CN201038186Y - A high power LED - Google Patents
A high power LED Download PDFInfo
- Publication number
- CN201038186Y CN201038186Y CN200720049177.6U CN200720049177U CN201038186Y CN 201038186 Y CN201038186 Y CN 201038186Y CN 200720049177 U CN200720049177 U CN 200720049177U CN 201038186 Y CN201038186 Y CN 201038186Y
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- Prior art keywords
- power led
- electrode
- chip
- great power
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
- H10H20/8582—Means for heat extraction or cooling characterised by their shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
- H10H20/8585—Means for heat extraction or cooling being an interconnection
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
本实用新型是一种大功率LED,包括透明罩,芯片,基座,电极片和散热片,上述基座呈杯碗状,其中心部位有一个圆形通孔,上述散热片在所述通孔内,其特征是所述通孔内壁与散热片组成一个灯杯,芯片位于此灯杯内且紧贴在散热片上,所述每个极性的电极片一端带有至少二片电极片,通过散热片和电极片两者散热。本实用新型的特点在于使用价格便宜的材料,同时也减小了散热系统的热阻,既达到了散热的目的又节省了成本。
The utility model is a high-power LED, which includes a transparent cover, a chip, a base, an electrode sheet and a heat sink. In the hole, it is characterized in that the inner wall of the through hole and the heat sink form a lamp cup, the chip is located in the lamp cup and is closely attached to the heat sink, and one end of the electrode sheet of each polarity has at least two electrode sheets, Heat is dissipated through both the heat sink and the electrode pads. The utility model is characterized in that cheap materials are used, and at the same time, the thermal resistance of the heat dissipation system is reduced, which not only achieves the purpose of heat dissipation but also saves costs.
Description
技术领域 technical field
本实用新型属于是照明灯具领域,尤其是指一种大功率LED。The utility model belongs to the field of lighting fixtures, in particular to a high-power LED.
背景技术 Background technique
发光二极管(LED)作为照明灯具已经非常广泛地被使用,为了追求更理想的照明光线效果,提升发光二极管的功率是最常用,也是最经济的一种方法。但随着发光二极管功率的提高,它的发热程度也更为严重。发光二极管的发热,对它的发光效率和使用寿命都有着极为负面的影响,因此现阶段人们对发光二极管的散热方法都进行了许多不同的尝试。现有的方案基本都是采用散热性能良好的金属给发光二极管散热,比如使用全金属的灯座,再附加散热块等等,虽然有一定效果,但是这样的方法成本太高,散热介质多,而且对于金属的加工生产工艺很麻烦,不适合大批量生产。对于LED的散热,散热系统热阻的大小是一个关键,减少散热介质对降低热阻有明显的效果。因此,仅使用导热良好的材料并不是最为有效且经济的方法,减小散热系统的热阻才是最有效的手段。Light-emitting diodes (LEDs) have been widely used as lighting fixtures. In order to pursue more ideal lighting effects, increasing the power of light-emitting diodes is the most common and economical method. However, as the power of the light-emitting diode increases, its heat generation becomes more serious. The heating of light-emitting diodes has a very negative impact on its luminous efficiency and service life. Therefore, at this stage, people have made many different attempts to dissipate heat from light-emitting diodes. The existing solutions basically use metals with good heat dissipation performance to dissipate heat for LEDs, such as using all-metal lamp holders, and adding heat dissipation blocks, etc. Although there are certain effects, such methods are too costly and have many heat dissipation media. And very troublesome for the processing production technology of metal, be not suitable for mass production. For the heat dissipation of LEDs, the thermal resistance of the heat dissipation system is a key point, and reducing the heat dissipation medium has an obvious effect on reducing the thermal resistance. Therefore, only using materials with good thermal conductivity is not the most effective and economical method, but reducing the thermal resistance of the heat dissipation system is the most effective means.
发明内容 Contents of the invention
本实用新型的目的就是为了提供一种热阻低、散热效果好,且生产工艺简单、成本低的大功率LED,以解决上述存在的技术问题。The purpose of the utility model is to provide a high-power LED with low thermal resistance, good heat dissipation effect, simple production process and low cost, so as to solve the above-mentioned existing technical problems.
本实用新型是一种大功率LED,包括透明罩,芯片,基座,电极片和散热片,上述基座呈杯碗状,其中心部位有一个圆形通孔,上述散热片在所述通孔内,其特征是:所述圆形通孔内壁与散热片组成一个灯杯,芯片位于此灯杯内且紧贴在散热片上,所述每个极性的电极片一端带有至少二片分电极片。The utility model is a high-power LED, which includes a transparent cover, a chip, a base, an electrode sheet and a heat sink. In the hole, it is characterized in that: the inner wall of the circular through hole and the heat sink form a lamp cup, the chip is located in the lamp cup and is closely attached to the heat sink, and one end of the electrode sheet of each polarity has at least two Divided electrodes.
