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AU2001286972A1 - Chemical mechanical polishing (cmp) head, apparatus, and method and planarized semiconductor wafer produced thereby - Google Patents

Chemical mechanical polishing (cmp) head, apparatus, and method and planarized semiconductor wafer produced thereby

Info

Publication number
AU2001286972A1
AU2001286972A1 AU2001286972A AU8697201A AU2001286972A1 AU 2001286972 A1 AU2001286972 A1 AU 2001286972A1 AU 2001286972 A AU2001286972 A AU 2001286972A AU 8697201 A AU8697201 A AU 8697201A AU 2001286972 A1 AU2001286972 A1 AU 2001286972A1
Authority
AU
Australia
Prior art keywords
cmp
head
semiconductor wafer
mechanical polishing
chemical mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001286972A
Inventor
David A. Hansen
Jiro Kajiwara
Gerard S. Moloney
Huey-Ming Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MULTI-PLANAR TECHNOLOGIES Inc
Original Assignee
MULTI PLANAR TECHNOLOGIES Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/652,855 external-priority patent/US6527625B1/en
Priority claimed from US09/652,854 external-priority patent/US6540590B1/en
Application filed by MULTI PLANAR TECHNOLOGIES Inc filed Critical MULTI PLANAR TECHNOLOGIES Inc
Publication of AU2001286972A1 publication Critical patent/AU2001286972A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AU2001286972A 2000-08-31 2001-08-30 Chemical mechanical polishing (cmp) head, apparatus, and method and planarized semiconductor wafer produced thereby Abandoned AU2001286972A1 (en)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US65296300A 2000-08-31 2000-08-31
US65363600A 2000-08-31 2000-08-31
US09/652,855 US6527625B1 (en) 2000-08-31 2000-08-31 Chemical mechanical polishing apparatus and method having a soft backed polishing head
US09/653,636 2000-08-31
US09/652,854 2000-08-31
US09/652,963 2000-08-31
US09/652,855 2000-08-31
US09/652,854 US6540590B1 (en) 2000-08-31 2000-08-31 Chemical mechanical polishing apparatus and method having a rotating retaining ring
PCT/US2001/027151 WO2002018101A2 (en) 2000-08-31 2001-08-30 Chemical mechanical polishing (cmp) head, apparatus, and method and planarized semiconductor wafer produced thereby

Publications (1)

Publication Number Publication Date
AU2001286972A1 true AU2001286972A1 (en) 2002-03-13

Family

ID=27505281

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001286972A Abandoned AU2001286972A1 (en) 2000-08-31 2001-08-30 Chemical mechanical polishing (cmp) head, apparatus, and method and planarized semiconductor wafer produced thereby

Country Status (5)

Country Link
JP (2) JP2004518270A (en)
KR (1) KR100920709B1 (en)
AU (1) AU2001286972A1 (en)
TW (1) TWI246448B (en)
WO (1) WO2002018101A2 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100400236C (en) * 2002-09-27 2008-07-09 小松电子金属股份有限公司 A grinding device and wafer manufacturing method
KR100752181B1 (en) * 2005-10-05 2007-08-24 동부일렉트로닉스 주식회사 Chemical mechanical polishing machine
US7267610B1 (en) * 2006-08-30 2007-09-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having unevenly spaced grooves
US8460067B2 (en) * 2009-05-14 2013-06-11 Applied Materials, Inc. Polishing head zone boundary smoothing
US9610672B2 (en) * 2014-06-27 2017-04-04 Applied Materials, Inc. Configurable pressure design for multizone chemical mechanical planarization polishing head
TWI574778B (en) * 2015-02-11 2017-03-21 國立勤益科技大學 Polishing machine
US10283396B2 (en) * 2016-06-27 2019-05-07 Asm Nexx, Inc. Workpiece holder for a wet processing system
CN107214614A (en) * 2017-07-25 2017-09-29 蒋南 A kind of automatic saw blade polishing machine
JP7113626B2 (en) * 2018-01-12 2022-08-05 ニッタ・デュポン株式会社 polishing pad
US12017322B2 (en) * 2018-08-14 2024-06-25 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing method
WO2020203639A1 (en) * 2019-04-03 2020-10-08 株式会社クラレ Polishing pad
US20210323117A1 (en) 2020-04-16 2021-10-21 Applied Materials, Inc. High throughput polishing modules and modular polishing systems
CN114905386A (en) * 2021-02-01 2022-08-16 中国石油化工股份有限公司 Pendant pretreatment device and method suitable for uniform corrosion rate test
JP2023022905A (en) * 2021-08-04 2023-02-16 アプライド マテリアルズ インコーポレイテッド High throughput polishing module, and modular polishing system
CN117103104B (en) * 2023-09-05 2025-09-05 浙江工业大学 Device and method for processing silicon nitride ceramic balls

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5020283A (en) * 1990-01-22 1991-06-04 Micron Technology, Inc. Polishing pad with uniform abrasion
JP2944176B2 (en) * 1990-09-19 1999-08-30 三菱マテリアル株式会社 Ultra-precision polishing method and polishing apparatus for wafer
US5584746A (en) * 1993-10-18 1996-12-17 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafers and apparatus therefor
US5624299A (en) * 1993-12-27 1997-04-29 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved carrier and method of use
JPH08267357A (en) * 1995-03-31 1996-10-15 Nec Corp Abrasive device of substrate and abrasive method thereof
US6024630A (en) * 1995-06-09 2000-02-15 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
JP2708022B2 (en) * 1995-08-21 1998-02-04 日本電気株式会社 Polishing equipment
JP3106418B2 (en) * 1996-07-30 2000-11-06 株式会社東京精密 Polishing equipment
JPH10156712A (en) * 1996-11-29 1998-06-16 Oki Electric Ind Co Ltd Wafer polishing device
JP3183204B2 (en) * 1997-01-08 2001-07-09 三菱マテリアル株式会社 Wafer polishing equipment
US6056632A (en) * 1997-02-13 2000-05-02 Speedfam-Ipec Corp. Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head
US5851140A (en) * 1997-02-13 1998-12-22 Integrated Process Equipment Corp. Semiconductor wafer polishing apparatus with a flexible carrier plate
JP2897207B1 (en) * 1997-04-04 1999-05-31 株式会社東京精密 Polishing equipment
US5921855A (en) * 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
JPH10315126A (en) * 1997-05-16 1998-12-02 Tokyo Seimitsu Co Ltd Grinding method and device using distributor ring
US6007411A (en) * 1997-06-19 1999-12-28 Interantional Business Machines Corporation Wafer carrier for chemical mechanical polishing
JP3006568B2 (en) * 1997-12-04 2000-02-07 日本電気株式会社 Wafer polishing apparatus and polishing method
JPH11226865A (en) * 1997-12-11 1999-08-24 Speedfam Co Ltd Carrier and cmp device
US6093651A (en) * 1997-12-23 2000-07-25 Intel Corporation Polish pad with non-uniform groove depth to improve wafer polish rate uniformity
US5993302A (en) * 1997-12-31 1999-11-30 Applied Materials, Inc. Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus
JPH11216663A (en) * 1998-02-03 1999-08-10 Sony Corp Polishing pad, polishing apparatus and polishing method
EP0992322A4 (en) * 1998-04-06 2006-09-27 Ebara Corp Polishing device
KR20000025003A (en) * 1998-10-07 2000-05-06 윤종용 Polishing pad used for chemical and mechanical polishing of semiconductor substrate
US6110012A (en) * 1998-12-24 2000-08-29 Lucent Technologies Inc. Chemical-mechanical polishing apparatus and method
US6368189B1 (en) * 1999-03-03 2002-04-09 Mitsubishi Materials Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
US6225224B1 (en) * 1999-05-19 2001-05-01 Infineon Technologies Norht America Corp. System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor wafer
JP2001298006A (en) * 2000-04-17 2001-10-26 Ebara Corp Polishing device
AU2001259745A1 (en) * 2000-05-12 2001-11-26 Multi-Planar Technologies, Inc. System and method for pneumatic diaphragm cmp head having separate retaining ring and multi-region wafer pressure control
US6409579B1 (en) * 2000-05-31 2002-06-25 Koninklijke Philips Electronics N.V. Method and apparatus for conditioning a polish pad at the point of polish and for dispensing slurry at the point of polish
JP2002046061A (en) * 2000-07-31 2002-02-12 Mitsubishi Materials Corp Polishing head

Also Published As

Publication number Publication date
TWI246448B (en) 2006-01-01
WO2002018101A3 (en) 2003-01-23
KR100920709B1 (en) 2009-10-07
WO2002018101A9 (en) 2003-10-30
KR20030064393A (en) 2003-07-31
WO2002018101A2 (en) 2002-03-07
JP5562370B2 (en) 2014-07-30
JP2004518270A (en) 2004-06-17
JP2012151501A (en) 2012-08-09

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