AU2001279126A1 - In-situ method and apparatus for end point detection in chemical mechanical polishing - Google Patents
In-situ method and apparatus for end point detection in chemical mechanical polishingInfo
- Publication number
- AU2001279126A1 AU2001279126A1 AU2001279126A AU7912601A AU2001279126A1 AU 2001279126 A1 AU2001279126 A1 AU 2001279126A1 AU 2001279126 A AU2001279126 A AU 2001279126A AU 7912601 A AU7912601 A AU 7912601A AU 2001279126 A1 AU2001279126 A1 AU 2001279126A1
- Authority
- AU
- Australia
- Prior art keywords
- end point
- mechanical polishing
- chemical mechanical
- point detection
- situ method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000001514 detection method Methods 0.000 title 1
- 238000011065 in-situ storage Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09628471 | 2000-07-31 | ||
| US09/628,471 US6476921B1 (en) | 2000-07-31 | 2000-07-31 | In-situ method and apparatus for end point detection in chemical mechanical polishing |
| US25893100P | 2000-12-29 | 2000-12-29 | |
| US60258931 | 2000-12-29 | ||
| PCT/US2001/024146 WO2002010729A1 (fr) | 2000-07-31 | 2001-07-31 | Procede et dispositif in situ de detection du point de virage destines au polissage chimico-mecanique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001279126A1 true AU2001279126A1 (en) | 2002-02-13 |
Family
ID=26946968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001279126A Abandoned AU2001279126A1 (en) | 2000-07-31 | 2001-07-31 | In-situ method and apparatus for end point detection in chemical mechanical polishing |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6798529B2 (fr) |
| EP (1) | EP1322940A4 (fr) |
| JP (1) | JP2004514273A (fr) |
| KR (1) | KR20030025281A (fr) |
| CN (1) | CN1466676A (fr) |
| AU (1) | AU2001279126A1 (fr) |
| MY (1) | MY128145A (fr) |
| TW (1) | TW491753B (fr) |
| WO (1) | WO2002010729A1 (fr) |
Families Citing this family (65)
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|---|---|---|---|---|
| US20020023715A1 (en) * | 2000-05-26 | 2002-02-28 | Norio Kimura | Substrate polishing apparatus and substrate polishing mehod |
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| KR100434189B1 (ko) | 2002-03-21 | 2004-06-04 | 삼성전자주식회사 | 화학 기계적 연마장치 및 그 제어방법 |
| US6806948B2 (en) * | 2002-03-29 | 2004-10-19 | Lam Research Corporation | System and method of broad band optical end point detection for film change indication |
| CN1302522C (zh) * | 2002-05-15 | 2007-02-28 | 旺宏电子股份有限公司 | 一种化学机械抛光装置的终点侦测系统 |
| DE10223945B4 (de) | 2002-05-29 | 2006-12-21 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren zum Verbessern der Herstellung von Damaszener-Metallstrukturen |
| US7363099B2 (en) * | 2002-06-07 | 2008-04-22 | Cadence Design Systems, Inc. | Integrated circuit metrology |
| US7853904B2 (en) * | 2002-06-07 | 2010-12-14 | Cadence Design Systems, Inc. | Method and system for handling process related variations for integrated circuits based upon reflections |
| WO2003104921A2 (fr) * | 2002-06-07 | 2003-12-18 | Praesagus, Inc. | Caracterisation et reduction de variation pour circuits integres |
| US20040038502A1 (en) * | 2002-06-26 | 2004-02-26 | Sethuraman Jayashankar | Method of detecting chemical mechanical polishing endpoints in thin film head processes |
| US7042564B2 (en) * | 2002-08-08 | 2006-05-09 | Applied Materials, Israel, Ltd. | Wafer inspection methods and an optical inspection tool |
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| US6970043B2 (en) * | 2002-10-29 | 2005-11-29 | Fairchild Semiconductor Corporation | Low voltage, low power differential receiver |
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| SG125108A1 (en) * | 2003-03-11 | 2006-09-29 | Asml Netherlands Bv | Assembly comprising a sensor for determining at least one of tilt and height of a substrate, a method therefor and a lithographic projection apparatus |
