AU2005232074A1 - Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices - Google Patents
Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices Download PDFInfo
- Publication number
- AU2005232074A1 AU2005232074A1 AU2005232074A AU2005232074A AU2005232074A1 AU 2005232074 A1 AU2005232074 A1 AU 2005232074A1 AU 2005232074 A AU2005232074 A AU 2005232074A AU 2005232074 A AU2005232074 A AU 2005232074A AU 2005232074 A1 AU2005232074 A1 AU 2005232074A1
- Authority
- AU
- Australia
- Prior art keywords
- light
- adhesive
- semiconductor elements
- sheet
- light active
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
- B32B2037/1215—Hot-melt adhesive
- B32B2037/1223—Hot-melt adhesive film-shaped
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B2038/1891—Using a robot for handling the layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/34—Inserts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/20—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
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- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
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- H01L2224/241—Disposition
- H01L2224/24135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/24137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (13)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US55695904P | 2004-03-29 | 2004-03-29 | |
| US60/556,959 | 2004-03-29 | ||
| US10/919,830 | 2004-08-17 | ||
| US10/920,010 | 2004-08-17 | ||
| US10/919,830 US7052924B2 (en) | 2004-03-29 | 2004-08-17 | Light active sheet and methods for making the same |
| US10/919,915 US7294961B2 (en) | 2004-03-29 | 2004-08-17 | Photo-radiation source provided with emissive particles dispersed in a charge-transport matrix |
| US10/920,010 US7217956B2 (en) | 2004-03-29 | 2004-08-17 | Light active sheet material |
| US10/919,915 | 2004-08-17 | ||
| US11/029,129 US7259030B2 (en) | 2004-03-29 | 2005-01-04 | Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices |
| US11/029,129 | 2005-01-04 | ||
| US11/029,137 US7427782B2 (en) | 2004-03-29 | 2005-01-04 | Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices |
| US11/029,137 | 2005-01-04 | ||
| PCT/US2005/010051 WO2005099310A2 (fr) | 2004-03-29 | 2005-03-26 | Feuille legere obtenue par depot en continu de rouleau a rouleau et dispositifs de circuit a semi-conducteurs encapsules |
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| AU2005232074A1 true AU2005232074A1 (en) | 2005-10-20 |
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| AU2005232074A Abandoned AU2005232074A1 (en) | 2004-03-29 | 2005-03-26 | Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices |
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| Country | Link |
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| EP (1) | EP1736035A4 (fr) |
| JP (1) | JP2007531321A (fr) |
| KR (1) | KR100880812B1 (fr) |
| AU (1) | AU2005232074A1 (fr) |
| CA (1) | CA2560701C (fr) |
| MX (1) | MXPA06011114A (fr) |
| WO (1) | WO2005099310A2 (fr) |
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| KR102162550B1 (ko) * | 2019-07-12 | 2020-10-08 | 울산과학기술원 | 무-유기 하이브리드 태양전지 제조방법 및 제조장치 |
| US11164851B2 (en) | 2019-07-17 | 2021-11-02 | Nthdegree Technologies Worldwide, Inc. | Three-layer color display using active LED dies |
| JP7388902B2 (ja) * | 2019-12-10 | 2023-11-29 | 株式会社ジャパンディスプレイ | 表示装置 |
| CN113451486A (zh) * | 2020-03-27 | 2021-09-28 | 京东方科技集团股份有限公司 | 显示基板及其制备方法、显示装置 |
| TWI718923B (zh) * | 2020-04-08 | 2021-02-11 | 台灣愛司帝科技股份有限公司 | 發光二極體晶片結構以及晶片移轉系統與方法 |
| EP3958308A1 (fr) | 2020-08-19 | 2022-02-23 | Lumileds LLC | Alignement d'élément d'éclairage |
