CN104902595B - Temperature control system for electronic cigarette heat-generating body - Google Patents
Temperature control system for electronic cigarette heat-generating body Download PDFInfo
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- CN104902595B CN104902595B CN201510331222.6A CN201510331222A CN104902595B CN 104902595 B CN104902595 B CN 104902595B CN 201510331222 A CN201510331222 A CN 201510331222A CN 104902595 B CN104902595 B CN 104902595B
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- 239000003571 electronic cigarette Substances 0.000 title claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 22
- 239000004065 semiconductor Substances 0.000 claims description 31
- 230000005611 electricity Effects 0.000 claims description 8
- 238000012545 processing Methods 0.000 claims description 6
- 238000004891 communication Methods 0.000 claims description 5
- 102100036285 25-hydroxyvitamin D-1 alpha hydroxylase, mitochondrial Human genes 0.000 claims 2
- 101000875403 Homo sapiens 25-hydroxyvitamin D-1 alpha hydroxylase, mitochondrial Proteins 0.000 claims 2
- 230000007175 bidirectional communication Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 7
- 230000010354 integration Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000001105 regulatory effect Effects 0.000 description 4
- 238000005070 sampling Methods 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 239000006199 nebulizer Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000009897 systematic effect Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000009699 differential effect Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 238000012369 In process control Methods 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000036760 body temperature Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000004422 calculation algorithm Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 230000001815 facial effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010965 in-process control Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
-
- A—HUMAN NECESSITIES
- A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
- A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
- A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
- A24F40/50—Control or monitoring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Control Of Resistance Heating (AREA)
- Control Of Temperature (AREA)
Abstract
The invention relates to a temperature control system for an electronic cigarette heat-generating body. According to the temperature control system, the output end of a heating detecting AD feedback module is connected with the input end of a central processor; the output end of the central processor is connected with the input end of a heating module and the input end of a display module; the output end of a key input module is connected with the input end of the central processor; a power supply module is electrically connected with a power management module; the power management module is connected with the central processor and is in bidirectional communication with the central processor; the output end of a voltage detecting module is connected with the input end of the central processor; the input end of the voltage detecting module is connected with the output end of the power supply module; the input end of a battery anti-reverse-connection module is connected with the power supply module; the output end of the battery anti-reverse-connection module is connected with the input end of the central processor; and the power management module is electrically connected with the display module and the central processor. The temperature control system is simple in structure and low in cost.
Description
Technical field
The invention belongs to electronic technology field, more particularly to a kind of temperature control system of electronic cigarette heater.
Background technology
For power adjustments or NTC control and regulation are on market to current electronic cigarette method for heating and controlling.Power
Regulation causes the non-constant of temperature, low when easily high during boiling hot mouth temperature, it is possible to cause smell of scorching.Using nebulizer NTC temperature
Control, if the complexity and compatibility that nebulizer can be caused to be connected with battery case is placed on nebulizer in NTC, such as in control
Use on plate or other power devices on detection can cause the inaccurate of actual temperature and detection temperature, it is error larger.But make
With electronic cigarette heater temperature control technology, by the change of heating-up temperature, so as to cause the change of heating bulk resistance, system
Monitoring to temperature is determined by the detecting to resistance value.
The content of the invention
It is an object of the invention to provide a kind of temperature control system of electronic cigarette heater, it is intended to solve above-mentioned technology
Problem.
The present invention is achieved in that a kind of temperature control system of electronic cigarette heater, and the temperature control system includes
Central processor MCU, display module, power management module, power supply module, cell anti-reverse connection module, detecting voltage module,
Heating module, heating detecting AD feedback modules and keyboard input module, the outfan connection of the heating detecting AD feedback modules
The input of the central processor MCU, the outfan of the central processor MCU connect the input of the heating module,
The outfan of the central processor MCU connects the input of the display module, and the outfan of the keyboard input module connects
The input of the central processor MCU is connect, the power supply module is electrically connected with the power management module, the power supply
Management module connects the central processor MCU two-way communication, and the outfan of the detecting voltage module connects the centre
The input of reason device MCU, the input of the detecting voltage module connect the outfan of the power supply module, the battery
The input of counnter attack connection module connects the power supply module, and the outfan of the cell anti-reverse connection module connects the central authorities
The input of processor MCU, the power supply module are electrically connected with the display module and central processor MCU.
The present invention further technical scheme be：The power management module include electric capacity C20, resistance R12, chip U5,
Resistance R15, electric capacity C19 and binding post P4, the 1st foot of the binding post P4 connect the positive pole of electric capacity C19, chip U5 respectively
The 4th, 8 feet, the 7th foot of the chip U5 connects one end of resistance R11, and resistance R12 is grounded by the 2nd foot of the chip U5,
5th foot of the chip U5 connects the positive pole of the electric capacity C20, and the negative pole of the electric capacity C20 connects the 1st foot of the chip U5
And ground connection, the chip U5 the 3rd, 6 feet, the negative pole of electric capacity C19, connect lower terminal P4 the 4th, 5 feet are grounded.
The present invention further technical scheme be：The cell anti-reverse connection module includes resistance R14, resistance R13, metal-oxide-semiconductor
Q3, metal-oxide-semiconductor Q4 and binding post P5, the grid of the metal-oxide-semiconductor Q4 connect one end of the resistance R14, the leakage of the metal-oxide-semiconductor Q4
Pole connects the 2nd foot of the drain electrode of metal-oxide-semiconductor Q3 and binding post P5 respectively, and the grid of the metal-oxide-semiconductor Q3 connects the one of resistance R13
End, the 1st foot of the other end, the other end of resistance R14 and binding post P5 of the resistance R13 connect the chip U5's respectively
5th foot, the source ground of the metal-oxide-semiconductor.
The present invention further technical scheme be：The power supply module includes powering for display module is powered first
Unit and the second power supply unit powered for central processing unit, the structure of first power supply unit and second power supply unit
Identical, first power supply unit includes electric capacity C7, electric capacity C8, chip U2, electric capacity C9, electric capacity C10 and inductance L1, the chip
The Vin feet of U2 connect one end of the positive pole and electric capacity C8 of the electric capacity C7 respectively, and the Vout feet of the chip U2 connect institute respectively
State one end of one end, the positive pole of electric capacity C10 and inductance L of electric capacity C9, the negative pole of the electric capacity C7, the other end of electric capacity C8, core
The negative pole of the GND feet, one end of electric capacity C9 and electric capacity C10 of piece U2 is grounded；Second power supply unit includes electric capacity C11, electric capacity
C12, chip U3, electric capacity C13, electric capacity C14 and inductance L2, the Vin feet of the chip U3 connect the positive pole of the electric capacity C11 respectively
And one end of electric capacity C12, the Vout feet of the chip U3 connect one end, the positive pole of electric capacity C14 and the electricity of the electric capacity C13 respectively
One end of sense L, the negative pole of the electric capacity C11, the other end of electric capacity C12, the GND feet of chip U3, one end of electric capacity C13 and electric capacity
The negative pole of C14 is grounded.
The present invention further technical scheme be：The display module include chip U1, electric capacity C1, electric capacity C2, electric capacity C3,
Electric capacity C4, electric capacity C5, electric capacity C6 and resistance R1, electric capacity C6 ground connection described in the 29th foot Jing of the chip U1, the chip U1's
Electric capacity C8 ground connection described in 28th foot Jing, resistance R1 ground connection, the 9th foot Jing of the chip U1 described in the 27th foot Jing of the chip U1
The electric capacity C3 ground connection, the electric capacity C2 is connected by electric capacity C4 ground connection described in the 6th foot Jing of chip U1, the 4th feet of chip U1
The electric capacity C1 is connected the 3rd foot of the chip U1, the chip U1 for 5th foot of the chip U1, the 2nd feet of chip U1
The 8th, 11,12,16,17,20-25 feet are grounded.
The present invention further technical scheme be：The central processor MCU include chip U4, electric capacity C15, electric capacity C16,
Switch SW1 and switch SW2, the chip U4 the 7th, 8 feet difference Jing described in electric capacity C15 ground connection, the 13rd foot of the chip U4
Electric capacity C16 ground connection described in Jing, the 19th foot of the chip U4 connect one end of the switch SW1, the 20th foot of the chip U4
One end of the connection switch SW2, the chip U4 the 18th, 10 feet are grounded.
The present invention further technical scheme be：It is described heating detecting AD feedback modules include resistance R10, audion Q1,
Resistance R9, metal-oxide-semiconductor Q2, resistance R7, resistance R8 binding posts P3 and electric capacity C18, one end of the resistance R10 connect three pole
The base stage of pipe Q1, the colelctor electrode of the audion Q1 connect one end of the grid and resistance R9 of the metal-oxide-semiconductor Q2 respectively, described
1st foot of the drain electrode connection binding post P3 of metal-oxide-semiconductor, one end of the 2nd foot difference resistance R7 of the binding post P3 and resistance
One end of R8, the other end Jing electric capacity C18 ground connection of the resistance R8, the emitter stage of the other end and audion Q1 of the resistance R7
It is grounded.
The present invention further technical scheme be：The heating module includes resistance Rt.
The present invention further technical scheme be：The keyboard input module include resistance R2, resistance R3, resistance R4, by
Key S1, button S2 and button S3, one end of the resistance R2 connect one end of the button S1, one end connection of the resistance R3
One end of the button S2, one end of the resistance R4 connect one end of the button S3, the other end of the button S1, button
The other end of the other end and button S3 of S2 is grounded.
The present invention further technical scheme be：The detecting voltage module block includes resistance R5, resistance R6 and electric capacity
One end of C17, the resistance R5 connects one end of the resistance R6 and one end of electric capacity C17 respectively, and the resistance R6's is another
The other end of end and electric capacity C17 is grounded.
The invention has the beneficial effects as follows：It is the application simple structure, easy to use, with low cost；Detection is more accurate, and control is more
The convenient globality stability and harmony for effectively implementing system.Using built-in boosting, communication speed, operation stability are improved
By force.
Description of the drawings
Fig. 1 is the structured flowchart of the temperature control system of electronic cigarette heater provided in an embodiment of the present invention；
Fig. 2 is the electrical schematic diagram of power supply module provided in an embodiment of the present invention；
Fig. 3 is power management module provided in an embodiment of the present invention, the electrical schematic diagram of cell anti-reverse connection module；
Fig. 4 is the electrical schematic diagram of display module provided in an embodiment of the present invention；
Fig. 5 is the electrical schematic diagram of central processing unit provided in an embodiment of the present invention；
Fig. 6 is the electrical schematic diagram of heating detecting AD feedback modules provided in an embodiment of the present invention；
Fig. 7 is the electrical schematic diagram of keyboard input module provided in an embodiment of the present invention；
Fig. 8 is the electrical schematic diagram of detecting voltage module provided in an embodiment of the present invention；
Fig. 9 is the curve relation figure of temperature provided in an embodiment of the present invention and AD values；
Figure 10 is the temperature curve target temperature 180 degree corresponding data point after control provided in an embodiment of the present invention；
Figure 11 is that the embodiment of the present invention provides PID control software control flow chart.
Specific embodiment
Fig. 1 shows the temperature control system of the electronic cigarette heater of present invention offer, during the temperature control system includes
Central processor MCU, display module, power management module, power supply module, cell anti-reverse connection module, detecting voltage module, plus
Thermal modules, heating detecting AD feedback modules and keyboard input module, the outfan connection institute of the heating detecting AD feedback modules
The input of central processor MCU is stated, the outfan of the central processor MCU connects the input of the heating module, institute
The outfan for stating central processor MCU connects the input of the display module, the outfan connection of the keyboard input module
The input of the central processor MCU, the power supply module are electrically connected with the power management module, the power supply pipe
Reason module connects the central processor MCU two-way communication, and the outfan connection central authorities of the detecting voltage module are processed
The input of device MCU, the input of the detecting voltage module connect the outfan of the power supply module, and the battery is prevented
The input of reversal connection module connects the power supply module, and the outfan of the cell anti-reverse connection module connects the centre
The input of reason device MCU, the power supply module are electrically connected with the display module and central processor MCU.
The power management module includes electric capacity C20, resistance R12, chip U5, resistance R15, electric capacity C19 and binding post
1st foot of P4, the binding post P4 connect respectively the positive pole of electric capacity C19, the 4th of chip U5 the, 8 feet, the 7th of the chip U5 the
Foot connects one end of resistance R11, and resistance R12 is grounded by the 2nd foot of the chip U5, and the 5th foot connection of the chip U5 is described
The positive pole of electric capacity C20, the 1st foot of the negative pole connection chip U5 of the electric capacity C20 and ground connection, the 3rd, the 6 of the chip U5
Foot, the negative pole of electric capacity C19, connect lower terminal P4 the 4th, 5 feet are grounded.
The cell anti-reverse connection module includes resistance R14, resistance R13, metal-oxide-semiconductor Q3, metal-oxide-semiconductor Q4 and binding post P5, institute
The grid for stating metal-oxide-semiconductor Q4 connects one end of the resistance R14, the drain electrode of the metal-oxide-semiconductor Q4 connect respectively the drain electrode of metal-oxide-semiconductor Q3 and
2nd foot of binding post P5, the grid of the metal-oxide-semiconductor Q3 connect one end of resistance R13, the other end of the resistance R13, resistance
1st foot of the other end and binding post P5 of R14 connects the 5th foot of the chip U5, the source ground of the metal-oxide-semiconductor respectively.
The power supply module includes the first power supply unit powered for display module and powers for central processing unit
Second power supply unit, first power supply unit are identical with the structure of second power supply unit, the first power supply unit bag
Electric capacity C7, electric capacity C8, chip U2, electric capacity C9, electric capacity C10 and inductance L1 are included, the Vin feet of the chip U2 connect the electricity respectively
Hold one end of the positive pole and electric capacity C8 of C7, the Vout feet of the chip U2 connect one end of the electric capacity C9, electric capacity C10 respectively
One end of positive pole and inductance L, the negative pole of the electric capacity C7, the other end of electric capacity C8, the GND feet of chip U2, one end of electric capacity C9
And the negative pole of electric capacity C10 is grounded；Second power supply unit includes electric capacity C11, electric capacity C12, chip U3, electric capacity C13, electric capacity C14
And the Vin feet of inductance L2, the chip U3 connect one end of the positive pole and electric capacity C12 of the electric capacity C11, the chip U3 respectively
Vout feet connect respectively the electric capacity C13 one end, the positive pole of electric capacity C14 and inductance L one end, the electric capacity C11's is negative
Pole, the other end of electric capacity C12, the negative pole of the GND feet, one end of electric capacity C13 and electric capacity C14 of chip U3 are grounded.
The display module includes chip U1, electric capacity C1, electric capacity C2, electric capacity C3, electric capacity C4, electric capacity C5, electric capacity C6 and electricity
Resistance R1, electric capacity C6 ground connection described in the 29th foot Jing of the chip U1, electric capacity C8 ground connection, institute described in the 28th foot Jing of the chip U1
Resistance R1 ground connection is stated described in the 27th foot Jing of chip U1, electric capacity C3 ground connection described in the 9th foot Jing of the chip U1, the of chip U1
The electric capacity C2 is connected the 5th foot of the chip U1, the chip for electric capacity C4 ground connection described in 6 foot Jing, the 4th feet of chip U1
The electric capacity C1 connects the 2nd feet of U1 the 3rd foot of the chip U1, the chip U1 the 8th, 11,12,16,17,20-25 feet
It is grounded.
The central processor MCU includes chip U4, electric capacity C15, electric capacity C16, switch SW1 and switch SW2, the chip
U4 the 7th, 8 feet difference Jing described in electric capacity C15 ground connection, described in the 13rd foot Jing of the chip U4 electric capacity C16 ground connection, the chip
19th foot of U4 connects one end of the switch SW1, and the 20th foot of the chip U4 connects one end of the switch SW2, described
Chip U4 the 18th, 10 feet ground connection.
The heating detecting AD feedback modules include resistance R10, audion Q1, resistance R9, metal-oxide-semiconductor Q2, resistance R7, resistance
One end of R8 binding posts P3 and electric capacity C18, the resistance R10 connects the base stage of the audion Q1, the audion Q1's
Colelctor electrode connects one end of the grid and resistance R9 of the metal-oxide-semiconductor Q2 respectively, the drain electrode connection binding post P3's of the metal-oxide-semiconductor
1st foot, one end and one end of resistance R8 of the 2nd foot difference resistance R7 of the binding post P3, the other end of the resistance R8
Jing electric capacity C18 is grounded, and the emitter stage of the other end and audion Q1 of the resistance R7 is grounded.
The heating module includes resistance Rt.
The keyboard input module includes resistance R2, resistance R3, resistance R4, button S1, button S2 and button S3, the electricity
One end of resistance R2 connects one end of the button S1, and one end of the resistance R3 connects one end of the button S2, the resistance
One end of R4 connects one end of the button S3, and the other end of the button S1, the other end of button S2 and button S3's is another
End is grounded.
The detecting voltage module block includes resistance R5, resistance R6 and electric capacity C17, and one end of the resistance R5 connects respectively
One end of the resistance R6 and one end of electric capacity C17, the other end of the other end and electric capacity C17 of the resistance R6 are grounded.
Display module adopts built-in boosting, and tri- line communication interface patterns of SPI are stable at a high speed.
Power management module, employs Q3, and two MOS of Q4 prevent battery reversal connection from showing to the burning out for other devices of circuit
As.
Power supply module, employs two-way power supply power supply mode, powers to OLED all the way, due to the built-in liter of display module
Pressure, prevents power supply disturbance MCU power supplies, causes AD to calculate inaccurate, so the mode for employing isolation is powered.
MCU (SN8F27E93L) central processing unit, with 1K RAM, 16K ROM, 12 high-precision adc input channels, tool
There is the PWM of built in hardware module, detect more smart Zhu, globality stability and the coordination of system is more easily effectively implemented in control
Property.
Data between heater actual temperature and actual measurement AD values are as shown in the table.
The curve relation figure of temperature and AD values is as shown in 9 figures.
According to above-mentioned mass data, data Fitting Analysis obtain the calculated relationship of AD and temperature T
T=753.3-1.556ad+0.000787ad*ad, above-mentioned calculated relationship are different according to heat-generating system, are generated
Calculated relationship is also differed, therefore above-mentioned calculated relationship refers to as one embodiment to support this heat-generating system.
Temperature value T0 corresponding to different AD, output display, while feeding back to can be calculated by this formula
MCU, MCU are obtained value of feedback and are sees only with setting value and compared, and realize accurately realizing the constant temperature control to heater using pid algorithm
System.
In process control, in the ratio (P) of deviation, integration (I) and the PID controller that is controlled of differential (D) (also known as
PID regulator) it is a kind of automatic controller being most widely used.It has principle simple, it is easy to accomplish, widely applicable, control
Parameter processed is separate, parameter it is selected fairly simple the advantages of；And may certify that in theory, for the allusion quotation of process control
The control object of type object --- " first-order lag+purely retarded " and " second-order lag+purely retarded ", PID controller are a kind of optimum
Control.PID Rule adjustings are a kind of effective ways of continuous system dynamic quality correction, its way of self-regulation simplicity, knot
Structure changes flexibly (PI, PD ...).
The selection of parameter：
1. impacts of the proportionality coefficient P to systematic function：Proportionality coefficient is increased, and accelerates being active in one's movements for system, speed, surely
State error reduces；P is bigger than normal, and the number of oscillation is added, and regulating time is lengthened；When P is too big, system can tend to unstable；P is too little, and
The slow in one's movements of system can be made.P can select negative, and this is mainly determined by the characteristic of actuator, sensor and control object
Fixed.If the symbol of P select improper object measured value will from the setting value of control targe increasingly away from, if there is so
The symbol of situation P must just negate.Simultaneously it should be noted that the P parameters of the PID control block of the strategy controller of power control are
Gain in PID control.
2. impact of integration control I to systematic function：Integral action declines the stability of system, the little (integral actions of I
System can be made unstable by force), but steady-state error can be eliminated, improve the control accuracy of system.
3. differential control impacts of the D to systematic function：The differential action can improve dynamic characteristic, when D is bigger than normal, overshoot compared with
Greatly, regulating time is shorter；When D is less than normal, overshoot is also larger, and regulating time is also longer；Only D is suitable, can just make overshoot compared with
It is little, shorten regulating time.
Summary simulation control of PID figure is as follows：
The discretization of 1.PID control laws
PID controller is a kind of linear regulator, and this actuator is by the set-point r of system and real output value yy structure
Into the ratio (P) of control deviation c=r-y, integration (I), differential (D), controlled quentity controlled variable is constituted by linear combination, so referred to as
PID controller.Simulation control of PID rule in continuous control system is：On
Facial middle u (t) is the output of controller, and e (t) is the deviation of system specified rate and output, KPIt is proportionality coefficient, TIIt is integration
Time constant, TDIt is derivative time constant.Its respective transfer functions is：
The effect of proportional controller, integral controller and differential regulator
(1) proportional controller：Proportional controller is immediate reaction to deviation, once occurring, actuator is produced deviation immediately
Raw control action, makes output towards the direction change for reducing deviation, and the power of control action depends on Proportional coefficient KP.Ratio
Actuator is although simple and quick, but the control object for system response for finite value has static difference.Increase Proportional coefficient KPCan
To reduce static difference, but, KPWhen excessive, the dynamic mass of system can be made to degenerate, cause output to vibrate, even result in closed loop system
System is unstable.
(2) proportional and integral controller：In order to eliminate the remaining static difference in proportion adjustment, can be on the basis of proportion adjustment
Add integral adjustment.Integral adjustment has accumulation composition, as long as deviation e is not zero, it will affect controlled quentity controlled variable by cumulative function
U, so as to reduce deviation, until deviation is zero.If integration time constant TIGreatly, integral action is weak, otherwise is strong.Increase TIWill
Slow down the process for eliminating static difference, but overshoot can be reduced, improve stability.The cost for introducing integration word section is the quick of reduction system
Property.
(3) proportional integral derivative controller：In order to accelerate control process, it is necessary in the moment that deviation occurs or changes,
It is controlled by the trend of change of error, deviation is eliminated in bud, here it is the principle that differential is adjusted.The differential action
Addition will be helpful to reduce overshoot, overcomes vibration, makes system tend towards stability.
As computer system is a kind of sampled-data control system, controlled quentity controlled variable can only be calculated according to the deviation of sampling instant,
Therefore, numerical integration is carried out using boundary rectangle method, single order backward difference carries out numerical differentiation, when the sampling period being T,Meddlesome,
If the sampling period is sufficiently small, this discrete approximation is quite accurate.U in above formulaiExport for full dose, it corresponds to quilt
The position that the actuator i ＆ lt sampling instant of control object should reach, therefore, i above formulas are referred to as PID position types control formula.
As can be seen that when pressing above formula calculating, output valve is relevant with past all states.When actuator needs is not controlled quentity controlled variable
Absolute figure, but during its increment, equation below can be derived：
Above formula is referred to as incremental PID control formula.
Incremental control formula has advantages below：
(1) computer output control increment, the i.e. changing unit of actuator position, thus misoperation affects little.
(2) in the output u at i momenti, need to only use the deviation at this moment, and previous moment, the deviation at front two moment
ei-1、ei-2, and previous output valve ui-1, this greatlys save internal memory and calculating time.
(3) when manauto switching is carried out, control stroke is little, being capable of smootherly transition；The calculating of control process
It is confidential to seek very strong real-time, during with microcomputer as digitial controller, due to the restriction of word length and arithmetic speed, must
Calculating speed must be accelerated using necessary method.
Control is calculated by PID, then is adjusted by PWM, output duty cycle.Temperature curve target temperature after control
180 degree corresponding data point, as shown in Figure 9.
Figure 11 shows that concrete software realizes step：
Step 1：Code starts
Step 2：Initialization MCU, AD, I/O port state, intervalometer etc..
Step 3：Can be with target setting temperature T by key user
Step 4：It is compared with temperature T0 for feeding back by my temperature T that user sets, calculation error value, so as to
Adjust output.If more than design temperature, step 5 stops output, and otherwise step 6 is calculated to open according to PID and opens PWM value.
Step 5：Go to monitor the temperature (for example, monitoring once for 10 milliseconds) of heater with certain period frequency, according to electricity
Road understands that feedback device is connected in the middle of circuit, and monitoring AD needs ceaselessly to power, but the body temperature that generates heat can be caused after power supply
Degree is raised, and measurement is inaccurate, therefore when needing, is opened metal-oxide-semiconductor Q2 and powered, and first backs up the output valve in PWM, carry out before opening
Thermometric, closes Q2 immediately after thermometric, PWM output valves are reduced after closing.This situation testing time is short, probably needs 30 microseconds one
Secondary thermometric, does not affect the temperature parameter of calandria but has accurately measure very much temperature.Calculating measures the temperature output for coming to step
7OLED is also fed back to step 4 by step 8 while display, carries out the regulation output of next step.
Presently preferred embodiments of the present invention is the foregoing is only, not to limit the present invention, all essences in the present invention
Any modification, equivalent and improvement made within god and principle etc., should be included within the scope of the present invention.
Claims (9)
1. a kind of temperature control system of electronic cigarette heater, it is characterised in that the temperature control system includes central processing unit
MCU, display module, power management module, power supply module, cell anti-reverse connection module, detecting voltage module, heating module,
Heating detecting AD feedback modules and keyboard input module, the outfan of the heating detecting AD feedback modules connect the centre
The input of reason device MCU, the outfan of the central processor MCU connect the input of the heating module, the centre
The outfan of reason device MCU connects the input of the display module, and the outfan of the keyboard input module connects the central authorities
The input of processor MCU, the power supply module are electrically connected with the power management module, and the power management module connects
The central processor MCU two-way communication is connect, the outfan of the detecting voltage module connects the defeated of the central processor MCU
Enter end, the input of the detecting voltage module connects the outfan of the power supply module, the cell anti-reverse connection module
Input connect the power supply module, the outfan of the cell anti-reverse connection module connects the central processor MCU
Input, the power supply module is electrically connected with the display module and central processor MCU；
The power management module includes electric capacity C20, resistance R12, chip U5, resistance R15, electric capacity C19 and binding post P4, institute
The 1st foot for stating binding post P4 connects the positive pole of electric capacity C19, VCC, CE foot of chip U 5 respectively, and the of the chip U5
CHRG feet connect one end of resistance R11, resistance R12 ground connection described in the PROG foot Jing of the chip U5, and the of the chip U5
BAT feet connect the positive pole of the electric capacity C20, and the negative pole of the electric capacity C20 connects TEMP feet and the ground connection of the chip U5, institute
State GND, STDBY foot of chip U5, the negative pole of electric capacity C19, the 4th of binding post P4 the, 5 feet are grounded.
2. temperature control system according to claim 1, it is characterised in that the cell anti-reverse connection module includes resistance
R14, resistance R13, metal-oxide-semiconductor Q3, metal-oxide-semiconductor Q4 and binding post P5, the grid of the metal-oxide-semiconductor Q4 connect the one of the resistance R14
End, the drain electrode of the metal-oxide-semiconductor Q4 connect the drain electrode of metal-oxide-semiconductor Q3 and the 2nd foot of binding post P5, the grid of the metal-oxide-semiconductor Q3 respectively
Pole connects one end of resistance R13, the 1st foot point of the other end, the other end of resistance R14 and binding post P5 of the resistance R13
Do not connect the BAT feet of the chip U5, the source ground of the metal-oxide-semiconductor.
3. temperature control system according to claim 2, it is characterised in that the power supply module is included to show mould
The first power supply unit and the second power supply unit powered for central processing unit that block is powered, first power supply unit and described
The structure of two power supply units is identical, and first power supply unit includes electric capacity C7, electric capacity C8, chip U2, electric capacity C9, electric capacity C10
And the Vin feet of inductance L1, the chip U2 connect one end of the positive pole and electric capacity C8 of the electric capacity C7 respectively, the chip U2's
Vout feet connect one end of one end, the positive pole of electric capacity C10 and inductance L of the electric capacity C9, the negative pole of the electric capacity C7, electricity respectively
Hold the other end of C8, the negative pole of the GND feet, one end of electric capacity C9 and electric capacity C10 of chip U2 to be grounded；Second power supply unit includes
Electric capacity C11, electric capacity C12, chip U3, electric capacity C13, electric capacity C14 and inductance L2, the Vin feet of the chip U3 connect described respectively
One end of the positive pole and electric capacity C12 of electric capacity C11, the Vout feet of the chip U3 connect one end of the electric capacity C13, electric capacity respectively
One end of the positive pole and inductance L of C14, the negative pole of the electric capacity C11, the other end of electric capacity C12, the GND feet of chip U3, electric capacity
One end of C13 and the negative pole of electric capacity C14 are grounded.