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| US7078344B2 (en) * | 2003-03-14 | 2006-07-18 | Lam Research Corporation | Stress free etch processing in combination with a dynamic liquid meniscus |
| US7232766B2 (en) * | 2003-03-14 | 2007-06-19 | Lam Research Corporation | System and method for surface reduction, passivation, corrosion prevention and activation of copper surface |
| JP4219718B2 (ja) * | 2003-03-28 | 2009-02-04 | Ｈｏｙａ株式会社 | Ｅｕｖマスクブランクス用ガラス基板の製造方法及びｅｕｖマスクブランクスの製造方法 |
| US20050026542A1 (en) * | 2003-07-31 | 2005-02-03 | Tezer Battal | Detection system for chemical-mechanical planarization tool |
| JP4174399B2 (ja) * | 2003-09-24 | 2008-10-29 | 株式会社東芝 | 検査システム，検査方法，及び電子装置の製造方法 |
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| US7315642B2 (en) * | 2004-02-12 | 2008-01-01 | Applied Materials, Israel, Ltd. | System and method for measuring thin film thickness variations and for compensating for the variations |
| US20050197721A1 (en) * | 2004-02-20 | 2005-09-08 | Yung-Cheng Chen | Control of exposure energy on a substrate |
| US7052364B2 (en) * | 2004-06-14 | 2006-05-30 | Cabot Microelectronics Corporation | Real time polishing process monitoring |
| CN1972780B (zh) * | 2004-06-21 | 2010-09-08 | 株式会社荏原制作所 | 抛光设备和抛光方法 |
| JP4505634B2 (ja) * | 2004-08-13 | 2010-07-21 | 国立大学法人東北大学 | 半導体を使用する電子部品の評価方法及び半導体を使用する電子部品の管理方法 |
| KR20060078252A (ko) * | 2004-12-31 | 2006-07-05 | 동부일렉트로닉스 주식회사 | 트렌치 소자 분리막 평탄화 공정의 모니터 패턴 |
| JPWO2006126420A1 (ja) | 2005-05-26 | 2008-12-25 | 株式会社ニコン | Ｃｍｐ研磨装置における研磨終了点検出方法、ｃｍｐ研磨装置、及び半導体デバイスの製造方法 |
| EP1808823A1 (fr) * | 2005-12-14 | 2007-07-18 | Wincor Nixdorf International GmbH | Dispositif destiné à vérifier l'authenticité d'un support de valeur |
| US7849281B2 (en) * | 2006-04-03 | 2010-12-07 | Emc Corporation | Method and system for implementing hierarchical permission maps in a layered volume graph |
| KR101278236B1 (ko) | 2006-09-12 | 2013-06-24 | 가부시키가이샤 에바라 세이사꾸쇼 | 연마장치 및 연마방법 |
| US8260035B2 (en) * | 2006-09-22 | 2012-09-04 | Kla-Tencor Corporation | Threshold determination in an inspection system |
| JP5006883B2 (ja) * | 2006-10-06 | 2012-08-22 | 株式会社荏原製作所 | 加工終点検知方法および加工装置 |
| JP4988380B2 (ja) * | 2007-02-26 | 2012-08-01 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法および半導体製造装置 |
| US20090181475A1 (en) * | 2008-01-11 | 2009-07-16 | Novellus Systems, Inc. | Detecting the presence of a workpiece relative to a carrier head |
| DE102008021569A1 (de) * | 2008-04-30 | 2009-11-05 | Advanced Micro Devices, Inc., Sunnyvale | System und Verfahren zur optischen Endpunkterkennung während des CMP unter Anwendung eines substratüberspannenenden Signals |
| US20090275265A1 (en) * | 2008-05-02 | 2009-11-05 | Applied Materials, Inc. | Endpoint detection in chemical mechanical polishing using multiple spectra |
| KR101013569B1 (ko) * | 2008-12-30 | 2011-02-14 | 창익기계공업(주) | 피딩장치 및 이를 구비한 휴대폰용 키패드의 원단 펀칭기 |
| ES2473241T3 (es) * | 2010-05-18 | 2014-07-04 | Marposs Societa' Per Azioni | Método y aparato para medir �pticamente por interferometr�a el espesor de un objeto |
| IT1399876B1 (it) * | 2010-05-18 | 2013-05-09 | Marposs Spa | Metodo e apparecchiatura per la misura ottica mediante interferometria dello spessore di un oggetto |
| IT1399875B1 (it) * | 2010-05-18 | 2013-05-09 | Marposs Spa | Metodo e apparecchiatura per la misura ottica mediante interferometria dello spessore di un oggetto |
| WO2012071753A1 (fr) * | 2010-11-30 | 2012-06-07 | 深圳市华星光电技术有限公司 | Procédé pour la gravure de métal, procédé de régulation destiné à la gravure de métal et appareil pour celui-ci |
