CN111321410B - Substrate thickness detection and automatic correction system and detection and automatic correction method - Google Patents

Abstract

The invention relates to an etching process system and method, comprising a radio frequency copper measuring instrument and a pre-etching device. The radio frequency copper detector comprises a plurality of sensors; each sensor is capable of emitting and receiving radio frequencies, and the coverage ranges of the radio frequencies of the plurality of sensors overlap each other and are sufficient to span across both ends of the substrate for etching. After the radio frequency copper measuring instrument scans the substrate, data are transmitted to the pre-etching device for compensation spraying, so that abnormal positions of thickness and uniformity can be corrected. Therefore, the invention can scan all the surfaces of each substrate one by one and completely, the obtained thickness of the surface copper plating or the uniformity of the thickness of the surface copper plating is very accurate, the required detection time is short, and the pre-etching can be performed in real time to correct after the data are obtained, thereby greatly reducing the waste of resources and cost.

Description

Substrate thickness detection and automatic correction system and detection and automatic correction method

technical field

The invention relates to an etching process system and an etching process method.

Background technique

The etching process is one of the commonly used processes in the modern high-tech industry to manufacture electronic components such as chips. Etching generally works by engraving desired shapes on the surface of a substrate using physical or chemical reactions. Generally speaking, the aforementioned substrate is usually a multilayer board with copper foil plated on its surface, while the etching process in the prior art is to spray a chemical solvent corrosive to the copper foil on the surface of the copper foil to achieve the purpose of etching. Therefore, the thickness of the copper foil plated on the surface of the substrate and the uniformity of the thickness of the copper foil become important factors affecting the yield of the etching process.

Therefore, in the prior art, the operator of the etching process must first measure the thickness of the copper plating on the surface of the substrate prepared as the etching material or the uniformity of the thickness of the copper plating on the surface of the substrate with a contact type copper measuring instrument, and judge whether it is Within the error range, the substrate can then be sent into the etching process device.

Please refer to FIG. 7 and FIG. 8, when the operator is measuring, he needs to hold the sensor 91 of the copper measuring instrument to touch the substrate 92, and needs to repeat the operation at different positions on the surface of the substrate 92 to confirm the substrate 92. Copper plating thickness and uniformity of copper plating thickness everywhere on the surface.

However, this method is quite time-consuming, so it can only be sampled but not all the substrates 92 can be inspected, so that the obtained results are relatively inaccurate. And, as shown in FIG. 8 , detecting with a contact sensor 91 can only arrange detection points 921 on the substrate 92 as much as possible, but cannot reliably detect all surfaces of the substrate 92, resulting in undetected gaps. 922 will also make the detection results less accurate. The above two disadvantages will lead to a decrease in the yield of the entire etching process.

In addition, after the inspection, if the copper plating thickness and the uniformity of the copper plating thickness of the substrate 92 do not meet the acceptable error range of the etching process, they will be eliminated in batches, which is quite a waste of resources and costs.

Contents of the invention

In view of the aforementioned shortcomings and deficiencies in the prior art, the object of the present invention is to provide a radio frequency copper measuring instrument, a substrate thickness detection and automatic correction system, a substrate thickness detection method, and a substrate thickness detection and automatic correction method. Contact radio frequency inspection can scan all surfaces of each substrate one by one and completely, which is accurate and time-saving. Moreover, the pre-etching correction can be performed immediately with accurate data after scanning, which can greatly reduce the waste of resources and costs.

