CN117026350A - Electroplating solution circulating and filtering system and working method thereof - Google Patents
Electroplating solution circulating and filtering system and working method thereof Download PDFInfo
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- CN117026350A CN117026350A CN202311018137.5A CN202311018137A CN117026350A CN 117026350 A CN117026350 A CN 117026350A CN 202311018137 A CN202311018137 A CN 202311018137A CN 117026350 A CN117026350 A CN 117026350A
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- 238000001914 filtration Methods 0.000 title claims abstract description 160
- 238000009713 electroplating Methods 0.000 title claims abstract description 143
- 238000000034 method Methods 0.000 title claims description 20
- 238000007747 plating Methods 0.000 claims abstract description 88
- 239000007788 liquid Substances 0.000 claims abstract description 85
- 230000007246 mechanism Effects 0.000 claims abstract description 77
- 239000012535 impurity Substances 0.000 claims abstract description 65
- 150000002500 ions Chemical class 0.000 claims abstract description 26
- 239000002184 metal Substances 0.000 claims abstract description 19
- 229910052751 metal Inorganic materials 0.000 claims abstract description 19
- 229910000831 Steel Inorganic materials 0.000 claims description 31
- 238000005192 partition Methods 0.000 claims description 31
- 239000010959 steel Substances 0.000 claims description 31
- 238000003825 pressing Methods 0.000 claims description 16
- 238000005868 electrolysis reaction Methods 0.000 claims description 10
- 238000009826 distribution Methods 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 22
- 229910052759 nickel Inorganic materials 0.000 abstract description 9
- 239000000243 solution Substances 0.000 description 99
- 230000000694 effects Effects 0.000 description 23
- 230000008569 process Effects 0.000 description 11
- 239000002994 raw material Substances 0.000 description 8
- 238000003756 stirring Methods 0.000 description 8
- 210000005056 cell body Anatomy 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 230000003749 cleanliness Effects 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 210000004027 cell Anatomy 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 2
- PTFCDOFLOPIGGS-UHFFFAOYSA-N Zinc dication Chemical compound [Zn+2] PTFCDOFLOPIGGS-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000003651 drinking water Substances 0.000 description 2
- 235000020188 drinking water Nutrition 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- -1 iron ions Chemical class 0.000 description 2
- 229910001453 nickel ion Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/06—Filtering particles other than ions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The electroplating solution circulating and filtering system comprises a filtering mechanism connected with an electroplating bath through a pipeline, wherein the inside of the filtering mechanism is provided with a plurality of filtering tanks which are sequentially arranged along the length direction of the filtering mechanism, the electroplating bath is connected with the filtering tank at the liquid inlet end of the filtering mechanism through a liquid outlet pipe, and the electroplating bath is connected with the filtering tank at the liquid outlet end of the filtering mechanism through the liquid inlet pipe; the tops of the adjacent filter tanks are communicated, and the bottoms of the adjacent filter tanks are communicated through a connecting pipeline provided with a filter, so that electroplating solution is circularly filtered between the adjacent filter tanks, and the volume of the filtering mechanism is effectively reduced in a multistage circulating filtering mode; the impurity removing mechanism for electrolyzing metal impurity ions is arranged in the filtering tank positioned at the middle position in the filtering mechanism so as to remove the metal impurity ions in the electroplating solution, avoid the influence of the metal impurity ions on the brightness range and the hardness of the nickel plating layer and improve the electroplating quality.
Description
Technical Field
The invention relates to the technical field of electroplating equipment, in particular to an electroplating liquid circulating and filtering system and a working method thereof.
Background
Electroplating refers to the electrolytic reaction in a metal salt solution under the action of direct current, so that a metal layer or an alloy layer is deposited on the surface of a conductive body such as metal. For example, a metallic nickel is electrically connected to an anode of a power source, an electrically conductive steel strip is electrically connected to a cathode of the power source, wherein the metallic nickel plate and the steel strip are immersed in an electroplating solution (e.g., nickel sulfate solution), and the negative ions and positive ions in the electroplating solution are regularly moved under the action of direct current, and the metallic nickel is gradually deposited on the steel strip of the cathode, while the metallic nickel plate of the anode is continuously dissolved to supplement nickel ions consumed in the electroplating solution.
In the electroplating process, the purity of the electroplating solution directly influences the electroplating effect and influences the quality of a plating layer formed on the surface of the steel strip. If solid particles in suspension in the plating solution are attached to the surface of the coating formed on the surface of the steel strip, problems such as reduced flatness of the coating, light loss and slow light emission of the coating, or pinholes, pits and the like are generated in the coating, so that the corrosion resistance of the coating is reduced. In addition, in the long-time electroplating process, a lot of impurities are inevitably precipitated in the electroplating solution, and if the concentration of the impurities exceeds the standard, the steel strip is scrapped, so that the electroplating solution needs to be filtered by a filtering system.
