|
US7136173B2
(en)
*
|
1998-07-09 |
2006-11-14 |
Acm Research, Inc. |
Method and apparatus for end-point detection
|
|
US6395152B1
(en)
*
|
1998-07-09 |
2002-05-28 |
Acm Research, Inc. |
Methods and apparatus for electropolishing metal interconnections on semiconductor devices
|
|
US7449098B1
(en)
|
1999-10-05 |
2008-11-11 |
Novellus Systems, Inc. |
Method for planar electroplating
|
|
US7531079B1
(en)
|
1998-10-26 |
2009-05-12 |
Novellus Systems, Inc. |
Method and apparatus for uniform electropolishing of damascene IC structures by selective agitation
|
|
US6709565B2
(en)
*
|
1998-10-26 |
2004-03-23 |
Novellus Systems, Inc. |
Method and apparatus for uniform electropolishing of damascene ic structures by selective agitation
|
|
US20040065540A1
(en)
*
|
2002-06-28 |
2004-04-08 |
Novellus Systems, Inc. |
Liquid treatment using thin liquid layer
|
|
EP1052062A1
(en)
|
1999-05-03 |
2000-11-15 |
Applied Materials, Inc. |
Pré-conditioning fixed abrasive articles
|
|
US6653226B1
(en)
|
2001-01-09 |
2003-11-25 |
Novellus Systems, Inc. |
Method for electrochemical planarization of metal surfaces
|
|
US6756307B1
(en)
*
|
1999-10-05 |
2004-06-29 |
Novellus Systems, Inc. |
Apparatus for electrically planarizing semiconductor wafers
|
|
US6299741B1
(en)
|
1999-11-29 |
2001-10-09 |
Applied Materials, Inc. |
Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus
|
|
US7678245B2
(en)
|
2000-02-17 |
2010-03-16 |
Applied Materials, Inc. |
Method and apparatus for electrochemical mechanical processing
|
|
US6962524B2
(en)
|
2000-02-17 |
2005-11-08 |
Applied Materials, Inc. |
Conductive polishing article for electrochemical mechanical polishing
|
|
US6848970B2
(en)
*
|
2002-09-16 |
2005-02-01 |
Applied Materials, Inc. |
Process control in electrochemically assisted planarization
|
|
US6537144B1
(en)
|
2000-02-17 |
2003-03-25 |
Applied Materials, Inc. |
Method and apparatus for enhanced CMP using metals having reductive properties
|
|
US7059948B2
(en)
|
2000-12-22 |
2006-06-13 |
Applied Materials |
Articles for polishing semiconductor substrates
|
|
US7066800B2
(en)
|
2000-02-17 |
2006-06-27 |
Applied Materials Inc. |
Conductive polishing article for electrochemical mechanical polishing
|
|
US6991528B2
(en)
|
2000-02-17 |
2006-01-31 |
Applied Materials, Inc. |
Conductive polishing article for electrochemical mechanical polishing
|
|
US7303462B2
(en)
|
2000-02-17 |
2007-12-04 |
Applied Materials, Inc. |
Edge bead removal by an electro polishing process
|
|
US6979248B2
(en)
|
2002-05-07 |
2005-12-27 |
Applied Materials, Inc. |
Conductive polishing article for electrochemical mechanical polishing
|
|
US7303662B2
(en)
|
2000-02-17 |
2007-12-04 |
Applied Materials, Inc. |
Contacts for electrochemical processing
|
|
US7077721B2
(en)
|
2000-02-17 |
2006-07-18 |
Applied Materials, Inc. |
Pad assembly for electrochemical mechanical processing
|
|
US7029365B2
(en)
|
2000-02-17 |
2006-04-18 |
Applied Materials Inc. |
Pad assembly for electrochemical mechanical processing
|
|
US7374644B2
(en)
|
2000-02-17 |
2008-05-20 |
Applied Materials, Inc. |
Conductive polishing article for electrochemical mechanical polishing
|
|
US7670468B2
(en)
|
2000-02-17 |
2010-03-02 |
Applied Materials, Inc. |
Contact assembly and method for electrochemical mechanical processing
|
|
US7125477B2
(en)
|
2000-02-17 |
2006-10-24 |
Applied Materials, Inc. |
Contacts for electrochemical processing
|
|
US6991526B2
(en)
*
|
2002-09-16 |
2006-01-31 |
Applied Materials, Inc. |
Control of removal profile in electrochemically assisted CMP
|
|
US6428673B1
(en)
*
|
2000-07-08 |
2002-08-06 |
Semitool, Inc. |
Apparatus and method for electrochemical processing of a microelectronic workpiece, capable of modifying processing based on metrology
|
|
US6747734B1
(en)
*
|
2000-07-08 |
2004-06-08 |
Semitool, Inc. |
Apparatus and method for processing a microelectronic workpiece using metrology
|
|
JP2002093761A
(en)
*
|
2000-09-19 |
2002-03-29 |
Sony Corp |
Polishing method, polishing apparatus, plating method and plating apparatus
|
|
US6591160B2
(en)
*
|
2000-12-04 |
2003-07-08 |
Asyst Technologies, Inc. |
Self teaching robot
|
|
US7128825B2
(en)
|
2001-03-14 |
2006-10-31 |
Applied Materials, Inc. |
Method and composition for polishing a substrate
|
|
US6899804B2
(en)
|
2001-04-10 |
2005-05-31 |
Applied Materials, Inc. |
Electrolyte composition and treatment for electrolytic chemical mechanical polishing
|
|
US7160432B2
(en)
*
|
2001-03-14 |
2007-01-09 |
Applied Materials, Inc. |
Method and composition for polishing a substrate
|
|
US7323416B2
(en)
|
2001-03-14 |
2008-01-29 |
Applied Materials, Inc. |
Method and composition for polishing a substrate
|
|
US7137879B2
(en)
|
2001-04-24 |
2006-11-21 |
Applied Materials, Inc. |
Conductive polishing article for electrochemical mechanical polishing
|
|
US7344432B2
(en)
|
2001-04-24 |
2008-03-18 |
Applied Materials, Inc. |
Conductive pad with ion exchange membrane for electrochemical mechanical polishing
|
|
TW584899B
(en)
*
|
2001-07-20 |
2004-04-21 |
Nutool Inc |
Planar metal electroprocessing
|
|
US6881664B2
(en)
*
|
2001-08-28 |
2005-04-19 |
Lsi Logic Corporation |
Process for planarizing upper surface of damascene wiring structure for integrated circuit structures
|
|
US6720263B2
(en)
*
|
2001-10-16 |
2004-04-13 |
Applied Materials Inc. |
Planarization of metal layers on a semiconductor wafer through non-contact de-plating and control with endpoint detection
|
|
US20030072639A1
(en)
*
|
2001-10-17 |
2003-04-17 |
Applied Materials, Inc. |
Substrate support
|
|
CN100497748C
(en)
*
|
2001-11-13 |
2009-06-10 |
Acm研究公司 |
Electropolishing assembly and methods for electropolishing conductive layers
|
|
US6770565B2
(en)
|
2002-01-08 |
2004-08-03 |
Applied Materials Inc. |
System for planarizing metal conductive layers
|
|
US6621099B2
(en)
*
|
2002-01-11 |
2003-09-16 |
Xerox Corporation |
Polythiophenes and devices thereof
|
|
US6837983B2
(en)
*
|
2002-01-22 |
2005-01-04 |
Applied Materials, Inc. |
Endpoint detection for electro chemical mechanical polishing and electropolishing processes
|
|
WO2003088352A1
(en)
*
|
2002-04-09 |
2003-10-23 |
Rensselaer Polytechnic Institute |
Electrochemical planarization of metal feature surfaces
|
|
AU2003243506A1
(en)
*
|
2002-06-12 |
2003-12-31 |
Faraday Technology, Inc. |
Electrolytic etching of metal layers
|
|
TW200949918A
(en)
*
|
2002-07-22 |
2009-12-01 |
Acm Res Inc |
Adaptive electropolishing using thickness measurements and removal of barrier and sacrificial layers
|
|
US7799200B1
(en)
|
2002-07-29 |
2010-09-21 |
Novellus Systems, Inc. |
Selective electrochemical accelerator removal
|
|
US6783657B2
(en)
*
|
2002-08-29 |
2004-08-31 |
Micron Technology, Inc. |
Systems and methods for the electrolytic removal of metals from substrates
|
|
US20040040863A1
(en)
*
|
2002-08-29 |
2004-03-04 |
Micron Technology, Inc. |
Systems for electrolytic removal of metals from substrates
|
|
US20050061674A1
(en)
*
|
2002-09-16 |
2005-03-24 |
Yan Wang |
Endpoint compensation in electroprocessing
|
|
US7112270B2
(en)
*
|
2002-09-16 |
2006-09-26 |
Applied Materials, Inc. |
Algorithm for real-time process control of electro-polishing
|
|
US7842169B2
(en)
|
2003-03-04 |
2010-11-30 |
Applied Materials, Inc. |
Method and apparatus for local polishing control
|
|
US6939796B2
(en)
|
2003-03-14 |
2005-09-06 |
Lam Research Corporation |
System, method and apparatus for improved global dual-damascene planarization
|
|
US7217649B2
(en)
|
2003-03-14 |
2007-05-15 |
Lam Research Corporation |
System and method for stress free conductor removal
|
|
US6821899B2
(en)
|
2003-03-14 |
2004-11-23 |
Lam Research Corporation |
System, method and apparatus for improved local dual-damascene planarization
|
|
US7009281B2
(en)
|
2003-03-14 |
2006-03-07 |
Lam Corporation |
Small volume process chamber with hot inner surfaces
|
|
US7232766B2
(en)
|
2003-03-14 |
2007-06-19 |
Lam Research Corporation |
