CN2842747Y - LED lead frame - Google Patents

Abstract

The present invention relates to a design related to light emitting diode, and more particularly to a light emitting diode lead frame with light focusing and heat dissipating effects; the LED lead frame is mainly characterized in that a bowl-shaped base material is injected on a substrate, an annular flange is arranged on the substrate inside the bowl-shaped base material, and a plurality of metal terminals and radiating fins are convexly extended from the substrate to the outside of the bowl-shaped base material so as to enable the LED lead frame to have the effects of light condensation and heat radiation through the annular flange and the radiating fins.

Description

LED lead frame

technical field

The utility model relates to a design related to light-emitting diodes, in particular to a light-emitting diode lead frame with light-gathering and heat-radiating effects.

Background technique

According to general surface mount type light emitting diodes, it is mainly composed of metal terminals and semiconductor chips. The process is called solid crystal), and the wires are connected to each pin of the metal terminal (the process is called wire bonding), and then encapsulated with epoxy resin to form a surface-mounted light-emitting diode.

However, when the surface-mounted light-emitting diode is applied, it is only coated on the top of the semiconductor chip with epoxy resin. Therefore, when the semiconductor chip emits light, the light is directly transmitted to the outside through the epoxy resin, so that the light is emitted. The diode achieves the effect of luminescence; however, when the semiconductor chip emits light and transmits it on the epoxy resin, it is easy to cause light refraction, so that the light cannot be concentrated, which in turn affects the brightness generated by the overall operation of the light-emitting diode, making the light-emitting diode The efficiency is greatly reduced.

In addition, when the current passes through the metal terminals, the semiconductor chip will release light and heat energy will be generated at the same time, and the heat energy will be transferred to the epoxy resin on the surface of the package. Due to the poor thermal conductivity of the epoxy resin on the surface of the package, the light-emitting diode After absorbing heat energy under long-term use, the heat energy is sealed in the LED and is not easy to escape. At this time, it is easy to cause the LED with adhesive surface to overheat and shorten the service life of the LED.

Therefore, improving the heat dissipation and light concentrating effects of the light-emitting diodes is the technical means to be solved in the utility model.

Therefore, in view of the above-mentioned various problems, the inventor of the utility model has accumulated rich experience in the research, design, and manufacture of the roof product for many years, actively invested a lot of effort and energy in research and innovation, and finally successfully developed the utility model "" Light-emitting diode lead frame structure".

Utility model content

The purpose of the utility model is to provide a light emitting diode lead frame structure, which can improve the heat dissipation and light concentrating effects of the light emitting diode.

The utility model is a light-emitting diode lead frame structure, which is characterized in that the lead frame is composed of a bowl-shaped base material and a ring-shaped flange injected from the substrate, wherein:

The bowl-shaped substrate is coated on the outside of the substrate, and the substrate is separated by several conductive sheets, and the conductive sheets are respectively extended to the outside of the bowl-shaped substrate to form metal terminals, and the bowl-shaped substrate is reserved on the substrate. space, and the annular flange is arranged in the accommodating space of the bowl-shaped base material, and is arranged around the upper end of the base plate.

Wherein the inner edge of the bowl-shaped substrate is provided with an annular groove.

Wherein the annular groove is provided with a concentrating sheet capable of concentrating light.

Wherein the inner surface of the annular flange presents a gradually expanding slope from the bottom to the top.

Wherein the bowl-shaped base material is provided with at least one cooling fin, and the cooling fin protrudes from the base plate to the bowl-shaped base material.

Wherein the base plate is further provided with a recessed accommodating groove at the position of the inner peripheral edge of the annular flange.

The inner surface of the ring-shaped flange of the utility model presents a gradually expanding slope from the bottom to the top, and then when the semiconductor chip packaged in the ring-shaped flange emits light, the light can be projected on the ring-shaped flange on the inclined surface, so that the light is concentrated and projected to the outside of the light-emitting diode, so as to improve the efficiency of the light-emitting diode during operation.

The outside of the bowl-shaped substrate is further provided with a cooling fin, which extends from the base plate to the outside of the bowl-shaped substrate, and when the semiconductor chip is operated by introducing current through the metal terminal, the heat energy generated on the semiconductor chip can be dissipated. Conducted to the heat sink through the substrate, and then conducts heat exchange with the air through the heat sink, thereby achieving the effect of heat dissipation and prolonging the service life of the overall LED.

Description of drawings

In order to make it easier for the examiner to understand the content of the utility model and the effects that can be achieved, the following will be described in detail in conjunction with the embodiments and accompanying drawings, in which:

Fig. 1 is the schematic diagram of the utility model.

Fig. 2 is a schematic cross-sectional view of the utility model.

Fig. 3 is a schematic diagram of forming the substrate of the present invention.

FIG. 4 is a schematic cross-sectional view of the second embodiment of the present invention.