The nickel-plated steel strip is a continuous electroplating process, and the process and the equipment work continuously, have high efficiency and high speed, and require that the electroplating solution must be vigorously stirred during electroplating and the consumed nickel ions are timely replenished. However, the impurities in the plating solution are gradually trapped by the filter element along with the progress of the plating process in the conventional plating solution filtering system, so that the pressure of the filter is increased, the flow is reduced, the filter element can influence the flow, the final flow can not meet the stirring requirement of high-speed nickel plating, the quality of a plating layer is caused, and the filter element needs to be stopped and replaced.
In addition, the existing filtering system only uses a filter to remove solid impurities in the plating solution, and harmful ions such as iron ions, zinc ions and the like brought into the plating solution by raw materials or workpieces cannot be removed by filtering, so that the brightness range and the hardness of a nickel layer can be influenced by the harmful ions, and simultaneously, the cell voltage and the current efficiency can be reduced.
Disclosure of Invention
In order to solve the technical problems in the background technology, the invention provides an electroplating liquid circulating and filtering system and a working method thereof.
The technical scheme of the invention is as follows:
in a first aspect, an embodiment of the present invention provides a plating solution circulating filter system, comprising: the electroplating device comprises a filtering mechanism connected with an electroplating bath through a pipeline, wherein a plurality of filtering tanks are arranged in the filtering mechanism in sequence along the length direction of the filtering mechanism, the electroplating bath is connected with the filtering tank at the liquid inlet end of the filtering mechanism through a liquid outlet pipe, and the electroplating bath is connected with the filtering tank at the liquid outlet end of the filtering mechanism through the liquid inlet pipe; the tops of the adjacent filter tanks are communicated, and the bottoms of the adjacent filter tanks are communicated through a connecting pipeline provided with a filter, so that electroplating solution is circularly filtered between the adjacent filter tanks, the volume of the filter mechanism is effectively reduced through a multistage circulating filtering mode, and the filtering efficiency and effect are improved; the impurity removing mechanism for electrolyzing impurity ions is arranged in the filtering tank positioned at the middle position in the filtering mechanism so as to remove metal impurity ions in the electroplating solution, avoid the influence of the impurity ions on the brightness range and hardness of the nickel plating layer and improve the electroplating quality.
As a further implementation mode, the adjacent filter tanks are separated by the partition plates, the tops of the partition plates are used for overflow of the electroplating solution to enable the electroplating solution to flow between the tops of the adjacent filter tanks, the heights of the adjacent partition plates are sequentially increased in the direction from the liquid inlet end to the liquid outlet end of the filter mechanism, the electroplating solution containing a large amount of impurities can rapidly circulate between the adjacent filter tanks adjacent to the liquid inlet end, and meanwhile, the filtered electroplating solution in the filter tank adjacent to the liquid outlet end is mixed with the electroplating solution in the filter tank adjacent to the liquid inlet end, so that the filtering efficiency and the filtering effect are greatly improved.
As a further implementation mode, the connecting pipe is composed of two parallel branches, each branch is provided with a filter and at least one valve, the on-off of the branches can be switched at any time through the valves, and the normal operation of production cannot be influenced when the filter core is replaced or the filter breaks down.
As a further implementation mode, the aperture of the filter element of the filter on the connecting pipeline connected with the filter tank at the liquid inlet end of the filtering mechanism is the largest, and the aperture of the filter element of the filter on each connecting pipeline is gradually reduced along the flowing direction of the electroplating liquid, so that the filtering precision is gradually improved, and the filtering efficiency and the filtering effect are effectively improved.
As a further implementation mode, the filter on the connecting pipeline connected with the liquid inlet pipe does not contain a filter element, so that the flow can be increased, a continuous large-flow circulating stirring effect is obtained, and the smooth progress of electroplating work is ensured.
As a further implementation mode, the plating bath comprises coaxial outer cell body and interior cell body that sets up, be equipped with the first space that is used for holding the plating solution between outer cell body and the interior cell body, the inboard of interior cell body encloses the synthetic second space that is used for holding the plating solution, the bottom in first space is equipped with filter unit and communicates with the second space through filter pump and drinking-water pipe, can directly filter the plating solution in the plating bath, the cleanliness of plating solution has been improved greatly, the inner wall fixed connection of inner cell body's top through cloth liquid board and outer cell body, the level is equipped with first positive pole and the first negative pole that is used for electroplating work in the second space.
As a further implementation mode, the first cathode is located between two first anodes and higher than the first anodes, the steel belt sequentially bypasses the first anodes and the first cathodes, the steel belt can be effectively guaranteed to be located in the plating solution, the reliability of electroplating operation is guaranteed, the first cathode is rotationally provided with the sleeve and is electrically communicated with the steel belt through the sleeve, the end part of the first cathode is fixedly provided with the pressing mechanism for pressing the steel belt, and effective contact between the steel belt and the first cathode is effectively guaranteed.
As a further implementation mode, the pressing mechanism consists of a conductive connecting frame and a pressing wheel which is rotatably arranged on the connecting frame, the connecting frame is fixedly arranged at the end part of the first cathode, when the steel belt is separated from the sleeve, the pressing wheel can be used for ensuring the electric communication between the first cathode and the steel belt, and the reliability of electroplating work is effectively improved.
