CN111303781B - 粘结模组及其制造方法 - Google Patents
粘结模组及其制造方法 Download PDFInfo
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- CN111303781B CN111303781B CN202010262836.4A CN202010262836A CN111303781B CN 111303781 B CN111303781 B CN 111303781B CN 202010262836 A CN202010262836 A CN 202010262836A CN 111303781 B CN111303781 B CN 111303781B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Micromachines (AREA)
Abstract
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010262836.4A CN111303781B (zh) | 2020-04-03 | 2020-04-03 | 粘结模组及其制造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010262836.4A CN111303781B (zh) | 2020-04-03 | 2020-04-03 | 粘结模组及其制造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111303781A CN111303781A (zh) | 2020-06-19 |
| CN111303781B true CN111303781B (zh) | 2022-03-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010262836.4A Expired - Fee Related CN111303781B (zh) | 2020-04-03 | 2020-04-03 | 粘结模组及其制造方法 |
Country Status (1)
| Country | Link |
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| CN (1) | CN111303781B (zh) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2640006B1 (fr) * | 1988-12-05 | 1991-03-29 | Armines | Procede d'assemblage, par collage, de deux pieces ou substrats |
| FR2850390B1 (fr) * | 2003-01-24 | 2006-07-14 | Soitec Silicon On Insulator | Procede d'elimination d'une zone peripherique de colle lors de la fabrication d'un substrat composite |
| EP2154217A3 (de) * | 2008-07-29 | 2014-04-16 | Tesa Se | Selbstklebender Gegenstand |
| JP5411905B2 (ja) * | 2011-09-30 | 2014-02-12 | オリジン電気株式会社 | 接合部材の製造装置及び接合部材の製造方法 |
| JP4981190B1 (ja) * | 2011-12-08 | 2012-07-18 | 信越エンジニアリング株式会社 | 貼合デバイスの製造方法 |
| CN104004457A (zh) * | 2014-06-03 | 2014-08-27 | 苏州桐力光电技术服务有限公司 | 一种贴合方法 |
| DE102016106351A1 (de) * | 2016-04-07 | 2017-10-12 | Ev Group E. Thallner Gmbh | Verfahren und Vorrichtung zum Bonden zweier Substrate |
| US11597184B2 (en) * | 2017-10-31 | 2023-03-07 | Kimberly-Clark Worldwide, Inc. | Elastic laminates with curved elastics and methods for manufacturing |
| FR3085957B1 (fr) * | 2018-09-14 | 2021-01-29 | Commissariat Energie Atomique | Procede de collage temporaire avec adhesif thermoplastique incorporant une couronne rigide |
| CN109407891A (zh) * | 2018-12-03 | 2019-03-01 | 深圳莱宝高科技股份有限公司 | 一种触摸屏与触摸显示屏 |
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2020
- 2020-04-03 CN CN202010262836.4A patent/CN111303781B/zh not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| CN111303781A (zh) | 2020-06-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330096 Jiangxi Nanchang Nanchang hi tech Industrial Development Zone, east of six road, south of Tianxiang Avenue. Applicant before: OFilm Microelectronics Technology Co.,Ltd. Address after: 330096 Jiangxi Nanchang Nanchang hi tech Industrial Development Zone, east of six road, south of Tianxiang Avenue. Applicant after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330013 No.698 Tianxiang Avenue, high tech Zone, Nanchang City, Jiangxi Province Applicant before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Jiangxi Province Patentee after: Oufei Microelectronics (Nanchang) Co.,Ltd. Country or region after: China Address before: No. 699 Tianxiang North Avenue, Nanchang High tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee before: Jiangxi OMS Microelectronics Co.,Ltd. Country or region before: China |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220311 |