Detailed ways

The structural composition of the utility model "light-emitting diode lead frame structure", as shown in Figure 1, the lead frame 10 is composed of a bowl-shaped base material 30 and an annular flange 40 injected from the substrate 20, wherein:

The bowl-shaped substrate 30 surrounds the outside of the substrate 20, and the substrate 20 is divided into several conductive sheets 21, and the conductive sheets 21 respectively extend to the outside of the bowl-shaped substrate 30 to form metal terminals 22, and the bowl-shaped substrate 30 is on the substrate. An accommodating space is reserved on the 20, and an annular groove 31 is provided on the inner upper edge of the bowl-shaped base material 30; and the annular flange 40 is arranged in the accommodating space of the bowl-shaped base material 30, and The ring is provided on the upper end of the base plate 20 .

In addition, at least one cooling fin 23 is disposed on the outside of the bowl-shaped base material 30 , and the cooling fin 23 protrudes from the base plate 20 to the outside of the bowl-shaped base material 30 .

Please refer to Fig. 2, before the above-mentioned lead frame of the utility model intends to carry out the packaging operation, it is to carry out the action of solid crystal, that is, the semiconductor chip 50 is fixed on the substrate 20 located inside the annular flange 40, and is stamped. Wire, and use wire 60 to connect between semiconductor chip 50 and conductive sheet 21, and then utilize epoxy resin 70 to package, semiconductor chip 50 and wire 60 are packaged inside bowl-shaped base material 30, can be on annular groove 31 at the same time A light concentrating sheet 80 capable of concentrating light is provided.

Therefore, when the molded light-emitting diode conducts current through the metal terminal 22 outside the bowl-shaped substrate 30, the current will be conducted to the semiconductor chip 50 through the conductive sheet 21 and the wire 60, and then drive the semiconductor chip 50 to release it. When the semiconductor chip 50 is driven to emit light, the light emitted by the semiconductor chip 50 is projected onto the inner edge of the annular flange 40 and refracted, so that the light generated by the semiconductor chip 50 can be gathered in the ring The inner edge of the shaped flange 40 is projected to the outside of the whole light-emitting diode, so as to improve the luminous efficiency of the light-emitting diode, thereby increasing its brightness.

In addition, the inner surface of the annular flange 40 presents a slope 41 that gradually expands from the bottom to the top, so when the light is projected on the slope 41, the light will be refracted from the slope 41 to the outside of the light emitting diode, so that the light is more concentrated.

However, when the semiconductor chip 50 is driven by an electric current to emit light, the heat energy will be generated due to the flow of the electric current, so the heat energy can be guided to the heat sink 23 through the substrate 20, so that the heat sink 23 is connected to the outside of the bowl-shaped base material 30. The air performs heat exchange, thereby effectively improving the heat dissipation efficiency of the semiconductor chip 50 during operation, so as to prolong the service life of the overall LED.

As shown in Figure 3, the forming of the base plate 20 is mainly to punch several base plate 20 modules on a metal plate body, and several flow channels 24 are stamped on each base plate 20 module, and several metal terminals 22 are separated. The terminal 22 is formed by extending from the edge of the board to the side of the substrate 20, and a conductive sheet 21 is formed by bending the side close to the substrate 20, so that the conductive sheet 21 and the metal terminal 22 are connected as one, and at least one is stamped on the substrate 20. Radiating fins 23; after stamping the base plate 20 module on the metal plate body, the injection operation of the bowl-shaped base material 30 and the annular flange 40 can be carried out. Lead frame 10, and complete the making of lead frame.

As shown in Figure 4, the purpose of this utility model is to achieve the effect of concentrating light by surrounding the annular flange 40 around the semiconductor chip 50. During implementation, a recessed accommodating groove 25 can be preset on the substrate 20 For the placement of the semiconductor chip 50 , in addition to facilitating the positioning of the subsequent semiconductor chip 50 when implanted, the recess around the receiving groove 25 can also have the effect of concentrating light.

However, the above-mentioned names are determined for the convenience of describing the technical content of the utility model, and are not used to limit the scope of rights of this case; therefore, any conversion and replacement of equivalent components based on the creative spirit of this case shall be covered by this case. within the scope of protection.

Claims (6)

1. A light-emitting diode lead frame structure, characterized in that the lead frame is composed of a bowl-shaped base material and an annular flange injected from the substrate, wherein: The bowl-shaped substrate is coated on the outside of the substrate, and the substrate is separated by several conductive sheets, and the conductive sheets are respectively extended to the outside of the bowl-shaped substrate to form metal terminals, and the bowl-shaped substrate is reserved on the substrate. space, and the annular flange is arranged in the accommodating space of the bowl-shaped base material, and is arranged around the upper end of the base plate. 2. The light-emitting diode lead frame structure according to claim 1, wherein an annular groove is provided on the inner edge of the bowl-shaped substrate. 3. The light-emitting diode lead frame structure according to claim 2, wherein a light-condensing sheet is arranged on the annular groove. 4. The light-emitting diode lead frame structure according to claim 1, wherein the inner surface of the annular flange presents a gradually expanding slope from the bottom to the top. 5 . The LED lead frame structure according to claim 1 , wherein at least one cooling fin is provided on the outside of the bowl-shaped substrate, and the cooling fin protrudes from the substrate to the outside of the bowl-shaped substrate. 6. The LED lead frame structure according to claim 1, wherein the substrate is further provided with a recessed receiving groove at the inner peripheral edge of the annular flange.

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