As a further implementation mode, the impurity removing mechanism consists of a second anode and a second cathode which are connected with a power supply, the surface of the second cathode is in a continuous concave-convex shape, and different impurities or the same impurity in the plating solution can be removed by electrolysis at different current density positions, so that the effect of electrolytic treatment is improved.
In a second aspect, another embodiment of the present invention provides a working method of a plating solution circulating filtration system, which specifically includes: firstly, a filter pump is started, plating solution in a first space is filtered by a filter unit and then enters a second space for electroplating, and the plating solution in the second space flows back into the first space from a liquid distribution plate; when the filtration of the filtration unit can not meet the requirements of continuous steel strip electroplating work, the valve is opened, the impurity removing mechanism, the filtration pump and the filters on all connecting pipelines are started, so that the electroplating solution in the electroplating tank enters the filtration mechanism and is sequentially subjected to multistage circulating filtration, metal impurity ions in the electroplating solution are removed by utilizing the impurity removing mechanism in an electrolysis mode, and the filtered electroplating solution flows back into the electroplating tank through the liquid inlet pipe.
As a further implementation mode, in the process of circulating filtration, raw materials are supplemented into a filter tank connected with a liquid outlet pipe so as to ensure the stability of the components of the electroplating solution.
Preferably, the rotation speed of the filter tank at the liquid inlet end of the filter mechanism and the rotation speed of the filter tank at the liquid outlet end of the filter mechanism are both larger than those of the corresponding filters of the other filter tanks.
The beneficial effects of the invention are as follows:
(1) The electroplating device is connected with the electroplating tank through the circulating pipeline, the filtering work of the electroplating solution does not influence the normal operation of the electroplating work, and meanwhile, the volume of a filtering mechanism is effectively reduced and the filtering efficiency and effect are improved in a multistage circulating filtering mode; and be equipped with the edulcoration mechanism that is used for electrolysis metal impurity ion in the filter vat that is located intermediate position department in the filter equipment, the use of cooperation edulcoration mechanism can get rid of the metal impurity ion in the plating solution, avoids the metal impurity ion to the influence of the bright scope and the hardness of nickel coating, has improved electroplating quality.
(2) The height of the adjacent partition plates is sequentially increased in the direction from the liquid inlet end to the liquid outlet end of the filtering mechanism, so that electroplating liquid containing a large amount of impurities can rapidly circulate between the adjacent filtering tanks adjacent to the liquid inlet end, and meanwhile, the filtered electroplating liquid in the filtering tank adjacent to the liquid outlet end is mixed with the electroplating liquid in the filtering tank adjacent to the liquid inlet end, so that the filtering efficiency and the filtering effect are greatly improved.
(3) According to the invention, the aperture of the filter element of the filter on each connecting pipeline is gradually reduced along the flowing direction of the electroplating solution, so that the filtering efficiency and effect are effectively improved, and meanwhile, the filter on the connecting pipeline connected with the liquid inlet pipe does not contain the filter element, so that the flow can be effectively increased, the continuous large-flow circulating stirring effect is obtained, the smooth operation of electroplating is ensured, and the influence of filtering on the electroplating is avoided.
(4) The surface of the cathode of the impurity removing mechanism is in a continuous concave-convex shape, and different impurities or the same impurity in the plating solution can be removed by electrolysis at different current density positions, so that the effect of electrolytic treatment is improved.
(5) The plating bath is divided into the first space and the second space, plating solution can be subjected to preliminary filtration in the electroplating work, and the use of the filtering mechanism is matched, so that the filtering effect of the plating solution is greatly improved; meanwhile, the arrangement of the first anode and the first cathode ensures that the steel strip can be effectively contacted with the plating solution and the first cathode, thereby ensuring the reliability of electroplating work and meeting the requirements of rapid continuous steel strip electroplating work.
Drawings
In the drawings:
FIG. 1 is a schematic diagram of the overall structure of a plating solution circulating filtration system according to one or more embodiments of the present invention;
FIG. 2 is a schematic cross-sectional view of a plating cell according to one or more embodiments of the invention in a side view;
FIG. 3 is a schematic view of a cross-sectional structure of a plating cell according to one or more embodiments of the invention in a front view;
FIG. 4 is a schematic view of a partial cross-sectional structure of a first cathode according to one or more embodiments of the present invention;
the components represented by the reference numerals in the figures are:
1. plating bath; 2. a liquid outlet pipe; 3. a liquid inlet pipe; 4. a filtering mechanism; 41. a filter tank main body; 42. a first separator; 43. a second separator; 44. a first filter tank; 45. a second filter tank; 46. a third filter tank; 5. a first connecting line; 6. a second connecting pipeline; 7. a third connecting pipeline; 8. a first filter; 9. a second filter; 10. a third filter; 11. a impurity removing mechanism; 12. an outer tank; 13. an inner tank body; 14. a liquid distribution plate; 15. a filtering unit; 16. a filter pump; 17. a first anode; 18. a first cathode; 19. a sleeve; 20. a pressing mechanism; 21. a connecting frame; 22. the pinch roller.
