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AU2002343588A1 - Agent-based control architecture - Google Patents

Agent-based control architecture

Info

Publication number
AU2002343588A1
AU2002343588A1 AU2002343588A AU2002343588A AU2002343588A1 AU 2002343588 A1 AU2002343588 A1 AU 2002343588A1 AU 2002343588 A AU2002343588 A AU 2002343588A AU 2002343588 A AU2002343588 A AU 2002343588A AU 2002343588 A1 AU2002343588 A1 AU 2002343588A1
Authority
AU
Australia
Prior art keywords
agent
based control
control architecture
architecture
control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002343588A
Inventor
Michael R. Conboy
Jason A. Grover
Michael L. Miller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of AU2002343588A1 publication Critical patent/AU2002343588A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67276Production flow monitoring, e.g. for increasing throughput
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/32Operator till task planning
    • G05B2219/32097Recipe programming for flexible batch
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/45Nc applications
    • G05B2219/45031Manufacturing semiconductor wafers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/80Management or planning

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Quality & Reliability (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • General Factory Administration (AREA)
  • Multi-Process Working Machines And Systems (AREA)
AU2002343588A 2002-01-10 2002-10-31 Agent-based control architecture Abandoned AU2002343588A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US4464002A 2002-01-10 2002-01-10
US10/044,640 2002-01-10
PCT/US2002/034850 WO2003060779A1 (en) 2002-01-10 2002-10-31 Agent-based control architecture

Publications (1)

Publication Number Publication Date
AU2002343588A1 true AU2002343588A1 (en) 2003-07-30

Family

ID=21933483

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002343588A Abandoned AU2002343588A1 (en) 2002-01-10 2002-10-31 Agent-based control architecture

Country Status (8)

Country Link
JP (1) JP4849773B2 (en)
KR (1) KR100939329B1 (en)
CN (1) CN100449551C (en)
AU (1) AU2002343588A1 (en)
DE (1) DE10297636B4 (en)
GB (1) GB2400925B (en)
TW (1) TWI312448B (en)
WO (1) WO2003060779A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8050900B2 (en) 2003-09-30 2011-11-01 Tokyo Electron Limited System and method for using first-principles simulation to provide virtual sensors that facilitate a semiconductor manufacturing process
US8036869B2 (en) 2003-09-30 2011-10-11 Tokyo Electron Limited System and method for using first-principles simulation to control a semiconductor manufacturing process via a simulation result or a derived empirical model
US8032348B2 (en) 2003-09-30 2011-10-04 Tokyo Electron Limited System and method for using first-principles simulation to facilitate a semiconductor manufacturing process
US8296687B2 (en) 2003-09-30 2012-10-23 Tokyo Electron Limited System and method for using first-principles simulation to analyze a process performed by a semiconductor processing tool
US8073667B2 (en) 2003-09-30 2011-12-06 Tokyo Electron Limited System and method for using first-principles simulation to control a semiconductor manufacturing process
US7542880B2 (en) * 2006-04-06 2009-06-02 Advanced Micro Devices, Inc. Time weighted moving average filter
DE102007014970B3 (en) * 2007-03-28 2008-07-31 Siemens Ag Process e.g. medical treatment, configuration method, involves configuring process step, where process includes parallel running process steps, and configuration of process steps determines sequence of process steps
DE102008035258A1 (en) * 2008-07-29 2010-03-25 Siemens Aktiengesellschaft Method for testing data consistency of technical system, involves testing data consistency of control parameters marked by part of tag groups based on preset validation rules for providing test results
DE102011109388A1 (en) * 2011-08-04 2013-02-07 Heidelberger Druckmaschinen Aktiengesellschaft Automatic press improvement
US9383739B2 (en) * 2012-02-21 2016-07-05 Applied Materials, Inc. Enhanced re-hosting capability for legacy hardware and software
US20130282333A1 (en) * 2012-04-23 2013-10-24 Abb Technology Ag Service port explorer
DE102019218623A1 (en) * 2019-11-29 2021-06-02 Sms Group Gmbh Control system for an industrial plant, in particular for a plant for the production or processing of metallic strips or sheets, and method for controlling an industrial plant, in particular a plant for the production or processing of metallic strips or sheets
US12386342B2 (en) * 2022-05-11 2025-08-12 Applied Materials, Inc. Holistic analysis of multidimensional sensor data for substrate processing equipment

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5548505A (en) * 1994-07-15 1996-08-20 Oktrak Systems, Inc. Scrubber control system
JP4276711B2 (en) * 1998-01-05 2009-06-10 株式会社日立国際電気 Semiconductor manufacturing equipment control system
JP3002776B1 (en) * 1998-07-16 2000-01-24 横河電機株式会社 Production system and processing apparatus selection method in production system
JP3704698B2 (en) * 1998-08-12 2005-10-12 横河電機株式会社 Production system
JP2000158297A (en) * 1998-12-01 2000-06-13 Dainippon Screen Mfg Co Ltd Job management system, job management method, and record medium
US6485990B1 (en) * 2000-01-04 2002-11-26 Advanced Micro Devices, Inc. Feed-forward control of an etch processing tool
JP2001338856A (en) * 2000-05-30 2001-12-07 Tokyo Seimitsu Co Ltd Process controller for semiconductor manufacturing system
US6694275B1 (en) * 2000-06-02 2004-02-17 Timbre Technologies, Inc. Profiler business model

Also Published As

Publication number Publication date
CN100449551C (en) 2009-01-07
KR100939329B1 (en) 2010-01-28
WO2003060779A1 (en) 2003-07-24
CN1610908A (en) 2005-04-27
JP2005515623A (en) 2005-05-26
TWI312448B (en) 2009-07-21
JP4849773B2 (en) 2012-01-11
DE10297636T5 (en) 2005-01-05
GB0412557D0 (en) 2004-07-07
GB2400925A (en) 2004-10-27
GB2400925B (en) 2005-08-03
DE10297636B4 (en) 2008-05-08
TW200301854A (en) 2003-07-16
KR20040074116A (en) 2004-08-21

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase