CN105925059A - 一种种子油墨 - Google Patents
一种种子油墨 Download PDFInfo
- Publication number
- CN105925059A CN105925059A CN201610312068.2A CN201610312068A CN105925059A CN 105925059 A CN105925059 A CN 105925059A CN 201610312068 A CN201610312068 A CN 201610312068A CN 105925059 A CN105925059 A CN 105925059A
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- China
- Prior art keywords
- seed ink
- iron powder
- ink
- seed
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 36
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 12
- 239000003960 organic solvent Substances 0.000 claims abstract description 8
- 230000003078 antioxidant effect Effects 0.000 claims abstract 2
- -1 Merlon Polymers 0.000 claims description 12
- 239000002994 raw material Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- 239000012298 atmosphere Substances 0.000 claims description 5
- 239000003638 chemical reducing agent Substances 0.000 claims description 5
- 229920000728 polyester Polymers 0.000 claims description 5
- 239000013008 thixotropic agent Substances 0.000 claims description 5
- 125000002091 cationic group Chemical group 0.000 claims description 4
- 239000002270 dispersing agent Substances 0.000 claims description 4
- 229920001038 ethylene copolymer Polymers 0.000 claims description 4
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 claims description 3
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 claims description 3
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical class B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 claims description 3
- 229910000085 borane Inorganic materials 0.000 claims description 3
- 239000008103 glucose Substances 0.000 claims description 3
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 claims description 3
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 claims description 3
- 229910021392 nanocarbon Inorganic materials 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 238000010301 surface-oxidation reaction Methods 0.000 claims description 3
- 238000007334 copolymerization reaction Methods 0.000 claims description 2
- 239000011261 inert gas Substances 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- 239000000178 monomer Substances 0.000 claims description 2
- VDGJOQCBCPGFFD-UHFFFAOYSA-N oxygen(2-) silicon(4+) titanium(4+) Chemical compound [Si+4].[O-2].[O-2].[Ti+4] VDGJOQCBCPGFFD-UHFFFAOYSA-N 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 229920003210 poly(4-hydroxy benzoic acid) Polymers 0.000 claims description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 2
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 2
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- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- WSQZNZLOZXSBHA-UHFFFAOYSA-N 3,8-dioxabicyclo[8.2.2]tetradeca-1(12),10,13-triene-2,9-dione Chemical compound O=C1OCCCCOC(=O)C2=CC=C1C=C2 WSQZNZLOZXSBHA-UHFFFAOYSA-N 0.000 claims 1
- 150000001336 alkenes Chemical class 0.000 claims 1
- 150000001450 anions Chemical class 0.000 claims 1
- 239000003963 antioxidant agent Substances 0.000 claims 1
- 235000006708 antioxidants Nutrition 0.000 claims 1
- ZDNFTNPFYCKVTB-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,4-dicarboxylate Chemical group C=CCOC(=O)C1=CC=C(C(=O)OCC=C)C=C1 ZDNFTNPFYCKVTB-UHFFFAOYSA-N 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000006185 dispersion Substances 0.000 claims 1
- 125000002791 glucosyl group Chemical group C1([C@H](O)[C@@H](O)[C@H](O)[C@H](O1)CO)* 0.000 claims 1
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- 239000013034 phenoxy resin Substances 0.000 claims 1
- 229920001596 poly (chlorostyrenes) Polymers 0.000 claims 1
- 238000006116 polymerization reaction Methods 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
- 239000001488 sodium phosphate Substances 0.000 claims 1
- 229910000162 sodium phosphate Inorganic materials 0.000 claims 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 abstract description 9
- 238000005516 engineering process Methods 0.000 description 7
- 235000012239 silicon dioxide Nutrition 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000005543 nano-size silicon particle Substances 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
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- 125000000129 anionic group Chemical group 0.000 description 3
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- 238000009713 electroplating Methods 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000011440 grout Substances 0.000 description 3
- 229910000510 noble metal Inorganic materials 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- QPRQEDXDYOZYLA-UHFFFAOYSA-N 2-methylbutan-1-ol Chemical compound CCC(C)CO QPRQEDXDYOZYLA-UHFFFAOYSA-N 0.000 description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- HXQPUEQDBSPXTE-UHFFFAOYSA-N Diisobutylcarbinol Chemical compound CC(C)CC(O)CC(C)C HXQPUEQDBSPXTE-UHFFFAOYSA-N 0.000 description 2
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000012752 auxiliary agent Substances 0.000 description 2
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- YKYONYBAUNKHLG-UHFFFAOYSA-N propyl acetate Chemical compound CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 2
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 2
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 1
- RUJPNZNXGCHGID-UHFFFAOYSA-N (Z)-beta-Terpineol Natural products CC(=C)C1CCC(C)(O)CC1 RUJPNZNXGCHGID-UHFFFAOYSA-N 0.000 description 1
