CN111303781B

CN111303781B - Bonding module and its manufacturing method

Info

Publication number: CN111303781B
Application number: CN202010262836.4A
Authority: CN
Inventors: 蔡昕宏; 周高旭; 黄保业
Original assignee: Jiangxi OMS Microelectronics Co Ltd
Current assignee: Oufei Microelectronics Nanchang Co ltd
Priority date: 2020-04-03
Filing date: 2020-04-03
Publication date: 2022-03-11
Anticipated expiration: 2040-04-03
Also published as: CN111303781A

Abstract

The application provides a bonding module and manufacturing method thereof, the bonding module includes device, base plate, solidification bonding portion and isolation bonding portion, solidification bonding portion with isolation bonding portion bonding is fixed on the base plate, isolation bonding portion encloses and establishes the circumference of solidification bonding portion, the device passes through solidification bonding portion bonding is fixed on the base plate, and is following the perpendicular to the base plate with the direction on device looks adhesive surface, solidification bonding portion is in projection profile area on the base plate falls into the device is in projection profile area on the base plate, isolation bonding portion is used for making solidification bonding portion is isolated with the external world. When using this application bonding module, can keep the device with better fixed effect of bonding between the base plate can be right again solidification bonding portion plays the isolation protection effect.

Description

Bonding module and manufacturing method thereof

Technical Field

The invention relates to the technical field of product processing, in particular to a bonding module and a manufacturing method thereof.

Background

With the development of industry, the quality requirement of users on products is higher and higher, and therefore, in order to ensure the durability of the products, when devices in the products are bonded with substrates, a better bonding effect needs to be ensured. However, in the conventional processing technology, when the cured bonding part with a high tensile coefficient is used, the isolation of the cured bonding part is poor, and in the process of using the product, the cured bonding part inevitably contacts with water vapor, so that the viscosity effect of the cured bonding part is easily deteriorated, and the product quality is further affected. Therefore, there is a need for a bonding module and a method for manufacturing the same, which can bond and fix a device on a substrate and maintain a good bonding effect, and can also perform an isolation protection function on a cured bonding portion.

Disclosure of Invention

The invention aims to provide a bonding module and a manufacturing method thereof, which can bond and fix a device on a substrate, keep a good bonding effect and play a role in isolating and protecting a cured bonding part.

This application the bonding module includes device, base plate, solidification bonding portion and isolation bonding portion, the solidification bonding portion with isolation bonding portion bonding is fixed on the base plate, isolation bonding portion encloses to be established the circumference of solidification bonding portion, the device passes through solidification bonding portion bonding is fixed on the base plate, and is following the perpendicular to the base plate with the direction on device looks adhesive surface, solidification bonding portion is in projection profile area on the base plate falls into the device is in the projection profile area on the base plate, isolation bonding portion is used for making solidification bonding portion is isolated with the external world.

When using this application bonding module, can keep the device with better fixed effect of bonding between the base plate can be right again solidification bonding portion plays the isolation protection effect.

In one embodiment, the cured bond is spaced from the isolation bond by a distance in a range of 50 μm to 100 μm. Because the isolation bonding part has certain viscosity at normal temperature, when the curing bonding part and the isolation bonding part are typeset and placed together as required, if the interval between the two parts is small, the two parts are easy to stick to each other, so that the typesetting effect is influenced, in the subsequent heating and pressing process, the curing bonding part and the isolation bonding part can be diffused due to extrusion, if the interval distance between the two parts is small, the curing bonding part and the isolation bonding part can be overlapped due to diffusion, the thickness of the overlapped part is thick, the whole thickness of the bonding structure is uneven, and the bonding effect is influenced; if the separation distance between the two is large, the air can enter the separation area, so that the filling of the bonding structure is incomplete, and the bonding effect is influenced. When the spacing distance between the cured bonding part and the isolation bonding part is in the range of 50-100 μm, the bonding effect of the bonding structure can be better ensured.

In one embodiment, the release bond is a pressure sensitive adhesive film. The pressure-sensitive adhesive film is used as the isolation bonding part, so that a good isolation effect can be achieved, and the curing bonding part is isolated from the outside.

