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AU2005232074A1 - Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices - Google Patents

Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices Download PDF

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Publication number
AU2005232074A1
AU2005232074A1 AU2005232074A AU2005232074A AU2005232074A1 AU 2005232074 A1 AU2005232074 A1 AU 2005232074A1 AU 2005232074 A AU2005232074 A AU 2005232074A AU 2005232074 A AU2005232074 A AU 2005232074A AU 2005232074 A1 AU2005232074 A1 AU 2005232074A1
Authority
AU
Australia
Prior art keywords
light
adhesive
semiconductor elements
sheet
light active
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2005232074A
Other languages
English (en)
Inventor
John J. Daniels
Gregory V. Nelson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LumaChip Inc
Original Assignee
LumaChip Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/919,830 external-priority patent/US7052924B2/en
Priority claimed from US10/919,915 external-priority patent/US7294961B2/en
Priority claimed from US10/920,010 external-priority patent/US7217956B2/en
Priority claimed from US11/029,129 external-priority patent/US7259030B2/en
Priority claimed from US11/029,137 external-priority patent/US7427782B2/en
Application filed by LumaChip Inc filed Critical LumaChip Inc
Publication of AU2005232074A1 publication Critical patent/AU2005232074A1/en
Assigned to LumaChip, Inc. reassignment LumaChip, Inc. Request for Assignment Assignors: ARTICULATED TECHNOLOGIES, LLC
Abandoned legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93Batch processes
    • H01L24/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/96Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207Heat-activated adhesive
    • B32B2037/1215Hot-melt adhesive
    • B32B2037/1223Hot-melt adhesive film-shaped
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/18Handling of layers or the laminate
    • B32B2038/1891Using a robot for handling the layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00Condition, form or state of the layers or laminate
    • B32B2305/34Inserts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/20Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
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    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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    • H01L2224/23Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
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    • H01L2224/241Disposition
    • H01L2224/24135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Electroluminescent Light Sources (AREA)
AU2005232074A 2004-03-29 2005-03-26 Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices Abandoned AU2005232074A1 (en)

Applications Claiming Priority (13)

Application Number Priority Date Filing Date Title
US55695904P 2004-03-29 2004-03-29
US60/556,959 2004-03-29
US10/919,830 2004-08-17
US10/920,010 2004-08-17
US10/919,830 US7052924B2 (en) 2004-03-29 2004-08-17 Light active sheet and methods for making the same
US10/919,915 US7294961B2 (en) 2004-03-29 2004-08-17 Photo-radiation source provided with emissive particles dispersed in a charge-transport matrix
US10/920,010 US7217956B2 (en) 2004-03-29 2004-08-17 Light active sheet material
US10/919,915 2004-08-17
US11/029,129 US7259030B2 (en) 2004-03-29 2005-01-04 Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
US11/029,129 2005-01-04
US11/029,137 US7427782B2 (en) 2004-03-29 2005-01-04 Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
US11/029,137 2005-01-04
PCT/US2005/010051 WO2005099310A2 (fr) 2004-03-29 2005-03-26 Feuille legere obtenue par depot en continu de rouleau a rouleau et dispositifs de circuit a semi-conducteurs encapsules

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KR20070011419A (ko) 2007-01-24
WO2005099310A2 (fr) 2005-10-20
EP1736035A4 (fr) 2009-01-07
CA2560701A1 (fr) 2005-10-20
CA2560701C (fr) 2016-10-18
KR100880812B1 (ko) 2009-01-30
WO2005099310A3 (fr) 2007-03-15
JP2007531321A (ja) 2007-11-01
MXPA06011114A (es) 2007-01-25
EP1736035A2 (fr) 2006-12-27

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