4. temperature control system according to claim 3, it is characterised in that the display module includes chip U1, electric capacity
C1, electric capacity C2, electric capacity C3, electric capacity C4, electric capacity C5, electric capacity C6 and resistance R1, electric capacity C6 described in the Vpp foot Jing of the chip U1
Ground connection, electric capacity C5 ground connection described in the VCOMH foot Jing of the chip U1, resistance R1 described in the IREF foot Jing of the chip U1 connect
Ground, electric capacity C3 ground connection described in the VDD1 foot Jing of the chip U1, described in the VDD2 foot Jing of chip U1, electric capacity C4 ground connection, described
The electric capacity C2 is connected the C2p feet of chip U1 the C2N feet of the chip U1, and the C1N feet of the chip U1 will be described
Electric capacity C1 connects the C1p feet of the chip U1, and VSS, IM1, IM2, WRB, RDB, D2-D7 foot of the chip U1 connects
Ground.
5. temperature control system according to claim 4, it is characterised in that the central processor MCU include chip U4,
Electric capacity C15, electric capacity C16, switch SW1 and switch SW2, described in Jing, electric capacity C15 connects VDD, VDD foot of the chip U4 respectively
Ground, electric capacity C16 described in the VDD1 foot Jing of the chip U4 are grounded, and open described in the EICK/P1.0 feet connection of the chip U4
Close one end of SW1, the EIDA/P1.0 feet of the chip U4 connect one end of the switch SW2, the of the chip U4
VSS1VSS feet are grounded.
6. temperature control system according to claim 5, it is characterised in that the heating detecting AD feedback modules include electricity
Resistance R10, audion Q1, resistance R9, metal-oxide-semiconductor Q2, resistance R7, resistance R8 binding posts P3 and electric capacity C18, the resistance R10's
One end connects the base stage of the audion Q1, and the colelctor electrode of the audion Q1 connects the grid and electricity of the metal-oxide-semiconductor Q2 respectively
One end of resistance R 9, the 1st foot of the drain electrode connection binding post P3 of the metal-oxide-semiconductor Q2, the 2nd foot difference of the binding post P3
One end of resistance R7 and one end of resistance R8, the other end Jing electric capacity C18 ground connection of the resistance R8, the other end of the resistance R7
And the emitter stage of audion Q1 is grounded.
7. temperature control system according to claim 6, it is characterised in that the heating module includes resistance Rt.
8. temperature control system according to claim 7, it is characterised in that the keyboard input module include resistance R2,
Resistance R3, resistance R4, button S1, button S2 and button S3, one end of the resistance R2 connect one end of the button S1, described
One end of resistance R3 connects one end of the button S2, and one end of the resistance R4 connects one end of the button S3, described to press
The other end of the other end, the other end of button S2 and button S3 of key S1 is grounded.
9. temperature control system according to claim 8, it is characterised in that the detecting voltage module include resistance R5,
One end of resistance R6 and electric capacity C17, the resistance R5 connects one end of the resistance R6 and one end of electric capacity C17 respectively, described
The other end of the other end and electric capacity C17 of resistance R6 is grounded.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510331222.6A CN104902595B (en) | 2015-06-15 | 2015-06-15 | Temperature control system for electronic cigarette heat-generating body |
| PCT/CN2015/096043 WO2016201911A1 (en) | 2015-06-15 | 2015-11-30 | Temperature control system for electronic cigarette heating member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510331222.6A CN104902595B (en) | 2015-06-15 | 2015-06-15 | Temperature control system for electronic cigarette heat-generating body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104902595A CN104902595A (en) | 2015-09-09 |
| CN104902595B true CN104902595B (en) | 2017-05-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510331222.6A Active CN104902595B (en) | 2015-06-15 | 2015-06-15 | Temperature control system for electronic cigarette heat-generating body |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104902595B (en) |
| WO (1) | WO2016201911A1 (en) |
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| CN104902595A (en) | 2015-09-09 |
| WO2016201911A1 (en) | 2016-12-22 |
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