In one embodiment, the cured bond is a non-conductive adhesive film. The non-conductive adhesive film is used as the curing bonding part, so that a good bonding effect can be achieved, and the device can be better bonded and fixed on the substrate.

In one embodiment, the projection of the edge of the device on the substrate, in a direction perpendicular to the surface to which the substrate is bonded to the device, falls within the projection profile of the isolation bond on the substrate. Under the structure, the device completely covers the upper surface of the cured bonding part and extends on the isolation bonding part, so that the cured bonding part is better isolated and protected, and the bonding effect of the cured bonding part cannot be influenced by contacting with the outside.

In one embodiment, the projection of the device edge on the substrate in a direction perpendicular to the surface to which the substrate is bonded coincides with the projection of the outer edge of the barrier bond on the substrate. Because the isolation bonding part also has a certain bonding effect, the bonding space on the curing bonding part and the isolation bonding part can be utilized to the maximum extent under the structure, and the cost is reduced.

The manufacturing method of the bonding module comprises the following steps:

providing a device, a substrate, a cured bond, and an isolation bond;

placing the cured bonding part and the isolation bonding part on the substrate, wherein the isolation bonding part is arranged around the cured bonding part in the circumferential direction, placing the device on the cured bonding part separately or simultaneously, and enabling the projection outline area of the cured bonding part on the substrate to fall into the projection outline area of the device on the substrate along the direction vertical to the surface of the substrate bonded with the device;

and heating and pressing the device and the substrate to enable the device to be adhered and fixed on the substrate through the single action of the curing bonding part or the combined action of the curing bonding part and the isolation bonding part.

By the manufacturing method of the bonding module, a good bonding effect between the device and the substrate can be kept, and the cured bonding part can be isolated and protected.

In one embodiment, a release film is provided prior to placing the cured bond and the release bond on the substrate; and the curing bonding part and the isolation bonding part are attached to the release film, so that the release film bears the curing bonding part and the isolation bonding part, and the device is placed on the curing bonding part alone or on the curing bonding part and the isolation bonding part simultaneously, and the release film is torn off so that the heating and pressing process is not influenced. Before the device with the base plate bonds, solidification bonding portion with keep apart bonding portion overall structure is softer, consequently arranges and places solidification bonding portion with keep apart bonding portion, be difficult to reach higher planarization, and solidification bonding portion with keep apart bonding portion and go up laminating from the type membrane back, from the hardness of type membrane higher relatively, provide solidification bonding portion with keep apart a bearing space of bonding portion for solidification bonding portion with keep apart bonding portion can level and smooth arranging, thereby guarantee the bonding effect.

In one embodiment, the heat pressing process includes a first heat pressing and a second heat pressing, the first heat pressing is performed after the cured bonding portion and the isolation bonding portion are placed on the substrate, the cured bonding portion and the isolation bonding portion are subjected to pressure heating to bond the cured bonding portion and the isolation bonding portion to the substrate, the second heat pressing is performed after the device is placed on the cured bonding portion alone or on the cured bonding portion and the isolation bonding portion simultaneously, and the device, the cured bonding portion and the isolation bonding portion are subjected to pressure heating to bond the device on the cured bonding portion alone or on the cured bonding portion and the isolation bonding portion simultaneously. And the bonding structure can better bond the device and the substrate by adopting two hot pressing processes, and the two hot pressing processes are separately carried out, so that the process error can be effectively controlled and reduced.

In one embodiment, after passing through the heating and pressing process, the cured bonding portion and the isolation bonding portion are subjected to a cooling process to harden the cured bonding portion and the isolation bonding portion to adhesively fix the device on the substrate. After the heating and pressing process, the solidified bonding part and the isolation bonding part can be quickly hardened and formed by providing the cooling treatment, so that the working efficiency is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a bonding module according to an embodiment of the present application.

Fig. 2 is a sectional view of the bonding module shown in fig. 1 in a direction a-a.

Fig. 3 is a schematic diagram of the structure of a cured bond and an isolated bond in a bonding module.

Fig. 4 is a schematic view of a structure for bonding a cured bond and an isolation bond to a substrate.

Fig. 5 is a cross-sectional view of the structure shown in fig. 4 in the direction B-B.

Fig. 6 is a schematic structural diagram of a bonding module according to another embodiment.

Fig. 7 is a cross-sectional view of the structure shown in fig. 6 in the direction a-a.

Fig. 8 is a schematic structural view of a bonding module according to a third embodiment.

Fig. 9 is a cross-sectional view of the structure shown in fig. 8 in the direction a-a.

Fig. 10 is a schematic flowchart of a method for manufacturing a bonding module according to an embodiment of the present disclosure.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Furthermore, the following description of the various embodiments refers to the accompanying drawings, which illustrate specific embodiments in which the invention may be practiced. Unless otherwise specified, directional terms used in the present invention, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", etc., refer only to the directions of the attached drawings, and therefore, the directional terms used herein are intended to better and more clearly describe and understand the present invention, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrally connected; may be a mechanical connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified. In the present specification, the term "step" is used to mean not only an independent step but also an independent step unless clearly distinguished from other steps, as long as the intended function of the step is achieved. In addition, the numerical range represented by "-" in the present specification means a range in which numerical values recited before and after "-" are included as a minimum value and a maximum value, respectively. In the drawings, elements having similar or identical structures are denoted by the same reference numerals.

In the bonding module 1000 provided in the embodiment of the application, the device 200 and the substrate 100 are not limited to an electronic component and a fixed substrate, and may be any component that needs to be bonded together, and are not specifically limited herein.

Referring to fig. 1 to 5, fig. 1 is a schematic structural diagram of a bonding module 1000 according to an embodiment of the present disclosure.

Fig. 2 is a cross-sectional view of the bonding module 1000 shown in fig. 1 in a direction a-a.

Fig. 3 is a schematic diagram of the structure of the cured bond 10 and the isolation bond 20 in the bonding module 1000.

Fig. 4 is a schematic view of the structure for bonding the cured bond 10 and the isolation bond 20 to the substrate 100.

The bonding module 1000 provided by the embodiment of the application comprises a device 200, a substrate 100, a cured bonding portion 10 and an isolated bonding portion 20, wherein the cured bonding portion 10 and the isolated bonding portion 20 are fixedly bonded on the substrate 100, the isolated bonding portion 20 is arranged around the cured bonding portion 10, the device 200 is fixedly bonded on the substrate 100 through the sole action of the cured bonding portion 10 or the combined action of the cured bonding portion 10 and the isolated bonding portion 200, the projected outline area of the cured bonding portion 10 on the substrate 100 falls into the projected outline area of the device 200 on the substrate 100 in the direction perpendicular to the surface where the substrate 100 and the device 200 are bonded, and the isolated bonding portion 20 is used for isolating the cured bonding portion 10 from the outside.

By using the bonding module 1000 provided by the embodiment of the application, due to the existence of the cured bonding part 10 and the isolation bonding part 20, the device 200 can be bonded on the substrate 100 with a good bonding effect, and the cured bonding part 10 is protected inside by the isolation bonding part 20, the device 200 and the substrate 100, so that the device is isolated from the outside, thereby playing a good isolation protection role for the cured bonding part 10.

Wherein, the projected outline area of the cured bonding part 10 on the substrate 100 falls within the projected outline of the device 200 on the substrate 100, i.e. the device 200 and the substrate 100 completely cover the upper and lower surfaces of the cured bonding part 10; the isolation bond 20 is arranged around the cured bond 10 in the circumferential direction, i.e. the isolation bond 20 surrounds the cured bond 10 at the edge positions. It can be seen that the device 200, the isolation adhesive portion 20 and the substrate 100 form a closed space in which the cured adhesive portion 10 is located, thereby achieving the purpose of isolating the cured adhesive portion 10 from the outside.

Wherein, keep apart bonding portion 20 and have certain stickness under the normal atmospheric temperature condition, and have better isolation characteristic, can be used for isolated liquid, solidification bonding portion 10 stickness is less strong under the normal atmospheric temperature state, and produces stronger stickness after heating the pressfitting effect to after cooling the sclerosis, can firmly bond device 200 and base plate 100, and solidification bonding portion 10 after the sclerosis has higher tensile strength than isolation bonding portion 20. In a specific embodiment, the isolation bonding portion 20 is a pressure sensitive adhesive film, and the cured bonding portion 10 is a non-conductive adhesive film, and it is understood that the isolation bonding portion 20 and the cured bonding portion 10 are not limited to the pressure sensitive adhesive film and the non-conductive adhesive film, and may be any bonding object satisfying the corresponding functional requirements, and are not limited thereto.

