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DE2029235A1 - Process for the production of a multi-sided laminated printed circuit board as well as printed circuit board produced according to this method - Google Patents

Process for the production of a multi-sided laminated printed circuit board as well as printed circuit board produced according to this method

Info

Publication number
DE2029235A1
DE2029235A1 DE19702029235 DE2029235A DE2029235A1 DE 2029235 A1 DE2029235 A1 DE 2029235A1 DE 19702029235 DE19702029235 DE 19702029235 DE 2029235 A DE2029235 A DE 2029235A DE 2029235 A1 DE2029235 A1 DE 2029235A1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
adhesive tape
film
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19702029235
Other languages
German (de)
Inventor
Siegfried 8070 Ingolstadt; Rehm Josef 8069 Rohrbach Goldkofer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Priority to DE19702029235 priority Critical patent/DE2029235A1/en
Publication of DE2029235A1 publication Critical patent/DE2029235A1/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09154—Bevelled, chamferred or tapered edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Description

Verfahren zur Herstellung einer mehrseitig kaschierten LeiterPlatte sowie nach diesem Verfahren hergestellte Leiterplatte.Process for the production of a multi-sided laminated circuit board as well as printed circuit board manufactured according to this process.

Zusatz zu Patent ........... (Patentanmeldung P 15 90 738.7).Addition to patent ........... (patent application P 15 90 738.7).

Die Hauptpatentanmeldung P 15 90 738.7 - 34 betrifft ein Verfahren zur Herstellung einer mehrseitig kaschierten Leiterplatte für einen elektrischen Schaltkreis und ist dadurch gekennzeichnet, dass sämtliche auf der Leiterplatte in Form von Metallkaschierungen aufzubringenden Leitungsverbindungen in bekannter Weise auf die eine Oberflächenseite einer biegsamen Folie geeigneter Grösse aufgebracht werden und dass anschliessend diese kaschierte Folie durch Faltung auf die Vorder- und Rückseite der Leitesplatte aufgelegt und auf geeignete Weise befestigt, insbesondere verklebt wird.The main patent application P 15 90 738.7 - 34 relates to a process for the production of a multi-sided laminated circuit board for an electrical Circuit and is characterized in that all on the circuit board in the form of metal laminations to be applied line connections in known Way applied to one surface side of a flexible sheet of suitable size and that this laminated film is then folded onto the front and placed on the back of the circuit board and fastened in a suitable manner, in particular is glued.

In der Praxis wird bei der Durchführung des Verfahrens nach der Hauptanmeldung beispielsweise so vorgegangen, dass die Folie mittels eines Klebstoffes auf die Leiterplatte auBgeklebt-wird. Die Erfindung will die dabei notwendigen Ablüfte- oder Aushärtezeiten vermeiden. Erfindungsgemäss erfolgt deshalb das Verkleben mittels eines doppelseitig klebenden Klebebandes. Dadurch lässt sich die Folie in rationeller Weise auf der Leiterplatte festlegen.In practice, when carrying out the procedure according to the main application for example, proceeded so that the film by means of an adhesive on the PCB is glued on. The invention aims to provide the necessary exhaust or avoid curing times. According to the invention, therefore, the gluing takes place by means of a double-sided adhesive tape. This allows the slide to be used more efficiently Way to set on the circuit board.

Weitere vorteilhafte Einzelheiten ergeben sich aus der. folgenden Beschreibung. Die Figur zeigt eine.nach dem erfindungsgemässen Verfahren hergestellte kaschierte Leiterplatte im Schnitt.Further advantageous details emerge from the. following Description. The figure shows a manufactured according to the inventive method laminated circuit board in section.

Eine Leiterplatte 1 wird zunächst an einer ihrer Kanten 1' abgerundet. Daraufhin wird ein doppelseitig klebendes Klebeband 2 mit seiner einen Seite auf die Oberfläche der Leiterplatte 1 aufgeklebt und um die abgerundete Kante 1' auf die Unterseite der Leiterplatte 1 gezogen. Die Fläche des Klebebandes ist etwa ebenso gross wie die auf der Leiterplatte zu befestigende Folie 3.A printed circuit board 1 is first rounded off at one of its edges 1 '. Then a double-sided adhesive tape 2 with its one side on the surface of the circuit board 1 glued and around the rounded edge 1 ' the underside of the circuit board 1 pulled. The area of the tape is about the same as large as the foil to be attached to the circuit board 3.

Es ist auch möglich, das Klebeband nur in einigen Bereichen, insbesondere den Randbereichen der aufzuklebenden Folie anzuordnen.It is also possible to use the tape only in some areas, in particular to be arranged in the edge areas of the film to be glued.