In order to achieve the above-mentioned creative purpose, the technical means adopted in the present invention is to design a detection and automatic correction system of substrate thickness, which is characterized in that it is used for scanning detection and correction of the thickness of copper plating on the surface of a substrate or the thickness of copper plating on the surface of the substrate. Uniformity of thickness, the substrate thickness detection and correction system includes:

A radio-frequency type copper measuring instrument, which includes:

a fixed seat;

A plurality of sensors, each of which is arranged on the fixing base and can emit radio frequency toward the substrate, and can receive radio frequency returned from the substrate; the plurality of sensors cover the substrate with radio frequency The ranges can be arranged in an overlapping manner, and the overlapped radio frequency coverage of the plurality of sensors spans both ends of the substrate;

A computing unit, which is electrically connected to the radio frequency copper measuring instrument; the computing unit receives the data obtained after scanning by the radio frequency copper measuring instrument, and calculates and judges the data obtained after scanning by the radio frequency copper measuring instrument ;

A pre-etching device, which is electrically connected to the computing unit; the pre-etching device receives instructions from the computing unit and selectively etches the surface of the substrate;

A transport track, which includes a detection area, a discrimination area, a correction area and an etching area connected in sequence; the radio frequency copper measuring instrument is set in the detection area, and the pre-etching device is set in the correction area ; The transport track is used to transport the substrate and enable the substrate to pass through the detection area, the judgment area, the correction area and the etching area in sequence;

a weeding track, which is connected to the discrimination area of the delivery track;

a eliminating device, which is arranged in the discriminating area of the transport track and is electrically connected to the computing unit; the eliminating device receives instructions from the computing unit and selectively sends the substrate from the discriminating area of the transporting track into the elimination track;

A main etching device is arranged in the etching area; the main etching device is used for etching the substrate.

In order to achieve the above creation purpose, the technical means adopted in the present invention is to design a detection and automatic correction method for the thickness of the substrate, which is characterized in that it includes the following steps:

Detection: use a radio frequency copper measuring instrument to scan a substrate; the radio frequency copper measuring instrument includes a plurality of sensors and a fixed seat, each of the sensors is set on the fixed seat and can emit radio frequency toward the substrate, and can receive the radio frequency returned from the substrate; the multiple sensors are arranged in such a way that the coverage of the radio frequency on the substrate can overlap each other, and the overlapping coverage of the radio frequency of the multiple sensors spans the The two ends of the substrate; the substrate and the radio frequency copper measuring instrument are relatively moved; during the process, the plurality of sensors are continuously released towards the substrate and receive radio frequency at the same time, and the radio frequency copper measuring instrument is completely scanned. The surface of the substrate; and further receive the data obtained by scanning the radio frequency copper measuring instrument with a computing unit, and use the computing unit to calculate and analyze the data obtained after scanning by the radio frequency copper measuring instrument;

Judgment: After the detection step, first judge the result after calculation and analysis by the calculation unit, and enter the following corresponding steps according to the judgment result of the calculation unit;

Correction: If the computing unit judges that the thickness of the surface copper plating of the substrate or the uniformity of the surface copper plating thickness is within the error range that can be corrected, then the computing unit sends instructions and data to a pre-etching device, and Drive the pre-etching device to correct the thickness of the copper plating on the surface of the substrate or the uniformity of the copper plating thickness on the surface; The abnormality of the uniformity of copper plating thickness is compensated by spraying and etching to correct the abnormality;

Elimination: If the calculation unit judges that the thickness of the surface copper plating of the substrate or the uniformity of the surface copper plating thickness is within the error range that cannot be corrected, then the calculation unit sends instructions to a elimination device, and drives The elimination device sends the substrate into an elimination track;

Etching: If the calculation unit judges that the thickness of the surface copper plating of the substrate or the uniformity of the surface copper plating thickness is within the standard range, or after the correction step, the substrate enters a main etching device, and the The main etching device etches the substrate.

The advantage of the present invention is that all the surfaces of each substrate are scanned one by one and completely by the radio frequency copper measuring instrument, and the data are sent to the computing unit for calculation and analysis. Then the computing unit can send instructions and data to the pre-etching device, and drive the pre-etching device to correct the thickness of the copper plating on the surface of the substrate or the uniformity of the thickness of the copper plating on the surface of the substrate. After the pre-etching device receives the instructions and data, it will perform compensation spraying on the specific position of the substrate (that is, the thickness of the copper plating on the surface of the substrate or the abnormality of the uniformity of the copper plating thickness on the surface of the substrate after the analysis of the computing unit), so as to correct The abnormality of the thickness of the surface copper plating or the uniformity of the surface copper plating thickness. With the cooperation and steps of the above-mentioned devices, the present invention can scan all the surfaces of each substrate one by one and completely, and the thickness of the copper plating on the surface or the uniformity of the thickness of the copper plating on the surface obtained by it is very accurate, and the required detection The time is greatly shortened compared with manual detection by touch sensors, and pre-etching can be performed immediately to correct after the data is obtained, which can greatly reduce the waste of resources and costs.