所述芯片位于构成上述灯杯的圆形通孔的轴线上。The chip is located on the axis of the circular through hole forming the lamp cup.
所述构成上述灯杯的圆形通孔内壁上带有反光层。A reflective layer is provided on the inner wall of the circular through hole constituting the lamp cup.
所述电极片分为正、负二个极性,并按其极性连接在基座的两侧,且与散热片在同一个平面内。The electrode sheets are divided into two polarities, positive and negative, and are connected to both sides of the base according to their polarities, and are in the same plane as the heat sink.
所述电极片中同一个极性的电极片一端有二片分电极片,即整个电极片有四片分电极片。The electrode sheets of the same polarity in the electrode sheets have two sub-electrode sheets at one end, that is, the entire electrode sheet has four sub-electrode sheets.
所述的芯片与每一片分电极片之间有一根导线按其极性相连接。A wire is connected between the chip and each sub-electrode sheet according to its polarity.
所述基座的侧壁上有凹孔,透明罩的侧壁上有环形凸耳,该环形凸耳与上述凹孔相匹配。There is a concave hole on the side wall of the base, and an annular lug is arranged on the side wall of the transparent cover, and the annular lug is matched with the above concave hole.
所述的基座内有凸台,该凸台的顶面与上述凹孔的底面平齐。There is a boss inside the base, and the top surface of the boss is flush with the bottom surface of the above-mentioned concave hole.
所述灯杯内芯片上覆盖有荧光粉与硅胶的混合物。The chip in the lamp cup is covered with a mixture of fluorescent powder and silica gel.
本实用新型采用上述的方案后,它的结构非常简单,透明罩与基座都可以采用相对便宜的塑料材料直接在模具里制作,因此生产工艺也简单,成本低,适合大批量生产;更为重要的一点是,采用上述的LED结构后,它的散热介质少,热阻小,经过测试,其热阻在10K/W(开/瓦)以下,因此它的散热效果良好。本实用新型的特点在于使用价格便宜的材料,同时也减小了散热系统的热阻,既达到了散热的目的又节省了成本。After the utility model adopts the above-mentioned scheme, its structure is very simple, and both the transparent cover and the base can be made directly in the mould, using relatively cheap plastic materials, so the production process is also simple, the cost is low, and it is suitable for mass production; more The important point is that after adopting the above-mentioned LED structure, it has less heat dissipation medium and small thermal resistance. After testing, its thermal resistance is below 10K/W (K/W), so its heat dissipation effect is good. The utility model is characterized in that cheap materials are used, and at the same time, the thermal resistance of the heat dissipation system is reduced, which not only achieves the purpose of heat dissipation, but also saves costs.
附图说明 Description of drawings
图1是本实用新型的外观图;Fig. 1 is the exterior view of the utility model;
图2是本实用新型的分解示意图;Fig. 2 is the exploded schematic view of the utility model;
图3是本实用新型中基座的示意图;Fig. 3 is the schematic diagram of base in the utility model;
图4是图1中的A-A剖视图;Fig. 4 is A-A sectional view among Fig. 1;
图5是本实用新型的电极片与散热片的俯视图。Fig. 5 is a top view of the electrode sheet and the heat sink of the present invention.
具体实施方式 Detailed ways
如图1和图2所示,本实用新型包括透明罩1,基座2,芯片3,电极片4和散热片5。如图2和图4中所示,透明罩1是一个半球形,内部有一定的弧度,使它能使光线折射一定角度,两侧壁上带有环形凸耳11;如图2和图3中所示,基座2整体呈杯碗状,其中心部位有一个圆形通孔23,侧壁上有两个凹孔21,基座内靠近侧壁有四个凸台22;如图5所示,位于基座2一端的电极片4分成两片分电极片,散热片5中间是圆形部位51,两侧延伸有方形部位52。As shown in FIGS. 1 and 2 , the utility model includes a
透明罩1与基座2都采用塑料制成,通过专门的模具一次成型。在基座2成型的同时,将电极片4和散热片5置于模具内,基座2成型后,电极片4和散热片5都被镶嵌在基座2内,如图1和图2中所示结构。散热片5中间的圆形部位51的半径与基座2上圆形通孔23的半径一致,散热片5的圆形部位51卡在圆形通孔23内,而它的方形部位52则贯穿于圆形通孔23的内壁,这样散热片5与圆形通孔23内壁就形成了一个灯杯,芯片3位于此灯杯内且紧贴在散热片5上,如图2中所示。透明罩1盖在基座2上,透明罩1两侧的凸耳11盖在基座2上与凸耳11相匹配的凹孔21内,其余边缘处则盖在基座2内的四个凸台22上,为了使透明罩1平稳地盖在基座2上,所以制作基座2时,确保凹孔21的底面与四个凸台22的顶面在同一个平面内。Both the
本实用新型有主辅两个散热途径。其主要途径即通过散热片5传热至外界,次要途径是通过电极片4散热。第一个途径,发热的芯片3紧贴于散热片5上,散热片5可贴附于其它导热良好的支架上,以传导热量;第二个途径,基座2两侧的电极片4分为两个分电极片,此分电极片与散热片5位于同一平面内,如图5中所示,再用导热性能良好的导线6将芯片3与电极片4按极性连接,芯片3产生的热量经导线6传导至电极片4,再由电极片4散热。电极片4分为两个分电极片以增大散热面积,另外为了更好的导热效果,一端的分电极片都采用多根导线6与芯片3上相应的一极连接,本实用新型一个分电极片分别使用二根导线6与芯片3连接,即总共使用四根导线连接,增强传热效果。以上结构使本实用新型具备了优异的散热效果,经测试本实用新型散热系统的热阻可以达到10K/W(开/瓦)以下。The utility model has two main and auxiliary heat dissipation paths. The main way is to transfer heat to the outside through the