Detailed Description
As introduced by the background technology, the impurities in the plating solution in the existing plating solution filtering system are gradually trapped by the filter element along with the plating process, so that the pressure of the filter is increased, the flow is reduced, the filter element can influence the flow, and the final flow can not meet the stirring requirement of high-speed nickel plating, so that the quality of a plating layer is caused, and the filter element needs to be stopped and replaced; in addition, the existing filtering system only uses a filter to remove solid impurities in the plating solution, and harmful ions such as iron ions, zinc ions and the like brought into the plating solution by raw materials or workpieces cannot be removed by filtering, so that the brightness range and the hardness of a nickel layer can be influenced by the harmful ions, and meanwhile, the tank voltage and the current efficiency can be reduced along with the problem.
Example 1
In an exemplary embodiment of the present invention, as shown in fig. 1 to 4, there is provided a plating solution circulating filter system comprising: the filtering mechanism 4 is connected with the electroplating tank 1 through a circulating pipeline so as not to hinder the electroplating work while filtering the electroplating liquid.
The bottom of plating bath 1 one end is connected with the feed liquor end of filtering mechanism 4 through drain pipe 2, and the bottom of plating bath 1 other end is connected with the play liquid end of filtering mechanism 4 through feed liquor pipe 3 to realize the circulation flow of plating bath between plating bath 1 and filtering mechanism 4.
Specifically, the plating tank 1 is composed of an outer tank body 12, an inner tank body 13, a first anode 17 and a first cathode 18, the inner tank body 13 is fixedly installed inside the outer tank body 12, the inner tank body 13 and the outer tank body 12 are coaxially arranged, a first space for containing plating solution is arranged between the inner tank body 13 and the outer tank body 12, a second space for containing plating solution is formed by surrounding the inner side of the outer tank body 13, and the first anode 17 and the first cathode 18 are arranged in the inner tank body 13.
It will be appreciated that the cross sections of the outer tank 12 and the inner tank 13 may be circular or quadrilateral, and may be specifically selected according to practical requirements, without any excessive limitation.
Be equipped with filter unit 15 in the first space, filter unit 15 is located the bottom in first space, and filter unit 15 is connected with filter pump 16, and filter pump 16 passes through the drinking-water pipe and communicates with the second space to usable filter pump 16 pumps the plating solution in the first space into the second space and filters, has effectively guaranteed the cleanliness of plating solution in the second space, simultaneously, can also play the effect of stirring, improves electroplating effect.
The top of the inner tank body 13 is lower than the top of the outer tank body 12, the top of the inner tank body 13 is fixedly connected with the inner wall of the outer tank body 12 through the liquid distribution plate 14, a plurality of through holes are uniformly formed in the liquid distribution plate 14, electroplating liquid in the inner tank body 13 can flow onto the liquid distribution plate 14 from the top of the electroplating liquid and uniformly fall back into the first space, and the liquid distribution plate 14 can effectively prolong the service life of the filtering unit 15.
The bottom of second space one end is connected with the feed liquor end of filtering mechanism 4 through drain pipe 2, and the bottom of second space other end is connected with the play liquid end of filtering mechanism 4 through feed liquor pipe 3 to realize the circulation flow of plating solution between plating bath 1 and filtering mechanism 4, improved the cleanliness of plating solution greatly.
The first anodes 17 and the first cathodes 18 are installed in the second space, as shown in fig. 2-3, two first anodes 17 are provided, one first cathode 18 is provided, the upper sides of two ends of the second space are respectively provided for the steel belt to pass in and out, the first cathodes 18 are located between the two first anodes 17, the height of the first cathodes 18 is higher than that of the two first anodes 17, and the heights of the two first anodes 17 are the same.
The steel strip penetrates into the plating solution from one end of the second space, then penetrates out of the plating solution from the lower side of one first anode 17, then penetrates into the plating solution again after bypassing from the upper side of the first cathode 18, finally penetrates out of the other end of the second space from the lower side of the other first anode 17, and then penetrates out of the electroplating bath 1, so that the steel strip is effectively ensured to be always contacted with the plating solution in the electroplating work, and the electroplating effect is greatly ensured.
The first anode 17 is fixedly arranged on a fixed rod fixedly connected with the driving mechanism, so that the first anode 17 can rotate around the shaft along with the fixed rod; the first cathode 18 is in a rod-shaped structure, the first cathode 18 is horizontally and fixedly arranged in the second space, a sleeve 19 is sleeved outside the first cathode 18, the sleeve 19 is rotationally connected with the first cathode 18, and the first cathode 18 is in contact with a steel belt through the sleeve 19.