- JLPULHDHAOZNQI-ZTIMHPMXSA-N 1-hexadecanoyl-2-(9Z,12Z-octadecadienoyl)-sn-glycero-3-phosphocholine Chemical compound CCCCCCCCCCCCCCCC(=O)OC[C@H](COP([O-])(=O)OCC[N+](C)(C)C)OC(=O)CCCCCCC\C=C/C\C=C/CCCCC JLPULHDHAOZNQI-ZTIMHPMXSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- FENFUOGYJVOCRY-UHFFFAOYSA-N 1-propoxypropan-2-ol Chemical compound CCCOCC(C)O FENFUOGYJVOCRY-UHFFFAOYSA-N 0.000 description 1
- NQDZCRSUOVPTII-UHFFFAOYSA-N 10-methylundecan-1-ol Chemical compound CC(C)CCCCCCCCCO NQDZCRSUOVPTII-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- CUDYYMUUJHLCGZ-UHFFFAOYSA-N 2-(2-methoxypropoxy)propan-1-ol Chemical compound COC(C)COC(C)CO CUDYYMUUJHLCGZ-UHFFFAOYSA-N 0.000 description 1
- XYVAYAJYLWYJJN-UHFFFAOYSA-N 2-(2-propoxypropoxy)propan-1-ol Chemical compound CCCOC(C)COC(C)CO XYVAYAJYLWYJJN-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- WVYWICLMDOOCFB-UHFFFAOYSA-N 4-methyl-2-pentanol Chemical compound CC(C)CC(C)O WVYWICLMDOOCFB-UHFFFAOYSA-N 0.000 description 1
- 208000035985 Body Odor Diseases 0.000 description 1
- 206010055000 Bromhidrosis Diseases 0.000 description 1
- PTQRHDITXUVTPO-UHFFFAOYSA-N C(C)(=O)OC=C.[Cl] Chemical compound C(C)(=O)OC=C.[Cl] PTQRHDITXUVTPO-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RNFAKTRFMQEEQE-UHFFFAOYSA-N Tripropylene glycol butyl ether Chemical compound CCCCOC(CC)OC(C)COC(O)CC RNFAKTRFMQEEQE-UHFFFAOYSA-N 0.000 description 1
- BAPJBEWLBFYGME-UHFFFAOYSA-N acrylic acid methyl ester Natural products COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 1
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 1
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- AJXBTRZGLDTSST-UHFFFAOYSA-N amino 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)ON AJXBTRZGLDTSST-UHFFFAOYSA-N 0.000 description 1
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- PGMYKACGEOXYJE-UHFFFAOYSA-N anhydrous amyl acetate Natural products CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- BTMVHUNTONAYDX-UHFFFAOYSA-N butyl propionate Chemical compound CCCCOC(=O)CC BTMVHUNTONAYDX-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- ZSBRYDJXHOFQMW-UHFFFAOYSA-N chloroethene;ethene;ethenyl acetate Chemical group C=C.ClC=C.CC(=O)OC=C ZSBRYDJXHOFQMW-UHFFFAOYSA-N 0.000 description 1
- HGAZMNJKRQFZKS-UHFFFAOYSA-N chloroethene;ethenyl acetate Chemical compound ClC=C.CC(=O)OC=C HGAZMNJKRQFZKS-UHFFFAOYSA-N 0.000 description 1
- 229920000891 common polymer Polymers 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- MNWFXJYAOYHMED-UHFFFAOYSA-M heptanoate Chemical compound CCCCCCC([O-])=O MNWFXJYAOYHMED-UHFFFAOYSA-M 0.000 description 1