System and method for surface reduction, passivation, corrosion prevention and activation of copper surface
|
|
US7078344B2
(en)
|
2003-03-14 |
2006-07-18 |
Lam Research Corporation |
Stress free etch processing in combination with a dynamic liquid meniscus
|
|
US6930782B1
(en)
|
2003-03-28 |
2005-08-16 |
Lam Research Corporation |
End point detection with imaging matching in semiconductor processing
|
|
US20040235297A1
(en)
*
|
2003-05-23 |
2004-11-25 |
Bih-Tiao Lin |
Reverse electroplating for damascene conductive region formation
|
|
US7390429B2
(en)
|
2003-06-06 |
2008-06-24 |
Applied Materials, Inc. |
Method and composition for electrochemical mechanical polishing processing
|
|
US8530359B2
(en)
|
2003-10-20 |
2013-09-10 |
Novellus Systems, Inc. |
Modulated metal removal using localized wet etching
|
|
US8158532B2
(en)
|
2003-10-20 |
2012-04-17 |
Novellus Systems, Inc. |
Topography reduction and control by selective accelerator removal
|
|
WO2005055283A2
(en)
*
|
2003-11-26 |
2005-06-16 |
Acm Research, Inc. |
Monitoring an electropolishing process in integrated circuit fabrication
|
|
US7186164B2
(en)
*
|
2003-12-03 |
2007-03-06 |
Applied Materials, Inc. |
Processing pad assembly with zone control
|
|
US20070131561A1
(en)
*
|
2003-12-17 |
2007-06-14 |
Acm Research, Inc. |
Controlling removal rate uniformity of an electropolishing process in integrated circuit fabrication
|
|
US20060207888A1
(en)
*
|
2003-12-29 |
2006-09-21 |
Taylor E J |
Electrochemical etching of circuitry for high density interconnect electronic modules
|
|
US20050145506A1
(en)
*
|
2003-12-29 |
2005-07-07 |
Taylor E. J. |
Electrochemical etching of circuitry for high density interconnect electronic modules
|
|
US7390744B2
(en)
|
2004-01-29 |
2008-06-24 |
Applied Materials, Inc. |
Method and composition for polishing a substrate
|
|
WO2005082057A2
(en)
*
|
2004-02-23 |
2005-09-09 |
Acm Research, Inc. |
Controlling removal rate uniformity of an electropolishing process in integrated circuit fabrication
|
|
US20050218009A1
(en)
*
|
2004-04-02 |
2005-10-06 |
Jinshan Huo |
Electrochemical planarization system and method of electrochemical planarization
|
|
US20050247673A1
(en)
*
|
2004-05-07 |
2005-11-10 |
International Business Machines Corporation |
Confinement of fluids on surfaces
|
|
US7084064B2
(en)
|
2004-09-14 |
2006-08-01 |
Applied Materials, Inc. |
Full sequence metal and barrier layer electrochemical mechanical processing
|
|
US7520968B2
(en)
|
2004-10-05 |
2009-04-21 |
Applied Materials, Inc. |
Conductive pad design modification for better wafer-pad contact
|
|
US7655565B2
(en)
*
|
2005-01-26 |
2010-02-02 |
Applied Materials, Inc. |
Electroprocessing profile control
|
|
US7427340B2
(en)
|
2005-04-08 |
2008-09-23 |
Applied Materials, Inc. |
Conductive pad
|
|
US20110094895A1
(en)
*
|
2005-05-20 |
2011-04-28 |
Stephen Mazur |
Optical detection of planarization, breakthrough and end-point in membrane-mediated electropolishing of metal layers
|
|
US20070181441A1
(en)
*
|
2005-10-14 |
2007-08-09 |
Applied Materials, Inc. |
Method and apparatus for electropolishing
|
|
US7938927B2
(en)
*
|
2006-03-01 |
2011-05-10 |
Camfil Ab |
Method of making a filter assembly
|
|
US7422982B2
(en)
*
|
2006-07-07 |
2008-09-09 |
Applied Materials, Inc. |
Method and apparatus for electroprocessing a substrate with edge profile control
|
|
US8168540B1
(en)
|
2009-12-29 |
2012-05-01 |
Novellus Systems, Inc. |
Methods and apparatus for depositing copper on tungsten
|
|
JP6128941B2
(en)
*
|
2013-05-10 |
2017-05-17 |
ルネサスエレクトロニクス株式会社 |
Semiconductor device manufacturing method and semiconductor manufacturing apparatus
|
|
CN104894634A
(en)
*
|
2014-03-03 |
2015-09-09 |
盛美半导体设备(上海)有限公司 |
Novel electrochemical polishing device
|
|
CN111632779B
(en)
*
|
2020-05-21 |
2023-03-24 |
国网宁夏电力有限公司检修公司 |
Conductive liquid spraying device for high-voltage isolating switch
|
|
GB202308117D0
(en)
*
|
2023-05-31 |
2023-07-12 |
Holdson Ltd |
System and method for electrolyte flow control in electrochemical polishing apparatus
|