AU2001284817A1 - Metal sulfide-oxide semiconductor transistor devices - Google Patents
Metal sulfide-oxide semiconductor transistor devicesInfo
- Publication number
- AU2001284817A1 AU2001284817A1 AU2001284817A AU8481701A AU2001284817A1 AU 2001284817 A1 AU2001284817 A1 AU 2001284817A1 AU 2001284817 A AU2001284817 A AU 2001284817A AU 8481701 A AU8481701 A AU 8481701A AU 2001284817 A1 AU2001284817 A1 AU 2001284817A1
- Authority
- AU
- Australia
- Prior art keywords
- oxide semiconductor
- metal sulfide
- semiconductor transistor
- transistor devices
- devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000002184 metal Substances 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28264—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being a III-V compound
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/601—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
- H10D64/681—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator having a compositional variation, e.g. multilayered
- H10D64/685—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator having a compositional variation, e.g. multilayered being perpendicular to the channel plane
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
- H10D64/691—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator comprising metallic compounds, e.g. metal oxides or metal silicates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/638,384 US6670651B1 (en) | 2000-05-04 | 2000-08-12 | Metal sulfide-oxide semiconductor transistor devices |
| PCT/US2001/025161 WO2002015283A2 (en) | 2000-08-12 | 2001-08-10 | Metal sulfide-oxide semiconductor transistor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001284817A1 true AU2001284817A1 (en) | 2002-02-25 |
Family
ID=24559811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001284817A Abandoned AU2001284817A1 (en) | 2000-08-12 | 2001-08-10 | Metal sulfide-oxide semiconductor transistor devices |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US6670651B1 (en) |
| AU (1) | AU2001284817A1 (en) |
| WO (1) | WO2002015283A2 (en) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6936900B1 (en) | 2000-05-04 | 2005-08-30 | Osemi, Inc. | Integrated transistor devices |
| US6989556B2 (en) * | 2002-06-06 | 2006-01-24 | Osemi, Inc. | Metal oxide compound semiconductor integrated transistor devices with a gate insulator structure |
| US7187045B2 (en) * | 2002-07-16 | 2007-03-06 | Osemi, Inc. | Junction field effect metal oxide compound semiconductor integrated transistor devices |
| US20070138506A1 (en) * | 2003-11-17 | 2007-06-21 | Braddock Walter D | Nitride metal oxide semiconductor integrated transistor devices |
| WO2005061756A1 (en) * | 2003-12-09 | 2005-07-07 | Osemi, Inc. | High temperature vacuum evaporation apparatus |
| US20070252216A1 (en) * | 2006-04-28 | 2007-11-01 | Infineon Technologies Ag | Semiconductor device and a method of manufacturing such a semiconductor device |
| US9997325B2 (en) | 2008-07-17 | 2018-06-12 | Verity Instruments, Inc. | Electron beam exciter for use in chemical analysis in processing systems |
| US9478419B2 (en) | 2013-12-18 | 2016-10-25 | Asm Ip Holding B.V. | Sulfur-containing thin films |
| US9245742B2 (en) | 2013-12-18 | 2016-01-26 | Asm Ip Holding B.V. | Sulfur-containing thin films |
| US9461134B1 (en) | 2015-05-20 | 2016-10-04 | Asm Ip Holding B.V. | Method for forming source/drain contact structure with chalcogen passivation |
| US9711350B2 (en) | 2015-06-03 | 2017-07-18 | Asm Ip Holding B.V. | Methods for semiconductor passivation by nitridation |
| US10490475B2 (en) | 2015-06-03 | 2019-11-26 | Asm Ip Holding B.V. | Methods for semiconductor passivation by nitridation after oxide removal |
| US9711396B2 (en) | 2015-06-16 | 2017-07-18 | Asm Ip Holding B.V. | Method for forming metal chalcogenide thin films on a semiconductor device |
| US9741815B2 (en) | 2015-06-16 | 2017-08-22 | Asm Ip Holding B.V. | Metal selenide and metal telluride thin films for semiconductor device applications |
| US9985019B2 (en) | 2015-09-16 | 2018-05-29 | Vanguard International Semiconductor Corporation | Semiconductor structure with high-voltage and low-voltage CMOS devices and method for manufacturing the same |