Preferably, the substrate thickness detection and automatic correction method is characterized in that the step of judging further includes the following steps: the first judgment: use the computing unit to judge the thickness of the copper plating on the surface of the substrate or the surface plating Whether the uniformity of copper thickness is in the standard range; If the uniformity of the thickness is not within the standard range, then use the calculation unit to judge whether the thickness of the copper plating on the surface of the substrate or the uniformity of the thickness of the copper plating on the surface is within the error range that can be corrected; if so, enter the correction step; if not, enter the elimination step.

The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

Description of drawings

Fig. 1 is a schematic diagram of the present invention;

Fig. 2 is the schematic diagram that the radio frequency coverage that the radio frequency type copper measuring instrument of the present invention emits and receives covers the substrate;

Fig. 3, Fig. 4 and Fig. 5 are the top view schematic diagrams when the radio frequency type copper measuring instrument of the present invention scans the substrate;

Fig. 6 is a flow chart of steps of the present invention;

Fig. 7 is the use schematic diagram of the contact type copper measuring instrument of prior art;

FIG. 8 is a schematic diagram of a gap generated when a contact copper measuring instrument in the prior art detects a substrate.

Among them, reference signs

A Substrate 10 Transport rail

11 Detection area 12 Discrimination area

13 Correction area 14 Etching area

20 Elimination Track 30 RF Copper Tester

31 Sensor 32 Holder

40 arithmetic unit 50 elimination device

60 Pre-etch unit 70 Main etch unit

91 Sensor 92 Substrate

921 Detection point 922 Gap

S1 first step S2 second step

S3 third step S4’ fourth first step

S4 Fourth bis step S5 Fifth step

Detailed ways

The technical means adopted by the present invention to achieve the intended creation purpose are further described below in conjunction with the accompanying drawings and preferred embodiments of the present invention.

Please refer to FIG. 1 and FIG. 2 , the substrate thickness detection and automatic correction system of the present invention is used to detect and correct the thickness of the copper plating on the surface of a substrate A or the uniformity of the copper plating thickness on the surface. The substrate thickness detection and automatic correction system includes a transport track 10 , a removal track 20 , a radio frequency copper measuring instrument 30 , a computing unit 40 , a removal device 50 , a pre-etching device 60 and a main etching device 70 .

The conveying track 10 includes a detection area 11 , a discrimination area 12 , a correction area 13 and an etching area 14 which are sequentially connected. The transport track 10 is used to transport the substrate A, and the substrate A passes through the RF copper measuring instrument 30 , the elimination device 50 and the pre-etching device 60 in sequence, and finally enters the main etching device 70 .

The elimination track 20 is connected to the identification area 12 of the transport track 10 and is used for transporting the rejected substrates A for centralized processing. But it is not limited thereto, and there may be no elimination track 20; in this case, the operator may directly remove the substrate A from the delivery track 10 and concentrate on processing the substrate A to be eliminated.

Please refer further to FIG. 2 to FIG. 5 , the radio frequency copper measuring instrument 30 is set in the detection area 11 of the transport track 10 and includes a plurality of sensors 31 and a fixing base 32 . Each sensor 31 is arranged on the fixed seat 32 and can emit radio frequency towards the delivery track 10, and can receive the radio frequency returned from the delivery track 10; The substrate A emits and receives radio frequency. The plurality of sensors 31 are arranged in such a way that the coverages of the radio frequency on the substrate A can overlap each other, and the overlapping coverage of the radio frequencies of the plurality of sensors 31 (that is, the radio frequency coverage of all sensors 31 total) across both ends of substrate A. Further, the coverage areas of the radio frequency emitted and received by the plurality of sensors 31 overlap each other in the width direction of the transport track 10 , and straddle both ends of the covering substrate A in the width direction of the transport track 10 . That is to say, the sensor 31 forms a scanning area across the two sides of the transport track 10 on the path where the substrate A moves along the transport track 10, so that when the substrate A passes through the radio frequency copper measuring instrument 30 along with the transport track 10 After the scanning area formed by the plurality of sensors 31, the combined radio frequency coverage of all sensors 31 will cross both ends of the substrate, so that the surface of the substrate A will be completely sensed. The detector 31 scans.

The computing unit 40 is electrically connected to the radio frequency copper measuring instrument 30 . The calculation unit 40 is used for receiving the data obtained after scanning by the radio frequency copper measuring instrument 30 , and for calculating and distinguishing the data obtained after scanning by the radio frequency copper measuring instrument 30 . The calculation unit 40 referred to here can be a computer, also can be only a program; And it can have a display to show the simulated imaging figure after its operation, also can not have display and do not show the simulated imaging figure, but directly Work with data.

The eliminating device 50 is disposed in the distinguishing area 12 of the conveying track 10 and is electrically connected to the computing unit 40 . The elimination device 50 receives the instruction of the computing unit 40 and selectively sends the substrate A from the identification area 12 of the delivery track 10 to the elimination track 20 . Specifically, the elimination device 50 can be a movable part or a rotary arm, and directly pushes the substrate A that does not meet the standard after detection into the elimination track 20; or the elimination device 50 can also be a switching device, and Selectively switch whether the judgment area 12 is connected to the correction area 13 or to the elimination track 20 . But it is not limited to this, in the present invention, there may be no elimination device 50, so that the substrate A that does not meet the standard is eliminated manually, that is, the operator directly removes the substrate A that does not meet the standard from the delivery track 10. Substrate A eliminated.

The pre-etching device 60 is disposed in the correction area 13 of the transport track 10 and is electrically connected to the computing unit 40 . The pre-etching device 60 receives instructions from the computing unit 40 and selectively etches the surface of the substrate A by using the data obtained after scanning by the radio frequency copper measuring instrument 30 . Specifically, in this embodiment, the pre-etching device 60 has a plurality of sprinklers (not shown in the figure); Or the simulated imaging image after analysis, start the sprinkler at the abnormal place corresponding to the thickness of the surface copper plating or the uniformity of the surface copper plating thickness to perform compensation spraying, so as to correct the abnormal place (specifically the so-called "abnormal place ” is a specific point or a specific block that the computing unit 40 determines must be corrected on the surface of the substrate A). That is to say, the sprinklers only need to be arranged along the width direction of the transport track 10 and across the transport track 10, so that the sprayers only need to be activated intermittently while the transport track 10 is moving to complete the corresponding substrate A. The thickness of copper plating on all surfaces or the uniformity of copper plating thickness on the surface is abnormal. But not limited to this, the pre-etching device 60 may also have a movable sprinkler, and actively move to the thickness of the copper plating on the surface of the substrate A or the abnormality of the uniformity of the copper plating thickness on the surface of the substrate A to perform compensation spraying to correct the exception.

The main etching device 70 is disposed in the etching area 14 of the transportation track 10 . The main etching device 70 is used to etch the substrate A; that is to say, the substrate A that has been corrected or does not need to be corrected will enter the main etching device 70 along the transport track 10, and the main etching device 70 will come out with the final product. Substrate A is subjected to an etching procedure. But not limited thereto, in other embodiments, the present invention may not have the main etching device 70 ; in this way, it is only used for detecting and correcting the substrate A.

In addition, the present invention may not have the pre-etching device 60 ; in this way, it is only used to quickly and one by one detect the substrates A, and eliminate those who are unsuitable. In other words, the present invention can be only a detection device, or a detection device with a correction function.