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 229940011051 isopropyl acetate Drugs 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-N isovaleric acid Chemical compound CC(C)CC(O)=O GWYFCOCPABKNJV-UHFFFAOYSA-N 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 238000000643 oven drying Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- TWSRVQVEYJNFKQ-UHFFFAOYSA-N pentyl propanoate Chemical compound CCCCCOC(=O)CC TWSRVQVEYJNFKQ-UHFFFAOYSA-N 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229940051841 polyoxyethylene ether Drugs 0.000 description 1
- 229920000056 polyoxyethylene ether Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- MCSINKKTEDDPNK-UHFFFAOYSA-N propyl propionate Chemical compound CCCOC(=O)CC MCSINKKTEDDPNK-UHFFFAOYSA-N 0.000 description 1
- 238000000275 quality assurance Methods 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 229940083466 soybean lecithin Drugs 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- QJVXKWHHAMZTBY-GCPOEHJPSA-N syringin Chemical compound COC1=CC(\C=C\CO)=CC(OC)=C1O[C@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 QJVXKWHHAMZTBY-GCPOEHJPSA-N 0.000 description 1
- KUCOHFSKRZZVRO-UHFFFAOYSA-N terephthalaldehyde Chemical compound O=CC1=CC=C(C=O)C=C1 KUCOHFSKRZZVRO-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/14—Treatment of metallic powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
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Abstract
本发明公开了一种种子油墨,包括以下重量份数的原料:铁粉30~85重量份、有机载体3~16重量份、有机溶剂12~65重量份,其中铁粉表面经过纳米二氧化硅处理,形成抗氧化保护膜。与现有技术相比,本发明的有益效果是:工艺简单、成本低,适用于多层柔性电路板(FPC)、多层印刷电路板(PCB)的灌孔导通。
Description
技术领域
本发明涉及一种PCB或FPC电路板灌封材料,特别是一种种子油墨。
背景技术
在现代微电子工业中,人们对电子元器件要求越来越高,生产多采用流程化、标准化来进行以降低成本,印刷电路板(PCB)就是适合微电子工业的这种需求而诞生的。目前市场上的双面多层线路板的贯通孔技术采用大多是电镀技术,电镀技术除了造成环境污染外,在生产成本上也给企业造成极大的压力。故此,越来越多的印制线路板企业会考虑不采用电镀技术来处理贯通孔,一般都会采用导电油墨或者导电浆料。但使用的导电油墨都含有金、银、铂、钯等贵金属粉末,导致成本过高。而贱金属铜、镍取代金、银、铂、钯等贵金属,由于容易氧化,在加工过程中会在其表面形成氧化层,造成不导电。另外,由于碳的导电率低,不能满足低电阻率电路的要求。以上的几种灌孔方法还存在耐热冲击的可靠性,电阻值的稳定性和附着力度变弱等问题。
发明内容
本发明旨在提供成本少、吸附性好、应用范围广,品质保障系数较好且便于操作的一种线路板灌孔的种子油墨,本发明还提供该种子油墨中金属铁的表面处理工艺。本发明要解决的技术问题是提供一种种子油墨。
本发明是通过以下技术方案来实现:
一种种子油墨,包括以下重量份数的原料:铁粉30~85重量份、有机载体3~16重量份、有机溶剂12~65重量份,所述铁粉经过表面抗氧化处理。
进一步,所述的一种种子油墨,铁粉经过以下步骤进行表面抗氧化处理:在惰性气体气氛中,利用高能高速振动盘式研磨机将铁粉原料与纳米二氧化硅混合均匀即可。
进一步,所述的一种种子油墨,原料还包括分散剂0.5~1.5重量份。
进一步,所述的一种种子油墨,分散剂为阳离子型、阴离子型、非离子型和两性型中的至少一种。
进一步,所述的一种种子油墨,原料还包括还原剂2~5重量份。
进一步,所述的一种种子油墨,还原剂为葡萄糖、甲醛、次亚磷酸钠、硼烷类物质和水合肼中的至少一种。
进一步,所述的一种种子油墨,原料还包括触变剂0.2~2重量份。
进一步,所述的一种种子油墨,触变剂为纳米碳粉、纳米二氧化硅或者有机膨润土中的至少一种。
进一步,所述的一种种子油墨,铁粉的颗粒直径为1~75微米。
进一步,所述的一种种子油墨,有机载体由下列高分子聚合物中的一种或者两种以上按任意重量比例混合构成:聚氨酯、聚碳酸酯、聚氯乙烯、聚甲基丙烯酸甲酯、苯氧树脂、聚酯、乙烯共聚物,所述聚酯为聚对苯二甲酸乙二酯、聚对苯二甲酸丁二酯、聚对苯二甲酸二烯丙酯、聚对羟基苯甲酸酯、不饱和聚酯树脂、酚醛树脂或丙烯酸树脂,所述乙烯共聚物由两种或两种以上含有乙烯基的单体共聚而成的聚合物。
与现有技术相比,本发明的有益效果是:
1.本发明所制造的种子油墨中不含有银、金、铂、钯等贵金属,所使用的金属铁易获得且价格便宜,所以大大降低了相关产品的制造成本。
2.本发明所制造的种子油墨的使用方法简单,操作简便,容易实现。
3.由本发明所制造的种子油墨灌孔,以氧化还原反应后形成的铜层电路可靠,与PCB/FPC的铜电路接触良好,电阻率低,导电性能好。
4.本发明所制造的种子油墨,其组成成分铁粉经过二氧化硅表面处理,有效防止产品易氧化的现象。
具体实施方式:
本发明具体按照以下步骤进行:1)在惰性气体气氛中,利用高能高速振动盘式研磨机将铁粉原料与纳米二氧化硅混合均匀,得带本发明所需铁粉;2)将有机载体溶于有机溶剂;3)将铁粉和助剂溶于有机溶剂中,混合均匀,得到种子油墨。