Dadurch lässt sich Klebeband einsparen und für verschiedene Folienabmessungen Eletphfid einheitlicher Abmessung verwenden.This saves on adhesive tape and for different film dimensions Eletphfid Use uniform dimensions.

Nach der Festlegung des Klebebandes 2 auf der Leiterplatte 1 wird die mit den elektrischen Leitungsverbindungen 4 versehene Folie auf die andere Seite des Klebebandes 2 und damit die Leiterplatte 1 aufgebracht. Vorteilhaft werden zur Bestimmung der Lage des Klebebandes auf der Leiterplatte beispielsweise in der Beiterplatte, dem Klebeband und der Folie Ausnehmungen vorgesehen, durch die sich Ausrichtedorne erstrecken. Bevorzugt wird die Folie auf die Leiterplatte aufgewalzt.After fixing the adhesive tape 2 on the circuit board 1 is the foil provided with the electrical line connections 4 on the other side of the adhesive tape 2 and thus the circuit board 1 is applied. Be beneficial to Determination of the position of the adhesive tape on the circuit board, for example in the circuit board, the adhesive tape and the film recesses are provided through which alignment pins extend. The film is preferably rolled onto the printed circuit board.

Die erfindungsgemässe Verbindung zwischen der Leiterplatte 1 und der Folie 3 mittels des doppelseitig klebenden Klebebandes 2 lässt sich auch so ausführen, dass zuerst das Klebeband 2 mit der Folie 3 verklebt wird, und danach die mit dem Klebeband versehene Folie an die Leiterplatte angedrückt wird.The inventive connection between the circuit board 1 and the Foil 3 by means of the double-sided adhesive tape 2 can also be designed in such a way that that first the adhesive tape 2 is glued to the film 3, and then the one with the Foil provided with adhesive tape is pressed onto the circuit board.

Zur Verbesserung der Klebeverbindung wird die mit der Folie verklebte Leiterplatte einer nachträglichen Wärmebehandlung unterzogen. Diese dauert bevorzugt 10 bis 30 Minuten bei 600C bis 1000C.To improve the adhesive bond, the adhesive bonded to the film is bonded Printed circuit board subjected to a subsequent heat treatment. This lasts preferably 10 to 30 minutes at 600C to 1000C.

Claims (5)

Patentansprüche:Patent claims: Verfahren zur Herstellung einer mehrseitig kaschierten Leiterplatte für einen elektrischen Schaltkreis, wobei nach Patent (Patentanmeldung P 15 90 738.7-34) sämtliche auf der Leiterplatte in Form von Metallkaschierungen aufzubringenden Leitungsverbindungen in bekannter Weise auf die eine Oberflächenseite einer biegsamen Folie geeigneter Grösse aufgebracht werden und dass anschliessend diese kaschierte Folie durch Faltung auf die Vorder- und Rückseite der Leiterplatte aufgelegt und auf geeignete Weise befestigt, insbesondere verklebt wird, dadurch gekennzeichnet, dass das Verkleben mittels eines doppelseitig klebenden Klebebandes erfolgt.Process for the production of a multi-sided laminated printed circuit board for an electrical circuit, according to patent (patent application P 15 90 738.7-34) all line connections to be applied to the circuit board in the form of metal laminations in a known manner on one surface side of a flexible film more suitable Size are applied and then this laminated film by folding placed on the front and back of the circuit board and in a suitable manner attached, in particular glued, characterized in that the gluing takes place by means of a double-sided adhesive tape. 2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass die Kante der Leiterplatte, über die das Klebeband geklebt werden soll, abgerundet wird. 2. The method according to claim 1, characterized in that the edge the circuit board over which the tape is to be stuck is rounded off. 3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass zur Bestimmung der Lage des Klebebandes und der Folie auf der Leiterplatte durch diese Ausrichtedorne gesteckt werden. 3. The method according to claim 1 or 2, characterized in that to determine the position of the adhesive tape and the film on the circuit board these alignment pins are inserted. 4. Verfahren nach einem oder mehreren der vorhergehenden Ansprüche 1 bis 3, dadurch gekennzeichnet, dass die mit der Folie beklebte Leiterplatte einer Wärmebehandlung unterzogen wird. 4. The method according to one or more of the preceding claims 1 to 3, characterized in that the printed circuit board glued to the film is a Is subjected to heat treatment. 5. Klebeband zur Durchführung des Verfahrens nach einem oder mehreren der vorhergehenden Ansprüche 1 bis 4, dadurch gekennzeichnet, dass das Klebeband etwa die gleiche Fläche wie die Folie hat. 5. Adhesive tape for carrying out the method according to one or more of the preceding claims 1 to 4, characterized in that the adhesive tape has about the same area as the foil. LeerseiteBlank page
DE19702029235 1970-06-13 1970-06-13 Process for the production of a multi-sided laminated printed circuit board as well as printed circuit board produced according to this method Pending DE2029235A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19702029235 DE2029235A1 (en) 1970-06-13 1970-06-13 Process for the production of a multi-sided laminated printed circuit board as well as printed circuit board produced according to this method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702029235 DE2029235A1 (en) 1970-06-13 1970-06-13 Process for the production of a multi-sided laminated printed circuit board as well as printed circuit board produced according to this method