Furthermore, in this embodiment, the substrate A is directly carried and transported by the transport rail 10 , but in other embodiments, the substrate A is not limited to only being transported by the transport rail 10 , and a robot arm may also be used. In this way, a plurality of robotic arms can be electrically connected to the computing unit 40 and respectively installed between the radio frequency copper measuring instrument 30, the pre-etching device 60 and the main etching device 70 to transport the substrate A; A robot arm can send the substrate A into the RF copper measuring instrument 30 , the pre-etching device 60 and the main etching device 70 in sequence. Moreover, the plurality of robotic arms can selectively send the substrate A into the elimination track 20 at the same time, that is, when the computing unit 40 judges that the substrate A does not meet the standard, it drives the robotic arm to eliminate it.

Please refer further to FIG. 6, the substrate thickness detection and automatic correction method of the present invention includes the following steps in sequence:

The first step S1: detection. During execution, the substrate A (may also be a robot arm) is conveyed by the conveying track 10 , and the substrate A is scanned and detected by the radio frequency copper measuring instrument 30 . During scanning, the substrate A and the radio-frequency type copper measuring instrument 30 are relatively moved; specifically, in this embodiment, the substrate A is passed through the radio-frequency type copper measuring instrument 30 through the transport track 10, but it is not limited to this, and it can also be The substrate A is fixed and the RF copper measuring instrument 30 moves above the substrate A and scans the substrate A. During the relative movement of the substrate A and the radio frequency copper measuring instrument 30, the plurality of sensors 31 are continuously released towards the substrate A and simultaneously receive radio frequency, thereby making the plurality of sensors of the radio frequency copper measuring instrument 30 The radio frequency emitted and received by the sensor 31 completely scans the surface of the substrate A (that is, the overlapping coverage of the radio frequencies of all the sensors 31 completely scans the surface of the substrate A). After scanning, the computing unit 40 further receives the data scanned by the radio frequency copper measuring instrument 40 , and uses the computing unit 40 to calculate and analyze the data scanned by the radio frequency copper measuring instrument 30 .

The second step S2: the first judgment. After the detection step of the first step S1, determine whether the thickness of the copper plating on the surface of the substrate A or the uniformity of the thickness of the copper plating on the surface of the substrate A are within the standard range; The substrate A has different standard ranges, and the standard ranges can be pre-set and adjusted in the computing unit 40 . For example, a specific value may be preset, and plus or minus 10% of the specific value may be used as a standard range, but it is not limited thereto, and it depends on the finished etching process to be manufactured. When discriminating for the first time, if the computing unit 40 judges that the thickness of the copper plating on the surface of the substrate A or the uniformity of the copper plating thickness on the surface are within the preset standard range, then the substrate A directly follows the substrate A without any treatment. The transport rail 10 enters the main etching device 70; if not, enters the next step.

The third step S3: the second judgment. If the computing unit 40 judges that the thickness of the surface copper plating of the substrate A or the uniformity of the surface copper plating thickness are not within the standard range during the second step S2, then the computing unit 40 is used to determine the thickness or surface thickness of the surface copper plating of the substrate A. Whether the uniformity of copper plating thickness is within the error range that can be corrected; specifically, the so-called "error range that can be corrected" is also the substrate A required by different etching processes or different correction devices and methods rather different. For example, it may be within plus or minus 10% to 15% of the aforementioned standard value, or within two specific values, but it is not limited thereto. If the computing unit 40 judges that the thickness of the surface copper plating of the substrate A or the uniformity of the surface copper plating thickness are within the error range that can be corrected, then enter the fourth two step S4; if not (that is, the computing unit 40 judges If it is not within the error range that can be corrected, for example, it exceeds plus or minus 15% of the aforementioned standard value), then enter the fourth step S4'. But it is not necessary to carry out the third step S3, if in the second step S2, the calculation unit 40 judges that the thickness of the surface copper plating of the substrate A or the uniformity of the surface copper plating thickness is within the preset standard range, Then the third step S3 is skipped.

