CN100376655C - Thermal Interface Material - Google Patents
Thermal Interface Material Download PDFInfo
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- CN100376655C CN100376655C CNB2004100279340A CN200410027934A CN100376655C CN 100376655 C CN100376655 C CN 100376655C CN B2004100279340 A CNB2004100279340 A CN B2004100279340A CN 200410027934 A CN200410027934 A CN 200410027934A CN 100376655 C CN100376655 C CN 100376655C
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- interface material
- thermal interface
- particulate
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- carbon black
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Abstract
The present invention relates to a thermal interface material added with high thermal conductivity particles, which comprises black carbon particles, high thermal conductivity particles and a basal body, wherein the black carbon particles are of nanometer levels and have porous structures and good ductility. The black carbon particles, the high thermal conductivity particles and the basal body are sufficiently mixed to form a thermal interface material. The thermal interface material not only can be filled in gaps of contact interfaces of heat sources and radiating assemblies so as to exhaust air and improve thermal contact, but also can provide good heat conducting performance between the heat sources and the radiating assemblies.
Description
[technical field]
The present invention relates to a kind of thermal interface material, relate in particular to a kind of thermal interface material that adds the high thermal conductivity particulate.
[background technology]
In recent years, along with the fast development of semiconducter device integrated technique, the integrated degree of semiconducter device is more and more higher, yet it is more and more littler that device volume becomes, and its demand to heat radiation is more and more higher, has become a more and more important problem.For satisfying this needs, the fan heat radiation, various radiating modes such as water-cooled auxiliary heat dissipation and heat pipe heat radiation are extensively used, and obtain certain radiating effect, but because of scatterer and thermal source (semiconductor integrated device, as CPU) the contact surface unfairness, generally be in contact with one another area less than 2%, an ideal contact surface is not arranged, fundamentally influence the effect of semiconducter device to the heat sink heat, so, traditional scatterer by increase the higher thermal interface material of a thermal conductivity between scatterer and semiconducter device to increase the exposure level of interface, improve the heat transfer effect between semiconducter device and the scatterer.
The most frequently used thermal interface material is heat-conducting fluid (Thermal Fluid) and heat-conducting glue (Thermal Paste) in the traditional heat-dissipating device.The heat conductivility of heat-conducting fluid is also bad at present, the heat-conducting glue that tradition is used then is to utilize the particulate that adds some tool excellent heat conducting performances in matrix such as silica gel (Silicone) to promote heat conductivility, yet this method can cause conformability (Conformability) and ductility (Spreadability) not good because add particulate, thereby causes heat conductivility not have pre-interim ideal.Newer heat-conducting glue then is to use high silver content to reach the lifting of heat conductivility, yet this heat-conducting glue can cause cost higher.
To sum up, provide a kind of tool preferable ductility, heat conductivility is good, and lower-cost thermal interface material is necessary in fact.
[summary of the invention]
Cause conformability and ductility not good for solving in the prior art thermal interface material because of adding particulate, cause the problem that heat conductivility is not good or cost is higher, main purpose of the present invention provides the good and lower-cost thermal interface material of a kind of heat conductivility.
For realizing goal of the invention, the invention provides a kind of thermal interface material, comprising: polymeric matrix and make an addition to nano grade carbon black (Carbon Black) particulate of this matrix and be selected from one or more high thermal conductivity particulate in the particulates such as nickel, boron nitride, zinc, zinc oxide, aluminium, aluminium nitride, copper or nano carbon microsphere; This nano grade carbon black particulate and high thermal conductivity particulate are dispersed in the matrix.
Thermal interface material provided by the invention can further comprise dispersion agent.
Wherein, described matrix comprises silica gel series, polyethylene glycol, epoxy resin series, anoxic glue series, acrylate glue series or the like; Described carbon black comprises furnace black, channel black, heat is black, alkynes is black or dim; Described dispersion agent is to help the particulate homodisperse that adds in the matrix and the auxiliary agent of suspension, comprises ethyl cellulose.
Compare with existing thermal interface material, thermal interface material provided by the invention has the following advantages: one, because carbon black is nano level, and has vesicular structure, matrix, carbon black and high thermal conductivity particulate can be mixed easily uniformly, and make the heat conductivility excellence; Its two, carbon black also has the character of extending (Spreadable), thereby has more excellent character than other weighting materials (Fillers), can be so that two assemblies are done combination more closely.Its three, improve carbon black particle and high thermal conductivity Particle Distribution and suspension in the described thermal interface material by the dissemination of dispersion agent, thereby obtain better heat conductivility; Its four, cost is lower, need not add a large amount of expensive thermally conductive materials.
[description of drawings]
Fig. 1 is the synoptic diagram of thermal interface material of the present invention.
Fig. 2 is the user mode synoptic diagram of thermal interface material of the present invention.
[embodiment]
The present invention is described in detail below in conjunction with the accompanying drawings and the specific embodiments.
The invention provides a kind of thermal interface material, as shown in Figure 1, this thermal interface material 10 comprises carbon black particle 11, high thermal conductivity particulate 13 and matrix 12, described carbon black particle 11 is the nano grade carbon black particulate, and this carbon black particle 11 comprises furnace black (Furnace Black), channel black (Channel Black), heat black (ThermalBlack), alkynes black (Acethylene Black) or dim (Lamp Black).
The diameter range of described nano grade carbon black particulate is 1～50 nanometer.
Described matrix 12 is a polymeric matrix, and this polymeric matrix comprises silica gel (Silicone Glue) series, polyethylene glycol (Polyethylene Glycol), Resins, epoxy (Epoxy Resin) series, anoxic glue series, acrylate glue (Acrylic) series or the like.
Described high thermal conductivity particulate 13 is meant the particulate of heat conductivility excellence, comprise in the particulates such as nickel (Nickel), boron nitride (Boron Nitride), zinc (Zinc), zinc oxide (Zinc Oxide), aluminium (Aluminum Oxide), aluminium nitride (Aluminum Nitride), copper (Copper) or nano carbon microsphere one or more, its particle diameter is less than 5 microns.
This carbon black particle 11 and high thermal conductivity particulate 13 are added in matrix 12 and full and uniform dispersion, to form a kind of thermal interface material 10.Wherein, the ratio of adding carbon black particle 11 in this thermal interface material 10 is 1%～5%, and the ratio of adding high thermal conductivity particulate 13 is 1%～2%.
The present invention can also further add dispersion agent (figure does not show) in thermal interface material 10, as ethyl cellulose (Ethyl Cellulose) etc. helping improve dispersion and the suspension in matrix 12 of carbon black particle 11 and high thermal conductivity particulate 13, thereby obtain better heat conductivility.
As shown in Figure 2, described thermal interface material 10 is arranged between the contact interface of scatterer 20 and heat generating component 30 (as thermals source such as central processing units), and the good thermo-contact between scatterer 20 and heat generating component 30 interfaces can be provided.Because the particle diameter of the particulate of filling is minimum in the thermal interface material 10 of the present invention, and has ductility preferably, even irregular under scatterer 20 and heat generating component 30 surface in contact microcosmic, also can be by thermal interface material 10 calkings of the present invention, thereby exhausted air provides that good hot joining touches heat conductivility between scatterer 20 and the heat generating component 30.
In sum, for the person of ordinary skill of the art, can make other various corresponding changes and distortion, and all these changes and distortion all should belong to the protection domain of claim of the present invention according to technical scheme of the present invention and technical conceive.
Claims (9)
1. thermal interface material, it comprises:
One polymeric matrix and be filled in one or more the high thermal conductivity particulate in nickel, boron nitride, zinc, zinc oxide, aluminium, aluminium nitride, copper and the nano carbon microsphere of being selected from of this matrix is characterized in that, also is filled with the nano grade carbon black particulate in this thermal interface material.
2. thermal interface material as claimed in claim 1 is characterized in that, described matrix is selected from silica gel series, polyethylene glycol, epoxy resin series, anoxic glue series and acrylate glue series.
3. thermal interface material as claimed in claim 1 is characterized in that, described nano grade carbon black particulate is selected from furnace black, channel black, heat is black, alkynes is black or dim.
4. thermal interface material as claimed in claim 1 is characterized in that, the adding proportion of nano grade carbon black particulate is 1%～5% in the described thermal interface material.