It should be noted that the isolation from the outside in the embodiments of the present application is not limited to outside water, but may also be other liquids that affect the cured bonding portion 10, such as oil, and the like, and may also be isolated from outside mist-like substances, such as water vapor, or other gases or solids that may affect the cured bonding portion 10, and therefore, the description is omitted here.

In one embodiment, cured bond 10 is spaced apart from isolation bond 20 by a distance in the range of 50 μm to 100 μm between cured bond 10 and isolation bond 20. In the normal temperature state, the isolation bonding part 20 has a certain viscosity, so when the curing bonding part 10 and the isolation bonding part 20 are laid together as required, if the distance between the two is less than 50 μm, the bonding action between the curing bonding part 10 and the isolation bonding part 20 is likely to occur, i.e. the two are mutually bonded and pulled, so that the setting placement of the curing bonding part 10 and the isolation bonding part 20 according to the specified position is difficult, thereby affecting the smooth process flow, and in the subsequent heating and pressing process, the curing bonding part 10 and the isolation bonding part 20 will generate a certain diffusion under the condition of heating and pressing, if the distance between the two is less than 50 μm, due to the diffusion action, the adjacent positions between the curing bonding part 10 and the isolation bonding part 20 may overlap, and the thickness of the overlapping part is inevitably thicker than the thickness of the other parts, resulting in uneven overall thickness of the cured bond 10 and the isolation bond, thereby affecting the bonding effect.

If the separation distance between the cured bonding portion 10 and the isolation bonding portion 20 is greater than 100 μm, there may be a gap between the cured bonding portion 10 and the isolation bonding portion 20 after the heating and pressing process, and air enters into the gap, which may result in incomplete filling between the substrate 100 and the device 200, and thus poor bonding between the device 200 and the substrate 100.

When the separation distance between the cured bonding part 10 and the isolation bonding part 20 is within the range of 50 μm to 100 μm, the cured bonding part 10 and the isolation bonding part 20 can be well laid according to the specified positions, and a good bonding effect between the device 200 and the substrate 100 can be ensured.

Referring to fig. 6 and 7, fig. 6 is a schematic structural diagram of a bonding module 1000 according to another embodiment.

In one embodiment, the projection of the edge of device 200 onto substrate 100 in a direction perpendicular to the surface to which substrate 100 and device 200 are bonded falls within the projected outline area of isolation bond 20 onto substrate 100. Under the structure, the device 200 completely covers the upper surface of the cured bonding part 10, the edge of the device 200 extends to the isolation bonding part 20, the sealing performance of the sealed space formed by the device 200, the isolation bonding part 20 and the substrate 100 is further ensured, and the cured bonding part 10 is located in the sealed space, so that the cured bonding part 10 is better isolated and protected, and the bonding effect of the cured bonding part 10 cannot be affected by contact with the outside.

Referring to fig. 8 and 9, fig. 8 is a schematic structural diagram of a bonding module 1000 according to a third embodiment.

In one embodiment, the projection of the edge of the device 200 onto the substrate 100 coincides with the projection of the outer edge of the barrier bond 20 onto the substrate 100 in a direction perpendicular to the surface to which the substrate 100 and the device 200 are bonded. Under the structure, the device 200 completely covers the upper surface of the cured bonding part 10, the device 200 extends onto the isolation bonding part 20, the edge of the device 200 is flush with the edge of the isolation bonding part 20, the sealing performance of a sealing space formed by the device 200, the isolation bonding part 20 and the substrate 100 is further ensured, the cured bonding part 10 is better isolated and protected, and the isolation bonding part 20 also has a certain bonding effect, so that the device 200 is bonded to the substrate 100 together by the cured bonding part 10 and the isolation bonding part 20 and still can meet the better bonding effect.

Referring to fig. 10, fig. 10 is a schematic flow chart illustrating a manufacturing method of a bonding module 1000 according to an embodiment of the present disclosure.