The fourth step S4': eliminate. If in the third step S3, the computing unit 40 judges that the thickness of the copper plating on the surface of the substrate A or the uniformity of the thickness of the copper plating on the surface is within the error range that cannot be corrected, that is to say, it exceeds the standard value of the aforementioned examples. Plus or minus 15%, then the operation unit 40 sends instructions to the elimination device 50, and drives the elimination device 50 to send the substrate A into the elimination track 20, so that the substrate A is not within the standard range and is not within the error range that can be corrected. The inner substrate A is excluded in the whole etching procedure, thereby improving the yield. But it is not necessary to carry out the third step S3, if in the second step S2, the calculation unit 40 judges that the thickness of the surface copper plating of the substrate A or the uniformity of the surface copper plating thickness is within the preset standard range, Alternatively, in the third step S3 , the calculation unit 40 judges that the thickness of the copper plating on the surface of the substrate A or the uniformity of the copper plating thickness on the surface is within the error-correctable range, and the fourth step S4 ′ is skipped.

The fourth bis step S4: correction. If the computing unit 40 judges that the thickness of the surface copper plating of the substrate A or the uniformity of the surface copper plating thickness is within the correctable error range, the computing unit 40 sends instructions and data to the pre-etching device 60, and drives the pre-etching The device 60 corrects the thickness of the copper plating on the surface of the substrate A or the uniformity of the thickness of the copper plating on the surface; when correcting, the pre-etching device 60 compensates for the abnormality of the copper plating thickness on the surface of the substrate A according to the calculation and analysis results of the calculation unit 40 Spray and etch to correct anomalies. Specifically, the so-called "abnormal place" is a specific point or a specific area where the calculation unit 40 judges that the thickness of the surface copper plating or the uniformity of the surface copper plating thickness is within the error range that can be corrected on the surface of the substrate A. piece. But not limited to this, if in the second step S2, the calculation unit 40 judges that the thickness of the surface copper plating of the substrate A or the uniformity of the surface copper plating thickness is within the preset standard range, then skip The fourth bis step S4.

The fifth step S5: etching. If the judging operation unit 40 judges that the thickness of the surface copper plating of the substrate A or the uniformity of the surface copper plating thickness are within the standard range in the first discrimination step, or after the correction of the fourth step S4, the substrate A Entering the main etching device 70 through the transport rail 10, the main etching device 70 starts to etch the substrate A in the finished form; that is to say, the thickness of the copper plating on the surface of the substrate A or the uniformity of the copper plating thickness on the surface of the substrate A have met the etching process standard, and formally enter the main etching process to make the substrate A into a finished product.

With the cooperation and steps of the above-mentioned devices, the present invention can scan all the surfaces of each substrate one by one and completely, and the thickness of the copper plating on the surface or the uniformity of the thickness of the copper plating on the surface obtained by it is very accurate, and the required detection The time is greatly shortened compared with manual detection by touch sensors, and pre-etching can be performed immediately to correct after the data is obtained, which can greatly reduce the waste of resources and costs.

In addition, in other embodiments, the second step S2 and the third step S3 can also be integrated into one step. In other words, the calculation unit 40 directly determines whether the data of the substrate A is within the standard range, the error range that can be corrected, or the error range that cannot be corrected, and then proceed to the elimination step, correction step or etching step according to the situation .

Certainly, the present invention also can have other multiple embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these corresponding Changes and deformations should belong to the scope of protection of the appended claims of the present invention.

Claims (3)

1. A system for detecting and automatically correcting the thickness of a substrate, the system for scanning and detecting and correcting the thickness of copper plating on the surface of a substrate or the uniformity of the thickness of copper plating on the surface of a substrate, the system comprising:

a radio frequency copper meter, comprising:

a fixing seat;

the sensors are arranged on the fixing seat, can emit radio frequency towards the substrate and can receive the radio frequency transmitted back from the substrate; the plurality of sensors are arranged in a mode that coverage ranges of radio frequencies on the substrate can be overlapped with each other, and the coverage ranges of the plurality of sensors after radio frequency overlapping cross two ends of the substrate;