为了达到更好的光线效果,本实用新型也采取了一系列相应的措施。首先,透明罩1带有一定弧度,使光线经过一定角度的折射后出射;其次,本实用新型还在圆形通孔23的内壁上电镀有反光层231,使射向侧边的一部分光线反射向透明罩1;再者,为了使光线效果更佳,本实用新型将芯片3设置于散热片5的中心位置,即位于圆形通孔23的轴线上;最后,在芯片3上还覆盖有荧光粉与硅胶的混合物,以增加发光和散光效果。In order to achieve a better light effect, the utility model also takes a series of corresponding measures. Firstly, the
本实用新型生产工艺也简单,成本低,同时也减小了散热系统的热阻,既达到了散热的目的又节省了成本,适合于大批量生产。The utility model has simple production process and low cost, and also reduces the thermal resistance of the heat dissipation system, which not only achieves the purpose of heat dissipation but also saves costs, and is suitable for mass production.
Claims (8)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200720049177.6U CN201038186Y (en) | 2007-03-08 | 2007-03-08 | A high power LED |
| PCT/CN2007/003458 WO2008106847A1 (en) | 2007-03-08 | 2007-12-06 | Heat dissipating structure of led |
| JP2008000727U JP3141198U (en) | 2007-03-08 | 2008-02-13 | High power light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200720049177.6U CN201038186Y (en) | 2007-03-08 | 2007-03-08 | A high power LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201038186Y true CN201038186Y (en) | 2008-03-19 |
Family
ID=39210706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200720049177.6U Expired - Fee Related CN201038186Y (en) | 2007-03-08 | 2007-03-08 | A high power LED |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3141198U (en) |
| CN (1) | CN201038186Y (en) |
| WO (1) | WO2008106847A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102044537A (en) * | 2009-10-22 | 2011-05-04 | 亿光电子工业股份有限公司 | Light emitting diode packaging structure |
| CN102330898A (en) * | 2011-07-21 | 2012-01-25 | 苏州晶雷光电照明科技有限公司 | Anti-glare LED (Light-Emitting Diode) fluorescent lamp |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EA201001858A1 (en) | 2008-06-04 | 2011-08-30 | Астразенека Аб | HETEROCYCLIC DERIVATIVES OF UREA FOR THE TREATMENT OF BACTERIAL INFECTIONS |
| JP6110528B2 (en) * | 2016-02-03 | 2017-04-05 | 京セラコネクタプロダクツ株式会社 | Semiconductor light emitting device holder and semiconductor light emitting device module |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM258416U (en) * | 2004-06-04 | 2005-03-01 | Lite On Technology Corp | Power LED package module |
| US7119422B2 (en) * | 2004-11-15 | 2006-10-10 | Unity Opto Technology Co., Ltd. | Solid-state semiconductor light emitting device |
| TWI268631B (en) * | 2005-08-26 | 2006-12-11 | Headlite Tech Corporation | Manufacturing method and structure of LED device which combines a base with a module filled of lens colloid, wherein the base is completed with diode chip setting, wire connection, and light-collecting layer cover |
| CN2842747Y (en) * | 2005-11-07 | 2006-11-29 | 大铎精密工业股份有限公司 | LED lead frame |
-
2007
- 2007-03-08 CN CN200720049177.6U patent/CN201038186Y/en not_active Expired - Fee Related
- 2007-12-06 WO PCT/CN2007/003458 patent/WO2008106847A1/en not_active Ceased
-
2008
- 2008-02-13 JP JP2008000727U patent/JP3141198U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102044537A (en) * | 2009-10-22 | 2011-05-04 | 亿光电子工业股份有限公司 | Light emitting diode packaging structure |
| CN102044537B (en) * | 2009-10-22 | 2012-11-28 | 亿光电子工业股份有限公司 | Light-emitting diode packaging structure |
| CN102330898A (en) * | 2011-07-21 | 2012-01-25 | 苏州晶雷光电照明科技有限公司 | Anti-glare LED (Light-Emitting Diode) fluorescent lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3141198U (en) | 2008-04-24 |
| WO2008106847A1 (en) | 2008-09-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080319 Termination date: 20120308 |