AU2003263593A1 - Charge control members - Google Patents
Charge control membersInfo
- Publication number
- AU2003263593A1 AU2003263593A1 AU2003263593A AU2003263593A AU2003263593A1 AU 2003263593 A1 AU2003263593 A1 AU 2003263593A1 AU 2003263593 A AU2003263593 A AU 2003263593A AU 2003263593 A AU2003263593 A AU 2003263593A AU 2003263593 A1 AU2003263593 A1 AU 2003263593A1
- Authority
- AU
- Australia
- Prior art keywords
- charge control
- control members
- members
- charge
- control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/003—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/12—Polyester-amides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Packaging Frangible Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002257051 | 2002-09-02 | ||
| JPNO.2002-257051 | 2002-09-02 | ||
| PCT/JP2003/011208 WO2004023532A2 (en) | 2002-09-02 | 2003-09-02 | Charge control members |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2003263593A1 true AU2003263593A1 (en) | 2004-03-29 |
Family
ID=31972974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2003263593A Abandoned AU2003263593A1 (en) | 2002-09-02 | 2003-09-02 | Charge control members |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP4540478B2 (en) |
| KR (1) | KR100716701B1 (en) |
| CN (1) | CN100380577C (en) |
| AU (1) | AU2003263593A1 (en) |
| TW (1) | TWI291439B (en) |
| WO (1) | WO2004023532A2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4971654B2 (en) * | 2005-04-21 | 2012-07-11 | 株式会社クレハ | PCB cassette |
| JP2006342345A (en) * | 2005-05-13 | 2006-12-21 | Kureha Corp | Antistatic resin composition |
| KR101353157B1 (en) * | 2010-12-28 | 2014-01-22 | 도쿄엘렉트론가부시키가이샤 | Electrostatic chuck |
| CN103662454B (en) * | 2013-11-27 | 2015-09-30 | 深圳市华星光电技术有限公司 | Substrate box |
| KR101802863B1 (en) * | 2016-12-06 | 2017-11-29 | 양락주 | Mask cassette |
| CN108001843A (en) * | 2017-12-06 | 2018-05-08 | 宣城杰爱新材料科技有限公司 | A kind of composite mortar thermal insulation board dispenser |
| JP7697827B2 (en) * | 2021-06-16 | 2025-06-24 | 大塚化学株式会社 | Antistatic polyamide resin composition and molded part |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2556119B2 (en) * | 1988-08-16 | 1996-11-20 | 東レ株式会社 | Antistatic resin composition and method for producing the same |
| JP3419964B2 (en) * | 1995-06-27 | 2003-06-23 | 日本ポリペンコ株式会社 | Antistatic monomer-cast nylon molded product |
| EP0915506B1 (en) * | 1997-04-04 | 2009-12-16 | Teijin Limited | Silicon wafer carrier |
| JPH11302481A (en) * | 1998-04-22 | 1999-11-02 | Idemitsu Petrochem Co Ltd | Styrenic resin composition and semiconductor conveyor jig |
| JP2000044778A (en) * | 1998-08-03 | 2000-02-15 | Teijin Ltd | Resin composition and component for upset-detecting switch made of the same |
| KR100407703B1 (en) * | 1998-11-05 | 2003-12-03 | 구레하 가가쿠 고교 가부시키가이샤 | Antistatic resin composition |
| JP2000248186A (en) * | 1999-02-26 | 2000-09-12 | Teijin Ltd | Resin composition and jig for transporting electronic part made of it |
| JP3942326B2 (en) * | 1999-04-22 | 2007-07-11 | 株式会社クレハ | Thermoplastic resin composition |
| JP5060004B2 (en) * | 2000-10-05 | 2012-10-31 | 東レ株式会社 | Exterior parts for vehicles and manufacturing method thereof |
-
2003
- 2003-09-01 TW TW092124083A patent/TWI291439B/en not_active IP Right Cessation
- 2003-09-02 CN CNB038199386A patent/CN100380577C/en not_active Expired - Fee Related
- 2003-09-02 KR KR1020057003439A patent/KR100716701B1/en not_active Expired - Fee Related
- 2003-09-02 WO PCT/JP2003/011208 patent/WO2004023532A2/en not_active Ceased
- 2003-09-02 AU AU2003263593A patent/AU2003263593A1/en not_active Abandoned
- 2003-09-02 JP JP2004534137A patent/JP4540478B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| WO2004023532A2 (en) | 2004-03-18 |
| KR100716701B1 (en) | 2007-05-14 |
| CN100380577C (en) | 2008-04-09 |
| CN1679139A (en) | 2005-10-05 |
| TWI291439B (en) | 2007-12-21 |
| JP4540478B2 (en) | 2010-09-08 |
| TW200407252A (en) | 2004-05-16 |
| WO2004023532A3 (en) | 2004-10-21 |
| KR20050042796A (en) | 2005-05-10 |
| JP2005537378A (en) | 2005-12-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |