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CA2560701A1 - Feuille legere obtenue par depot en continu de rouleau a rouleau et dispositifs de circuit a semi-conducteurs encapsules - Google Patents

Feuille legere obtenue par depot en continu de rouleau a rouleau et dispositifs de circuit a semi-conducteurs encapsules Download PDF

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Publication number
CA2560701A1
CA2560701A1 CA002560701A CA2560701A CA2560701A1 CA 2560701 A1 CA2560701 A1 CA 2560701A1 CA 002560701 A CA002560701 A CA 002560701A CA 2560701 A CA2560701 A CA 2560701A CA 2560701 A1 CA2560701 A1 CA 2560701A1
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CA
Canada
Prior art keywords
light
substrate
adhesive
light active
semiconductor elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002560701A
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English (en)
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CA2560701C (fr
Inventor
John J. Daniels
Gregory V. Nelson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Grote Industries LLC
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Individual
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Filing date
Publication date
Priority claimed from US10/919,830 external-priority patent/US7052924B2/en
Priority claimed from US10/920,010 external-priority patent/US7217956B2/en
Priority claimed from US10/919,915 external-priority patent/US7294961B2/en
Priority claimed from US11/029,137 external-priority patent/US7427782B2/en
Priority claimed from US11/029,129 external-priority patent/US7259030B2/en
Application filed by Individual filed Critical Individual
Publication of CA2560701A1 publication Critical patent/CA2560701A1/fr
Application granted granted Critical
Publication of CA2560701C publication Critical patent/CA2560701C/fr
Anticipated expiration legal-status Critical
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • B32B2037/1215—Hot-melt adhesive
    • B32B2037/1223—Hot-melt adhesive film-shaped
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B2038/1891—Using a robot for handling the layers
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    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/34—Inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B37/20—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
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US10/920,010 US7217956B2 (en) 2004-03-29 2004-08-17 Light active sheet material
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US11/029,129 2005-01-04
US11/029,137 US7427782B2 (en) 2004-03-29 2005-01-04 Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
US11/029,137 2005-01-04
US11/029,129 US7259030B2 (en) 2004-03-29 2005-01-04 Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
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Families Citing this family (149)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070090387A1 (en) * 2004-03-29 2007-04-26 Articulated Technologies, Llc Solid state light sheet and encapsulated bare die semiconductor circuits
US7858994B2 (en) 2006-06-16 2010-12-28 Articulated Technologies, Llc Solid state light sheet and bare die semiconductor circuits with series connected bare die circuit elements