Publications (1)

Publication Number Publication Date
DE2029235A1 true DE2029235A1 (en) 1971-12-30

Family

ID=5773873

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19702029235 Pending DE2029235A1 (en) 1970-06-13 1970-06-13 Process for the production of a multi-sided laminated printed circuit board as well as printed circuit board produced according to this method

Country Status (1)

Country Link
DE (1) DE2029235A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4164071A (en) * 1977-12-27 1979-08-14 Ford Motor Company Method of forming a circuit board with integral terminals
EP0017979A1 (en) * 1979-04-23 1980-10-29 Siemens Aktiengesellschaft Electrical network and method of manufacturing same
FR2466088A1 (en) * 1979-09-21 1981-03-27 Thomas & Betts Corp PROCESS FOR SEALED PROTECTION AGAINST THE ENVIRONMENT THE CUT END OF MULTICONDUCTOR CABLES AND CABLES THEREOF
EP0303485A3 (en) * 1987-08-12 1989-11-08 BICC Public Limited Company An improved circuit board
WO2002085083A1 (en) * 2001-04-18 2002-10-24 Gebr. Swoboda Gmbh Method for bonding flexible printed circuit boards and/or metal foils
WO2009080571A1 (en) * 2007-12-21 2009-07-02 Tesa Se Method for producing an antenna system
WO2011134701A1 (en) * 2010-04-28 2011-11-03 International Business Machines Corporation Printed circuit board edge connector

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4164071A (en) * 1977-12-27 1979-08-14 Ford Motor Company Method of forming a circuit board with integral terminals
EP0017979A1 (en) * 1979-04-23 1980-10-29 Siemens Aktiengesellschaft Electrical network and method of manufacturing same
FR2466088A1 (en) * 1979-09-21 1981-03-27 Thomas & Betts Corp PROCESS FOR SEALED PROTECTION AGAINST THE ENVIRONMENT THE CUT END OF MULTICONDUCTOR CABLES AND CABLES THEREOF
US4274197A (en) * 1979-09-21 1981-06-23 Thomas & Betts Corporation Method of making an environmental seal
EP0303485A3 (en) * 1987-08-12 1989-11-08 BICC Public Limited Company An improved circuit board
WO2002085083A1 (en) * 2001-04-18 2002-10-24 Gebr. Swoboda Gmbh Method for bonding flexible printed circuit boards and/or metal foils
WO2009080571A1 (en) * 2007-12-21 2009-07-02 Tesa Se Method for producing an antenna system
WO2011134701A1 (en) * 2010-04-28 2011-11-03 International Business Machines Corporation Printed circuit board edge connector
GB2492490A (en) * 2010-04-28 2013-01-02 Ibm Printed circuit board edge connector
CN102860142A (en) * 2010-04-28 2013-01-02 国际商业机器公司 Printed circuit board edge connector
GB2492490B (en) * 2010-04-28 2014-03-12 Ibm Printed circuit board edge connector
US8677617B2 (en) 2010-04-28 2014-03-25 International Business Machines Corporation Printed circuit board edge connector
US20140158403A1 (en) * 2010-04-28 2014-06-12 International Business Machines Corporation Printed Circuit Board Edge Connector
CN102860142B (en) * 2010-04-28 2015-05-20 国际商业机器公司 PCB Edge Connectors
US20160249454A1 (en) * 2010-04-28 2016-08-25 International Business Machines Corporation Printed Circuit Board Edge Connector
US9549469B2 (en) 2010-04-28 2017-01-17 International Business Machines Corporation Printed circuit board edge connector
US9693457B2 (en) 2010-04-28 2017-06-27 International Business Machines Corporation Printed circuit board edge connector
US9814140B2 (en) 2010-04-28 2017-11-07 International Business Machines Corporation Printed circuit board edge connector

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