bottom left, clearly shows.
Die bei einem jetzt folgenden Temperaturwechseltest auftretenden Spannungen zwischen der Durchkontaktierung 5 und der sie umgebenden Epoxidharzverbindungs masse werden durch die fest in den Durchkontaktierungen 5 verankerten Enden der Glasfaserpartikel 3 aufgenommen und damit ein Lösen der Durchkontaktierung 5 von der Epoxidharzverbindungsmasse und ein Reißen der Durchkontaktierung 5 selbst vermieden.The voltages occurring in a subsequent temperature change test between the through-hole 5 and the epoxy resin compound surrounding it are absorbed by the ends of the glass fiber particles 3 firmly anchored in the through-holes 5 , and thus loosening of the via 5 from the epoxy resin compound and tearing of the via 5 itself are avoided .
Claims (4)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19883826522 DE3826522A1 (en) | 1988-08-04 | 1988-08-04 | PCB |
| PCT/EP1989/000725 WO1990001860A1 (en) | 1988-08-04 | 1989-06-27 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19883826522 DE3826522A1 (en) | 1988-08-04 | 1988-08-04 | PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE3826522A1 true DE3826522A1 (en) | 1990-02-08 |
Family
ID=6360241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19883826522 Withdrawn DE3826522A1 (en) | 1988-08-04 | 1988-08-04 | PCB |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE3826522A1 (en) |
| WO (1) | WO1990001860A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993023979A1 (en) * | 1992-05-15 | 1993-11-25 | Marina Adolfovna Sokolinskaya | Substrate for printed circuit boards and method of making it |
| CN114316519A (en) * | 2022-01-05 | 2022-04-12 | 泰山玻璃纤维有限公司 | Carbon-glass mixed pulling plate and preparation method thereof |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2694139B1 (en) * | 1992-07-21 | 1994-10-14 | Aerospatiale | Interconnection substrate for electronic components and its manufacturing process. |
| BE1011624A4 (en) * | 1997-12-17 | 1999-11-09 | Laude Lucien Diego | Media electrical circuit. |
| PL342654A1 (en) * | 1998-03-03 | 2001-07-02 | Ppg Ind Ohio | Glass fibre reinforced laminates, printed circuit boards made of such laminates and glass fibre fabric used as their reinforcement |
| CA2322155A1 (en) * | 1998-03-03 | 1999-09-10 | Bruce Novich | Inorganic particle-coated glass fiber strands and products including the same |
| DE69907881T2 (en) * | 1998-03-03 | 2004-02-26 | PPG Industries Ohio, Inc., Cleveland | GLASS SPIDING THREAD COATED WITH HEAT-CONDUCTING INORGANIC PARTICLES AND PRODUCTS CONTAINING THEM |
| US6949289B1 (en) | 1998-03-03 | 2005-09-27 | Ppg Industries Ohio, Inc. | Impregnated glass fiber strands and products including the same |
| WO1999044958A1 (en) * | 1998-03-03 | 1999-09-10 | Ppg Industries Ohio, Inc. | Methods for inhibiting abrasive wear of glass fiber strands |
| EP1060141B1 (en) * | 1998-03-03 | 2002-10-30 | PPG Industries Ohio, Inc. | Impregnated glass fiber strands and products including the same |
| CN100488906C (en) * | 1998-10-13 | 2009-05-20 | Ppg工业俄亥俄公司 | Glass fiber reinforced prepreg, laminate, circuit board and method of assembling fabric |
| MXPA01003660A (en) * | 1999-07-30 | 2001-07-01 | Impregnated glass fiber torones and products that include them | |
| US7354641B2 (en) | 2004-10-12 | 2008-04-08 | Ppg Industries Ohio, Inc. | Resin compatible yarn binder and uses thereof |
| JP6111833B2 (en) * | 2013-05-06 | 2017-04-12 | 株式会社デンソー | Multilayer substrate manufacturing method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3617613A (en) * | 1968-10-17 | 1971-11-02 | Spaulding Fibre Co | Punchable printed circuit board base |
| DE1504111B1 (en) * | 1964-02-13 | 1971-11-04 | Cincinnati Milling Machine Co | COPPER-CLADED GLASS FIBER REINFORCED RESIN PANEL |
| US3801427A (en) * | 1970-12-25 | 1974-04-02 | Hitachi Ltd | Printed circuit plate |
| EP0211979A1 (en) * | 1985-08-14 | 1987-03-04 | Toray Industries, Inc. | Laminate board containing uniformly distributed filler particles and method for producing the same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE307179B (en) * | 1962-11-19 | 1968-12-23 | Solitron Devices | |
| DE2739494B2 (en) * | 1977-08-30 | 1980-10-16 | Fuba, Hans Kolbe & Co, 3202 Bad Salzuflen | Process for manufacturing electrical circuit boards |
| US4615763A (en) * | 1985-01-02 | 1986-10-07 | International Business Machines Corporation | Roughening surface of a substrate |
| JPS62251136A (en) * | 1986-04-25 | 1987-10-31 | 三菱樹脂株式会社 | metal composite laminate |
-
1988
- 1988-08-04 DE DE19883826522 patent/DE3826522A1/en not_active Withdrawn
-
1989
- 1989-06-27 WO PCT/EP1989/000725 patent/WO1990001860A1/en not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1504111B1 (en) * | 1964-02-13 | 1971-11-04 | Cincinnati Milling Machine Co | COPPER-CLADED GLASS FIBER REINFORCED RESIN PANEL |
| US3617613A (en) * | 1968-10-17 | 1971-11-02 | Spaulding Fibre Co | Punchable printed circuit board base |
| US3801427A (en) * | 1970-12-25 | 1974-04-02 | Hitachi Ltd | Printed circuit plate |
| EP0211979A1 (en) * | 1985-08-14 | 1987-03-04 | Toray Industries, Inc. | Laminate board containing uniformly distributed filler particles and method for producing the same |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993023979A1 (en) * | 1992-05-15 | 1993-11-25 | Marina Adolfovna Sokolinskaya | Substrate for printed circuit boards and method of making it |
| CN114316519A (en) * | 2022-01-05 | 2022-04-12 | 泰山玻璃纤维有限公司 | Carbon-glass mixed pulling plate and preparation method thereof |
| CN114316519B (en) * | 2022-01-05 | 2024-03-22 | 泰山玻璃纤维有限公司 | Carbon-glass mixed pulling plate and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| WO1990001860A1 (en) | 1990-02-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OM8 | Search report available as to paragraph 43 lit. 1 sentence 1 patent law | ||
| 8139 | Disposal/non-payment of the annual fee |