CN102097458B (zh) 2004-06-04 2013-10-30 伊利诺伊大学评议会 用于制造并组装可印刷半导体元件的方法和设备
DE102005055293A1 (de) 2005-08-05 2007-02-15 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung von Halbleiterchips und Dünnfilm-Halbleiterchip
FR2892594B1 (fr) * 2005-10-21 2007-12-07 Saint Gobain Structure lumineuse comportant au moins une diode electroluminescente, sa fabrication et ses applications
US8173519B2 (en) * 2006-03-03 2012-05-08 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
DE202006007482U1 (de) * 2006-05-10 2006-07-20 Sentner, Thomas Leuchtmöbel
DE102007004303A1 (de) 2006-08-04 2008-02-07 Osram Opto Semiconductors Gmbh Dünnfilm-Halbleiterbauelement und Bauelement-Verbund
US8017220B2 (en) * 2006-10-04 2011-09-13 Corning Incorporated Electronic device and method of making
JP2008141026A (ja) * 2006-12-04 2008-06-19 Sony Corp 電子機器及びその製造方法、並びに、発光ダイオード表示装置及びその製造方法
KR101610885B1 (ko) 2007-01-17 2016-04-08 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 프린팅­기반 어셈블리에 의해 제조되는 광학 시스템
EP1947693B1 (fr) 2007-01-18 2015-03-25 Polytron Technologies, Inc. Structure plate d'appareil d'éclairage à diodes électroluminescentes
TWI440210B (zh) 2007-01-22 2014-06-01 克里公司 使用發光裝置外部互連陣列之照明裝置及其製造方法
DE102007004304A1 (de) 2007-01-29 2008-07-31 Osram Opto Semiconductors Gmbh Dünnfilm-Leuchtdioden-Chip und Verfahren zur Herstellung eines Dünnfilm-Leuchtdioden-Chips
EP1953837A3 (fr) * 2007-01-31 2014-01-15 OSRAM Opto Semiconductors GmbH Composant semi-conducteur doté d'une couche active optique, agencement doté d'une pluralité de couches optiques actives et procédé de fabrication d'un composant semi-conducteur
DE102007008524A1 (de) 2007-02-21 2008-08-28 Osram Opto Semiconductors Gmbh Strahlung emittierender Chip mit mindestens einem Halbleiterkörper
JP5162979B2 (ja) * 2007-06-28 2013-03-13 日亜化学工業株式会社 発光装置
DE102007041896A1 (de) * 2007-09-04 2009-03-05 Osram Opto Semiconductors Gmbh Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements
EP2058582B1 (fr) * 2007-11-12 2015-04-22 Siteco Beleuchtungstechnik GmbH Lampe à DEL
DE102008030815A1 (de) 2008-06-30 2009-12-31 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Vielzahl von optoelektronischen Bauelementen
WO2010042653A1 (fr) 2008-10-07 2010-04-15 Mc10, Inc. Ballonnet de cathéter comportant un circuit intégré étirable et un réseau de détecteurs
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
DE102009007430A1 (de) 2009-02-04 2010-08-12 Osram Gesellschaft mit beschränkter Haftung Leuchtmodul
US8865489B2 (en) 2009-05-12 2014-10-21 The Board Of Trustees Of The University Of Illinois Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
GB2472047B (en) * 2009-07-22 2011-08-10 Novalia Ltd Packaging or mounting a component
JP4914929B2 (ja) * 2009-10-15 2012-04-11 シャープ株式会社 発光装置およびその製造方法
US8872214B2 (en) 2009-10-19 2014-10-28 Sharp Kabushiki Kaisha Rod-like light-emitting device, method of manufacturing rod-like light-emitting device, backlight, illuminating device, and display device
JP2011096901A (ja) * 2009-10-30 2011-05-12 Kitagawa Ind Co Ltd フレキシブルｌｅｄモジュール及び単体ｌｅｄモジュール
US9936574B2 (en) 2009-12-16 2018-04-03 The Board Of Trustees Of The University Of Illinois Waterproof stretchable optoelectronics
JP5670051B2 (ja) * 2009-12-25 2015-02-18 日亜化学工業株式会社 半導体発光装置及びその製造方法
DE102010018260A1 (de) 2010-01-29 2011-08-04 OSRAM Opto Semiconductors GmbH, 93055 Beleuchtungsvorrichtung
KR101159782B1 (ko) 2010-02-05 2012-06-26 신왕균 투명 엘이디 웨이퍼 모듈 및 그 제조방법
JP5751728B2 (ja) 2010-03-17 2015-07-22 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ 生体吸収性基板上の埋め込み型バイオメディカルデバイス
US8198109B2 (en) 2010-08-27 2012-06-12 Quarkstar Llc Manufacturing methods for solid state light sheet or strip with LEDs connected in series for general illumination
US8461602B2 (en) 2010-08-27 2013-06-11 Quarkstar Llc Solid state light sheet using thin LEDs for general illumination
US8210716B2 (en) 2010-08-27 2012-07-03 Quarkstar Llc Solid state bidirectional light sheet for general illumination
US8338199B2 (en) 2010-08-27 2012-12-25 Quarkstar Llc Solid state light sheet for general illumination
KR101172315B1 (ko) * 2010-10-11 2012-08-14 한국철강 주식회사 광기전력 모듈 및 그 제조 방법
US8192051B2 (en) 2010-11-01 2012-06-05 Quarkstar Llc Bidirectional LED light sheet
US8455895B2 (en) * 2010-11-08 2013-06-04 Bridgelux, Inc. LED-based light source utilizing asymmetric conductors
US9442285B2 (en) 2011-01-14 2016-09-13 The Board Of Trustees Of The University Of Illinois Optical component array having adjustable curvature
US8410726B2 (en) 2011-02-22 2013-04-02 Quarkstar Llc Solid state lamp using modular light emitting elements
US8314566B2 (en) 2011-02-22 2012-11-20 Quarkstar Llc Solid state lamp using light emitting strips
WO2012158709A1 (fr) 2011-05-16 2012-11-22 The Board Of Trustees Of The University Of Illinois Barrettes de del à gestion thermique assemblées par impression
JP2014523633A (ja) 2011-05-27 2014-09-11 エムシー１０ インコーポレイテッド 電子的、光学的、且つ／又は機械的装置及びシステム並びにこれらの装置及びシステムを製造する方法
JP6164656B2 (ja) * 2011-06-10 2017-07-19 フィリップス ライティング ホールディング ビー ヴィ 光出力装置及び製造の方法
EP2742283B1 (fr) 2011-08-10 2018-09-12 Philips Lighting Holding B.V. Dispositif d'eclairage retractable
US9066443B2 (en) 2011-09-13 2015-06-23 General Electric Company Overlay circuit structure for interconnecting light emitting semiconductors
US9620478B2 (en) 2011-11-18 2017-04-11 Apple Inc. Method of fabricating a micro device transfer head
US8573469B2 (en) 2011-11-18 2013-11-05 LuxVue Technology Corporation Method of forming a micro LED structure and array of micro LED structures with an electrically insulating layer
US8349116B1 (en) * 2011-11-18 2013-01-08 LuxVue Technology Corporation Micro device transfer head heater assembly and method of transferring a micro device
US8426227B1 (en) 2011-11-18 2013-04-23 LuxVue Technology Corporation Method of forming a micro light emitting diode array
US8518204B2 (en) 2011-11-18 2013-08-27 LuxVue Technology Corporation Method of fabricating and transferring a micro device and an array of micro devices utilizing an intermediate electrically conductive bonding layer
US8912020B2 (en) * 2011-11-23 2014-12-16 International Business Machines Corporation Integrating active matrix inorganic light emitting diodes for display devices
EP2786644B1 (fr) 2011-12-01 2019-04-10 The Board of Trustees of the University of Illionis Dispositifs transitoires conçus pour subir des transformations programmables
EP2788676B1 (fr) * 2011-12-05 2016-06-08 Koninklijke Philips N.V. Système d'éclairage
MX2014008948A (es) * 2012-02-02 2014-10-24 Procter & Gamble Laminado que emite luz y metodo para fabricarlo.
US9773750B2 (en) * 2012-02-09 2017-09-26 Apple Inc. Method of transferring and bonding an array of micro devices
US9548332B2 (en) 2012-04-27 2017-01-17 Apple Inc. Method of forming a micro LED device with self-aligned metallization stack
US9105492B2 (en) 2012-05-08 2015-08-11 LuxVue Technology Corporation Compliant micro device transfer head
US8415768B1 (en) 2012-07-06 2013-04-09 LuxVue Technology Corporation Compliant monopolar micro device transfer head with silicon electrode
KR101922118B1 (ko) * 2012-08-27 2018-11-26 삼성전자주식회사 플렉서블 반도체소자 및 그 제조방법
US9506633B2 (en) 2012-09-06 2016-11-29 Cooledge Lighting Inc. Sealed and sealable lighting systems incorporating flexible light sheets and related methods
US8791530B2 (en) 2012-09-06 2014-07-29 LuxVue Technology Corporation Compliant micro device transfer head with integrated electrode leads
US9162880B2 (en) 2012-09-07 2015-10-20 LuxVue Technology Corporation Mass transfer tool
US9449948B2 (en) 2012-09-23 2016-09-20 Tohoku University Chip support substrate, chip support method, three-dimensional integrated circuit, assembly device, and fabrication method of three-dimensional integrated circuit
US20150249069A1 (en) * 2012-09-25 2015-09-03 Sharp Kabushiki Kaisha Display device and method for manufacturing display device
JP6030905B2 (ja) * 2012-09-28 2016-11-24 ゼネラル・エレクトリック・カンパニイ 発光半導体を相互接続するためのオーバーレイ回路構造
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
US9558721B2 (en) 2012-10-15 2017-01-31 Apple Inc. Content-based adaptive refresh schemes for low-power displays
US9236815B2 (en) 2012-12-10 2016-01-12 LuxVue Technology Corporation Compliant micro device transfer head array with metal electrodes
CN103000780B (zh) * 2012-12-14 2015-08-05 京东方科技集团股份有限公司 一种led芯片封装结构及制作方法、显示装置
JP6402625B2 (ja) * 2013-03-28 2018-10-10 三菱ケミカル株式会社 光学フィルムの製造方法、光学フィルム、面発光体及び光学フィルムの製造装置
EP3300108B1 (fr) 2013-03-28 2019-07-24 Toshiba Hokuto Electronics Corporation Dispositif électroluminescent et son procédé de fabrication
CN108922959B (zh) 2013-03-28 2022-07-29 日亚化学工业株式会社 发光装置、及使用发光装置的装置
US8975121B2 (en) * 2013-05-09 2015-03-10 Johnson & Johnson Vision Care, Inc. Methods and apparatus to form thin film nanocrystal integrated circuits on ophthalmic devices
US9484504B2 (en) 2013-05-14 2016-11-01 Apple Inc. Micro LED with wavelength conversion layer
US9217541B2 (en) 2013-05-14 2015-12-22 LuxVue Technology Corporation Stabilization structure including shear release posts
US9136161B2 (en) 2013-06-04 2015-09-15 LuxVue Technology Corporation Micro pick up array with compliant contact
CN105683872B (zh) 2013-06-12 2020-05-12 罗茵尼公司 安置有光产生源的键盘背后照明
WO2014200846A1 (fr) 2013-06-12 2014-12-18 Cooledge Lighting Inc. Systèmes d'éclairage portables incorporant des feuilles de lumière déformables
US8987765B2 (en) 2013-06-17 2015-03-24 LuxVue Technology Corporation Reflective bank structure and method for integrating a light emitting device
US9111464B2 (en) 2013-06-18 2015-08-18 LuxVue Technology Corporation LED display with wavelength conversion layer
US8928021B1 (en) 2013-06-18 2015-01-06 LuxVue Technology Corporation LED light pipe
US9035279B2 (en) 2013-07-08 2015-05-19 LuxVue Technology Corporation Micro device with stabilization post
US9296111B2 (en) 2013-07-22 2016-03-29 LuxVue Technology Corporation Micro pick up array alignment encoder
US9087764B2 (en) 2013-07-26 2015-07-21 LuxVue Technology Corporation Adhesive wafer bonding with controlled thickness variation
JP5961148B2 (ja) * 2013-08-02 2016-08-02 富士フイルム株式会社 発光装置の製造方法
US9153548B2 (en) 2013-09-16 2015-10-06 Lux Vue Technology Corporation Adhesive wafer bonding with sacrificial spacers for controlled thickness variation
JP6496664B2 (ja) 2013-11-07 2019-04-03 東芝ホクト電子株式会社 発光装置
JP6431485B2 (ja) 2013-12-02 2018-11-28 東芝ホクト電子株式会社 発光装置
US9367094B2 (en) 2013-12-17 2016-06-14 Apple Inc. Display module and system applications
US9768345B2 (en) 2013-12-20 2017-09-19 Apple Inc. LED with current injection confinement trench
US9583466B2 (en) 2013-12-27 2017-02-28 Apple Inc. Etch removal of current distribution layer for LED current confinement
US9450147B2 (en) 2013-12-27 2016-09-20 Apple Inc. LED with internally confined current injection area
US9542638B2 (en) 2014-02-18 2017-01-10 Apple Inc. RFID tag and micro chip integration design
US9583533B2 (en) 2014-03-13 2017-02-28 Apple Inc. LED device with embedded nanowire LEDs
JP2015185762A (ja) * 2014-03-25 2015-10-22 スタンレー電気株式会社 半導体発光装置の製造方法及び製造装置
JPWO2015146115A1 (ja) 2014-03-25 2017-04-13 東芝ホクト電子株式会社 発光装置
US9522468B2 (en) 2014-05-08 2016-12-20 Apple Inc. Mass transfer tool manipulator assembly with remote center of compliance
US9318475B2 (en) 2014-05-15 2016-04-19 LuxVue Technology Corporation Flexible display and method of formation with sacrificial release layer
US9741286B2 (en) 2014-06-03 2017-08-22 Apple Inc. Interactive display panel with emitting and sensing diodes
US9624100B2 (en) 2014-06-12 2017-04-18 Apple Inc. Micro pick up array pivot mount with integrated strain sensing elements
US9425151B2 (en) 2014-06-17 2016-08-23 Apple Inc. Compliant electrostatic transfer head with spring support layer
US9570002B2 (en) 2014-06-17 2017-02-14 Apple Inc. Interactive display panel with IR diodes
CN106030839B (zh) 2014-09-26 2018-09-28 东芝北斗电子株式会社 发光模块
WO2016047133A1 (fr) 2014-09-26 2016-03-31 東芝ホクト電子株式会社 Module d'émission de lumière
US9705432B2 (en) 2014-09-30 2017-07-11 Apple Inc. Micro pick up array pivot mount design for strain amplification
US9828244B2 (en) 2014-09-30 2017-11-28 Apple Inc. Compliant electrostatic transfer head with defined cavity
US9478583B2 (en) 2014-12-08 2016-10-25 Apple Inc. Wearable display having an array of LEDs on a conformable silicon substrate
DE102015103141A1 (de) 2015-03-04 2016-09-08 Thyssenkrupp Ag Verfahren zum Herstellen eines Metallverbundwerkstoffs mit eingebetteter funktionaler Struktur und entsprechender Metallverbundwerkstoff
CN104865625B (zh) * 2015-04-23 2017-03-22 成都中节能反光材料有限公司 一种导静电反光布及其制作方法
CN111028715A (zh) 2015-07-23 2020-04-17 首尔半导体株式会社 显示装置
US10158051B2 (en) * 2015-08-18 2018-12-18 Jiangsu Cherity Optronics Co., Ltd. Process method for refining photoconverter to bond-package LED and refinement equipment system
JP6731005B2 (ja) * 2015-08-18 2020-07-29 ジアンスー チェリティ オプトロニクス カンパニー リミテッドＪｉａｎｇｓｕ Ｃｈｅｒｒｉｔｙ Ｏｐｔｒｏｎｉｃｓ Ｃｏ．， Ｌｔｄ． ローリングによって熱可塑性樹脂光変換体でｌｅｄを貼り合せてパッケージする設備システム
JP6055054B1 (ja) * 2015-09-09 2016-12-27 奥本　健二 発光デバイスおよびその製造方法
US10925543B2 (en) 2015-11-11 2021-02-23 The Board Of Trustees Of The University Of Illinois Bioresorbable silicon electronics for transient implants
KR102546307B1 (ko) 2015-12-02 2023-06-21 삼성전자주식회사 발광 소자 및 이를 포함하는 표시 장치
JP6709046B2 (ja) * 2015-12-21 2020-06-10 スタンレー電気株式会社 半導体発光装置、及び半導体発光装置の製造方法
JP2017116885A (ja) * 2015-12-25 2017-06-29 大日本印刷株式会社 Ｌｅｄ表示装置
WO2017124109A1 (fr) 2016-01-15 2017-07-20 Rohinni, LLC Appareil et procédé de rétroéclairage à travers un couvercle sur l'appareil
US10193031B2 (en) * 2016-03-11 2019-01-29 Rohinni, LLC Method for applying phosphor to light emitting diodes and apparatus thereof
KR102417917B1 (ko) 2016-04-26 2022-07-07 삼성전자주식회사 공정 시스템 및 그 동작 방법
JP2018010169A (ja) * 2016-07-13 2018-01-18 大日本印刷株式会社 Ｌｅｄ表示装置
KR20180023881A (ko) * 2016-08-26 2018-03-07 김영범 시트 조명 및 이의 제조방법
JP6149247B1 (ja) * 2016-11-21 2017-06-21 株式会社奥本研究所 発光デバイスおよびその製造方法
DE102017101966A1 (de) 2017-02-01 2018-08-02 Osram Opto Semiconductors Gmbh Verfahren zum Transfer zumindest eines Halbleiterchips auf einen Zielträger
CN107039604B (zh) * 2017-04-18 2018-09-04 武汉华星光电技术有限公司 柔性显示面板贴附装置及其贴附方法
US10604843B2 (en) * 2017-05-10 2020-03-31 Xerox Corporation High registration particles-transferring system
FR3068819B1 (fr) * 2017-07-04 2019-11-08 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif d'affichage a leds
GB2566029B (en) * 2017-08-30 2022-11-02 Pragmatic Printing Ltd Methods and apparatus for manufacturing a plurality of electronic circuits
FR3070793B1 (fr) * 2017-09-05 2022-07-22 Commissariat Energie Atomique Procede de fabrication d'un dispositif d'affichage emissif a led
KR102486671B1 (ko) * 2017-12-21 2023-01-11 주식회사 루멘스 트랜스퍼 프린팅을 이용한 엘이디 모듈 제조방법
KR102167805B1 (ko) * 2018-04-26 2020-10-19 장성민 Led 칩의 전사방법
KR102417280B1 (ko) * 2018-07-25 2022-07-06 주식회사 제이마이크로 투명 발광 디스플레이 필름, 이의 제조 방법, 및 이를 사용한 투명 발광 사이니지
JP2020025064A (ja) * 2018-07-31 2020-02-13 アルディーテック株式会社 発光素子集積装置の製造方法および発光素子配列装置
WO2020155162A1 (fr) * 2019-02-02 2020-08-06 厦门三安光电有限公司 Écran d'affichage à del à puce retournée et son procédé de fabrication
JP6694222B1 (ja) * 2019-03-18 2020-05-13 アルディーテック株式会社 半導体チップ集積装置の製造方法、半導体チップ集積装置、半導体チップインクおよび半導体チップインク吐出装置
EP3742477A1 (fr) * 2019-05-21 2020-11-25 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Transfert sélectif de composants induit par la lumière à l'aide d'un jet d'adhésif fondu
US11444065B2 (en) 2019-05-30 2022-09-13 Nanosys, Inc. Light emitting diode device containing a positive photoresist insulating spacer and a conductive sidewall contact and method of making the same
KR102162550B1 (ko) * 2019-07-12 2020-10-08 울산과학기술원 무-유기 하이브리드 태양전지 제조방법 및 제조장치
US11164851B2 (en) 2019-07-17 2021-11-02 Nthdegree Technologies Worldwide, Inc. Three-layer color display using active LED dies
JP7388902B2 (ja) * 2019-12-10 2023-11-29 株式会社ジャパンディスプレイ 表示装置
CN113451486A (zh) * 2020-03-27 2021-09-28 京东方科技集团股份有限公司 显示基板及其制备方法、显示装置
TWI718923B (zh) * 2020-04-08 2021-02-11 台灣愛司帝科技股份有限公司 發光二極體晶片結構以及晶片移轉系統與方法
EP3958308A1 (fr) 2020-08-19 2022-02-23 Lumileds LLC Alignement d'élément d'éclairage
JP7575332B2 (ja) * 2021-03-30 2024-10-29 東レエンジニアリング株式会社 転写装置
CN114613893A (zh) * 2022-02-25 2022-06-10 Tcl华星光电技术有限公司 一种显示面板制造方法及装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4335501A (en) 1979-10-31 1982-06-22 The General Electric Company Limited Manufacture of monolithic LED arrays for electroluminescent display devices
US4495514A (en) 1981-03-02 1985-01-22 Eastman Kodak Company Transparent electrode light emitting diode and method of manufacture
JP2515820B2 (ja) * 1987-09-18 1996-07-10 株式会社日立製作所 ペ―ジ替え装置
EP0551377B1 (fr) 1990-10-01 1995-05-03 United Solar Systems Corporation Procede pour stratifier des structures composites pour dispositifs photovoltaiques
US5273608A (en) * 1990-11-29 1993-12-28 United Solar Systems Corporation Method of encapsulating a photovoltaic device
JPH08102360A (ja) * 1994-09-29 1996-04-16 Toyota Central Res & Dev Lab Inc 有機無機複合薄膜型電界発光素子
US5925897A (en) 1997-02-14 1999-07-20 Oberman; David B. Optoelectronic semiconductor diodes and devices comprising same
US20050045851A1 (en) * 2003-08-15 2005-03-03 Konarka Technologies, Inc. Polymer catalyst for photovoltaic cell
US20020096254A1 (en) * 2001-01-22 2002-07-25 Michael Kober Optical device module and method of fabrication
AU2002259077A1 (en) * 2001-04-30 2002-11-11 Lumimove, Inc. Electroluminescent devices fabricated with encapsulated light emitting polymer particles
JP2003030614A (ja) * 2001-07-11 2003-01-31 Toppan Printing Co Ltd 非接触方式ｉｃチップの装着方法と該装着方法を用いて作製したｉｃチップを装着した包装材料
TW543128B (en) * 2001-07-12 2003-07-21 Highlink Technology Corp Surface mounted and flip chip type LED package
JP2003077940A (ja) 2001-09-06 2003-03-14 Sony Corp 素子の転写方法及びこれを用いた素子の配列方法、画像表示装置の製造方法
US6787990B2 (en) * 2002-05-28 2004-09-07 Eastman Kodak Company OLED area illumination light source having flexible substrate on a support
GB0216787D0 (en) 2002-07-19 2002-08-28 Pilkington Plc Laminated glazing panel
US6762069B2 (en) * 2002-11-19 2004-07-13 United Epitaxy Company, Ltd. Method for manufacturing light-emitting element on non-transparent substrate
JP2004304161A (ja) 2003-03-14 2004-10-28 Sony Corp 発光素子、発光装置、画像表示装置、発光素子の製造方法及び画像表示装置の製造方法

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WO2005099310A2 (fr) 2005-10-20
EP1736035A2 (fr) 2006-12-27
MXPA06011114A (es) 2007-01-25
EP1736035A4 (fr) 2009-01-07
CA2560701C (fr) 2016-10-18
KR20070011419A (ko) 2007-01-24
AU2005232074A1 (en) 2005-10-20
WO2005099310A3 (fr) 2007-03-15
JP2007531321A (ja) 2007-11-01
KR100880812B1 (ko) 2009-01-30

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