| JP7575332B2 (ja) * | 2021-03-30 | 2024-10-29 | 東レエンジニアリング株式会社 | 転写装置 |
| CN114613893A (zh) * | 2022-02-25 | 2022-06-10 | Tcl华星光电技术有限公司 | 一种显示面板制造方法及装置 |
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| US4335501A (en) | 1979-10-31 | 1982-06-22 | The General Electric Company Limited | Manufacture of monolithic LED arrays for electroluminescent display devices |
| US4495514A (en) | 1981-03-02 | 1985-01-22 | Eastman Kodak Company | Transparent electrode light emitting diode and method of manufacture |
| JP2515820B2 (ja) * | 1987-09-18 | 1996-07-10 | 株式会社日立製作所 | ペ―ジ替え装置 |
| EP0551377B1 (fr) | 1990-10-01 | 1995-05-03 | United Solar Systems Corporation | Procede pour stratifier des structures composites pour dispositifs photovoltaiques |
| US5273608A (en) * | 1990-11-29 | 1993-12-28 | United Solar Systems Corporation | Method of encapsulating a photovoltaic device |
| JPH08102360A (ja) * | 1994-09-29 | 1996-04-16 | Toyota Central Res & Dev Lab Inc | 有機無機複合薄膜型電界発光素子 |
| US5925897A (en) | 1997-02-14 | 1999-07-20 | Oberman; David B. | Optoelectronic semiconductor diodes and devices comprising same |
| US20050045851A1 (en) * | 2003-08-15 | 2005-03-03 | Konarka Technologies, Inc. | Polymer catalyst for photovoltaic cell |
| AU2002253875A1 (en) * | 2001-01-22 | 2002-09-04 | Nanopierce Technologies, Inc. | Optical device module and method of fabrication |
| CA2473969A1 (fr) * | 2001-04-30 | 2002-11-07 | Lumimove, Inc. | Dispositifs electroluminescents fabriques a partir de particules polymeres photoemettrices encapsulees |
| JP2003030614A (ja) * | 2001-07-11 | 2003-01-31 | Toppan Printing Co Ltd | 非接触方式icチップの装着方法と該装着方法を用いて作製したicチップを装着した包装材料 |
| TW543128B (en) * | 2001-07-12 | 2003-07-21 | Highlink Technology Corp | Surface mounted and flip chip type LED package |
| JP2003077940A (ja) | 2001-09-06 | 2003-03-14 | Sony Corp | 素子の転写方法及びこれを用いた素子の配列方法、画像表示装置の製造方法 |
| US6787990B2 (en) * | 2002-05-28 | 2004-09-07 | Eastman Kodak Company | OLED area illumination light source having flexible substrate on a support |
| GB0216787D0 (en) | 2002-07-19 | 2002-08-28 | Pilkington Plc | Laminated glazing panel |
| US6762069B2 (en) * | 2002-11-19 | 2004-07-13 | United Epitaxy Company, Ltd. | Method for manufacturing light-emitting element on non-transparent substrate |
| JP2004304161A (ja) | 2003-03-14 | 2004-10-28 | Sony Corp | 発光素子、発光装置、画像表示装置、発光素子の製造方法及び画像表示装置の製造方法 |
-
2005
- 2005-03-26 WO PCT/US2005/010051 patent/WO2005099310A2/fr not_active Ceased
- 2005-03-26 AU AU2005232074A patent/AU2005232074A1/en not_active Abandoned
- 2005-03-26 KR KR1020067022659A patent/KR100880812B1/ko not_active Expired - Fee Related
- 2005-03-26 JP JP2007506288A patent/JP2007531321A/ja active Pending
- 2005-03-26 EP EP05729912A patent/EP1736035A4/fr not_active Withdrawn
- 2005-03-26 CA CA2560701A patent/CA2560701C/fr not_active Expired - Fee Related
- 2005-03-26 MX MXPA06011114A patent/MXPA06011114A/es active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| KR20070011419A (ko) | 2007-01-24 |
| WO2005099310A2 (fr) | 2005-10-20 |
| EP1736035A4 (fr) | 2009-01-07 |
| CA2560701A1 (fr) | 2005-10-20 |
| CA2560701C (fr) | 2016-10-18 |
| KR100880812B1 (ko) | 2009-01-30 |
| WO2005099310A3 (fr) | 2007-03-15 |
| JP2007531321A (ja) | 2007-11-01 |
| MXPA06011114A (es) | 2007-01-25 |
| EP1736035A2 (fr) | 2006-12-27 |
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Owner name: LUMACHIP, INC. Free format text: FORMER APPLICANT(S): ARTICULATED TECHNOLOGIES, LLC |
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| MK4 | Application lapsed section 142(2)(d) - no continuation fee paid for the application |