| TWI594365B (en) * | 2015-10-19 | 2017-08-01 | 世界先進積體電路股份有限公司 | Semiconductor structure and method for manufacturing the same |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4331737A (en) | 1978-04-01 | 1982-05-25 | Zaidan Hojin Handotai Kenkyu Shinkokai | Oxynitride film and its manufacturing method |
| JPS607720A (en) | 1983-06-28 | 1985-01-16 | Nec Corp | Epitaxial growing method |
| US4935789A (en) | 1985-02-19 | 1990-06-19 | Eaton Corporation | Buried channel FET with lateral growth over amorphous region |
| US4802180A (en) | 1986-04-30 | 1989-01-31 | American Telephone And Telegraph Company, At&T Bell Laboratories | Growth of congruently melting gadolinium scandium gallium garnet |
| US4745082A (en) | 1986-06-12 | 1988-05-17 | Ford Microelectronics, Inc. | Method of making a self-aligned MESFET using a substitutional gate with side walls |
| US4843450A (en) | 1986-06-16 | 1989-06-27 | International Business Machines Corporation | Compound semiconductor interface control |
| US4859253A (en) | 1988-07-20 | 1989-08-22 | International Business Machines Corporation | Method for passivating a compound semiconductor surface and device having improved semiconductor-insulator interface |
| US5124762A (en) | 1990-12-31 | 1992-06-23 | Honeywell Inc. | Gaas heterostructure metal-insulator-semiconductor integrated circuit technology |
| US5550089A (en) | 1994-03-23 | 1996-08-27 | Lucent Technologies Inc. | Gallium oxide coatings for optoelectronic devices using electron beam evaporation of a high purity single crystal Gd3 Ga5 O12 source. |
| US5451548A (en) | 1994-03-23 | 1995-09-19 | At&T Corp. | Electron beam deposition of gallium oxide thin films using a single high purity crystal source |
| US5767388A (en) | 1995-04-26 | 1998-06-16 | Siemens Aktiengesellschaft | Methane sensor and method for operating a sensor |
| US5665658A (en) | 1996-03-21 | 1997-09-09 | Motorola | Method of forming a dielectric layer structure |
| US5597768A (en) | 1996-03-21 | 1997-01-28 | Motorola, Inc. | Method of forming a Ga2 O3 dielectric layer |
| US5693565A (en) | 1996-07-15 | 1997-12-02 | Dow Corning Corporation | Semiconductor chips suitable for known good die testing |
| JP3604835B2 (en) | 1996-09-11 | 2004-12-22 | 大和製罐株式会社 | Method for manufacturing aluminum DI can having irregular pattern on body |
| US5920105A (en) | 1996-09-19 | 1999-07-06 | Fujitsu Limited | Compound semiconductor field effect transistor having an amorphous gas gate insulation layer |
| US6030453A (en) | 1997-03-04 | 2000-02-29 | Motorola, Inc. | III-V epitaxial wafer production |
| JP3734586B2 (en) * | 1997-03-05 | 2006-01-11 | 富士通株式会社 | Semiconductor device and manufacturing method thereof |
| US6207976B1 (en) * | 1997-12-17 | 2001-03-27 | Fujitsu Limited | Semiconductor device with ohmic contacts on compound semiconductor and manufacture thereof |
| US5945718A (en) * | 1998-02-12 | 1999-08-31 | Motorola Inc. | Self-aligned metal-oxide-compound semiconductor device and method of fabrication |
| US6094295A (en) | 1998-02-12 | 2000-07-25 | Motorola, Inc. | Ultraviolet transmitting oxide with metallic oxide phase and method of fabrication |
| US6150677A (en) | 1998-02-19 | 2000-11-21 | Sumitomo Electric Industries, Ltd. | Method of crystal growth of compound semiconductor, compound semiconductor device and method of manufacturing the device |
| US6006582A (en) | 1998-03-17 | 1999-12-28 | Advanced Technology Materials, Inc. | Hydrogen sensor utilizing rare earth metal thin film detection element |
| JP3850580B2 (en) * | 1999-03-30 | 2006-11-29 | 株式会社東芝 | Semiconductor device |
-
2000
- 2000-08-12 US US09/638,384 patent/US6670651B1/en not_active Expired - Fee Related
-
2001
- 2001-08-10 AU AU2001284817A patent/AU2001284817A1/en not_active Abandoned
- 2001-08-10 WO PCT/US2001/025161 patent/WO2002015283A2/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2002015283A3 (en) | 2002-03-28 |
| WO2002015283A2 (en) | 2002-02-21 |
| US6670651B1 (en) | 2003-12-30 |
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