The embodiment of the application provides a manufacturing method of a bonding module 1000, which comprises the following steps:

step 1: providing a device 200, a substrate 100, a cured bond 10, and an isolation bond 20;

step 2: placing the cured bonding part 10 and the isolation bonding part 20 on the substrate 100, wherein the isolation bonding part 20 is arranged around the cured bonding part 10, placing the device 200 on the cured bonding part 10 alone or simultaneously on the cured bonding part 10 and the isolation bonding part 20, and enabling the projection outline area of the cured bonding part 10 on the substrate 100 to fall into the projection outline area of the device 200 on the substrate 100 along the direction vertical to the surface of the substrate 100 bonded with the device 200;

and step 3: the device 200 and the substrate 100 are heated and bonded so that the device 200 is fixed to the substrate 100 by the single action of the cured bond 10 or by the combined action of the cured bond 10 and the isolation bond 20.

By using the manufacturing method of the bonding module 1000 provided by the embodiment of the present application, a good bonding effect between the device 200 and the substrate 100 can be maintained, and the cured bonding portion 10 can be isolated and protected.

In one embodiment, a release film (not shown) is provided prior to placing the cured bond 10 and the isolation bond 20 on the substrate 100; the cured bonding part 10 and the isolation bonding part 20 are attached to the release film, so that the release film bears the cured bonding part 10 and the isolation bonding part 20, and before the device 200 is placed on the cured bonding part 10 alone or on the cured bonding part 10 and the isolation bonding part 20 simultaneously, the release film is torn off, so that the heating and pressing process is not affected.

It can be understood that, in the process of performing the flow line process on the bonding module 1000, the structural stability and the flatness of the cured bonding portion 10 and the isolated bonding portion 20 therein should be ensured, however, at the normal temperature, the overall structure of the cured bonding portion 10 and the isolated bonding portion 20 is softer, in the process of laying out the cured bonding portion 10 and the isolated bonding portion 20, the form and the position of the cured bonding portion 10 and the isolated bonding portion 20 are easy to change, and the flatness of the overall structure is difficult to ensure in the transportation process, which easily causes adverse effects on the subsequent bonding process. And after laminating from the type membrane on solidification bonding portion 10 and isolation bonding portion 20, the hardness from the type membrane is higher relatively, offer solidification bonding portion 10 and keep apart bonding portion 20 one and bear the weight of and rely on for solidification bonding portion 10 and isolation bonding portion 20 can be levelly and smoothly arranged, thereby guarantee the bonding effect, and, the existence from the type membrane can also play certain guard action to solidification bonding portion 10 and isolation bonding portion 20, make its structure not receive external damage, further guaranteed structural stability.

In one embodiment, the heat bonding process includes a first heat pressing and a second heat pressing, the first heat pressing is performed after the cured bonding portion 10 and the isolation bonding portion 20 are placed on the substrate 100, the cured bonding portion 10 and the isolation bonding portion 20 are pressurized and heated to bond the cured bonding portion 10 and the isolation bonding portion 20 to the substrate 100, the second heat pressing is performed after the device 200 is placed on the cured bonding portion 10 alone or on the cured bonding portion 10 and the isolation bonding portion 20 simultaneously, the device 200, the cured bonding portion 10 and the isolation bonding portion 20 are pressurized and heated to bond the device 200 on the cured bonding portion 10 alone or on the cured bonding portion 10 and the isolation bonding portion 20 simultaneously. The two processes are separately carried out, so that the bonding effect of the bonding part 10 and the isolation bonding part 20 can be better ensured, the device 200 can be more firmly bonded on the substrate 100, in addition, the bonding structure 100, the substrate 100 and the device 200 are sequentially bonded, but the three processes are not bonded simultaneously, so that the operation precision can be better ensured, and the process error is effectively controlled and reduced.

In one embodiment, after the bonding process by heating, the cured bonding portion 10 and the isolation bonding portion 20 are subjected to a cooling process to harden the cured bonding portion 10 and the isolation bonding portion 20, so as to bond and fix the device 200 on the substrate 100. Providing the cooling process enables the cured bond 10 and the isolation bond 20 to be hardened and formed relatively quickly after the pressing process by heating, thereby improving the work efficiency.