the operation unit is electrically connected with the radio frequency copper measuring instrument; the operation unit receives the data obtained after the scanning of the radio frequency copper measuring instrument, and calculates and judges the data obtained after the scanning of the radio frequency copper measuring instrument;

a pre-etching device electrically connected to the operation unit; the pre-etching device receives the instruction of the operation unit and selectively etches the surface of the substrate;

a conveying track, which comprises a detection area, a judging area, a correction area and an etching area which are connected in sequence; the radio frequency copper measuring instrument is arranged in the detection area, and the pre-etching device is arranged in the correction area; the conveying track is used for conveying the substrate and enabling the substrate to sequentially pass through the detection area, the distinguishing area, the correction area and the etching area;

a eliminating rail connected to the discriminating region of the transporting rail;

the eliminating device is arranged in the distinguishing area of the conveying track and is electrically connected to the operation unit; the eliminating device receives the instruction of the operation unit and selectively sends the substrate into the eliminating track from the distinguishing area of the conveying track;

a main etching device arranged in the etching area; the main etching device is used for etching the substrate.

2. The method for detecting and automatically correcting the thickness of the substrate is characterized by comprising the following steps:

and (3) detection: scanning a substrate by using a radio frequency copper measuring instrument; the radio frequency copper measuring instrument comprises a plurality of sensors and a fixed seat, wherein each sensor is arranged on the fixed seat, can emit radio frequency towards the substrate, and can receive the radio frequency transmitted back from the substrate; the plurality of sensors are arranged in a mode that coverage ranges of radio frequencies on the substrate can be overlapped with each other, and the coverage ranges of the plurality of sensors after radio frequency overlapping cross two ends of the substrate; relatively moving the substrate and the radio frequency copper measuring instrument; in the process, continuously emitting and receiving radio frequency towards the substrate by the plurality of sensors, and enabling the radio frequency copper measuring instrument to completely scan the surface of the substrate; and further receiving the data obtained by the scanning of the radio frequency copper measuring instrument by an operation unit, and operating and analyzing the data obtained by the scanning of the radio frequency copper measuring instrument by the operation unit;

and (3) judging: after the detection step, firstly judging the result after operation analysis by the operation unit, and entering the following corresponding steps according to the result judged by the operation unit;

and (3) correction: if the arithmetic unit judges that the thickness of the surface copper plating of the substrate or the uniformity of the thickness of the surface copper plating is within the error range capable of being corrected, the arithmetic unit sends instructions and data to a pre-etching device and drives the pre-etching device to correct the thickness of the surface copper plating of the substrate or the uniformity of the thickness of the surface copper plating; when in correction, the pre-etching device performs compensation spraying and etching correction on abnormal positions of the copper plating thickness on the surface of the substrate or the uniformity of the copper plating thickness on the surface according to the result of the operation analysis of the operation unit;

eliminating: if the arithmetic unit judges that the thickness of the surface copper plating of the substrate or the uniformity of the thickness of the surface copper plating is within an error range which cannot be corrected, the arithmetic unit sends a command to a eliminating device and drives the eliminating device to send the substrate into an eliminating track;

etching: if the arithmetic unit judges that the thickness of the surface copper plating of the substrate or the uniformity of the thickness of the surface copper plating is within the standard range, or after the correction step, the substrate enters a main etching device, and the main etching device is used for etching the substrate.

3. The method for detecting and automatically correcting the thickness of a substrate according to claim 2, further comprising the steps of:

first discrimination: judging whether the thickness of the surface copper plating of the substrate or the uniformity of the thickness of the surface copper plating is within a standard range or not by using the operation unit; if yes, directly entering the etching step;

and (3) second discrimination: after the first discrimination, if the operation unit judges that the thickness of the surface copper plating of the substrate or the uniformity of the thickness of the surface copper plating is not in the standard range, the operation unit judges whether the thickness of the surface copper plating of the substrate or the uniformity of the thickness of the surface copper plating is in the error range which can be corrected; if yes, entering the correction step; if not, the step of eliminating is carried out.

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