本发明的实施例中,有机载体分别采用的是聚氨酯、聚酯、氯乙烯-醋酸乙烯酯共聚物、丙烯酸树脂、酚醛树脂、醋酸乙烯-氯乙烯-乙烯醇共聚物、苯氧树酯以及醋酸乙烯-氯乙烯-羟烷基丙烯酸酯共聚物。除此而外,有机载体还可以采用聚碳酸酯、聚氯乙烯、聚甲基丙烯酸甲酯以及它们之间的相互组合等等均可以实施本发明,并获得相同或等同的技术效果。
本发明的实施例中,有机溶剂分别采用的是乙酸乙酯、丁酮、二丙二醇甲醚酯酸酯、丁基卡必醇醋酸酯、二乙二醇乙醚、丙二醇甲醚酯酸酯、乙醇、α松油醇以及丁基卡必醇。除此而外,有机溶剂还可以采用丙二醇甲醚、二丙二醇甲醚、二丙二醇丙醚、丙二醇丙醚、丙二醇丁醚、二丙二醇丁醚、三丙二醇丁醚、丙二醇苯醚、二丙二醇二甲醚、丙二醇二醋酸酯、醋酸戊酯混合物、醋酸正丁酯、醋酸异丁酯、醋酸正丙酯、醋酸异丙酯、丙酸正丁酯、3-乙氧基丙酸乙酯、邻苯二甲酸二丁酯、丙酸正戊酯、丙酸正丙酯、二元酸酯、丙酮、β-松油醇、已二醇、戊醇混合物、正丁醇、异丁醇、异丙醇、二异丁基甲醇、甲基异丁基甲醇、2-甲基丁醇、正戊醇、正丙醇、三甲基壬醇以及它们之间的相互组合等等均可以实施本发明,并获得相同或等同的技术效果。
本发明的实施例中,分散剂采用阳离子型、阴离子型、非离子型和两性型中的一种,其中,阳离子型有聚乙烯亚胺、双十八烷基双甲基氯化铵或者咪唑啉季铵盐;阴离子型为大豆卵磷脂;非离子型为脂肪醇聚氧乙烯醚;两性型为椰油基磺丙基甜菜碱。还原剂采用葡萄糖、甲醛、次亚磷酸钠、硼烷类物质和水合肼中的至少一种。触变剂采用纳米碳粉、纳米二氧化硅或者有机膨润土。
下面结合实施例对本发明作进一步说明:
铁粉制备方法1:
选择直径20微米的铁粉与直径10纳米的二氧化硅混合,其中二氧化硅占铁粉比重为0.1%,在氩气气氛中,利用高能高速振动盘式研磨机研磨0.5小时,将铁粉与纳米二氧化硅混合均匀,制得所需铁粉。
铁粉制备方法2:
选择直径45微米的铁粉与直径42纳米的二氧化硅混合,其中二氧化硅占铁粉比重为3.5%,在氦气气氛中,利用高能高速振动盘式研磨机研磨6小时,将铁粉与纳米二氧化硅混合均匀,制得所需铁粉。
铁粉制备方法3:
选择直径65微米的铁粉与直径48纳米的二氧化硅混合,其中二氧化硅占铁粉比重为5%,在氮气气氛中,利用高能高速振动盘式研磨机研磨24小时,将铁粉与纳米二氧化硅混合均匀,制得所需铁粉。
一种种子油墨制备方法:
把有机载体溶解于有机溶剂中,然后加入铁粉和助剂,充分搅拌分散均匀,即得到本发明所用的种子油墨。
按表1中的原材料配方制备种子油墨,测试方法:将得到的油墨用丝网印刷方法在PCB电路板上,印刷宽为0.4毫米,长为1米的线路,再放入120℃烘箱干燥40分钟,得到紧附着于PCB板上的电路图形,室温下(25±5℃),放入硫酸铜含量为18%(重量比)的溶液中3分钟,得到导电性良好的铜导电线路,随后测量样品电阻值及电路图形铜层厚度,并计算电阻率。
表1:
上述实施例只为说明本发明的技术构思及特点,其目的在于让熟悉此项技术的人士能够了解本发明的内容并据以实施,并不能以此限制本发明的保护范围。凡根据本发明精神实质所作的等效变化或修饰,都应涵盖在本发明的保护范围之内。
Claims (10)
1.一种种子油墨,其特征在于,包括以下重量份数的原料:铁粉30~85重量份、有机载体3~16重量份、有机溶剂12~65重量份,所述铁粉经过表面抗氧化处理。
2.根据权利要求1所述的一种种子油墨,其特征在于,所述铁粉经过以下步骤进行表面抗氧化处理:在惰性气体气氛中,利用高能高速振动盘式研磨机将铁粉原料与纳米二氧化硅混合均匀即可。
3.根据权利要求1或2任一项所述的一种种子油墨,其特征在于,所述原料还包括分散剂0.5~1.5重量份。
4.根据权利要求3所述的一种种子油墨,其特征在于,所述分散剂为阳离子型、阴离子型、非离子型和两性型中的至少一种。
5.根据权利要求3所述的一种种子油墨,其特征在于,所述原料还包括还原剂2~5重量份。
6.根据权利要求5所述的一种种子油墨,其特征在于,所述还原剂为葡萄糖、甲醛、次亚磷酸钠、硼烷类物质和水合肼中的至少一种。
7.根据权利要求3所述的一种种子油墨,其特征在于,所述原料还包括触变剂0.2~2重量份。
8.根据权利要求7所述的一种种子油墨,其特征在于,所述触变剂为纳米碳粉、纳米二氧化硅或者有机膨润土中的至少一种。
9.根据权利要求1或2任一项所述的一种种子油墨,其特征在于,所述铁粉的颗粒直径为1~75微米。
10.根据权利要求1至9任一项所述的一种种子油墨,其特征在于,所述有机载体由下列高分子聚合物中的一种或者两种以上按任意重量比例混合构成:聚氨酯、聚碳酸酯、聚氯乙烯、聚甲基丙烯酸甲酯、苯氧树脂、聚酯、乙烯共聚物,所述聚酯为聚对苯二甲酸乙二酯、聚对苯二甲酸丁二酯、聚对苯二甲酸二烯丙酯、聚对羟基苯甲酸酯、不饱和聚酯树脂、酚醛树脂或丙烯酸树脂,所述乙烯共聚物由两种或两种以上含有乙烯基的单体共聚而成的聚合物。
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| CN110045864A (zh) * | 2019-03-06 | 2019-07-23 | 苏州蓝沛光电科技有限公司 | 种子层的制备方法 |
| CN110041760A (zh) * | 2019-03-06 | 2019-07-23 | 苏州蓝沛光电科技有限公司 | 种子油墨及其制备方法 |
| CN110058725A (zh) * | 2019-03-06 | 2019-07-26 | 苏州蓝沛光电科技有限公司 | 触控屏的制备方法 |
| CN110058726A (zh) * | 2019-03-06 | 2019-07-26 | 苏州蓝沛光电科技有限公司 | 触控屏的制备方法 |
| CN110197747A (zh) * | 2019-03-06 | 2019-09-03 | 苏州蓝沛光电科技有限公司 | 透明导电膜结构的制备方法 |
| WO2020177737A1 (zh) * | 2019-03-06 | 2020-09-10 | 苏州蓝沛光电科技有限公司 | 种子层的制备方法 |
| CN110058725B (zh) * | 2019-03-06 | 2021-11-05 | 苏州蓝沛光电科技有限公司 | 触控屏的制备方法 |
| CN110058726B (zh) * | 2019-03-06 | 2023-02-03 | 苏州蓝沛光电科技有限公司 | 触控屏的制备方法 |
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