The sleeve 19 is rotationally connected with the first cathode 18, the first cathode 18 is electrically communicated with the steel belt through the sleeve 19, the pressing mechanisms 20 are fixedly arranged at the two ends of the first cathode 18, the steel belt on the upper side of the first cathode 18 is pressed through the pressing mechanisms 20, and the failure of the electrical communication between the steel belt and the first cathode 18 is avoided.
The pressing mechanism 20 is composed of a connecting frame 21 and a pressing wheel 22, one end of the connecting frame 21 is fixedly arranged at the end part of the first cathode 18, the other end of the connecting frame 21 is positioned above the first cathode 18, and the pressing wheel 22 is rotatably arranged at the end part of the connecting frame 21 positioned above the first cathode 18 and used for pressing the steel belt.
The first cathode 18 is electrically communicated with the pinch roller 22 through the connecting frame 21, so that when the steel belt is separated from the sleeve 19, the pinch roller 22 can be utilized to ensure the electrical communication between the first cathode 18 and the steel belt, and the reliability of electroplating work is effectively improved.
The filtering mechanism 4 is composed of a filtering tank body 41 and a plurality of partition boards, wherein the partition boards are fixedly arranged in the filtering tank body 41 at intervals, so that the inside of the filtering tank body 41 is divided into a plurality of spaces for containing electroplating liquid by the partition boards.
In this embodiment, two partitions are taken as an example, that is, two partitions, namely, a first partition 42 and a second partition 43 are fixedly disposed in the filter tank body 41, and the first partition 42 and the second partition 43 equally divide the interior of the filter tank body 41 into three chambers sequentially arranged along the length direction of the filter tank body 41 for respectively accommodating the plating solution.
It will be appreciated that in other embodiments, three, four, etc. other numbers of baffles may be provided, and in particular may be determined according to actual design requirements, without undue limitation.
Specifically, in the present embodiment, a first filter tank 44 is formed between the first partition plate 42 and the side wall of the filter tank main body 41, a second filter tank 45 is formed between the first partition plate 42 and the second partition plate 43, and a third filter tank 46 is formed between the second partition plate 43 and the side wall of the filter tank main body 41.
The inside of the first filter tank 44 is communicated with the liquid outlet pipe 2, the bottoms of the first filter tank 44 and the second filter tank 45 are communicated through a first connecting pipeline 5, the bottoms of the second filter tank 45 and the third filter tank 46 are communicated through a second connecting pipeline 6, and the bottom of the third filter tank 46 is also connected with the liquid inlet pipe 3 through a third connecting pipeline 7.
The first connecting pipeline 5, the second connecting pipeline 6 and the third connecting pipeline 7 are all provided with a filter, so that the electroplating solution discharged from the electroplating tank 1 firstly enters the first filter tank 44, the electroplating solution in the first filter tank 44 is subjected to primary filtration through the first connecting pipeline 5 and the filter on the first connecting pipeline 5 and then enters the second filter tank 45, the electroplating solution in the second filter tank 45 is subjected to secondary filtration through the second connecting pipeline 6 and the filter on the second connecting pipeline 6 and then enters the third filter tank 46, and the electroplating solution in the third filter tank 46 flows back into the electroplating tank 1 through the third connecting pipeline 7 and the liquid inlet pipe 3.
The heights of the first partition plate 42 and the second partition plate 43 are lower than the heights of the side walls of the filter tank main body 41, and the heights of the first partition plate 42 and the second partition plate 43 are increased step by step, namely, the heights of the first partition plate 42 are lower than the heights of the second partition plate 43, so that the tops of the adjacent filter tanks are communicated, and the filter tank is mainly used for overflow of electroplating liquid in the filter tanks.
Specifically, the electroplating solution in the second filter tank 45 can overflow into the first filter tank 44 through the top of the first partition board 42, and the electroplating solution in the third filter tank 46 can overflow into the second filter tank 45 through the top of the second partition board 43, so that the circulating flow filtration of the electroplating solution between the adjacent filter tanks is realized, the volume of the filter mechanism 4 is effectively reduced, and the filtration efficiency and the filtration effect are improved.
The arrangement mode that the heights of the adjacent partition plates are gradually increased (the arrangement mode can be understood that the heights of the adjacent partition plates are sequentially increased in the direction from the liquid inlet end to the liquid outlet end of the filtering mechanism 4) can enable the electroplating solution containing a large amount of impurities to rapidly circulate between the adjacent filtering tanks (namely between the first filtering tank 44 and the second filtering tank 45) adjacent to the liquid inlet end, and meanwhile, the filtered electroplating solution in the filtering tank (namely in the third filtering tank 46) adjacent to the liquid outlet end is mixed with the electroplating solution in the filtering tank (namely in the first filtering tank 44) adjacent to the liquid inlet end, so that the filtering efficiency and the filtering effect are greatly improved.
The first filter tank 44, the second filter tank 45, the third filter tank 46, the first connecting pipeline 5, the second connecting pipeline 6, the third connecting pipeline 7 and the setting of the filter on each connecting pipeline can realize continuous circulation filtration of the electroplating solution, effectively ensure the cleanness of the electroplating solution, and the electroplating solution is discharged from the near bottom of one end of the electroplating bath 1, returns to the other end of the electroplating bath 1 after being filtered by the filtering mechanism 4, can not cause production stoppage, and avoids the influence on electroplating work.
It should be noted that the volume of each filter tank should be determined according to the flow rate of the filter on the corresponding connection line and the amount of the plating solution, and no excessive limitation is made here.
In this embodiment, the structures of the filters on the first connecting pipeline 5, the second connecting pipeline 6 and the third connecting pipeline 7 are different, specifically, the first connecting pipeline 5 is provided with a first filter 8, the first filter 8 adopts a filter core with ten micrometers for improving the filtering efficiency, the first filter 8 can adopt an activated carbon filter core, and organic impurities contained in the activated carbon filter core can be adsorbed by filtration after new raw materials are added; the second connecting pipeline 6 is provided with a second filter 9, and the second filter 9 adopts a filter core with five micrometers, so that the filtering efficiency can be ensured, and the filtering quality can be ensured; the third connecting pipeline 7 is provided with a third filter 10, and the third filter 10 adopts a filter element with one micron so as to further improve the filtering quality.
Because the electroplating solution in the third filter tank 46 is very clean after being subjected to multi-stage filtration, the electroplating solution does not need to be filtered again, and in order to obtain a continuous high-flow circulating stirring effect, a filter element on the third filter 10 can be preferably omitted, so that the third filter 10 only plays a role of a booster pump to increase the flow rate and ensure the smooth electroplating work.
The connecting pipelines between the adjacent filter tanks and between the liquid outlet end of the filter mechanism 4 and the liquid inlet pipe 3 are parallel pipelines, and specifically, the first connecting pipeline 5, the second connecting pipeline 6 and the third connecting pipeline 7 are parallel pipelines and all contain two parallel branches, and each branch is respectively provided with a filter and at least one valve, so that the on-off of the branches can be switched at any time through the valves, and the normal running of production cannot be influenced when the filter core is replaced or the filter breaks down.
It will be appreciated that valves are also provided on the outlet pipe 2 and inlet pipe 3 for controlling the discharge of the plating solution and the cyclic filtering operation.
The bright range and hardness of the nickel plating layer can be obviously influenced because impurities such as copper, iron and the like have a larger influence on the nickel plating quality, and the voltage and current efficiency of the electrolytic tank 1 can be reduced; periodic dilution is required to reduce the metal impurity ion content.
Therefore, a impurity removing mechanism 11 for subjecting metal impurity ions to electrolytic treatment is provided in the filter tank at the intermediate position to remove the metal impurity ions in the plating liquid.
Specifically, in this embodiment, the impurity removing mechanism 11 is disposed in the second filtering tank 45, where the impurity removing mechanism 11 is composed of a second anode and a second cathode, and both the second anode and the second cathode are connected to a power source, so that the metal impurity ions of the electrolyte in the second filtering tank 45 are removed by an electrolytic method while the circulation filtering of the electroplating solution is performed.
It should be noted that, since the impurities are electrolyzed on the surface of the second cathode, the area of the second cathode should be increased as needed to improve the efficiency of removing the impurities.
In general, in order to reduce deposition of the main discharge metal ions in the plating solution, oneGenerally, low current density electrolysis is adopted, and in actual electroplating production, the influence of most impurities is reflected in a low current density region, so that the current density of the electrolysis treatment is controlled to be 0.1A/dm 2 ～0.5A/dm 2 Between them.
It can be appreciated that in the electroplating process, if the influence of impurities is reflected in the high current density region, high current density is selected for electrolysis; if the impurities have influence in both the high current density area and the low current density area, the high current density electrolytic treatment can be used for a period of time, and then the low current density electrolytic treatment can be used again until the plating solution returns to normal, and the specific situation can be determined according to the actual situation, and the excessive limitation is not carried out.
The second cathode of the impurity removing mechanism 11 is of a corrugated plate structure, namely, the surface of the second cathode is of a continuous concave-convex shape, so that different impurities or the same impurities in the plating solution can be removed by electrolysis at different current density positions, and the electrolytic treatment effect is improved.
It is noted that the recess in the second cathode should not be too deep to prevent too small a current density to allow deposition or reduction of impurities in the recess.
Example 2
In an exemplary embodiment of the present invention, a working method of an electroplating solution circulating and filtering system is provided, which specifically includes the following steps:
firstly, the filter pump 16 is turned on, the plating solution in the first space is filtered by the filter unit 15 under the pumping of the filter pump 16 and then enters the second space for electroplating operation, and the plating solution in the second space flows onto the liquid distribution plate 14 from the top of the second space and flows back into the first space again;
when the filtering effect of the filtering unit 15 can not meet the requirement of continuous electroplating work, the valves on the liquid outlet pipe 2 and the liquid inlet pipe 3 are opened, and the impurity removing mechanism 11 and the filters on all connecting pipelines are started, so that the electroplating liquid in the electroplating bath 1 enters the filtering mechanism 4 through the liquid outlet pipe 2 and is sequentially subjected to multistage circulating filtration, and meanwhile, the impurity removing mechanism 11 is utilized to electrolytically remove metal impurity ions in the electroplating liquid, and the filtered electroplating liquid flows back into the electroplating bath 1 through the liquid inlet pipe 3 again, so that continuous production is effectively ensured, and the cleanliness of the electroplating liquid is improved.