By using the manufacturing method of the bonding module 1000 provided by the embodiment of the application, as the cured bonding part 10 and the isolation bonding part 20 are arranged between the device 200 and the substrate 100, through the heating and pressing process, the bonding effect between the device 200 and the substrate 100 can be ensured to be good, and meanwhile, the cured bonding part 10 is arranged in the sealed space formed by enclosing the isolation bonding part 20, the device 200 and the substrate 100 together, so that the cured bonding part 10 can be well isolated and protected.

The technical features of the above embodiments may be arbitrarily combined, and for the sake of brief description, all possible combinations of the technical features in the above embodiments are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A bonding module, characterized in that the bonding module comprises a device, a substrate, a curing bonding portion and an isolation bonding portion, and the curing bonding portion and the isolation bonding portion are bonded and fixed On the substrate, the isolation bonding portion is arranged in a circumferential direction of the curing bonding portion, and the device is adhesively fixed on the substrate through the curing bonding portion, and is perpendicular to the The direction of the surface where the substrate and the device are bonded, the projected contour area of the cured bonding portion on the substrate falls within the projected contour area of the device on the substrate, and the isolation adhesive The junction is used to isolate the solidified bonding part from the outside world, the solidified bonding part and the isolation bonding part are arranged at intervals, and the distance between the solidified bonding part and the isolation bonding part is The range is 50μm-100μm.

2 . The bonding module according to claim 1 , wherein the isolation bonding portion is a pressure-sensitive adhesive film. 3 .

3 . The bonding module of claim 1 , wherein the cured bonding portion is a non-conductive adhesive film. 4 .

4 . The bonding module according to claim 1 , wherein in a direction perpendicular to the surface of the substrate and the device to which the device is bonded, the projection of the edge of the device on the substrate falls. 5 . into the projected contour of the isolation bond on the substrate.

5 . The bonding module according to claim 1 , wherein in a direction perpendicular to the surface of the substrate and the device to which the device is bonded, the projection of the edge of the device on the substrate is the same as 5 . The projections of the outer edges of the isolation bonding portions on the substrate are coincident.

6. A method for manufacturing a bonding module according to any one of claims 1-5, characterized in that, comprising:

Provide devices, substrates, cured bonds and isolation bonds;

The curing bonding part and the isolation bonding part are placed on the substrate, and the isolation bonding part is surrounded in the circumferential direction of the curing bonding part, and the device is separately placed on the on the cured bond, or on both the cured bond and the isolation bond, in a direction perpendicular to the surface of the substrate to which the device is bonded, making the cured bond The projected contour area of the part on the substrate falls within the projected contour area of the device on the substrate;

The device and the substrate are heated and pressed together, so that the device is adhered and fixed on the device by the single action of the curing bonding part or the joint action of the curing bonding part and the isolation bonding part. on the aforementioned substrate.

7. The manufacturing method according to claim 6, characterized in that, before placing the cured bonding portion and the isolation bonding portion on the substrate, a release film is provided; The part and the isolation bonding part are attached to the release film, so that the release film supports the curing bonding part and the isolation bonding part, and then the device is placed on the curing bonding part alone. Or the release film is torn off before being placed on the solidified bonding part and the isolating bonding part at the same time, so that the heating and pressing process is not affected.

8 . The manufacturing method according to claim 6 , wherein the heat pressing process comprises a first heat pressing and a second heat pressing, and after the solidified bonding part and the isolation bonding part are combined. 9 . After being placed on the substrate, the first hot pressing is performed, and the cured bonding part and the isolation bonding part are pressurized and heated, so that the cured bonding part and the isolation bonding part are bonded On the substrate, after placing the device on the cured bonding portion alone, or on both the cured bonding portion and the release bonding portion, a second thermal pressing is performed to The device, the cured bonding part and the isolation bonding part are pressurized and heated, so that the device is individually bonded to the cured bonding part, or is simultaneously bonded to the cured bonding part and the isolation bonding part. on the isolation bond.

9 . The manufacturing method according to claim 6 , wherein after the heating and pressing process, the solidified bonding part and the isolation bonding part are cooled to make the solidified bonding part The part and the isolation bond harden to bond the device to the substrate.