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AU2002229023A1 - Methods, apparatus and slurries for chemical mechanical planarization - Google Patents

Methods, apparatus and slurries for chemical mechanical planarization

Info

Publication number
AU2002229023A1
AU2002229023A1 AU2002229023A AU2902302A AU2002229023A1 AU 2002229023 A1 AU2002229023 A1 AU 2002229023A1 AU 2002229023 A AU2002229023 A AU 2002229023A AU 2902302 A AU2902302 A AU 2902302A AU 2002229023 A1 AU2002229023 A1 AU 2002229023A1
Authority
AU
Australia
Prior art keywords
slurries
methods
chemical mechanical
mechanical planarization
planarization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002229023A
Inventor
Joseph M Desimone
James B. Mcclain
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MiCell Technologies Inc
Original Assignee
MiCell Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MiCell Technologies Inc filed Critical MiCell Technologies Inc
Publication of AU2002229023A1 publication Critical patent/AU2002229023A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
AU2002229023A 2000-11-07 2001-11-02 Methods, apparatus and slurries for chemical mechanical planarization Abandoned AU2002229023A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US70775500A 2000-11-07 2000-11-07
US09707755 2000-11-07
US09/816,956 US6623355B2 (en) 2000-11-07 2001-03-23 Methods, apparatus and slurries for chemical mechanical planarization
US09816956 2001-03-23
PCT/US2001/048100 WO2002038335A1 (en) 2000-11-07 2001-11-02 Methods, apparatus and slurries for chemical mechanical planarization

Publications (1)

Publication Number Publication Date
AU2002229023A1 true AU2002229023A1 (en) 2002-05-21

Family

ID=27107947

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002229023A Abandoned AU2002229023A1 (en) 2000-11-07 2001-11-02 Methods, apparatus and slurries for chemical mechanical planarization

Country Status (8)

Country Link
US (2) US6623355B2 (en)
EP (1) EP1339529A1 (en)
JP (1) JP2004521484A (en)
KR (1) KR20030042478A (en)
CN (1) CN1469794A (en)
AU (1) AU2002229023A1 (en)
TW (1) TW577783B (en)
WO (1) WO2002038335A1 (en)

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Also Published As

Publication number Publication date
US6743078B2 (en) 2004-06-01
WO2002038335A1 (en) 2002-05-16
EP1339529A1 (en) 2003-09-03
US20030194953A1 (en) 2003-10-16
TW577783B (en) 2004-03-01
US6623355B2 (en) 2003-09-23
US20020055323A1 (en) 2002-05-09
KR20030042478A (en) 2003-05-28
JP2004521484A (en) 2004-07-15
CN1469794A (en) 2004-01-21

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