5. as claim 3 or 4 described thermal interface materials, it is characterized in that the diameter range of described nano grade carbon black particulate is 1～50 nanometer.
6. thermal interface material as claimed in claim 1 is characterized in that, the adding proportion of high thermal conductivity particulate is 1%～2% in the described thermal interface material.
7. thermal interface material as claimed in claim 1 is characterized in that the particle diameter of described high thermal conductivity particulate is less than 5 microns.
8. thermal interface material as claimed in claim 1 is characterized in that, also is added with dispersion agent in the described thermal interface material.
9. thermal interface material as claimed in claim 8 is characterized in that described dispersion agent comprises ethyl cellulose.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100279340A CN100376655C (en) | 2004-06-30 | 2004-06-30 | Thermal Interface Material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100279340A CN100376655C (en) | 2004-06-30 | 2004-06-30 | Thermal Interface Material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1715360A CN1715360A (en) | 2006-01-04 |
| CN100376655C true CN100376655C (en) | 2008-03-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100279340A Expired - Fee Related CN100376655C (en) | 2004-06-30 | 2004-06-30 | Thermal Interface Material |
Country Status (1)
| Country | Link |
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| CN (1) | CN100376655C (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050016714A1 (en) | 2003-07-09 | 2005-01-27 | Chung Deborah D.L. | Thermal paste for improving thermal contacts |
| US8138239B2 (en) * | 2008-12-23 | 2012-03-20 | Intel Corporation | Polymer thermal interface materials |
| US8564954B2 (en) | 2010-06-15 | 2013-10-22 | Chipmos Technologies Inc. | Thermally enhanced electronic package |
| CN105038374A (en) * | 2015-09-02 | 2015-11-11 | 普罗旺斯科技（深圳）有限公司 | Cooling coating, cooling fin and manufacturing method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07224214A (en) * | 1994-02-10 | 1995-08-22 | Toyo Tire & Rubber Co Ltd | Temperature-selfcontrolling pyrogenetic material |
| EP0939115A1 (en) * | 1998-02-27 | 1999-09-01 | Shin-Etsu Chemical Co., Ltd. | Thermally conductive grease composition |
| JP2002030217A (en) * | 2000-07-17 | 2002-01-31 | Fujitsu Ltd | Thermal conductive silicone composition |
| US20030171487A1 (en) * | 2002-03-11 | 2003-09-11 | Tyco Electronics Corporation | Curable silicone gum thermal interface material |
| US6620515B2 (en) * | 2001-12-14 | 2003-09-16 | Dow Corning Corporation | Thermally conductive phase change materials |
| CN1485396A (en) * | 2002-09-27 | 2004-03-31 | 徐惠群 | thermal interface layer |
| CN1501483A (en) * | 2002-11-14 | 2004-06-02 | �廪��ѧ | A kind of thermal interface material and its manufacturing method |
-
2004
- 2004-06-30 CN CNB2004100279340A patent/CN100376655C/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07224214A (en) * | 1994-02-10 | 1995-08-22 | Toyo Tire & Rubber Co Ltd | Temperature-selfcontrolling pyrogenetic material |
| EP0939115A1 (en) * | 1998-02-27 | 1999-09-01 | Shin-Etsu Chemical Co., Ltd. | Thermally conductive grease composition |
| JP2002030217A (en) * | 2000-07-17 | 2002-01-31 | Fujitsu Ltd | Thermal conductive silicone composition |
| US6620515B2 (en) * | 2001-12-14 | 2003-09-16 | Dow Corning Corporation | Thermally conductive phase change materials |
| US20030171487A1 (en) * | 2002-03-11 | 2003-09-11 | Tyco Electronics Corporation | Curable silicone gum thermal interface material |
| CN1485396A (en) * | 2002-09-27 | 2004-03-31 | 徐惠群 | thermal interface layer |
| CN1501483A (en) * | 2002-11-14 | 2004-06-02 | �廪��ѧ | A kind of thermal interface material and its manufacturing method |
Non-Patent Citations (1)
| Title |
|---|
| 导热高分子符合材料的研究与应用. 马传国等.材料工程，第7期. 2002 * |
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|---|---|
| CN1715360A (en) | 2006-01-04 |
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