| CN102221416B (zh) * | 2011-03-10 | 2012-10-10 | 清华大学 | 抛光液物理参数测量装置、测量方法和化学机械抛光设备 |
| US8563335B1 (en) * | 2012-04-23 | 2013-10-22 | Applied Materials, Inc. | Method of controlling polishing using in-situ optical monitoring and fourier transform |
| US9011202B2 (en) | 2012-04-25 | 2015-04-21 | Applied Materials, Inc. | Fitting of optical model with diffraction effects to measured spectrum |
| US9248544B2 (en) * | 2012-07-18 | 2016-02-02 | Applied Materials, Inc. | Endpoint detection during polishing using integrated differential intensity |
| US20140078495A1 (en) * | 2012-09-14 | 2014-03-20 | Stmicroelectronics, Inc. | Inline metrology for attaining full wafer map of uniformity and surface charge |
| US10513006B2 (en) * | 2013-02-04 | 2019-12-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | High throughput CMP platform |
| US10309013B2 (en) * | 2013-03-15 | 2019-06-04 | Applied Materials, Inc. | Method and system for identifying a clean endpoint time for a chamber |
| WO2014149330A1 (fr) * | 2013-03-15 | 2014-09-25 | Applied Materials, Inc. | Commande d'élimination de résidus dynamique à commande de profil in-situ (ispc) |
| CN103394994B (zh) * | 2013-07-18 | 2017-12-15 | 上海集成电路研发中心有限公司 | 一种晶圆的抛光方法 |
| TW201543016A (zh) * | 2014-05-06 | 2015-11-16 | 蘋果傑克１９９有限合夥公司 | 半導體晶圓應力分析 |
| CN104034765A (zh) * | 2014-07-07 | 2014-09-10 | 中国船舶重工集团公司第七二五研究所 | 局部区域形貌扫描的电化学检测方法 |
| CN105437076A (zh) * | 2014-08-27 | 2016-03-30 | 中芯国际集成电路制造(上海)有限公司 | 晶片轮廓实时控制方法和系统 |
| US11639881B1 (en) | 2014-11-19 | 2023-05-02 | Carlos A. Rosero | Integrated, continuous diagnosis, and fault detection of hydrodynamic bearings by capacitance sensing |
| US12264986B1 (en) | 2014-11-19 | 2025-04-01 | Carlos A. Rosero | Integrated, continuous diagnosis, and fault detection of hydrodynamic bearings by capacitance sensing |
| US9835449B2 (en) | 2015-08-26 | 2017-12-05 | Industrial Technology Research Institute | Surface measuring device and method thereof |
| CN108608328B (zh) * | 2018-07-06 | 2023-09-26 | 中国工程物理研究院激光聚变研究中心 | 抛光摩擦力的测量装置及其测量方法 |
| US11756840B2 (en) * | 2018-09-20 | 2023-09-12 | Taiwan Semiconductor Manufacturing Co., Ltd. | Reflectance measurement system and method thereof |
| CN110931377B (zh) | 2018-09-20 | 2023-11-03 | 台湾积体电路制造股份有限公司 | 反射率测量系统与方法 |
| US12347735B2 (en) * | 2022-03-16 | 2025-07-01 | Taiwan Semiconductor Manufacturing Company Limited | In-situ defect count detection in post chemical mechanical polishing |
| CN117047284A (zh) * | 2023-07-18 | 2023-11-14 | 北京航空航天大学 | 一种用于半导体生产的激光抛光-检测一体化工艺 |
| CN119704034A (zh) * | 2024-12-10 | 2025-03-28 | 西安奕斯伟材料科技股份有限公司 | 一种抛光方法及抛光设备、装置及介质 |
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-
2001
- 2001-07-31 TW TW090118624A patent/TW491753B/zh not_active IP Right Cessation
- 2001-07-31 EP EP01957372A patent/EP1322940A4/fr not_active Withdrawn
- 2001-07-31 KR KR10-2003-7001394A patent/KR20030025281A/ko not_active Ceased
- 2001-07-31 JP JP2002516606A patent/JP2004514273A/ja active Pending
- 2001-07-31 CN CNA018155251A patent/CN1466676A/zh active Pending
- 2001-07-31 AU AU2001279126A patent/AU2001279126A1/en not_active Abandoned
- 2001-07-31 WO PCT/US2001/024146 patent/WO2002010729A1/fr not_active Ceased
- 2001-07-31 MY MYPI20013602A patent/MY128145A/en unknown
- 2001-12-21 US US10/029,080 patent/US6798529B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US20030045100A1 (en) | 2003-03-06 |
| CN1466676A (zh) | 2004-01-07 |
| JP2004514273A (ja) | 2004-05-13 |
| KR20030025281A (ko) | 2003-03-28 |
| TW491753B (en) | 2002-06-21 |
| EP1322940A1 (fr) | 2003-07-02 |
| EP1322940A4 (fr) | 2006-03-15 |
| WO2002010729A1 (fr) | 2002-02-07 |
| US6798529B2 (en) | 2004-09-28 |
| MY128145A (en) | 2007-01-31 |
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