The electroplating solution in the electroplating bath 1 (namely the second space) flows into the first filtering tank 44 through the liquid outlet pipe 2, the electroplating solution in the first filtering tank 44 flows into the second filtering tank 45 through the first connecting pipeline 5 and the first filtering machine 8, and at the moment, the rotating speed of the first filtering machine 8 is 2900r/min so as to realize primary filtering;
the second filter tank 45 contains a impurity removing mechanism 11, the impurity removing mechanism 11 can remove metal impurity ions in the electroplating solution by an electrolytic method, and the current density of the electrolytic treatment is controlled to be 0.1A/dm 2 ～0.5A/dm 2 The electroplating solution in the second filter tank 45 overflows back into the first filter tank 44 through the top of the first partition board 42 and flows back into the second filter tank 45 after being filtered by the first filter 8 again to realize circulating filtering operation so as to improve the filtering effect;
it can be appreciated that in the electroplating process, if the influence of impurities is reflected in the high current density region, high current density is selected for electrolysis; if the impurities have influence in both the high current density area and the low current density area, the high current density electrolytic treatment can be used for a period of time, and then the low current density electrolytic treatment can be used again until the plating solution returns to normal, and the specific situation can be determined according to the actual situation, and the excessive limitation is not carried out.
Meanwhile, the electroplating solution in the second filter tank 45 flows into the third filter tank 46 through the second connecting pipeline 6 and the second filter 9, at this time, the rotating speed of the second filter 9 is 2000r/min to realize secondary filtration, the electroplating solution flowing into the third filter tank 46 overflows into the second filter tank 45 through the top of the second baffle plate 43 and is electrolyzed again to remove metal impurity ions and circularly filtered, so that the cleanliness of the electroplating solution in the third filter tank 46 is improved;
finally, the plating solution in the third filter tank 46 enters the liquid inlet pipe 3 through the third connecting pipeline 7 and the third filter 10, and flows back to the plating tank 1 again through the liquid inlet pipe 3 to perform plating operation, and at this time, the rotating speed of the third filter 10 is 2900r/min.
The rotation speed of the second filter 9 is lower than that of the first filter 8, so that the plating solution can be circularly filtered between the first filter tank 44 and the second filter tank 45 for a plurality of times, and the filtering effect is greatly improved; the rotation speed of the third filter 10 is larger than that of the second filter 9, so that the clean plating solution can be pumped back into the plating tank 1 quickly, and the pumped back plating solution has high flow, so that the stirring is facilitated.
The first filter 8 adopts a filter core with ten micrometers for improving the filtering efficiency, the first filter 8 can adopt an active carbon filter core, and organic impurities contained in the filter core can be adsorbed by filtration after new raw materials are added; the second filter 9 adopts a filter core with five micrometers, so that the filtering efficiency and the filtering quality can be ensured; the third filter 10 may use a filter element of one micron to further improve the filtering quality or may not use a filter element to improve the stirring effect.
In the electroplating production, the filtering mechanism 4 generally filters about four times per hour, but the electroplating solution cannot maintain high purity due to the limitations of raw material purity and process flow, and the electroplating quality gradually decreases with the increase of the service time.
Therefore, in the process of circulating filtration, the change rule of the electroplating solution can be mastered through analysis and detection of the electroplating solution, so that the stability of the electroplating solution components can be ensured by periodically adding the raw materials with lower content into the first filter tank 44 (i.e. the filter tank communicated with the liquid outlet pipe 2) according to the change rule, and the specific content and the raw material components can be determined according to actual requirements.
It can be understood that in practical application, all filters can be synchronously opened on the connecting pipeline, or only one filter on one branch can be used, and the selection can be specifically performed according to practical requirements, so that excessive limitation is not required.
In use, when the filter pressure rises, the valve on the corresponding branch can be closed, so that the filter on the branch connected in parallel with the valve can work, thereby facilitating the replacement of the filter element and not affecting the production work.
Claims (10)
1. The electroplating solution circulating and filtering system comprises a filtering mechanism (4) connected with an electroplating bath (1) through a pipeline, and is characterized in that the inside of the filtering mechanism (4) is provided with a plurality of filtering tanks which are sequentially arranged along the length direction of the filtering mechanism, the electroplating bath (1) is connected with the filtering tank at the liquid inlet end of the filtering mechanism (4) through a liquid outlet pipe (2), and the electroplating bath (1) is connected with the filtering tank at the liquid outlet end of the filtering mechanism (4) through a liquid inlet pipe (3); the tops of the adjacent filter tanks are communicated, the bottoms of the adjacent filter tanks are communicated through a connecting pipeline provided with a filter, so that electroplating solution is circularly filtered between the adjacent filter tanks, and the filter tanks are connected with the liquid inlet pipe (3) through the connecting pipeline; the filtering mechanism (4) is internally provided with a impurity removing mechanism (11) for electrolyzing impurity ions in a filtering tank positioned at the middle position so as to remove metal impurity ions in the electroplating solution.
2. The plating solution circulating and filtering system according to claim 1, wherein the adjacent filter tanks are separated by a partition plate, the top of the partition plate is used for overflow of the plating solution to realize flow of the plating solution between the tops of the adjacent filter tanks, and the heights of the adjacent partition plates are sequentially increased in the direction from the liquid inlet end to the liquid outlet end of the filtering mechanism (4).
3. The plating solution circulating and filtering system according to claim 1, wherein the connecting pipe is composed of two parallel branches, and each branch is provided with a filter and at least one valve.
4. The plating solution circulating and filtering system according to claim 1, wherein the filter core aperture of the filter on the connecting pipe connected with the filter tank at the liquid inlet end of the filtering mechanism (4) is the largest, and the filter core aperture of the filter on each connecting pipe is gradually reduced along the flowing direction of the plating solution, and the filtering precision is gradually improved.
5. A plating solution circulating filter system according to claim 1, wherein the filter on the connection line connected to the feed pipe (3) does not contain a filter element.
6. The electroplating solution circulating and filtering system according to claim 1, wherein the electroplating bath (1) is composed of an outer bath body (12) and an inner bath body (13) which are coaxially arranged, a first space for containing the electroplating solution is arranged between the outer bath body (12) and the inner bath body (13), a second space for containing the electroplating solution is formed by surrounding the inner side of the inner bath body (13), a filtering unit (15) is arranged at the bottom of the first space and communicated with the second space through a filtering pump (16) and a water suction pipe, the top of the inner bath body (13) is fixedly connected with the inner wall of the outer bath body (12) through a liquid distribution plate (14), and a first anode (17) and a first cathode (18) for electroplating work are horizontally arranged in the second space, and the second space is connected with the filtering mechanism (4).
7. The plating solution circulating and filtering system according to claim 6, wherein the first cathode (18) is located between two first anodes (17) and higher than the first anodes (17), the steel strip sequentially bypasses the first anodes (17) and the first cathode (18), a sleeve (19) is rotatably arranged on the first cathode (18) and is electrically communicated with the steel strip through the sleeve (19), and a pressing mechanism (20) for pressing the steel strip is fixedly arranged at the end part of the first cathode (18).
8. The plating solution circulating and filtering system according to claim 7, wherein the pressing mechanism (20) is composed of a conductive connecting frame (21) and a pressing wheel (22) rotatably arranged on the connecting frame (21), and the connecting frame (21) is fixedly arranged at the end part of the first cathode (18).
9. The plating solution circulating and filtering system according to claim 1, wherein the impurity removing mechanism (11) is composed of a second anode and a second cathode which are connected with a power supply, and the surface of the second cathode is in a continuous concave-convex shape.
10. The working method of the electroplating liquid circulating and filtering system is characterized by comprising the following steps of:
firstly, a filter pump (16) is started, plating solution in a first space enters a second space for electroplating after being filtered by a filter unit (15), and the plating solution in the second space flows back into the first space from a solution distribution plate (14);
when the filtering of the filtering unit (15) can not meet the requirements of continuous steel strip electroplating work, the valve is opened, the impurity removing mechanism (11), the filtering pump (16) and the filtering machine on all connecting pipelines are started, so that electroplating liquid in the electroplating tank (1) enters the filtering mechanism (4) and is sequentially subjected to multistage circulating filtration, impurity ions in the electroplating liquid are removed by utilizing the impurity removing mechanism (11) in an electrolysis mode, and the filtered electroplating liquid flows back into the electroplating tank (1) through the liquid inlet pipe (3).
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| CN202311018137.5A CN117026350A (en) | 2023-08-14 | 2023-08-14 | Electroplating solution circulating and filtering system and working method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118563395A (en) * | 2024-07-30 | 2024-08-30 | 环讯精密制品(南通)有限公司 | Anti-splashing zinc alloy precision die casting electroplating device and method |
| CN118600495A (en) * | 2024-06-05 | 2024-09-06 | 江苏威金迈科技有限公司 | Continuous nickel plating process and device based on impurity removal control |
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2023
- 2023-08-14 CN CN202311018137.5A patent/CN117026350A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118600495A (en) * | 2024-06-05 | 2024-09-06 | 江苏威金迈科技有限公司 | Continuous nickel plating process and device based on impurity removal control |
| CN118600495B (en) * | 2024-06-05 | 2025-09-09 | 江苏威金迈科技有限公司 | Continuous nickel plating process and device based on impurity removal control |
| CN118563395A (en) * | 2024-07-30 | 2024-08-30 | 环讯精密制品(南通)有限公司 | Anti-splashing zinc alloy precision die casting electroplating device and method |
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