AU2001237483A1 - Mos transistor for high density integration circuits - Google Patents
Mos transistor for high density integration circuitsInfo
- Publication number
- AU2001237483A1 AU2001237483A1 AU2001237483A AU3748301A AU2001237483A1 AU 2001237483 A1 AU2001237483 A1 AU 2001237483A1 AU 2001237483 A AU2001237483 A AU 2001237483A AU 3748301 A AU3748301 A AU 3748301A AU 2001237483 A1 AU2001237483 A1 AU 2001237483A1
- Authority
- AU
- Australia
- Prior art keywords
- mos transistor
- high density
- integration circuits
- density integration
- circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 230000010354 integration Effects 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6741—Group IV materials, e.g. germanium or silicon carbide
- H10D30/6743—Silicon
- H10D30/6744—Monocrystalline silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/64—Electrodes comprising a Schottky barrier to a semiconductor
- H10D64/647—Schottky drain or source electrodes for IGFETs
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0002237 | 2000-02-23 | ||
| FR0002237A FR2805395B1 (en) | 2000-02-23 | 2000-02-23 | MOS TRANSISTOR FOR HIGH INTEGRATION DENSITY CIRCUITS |
| PCT/FR2001/000532 WO2001063677A1 (en) | 2000-02-23 | 2001-02-23 | Mos transistor for high density integration circuits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001237483A1 true AU2001237483A1 (en) | 2001-09-03 |
Family
ID=8847291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001237483A Abandoned AU2001237483A1 (en) | 2000-02-23 | 2001-02-23 | Mos transistor for high density integration circuits |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6774451B2 (en) |
| EP (1) | EP1258042A1 (en) |
| JP (1) | JP5090601B2 (en) |
| AU (1) | AU2001237483A1 (en) |
| CA (1) | CA2399115C (en) |
| FR (1) | FR2805395B1 (en) |
| WO (1) | WO2001063677A1 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6833556B2 (en) | 2002-08-12 | 2004-12-21 | Acorn Technologies, Inc. | Insulated gate field effect transistor having passivated schottky barriers to the channel |
| US7084423B2 (en) | 2002-08-12 | 2006-08-01 | Acorn Technologies, Inc. | Method for depinning the Fermi level of a semiconductor at an electrical junction and devices incorporating such junctions |
| JP4647889B2 (en) * | 2003-04-25 | 2011-03-09 | 富士通セミコンダクター株式会社 | Method for manufacturing field effect transistor having Schottky source / drain structure |
| DE112012004882B4 (en) | 2011-11-23 | 2022-12-29 | Acorn Technologies, Inc. | Improvement of metal contacts to Group IV semiconductors by insertion of interfacial atomic monolayers |
| US9685509B2 (en) | 2013-07-30 | 2017-06-20 | Samsung Electronics Co., Ltd. | Finfet devices including high mobility channel materials with materials of graded composition in recessed source/drain regions |
| US9917158B2 (en) * | 2013-07-30 | 2018-03-13 | Samsung Electronics Co., Ltd. | Device contact structures including heterojunctions for low contact resistance |
| US9620611B1 (en) | 2016-06-17 | 2017-04-11 | Acorn Technology, Inc. | MIS contact structure with metal oxide conductor |
| US10170627B2 (en) | 2016-11-18 | 2019-01-01 | Acorn Technologies, Inc. | Nanowire transistor with source and drain induced by electrical contacts with negative schottky barrier height |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4665414A (en) * | 1982-07-23 | 1987-05-12 | American Telephone And Telegraph Company, At&T Bell Laboratories | Schottky-barrier MOS devices |
| US4638551A (en) * | 1982-09-24 | 1987-01-27 | General Instrument Corporation | Schottky barrier device and method of manufacture |
| JPH0656883B2 (en) * | 1986-03-03 | 1994-07-27 | 鐘淵化学工業株式会社 | Semiconductor device |
| US4696093A (en) * | 1986-06-09 | 1987-09-29 | Welch James D | Fabrication of Schottky barrier MOSFETS |
| JPS6370576A (en) * | 1986-09-12 | 1988-03-30 | Komatsu Ltd | Thin-film transistor and manufacture thereof |
| FR2660114B1 (en) * | 1990-03-22 | 1997-05-30 | France Etat | OPTICAL DETECTION DEVICE WITH VARIABLE DETECTION THRESHOLD. |
| JP2751658B2 (en) * | 1990-04-27 | 1998-05-18 | 日本電気株式会社 | Semiconductor device |
| EP0456059B1 (en) * | 1990-04-27 | 1996-08-28 | Nec Corporation | Thin-film-transistor having Schottky barrier |
| JP3039967B2 (en) * | 1990-08-03 | 2000-05-08 | 株式会社日立製作所 | Semiconductor device |
| US5407837A (en) * | 1992-08-31 | 1995-04-18 | Texas Instruments Incorporated | Method of making a thin film transistor |
| JPH06177366A (en) * | 1992-12-04 | 1994-06-24 | Nikon Corp | Manufacture of schottky diode |
| US5663584A (en) * | 1994-05-31 | 1997-09-02 | Welch; James D. | Schottky barrier MOSFET systems and fabrication thereof |
| JP2630279B2 (en) * | 1994-10-12 | 1997-07-16 | 日本電気株式会社 | Schottky photodetector and driving method thereof |
| JPH08115914A (en) * | 1994-10-14 | 1996-05-07 | Hitachi Ltd | Semiconductor device |
| JP3614231B2 (en) * | 1995-02-17 | 2005-01-26 | 株式会社ルネサステクノロジ | Semiconductor memory element and semiconductor memory device |
| JP2760345B2 (en) * | 1996-06-25 | 1998-05-28 | 日本電気株式会社 | Single electronic device |
| JP3217015B2 (en) * | 1996-07-18 | 2001-10-09 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Method for forming field effect transistor |
| JP3003633B2 (en) * | 1997-07-09 | 2000-01-31 | 日本電気株式会社 | Field effect transistor and method for manufacturing the same |
| US6303479B1 (en) * | 1999-12-16 | 2001-10-16 | Spinnaker Semiconductor, Inc. | Method of manufacturing a short-channel FET with Schottky-barrier source and drain contacts |
-
2000
- 2000-02-23 FR FR0002237A patent/FR2805395B1/en not_active Expired - Fee Related
-
2001
- 2001-02-23 AU AU2001237483A patent/AU2001237483A1/en not_active Abandoned
- 2001-02-23 US US10/204,530 patent/US6774451B2/en not_active Expired - Lifetime
- 2001-02-23 WO PCT/FR2001/000532 patent/WO2001063677A1/en not_active Ceased
- 2001-02-23 EP EP01909882A patent/EP1258042A1/en not_active Withdrawn
- 2001-02-23 JP JP2001562764A patent/JP5090601B2/en not_active Expired - Fee Related
- 2001-02-23 CA CA002399115A patent/CA2399115C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US6774451B2 (en) | 2004-08-10 |
| JP2003524899A (en) | 2003-08-19 |
| EP1258042A1 (en) | 2002-11-20 |
| FR2805395A1 (en) | 2001-08-24 |
| FR2805395B1 (en) | 2002-05-10 |
| JP5090601B2 (en) | 2012-12-05 |
| WO2001063677A1 (en) | 2001-08-30 |
| CA2399115C (en) | 2009-10-13 |
| US20030094629A1 (en) | 2003-05-22 |
| CA2399115A1 (en) | 2002-08-30 |
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