AU2001274593A1 - Cold-setting composition - Google Patents
Cold-setting compositionInfo
- Publication number
- AU2001274593A1 AU2001274593A1 AU2001274593A AU7459301A AU2001274593A1 AU 2001274593 A1 AU2001274593 A1 AU 2001274593A1 AU 2001274593 A AU2001274593 A AU 2001274593A AU 7459301 A AU7459301 A AU 7459301A AU 2001274593 A1 AU2001274593 A1 AU 2001274593A1
- Authority
- AU
- Australia
- Prior art keywords
- cold
- setting composition
- composition
- setting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
- C08K5/098—Metal salts of carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/07—Aldehydes; Ketones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Sealing Material Composition (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000193927 | 2000-06-28 | ||
| JP2000193928 | 2000-06-28 | ||
| JP2000-193928 | 2000-06-28 | ||
| JP2000-193927 | 2000-06-28 | ||
| JP2000-310046 | 2000-10-11 | ||
| JP2000310046 | 2000-10-11 | ||
| PCT/JP2001/005370 WO2002000784A1 (en) | 2000-06-28 | 2001-06-22 | Cold-setting composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001274593A1 true AU2001274593A1 (en) | 2002-01-08 |
Family
ID=27343871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001274593A Abandoned AU2001274593A1 (en) | 2000-06-28 | 2001-06-22 | Cold-setting composition |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20030149152A1 (en) |
| EP (1) | EP1298169A4 (en) |
| JP (1) | JP4951839B2 (en) |
| CN (1) | CN1210346C (en) |
| AU (1) | AU2001274593A1 (en) |
| TW (1) | TW554002B (en) |
| WO (1) | WO2002000784A1 (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060263531A1 (en) * | 2003-12-18 | 2006-11-23 | Lichtenhan Joseph D | Polyhedral oligomeric silsesquioxanes as glass forming coatings |
| US20080075872A1 (en) * | 1999-08-04 | 2008-03-27 | Lichtenhan Joseph D | Nanoscopic Assurance Coating for Lead-Free Solders |
| WO2005007751A1 (en) | 2003-07-18 | 2005-01-27 | Konishi Co., Ltd. | Curable resin composition and cold-setting adhesive |
| TW200708544A (en) * | 2005-05-24 | 2007-03-01 | Hybrid Plastics Inc | Polyhedral oligomeric silsesquioxanes as glass forming coatings |
| ATE531755T1 (en) * | 2006-07-11 | 2011-11-15 | Dsm Ip Assets Bv | COMPOSITION COMPRISING A POLYMER AND AN OXIDATION CATALYST |
| US20080064815A1 (en) * | 2006-09-12 | 2008-03-13 | Henkel Corporation | Reinforcement and Cure Enhancement of Curable Resins |
| ATE552296T1 (en) * | 2007-09-28 | 2012-04-15 | Dow Global Technologies Llc | IN-SITU PROCESS FOR GENERATING WATER BY DEHYDRATION OF METAL HYDRATES FOR MOISTURE CROSSLINKING OF POLYOLEFINS |
| US20110098410A1 (en) * | 2008-05-02 | 2011-04-28 | Kaneka Corporation | Room temperature-curable composition and cured product thereof |
| DE102010042712A1 (en) * | 2010-10-20 | 2012-04-26 | Wacker Chemie Ag | Self-adhesive hardener composition |
| DE102010052016A1 (en) | 2010-11-19 | 2012-05-24 | Tremco Illbruck Produktion Gmbh | Fast-curing compound with good adhesive properties |
| JP5959827B2 (en) * | 2011-11-02 | 2016-08-02 | ノガワケミカル株式会社 | Adhesive composition |
| JP2014001333A (en) * | 2012-06-20 | 2014-01-09 | Techno Brains:Kk | Curing accelerator for one-pack type moisture curable resin and curing acceleration method using the same |
| US9512342B1 (en) * | 2014-10-14 | 2016-12-06 | Sun Coatings, Inc. | Moisture cured polymer and recycled glass roof coating, caulk/sealant and patching compound membranes |
| CN110129000A (en) * | 2019-06-11 | 2019-08-16 | 郝建强 | Free radical cure silicone conducting resinl |
| CN110395792A (en) * | 2019-07-24 | 2019-11-01 | 陕西朗正环保科技有限公司 | A kind of cohesion curing agent and preparation method thereof |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0742376B2 (en) * | 1986-10-29 | 1995-05-10 | 鐘淵化学工業株式会社 | Curable composition |
| JP2700265B2 (en) * | 1989-01-11 | 1998-01-19 | 鐘淵化学工業株式会社 | Curable resin composition |
| JPH051225A (en) * | 1991-06-25 | 1993-01-08 | Kanegafuchi Chem Ind Co Ltd | Curable composition |
| JP3224631B2 (en) * | 1993-05-12 | 2001-11-05 | 積水化学工業株式会社 | Room temperature curable composition |
| JPH073160A (en) * | 1993-06-15 | 1995-01-06 | Shin Etsu Chem Co Ltd | Room temperature curable organopolysiloxane composition |
| JP3550198B2 (en) * | 1994-11-17 | 2004-08-04 | 積水化学工業株式会社 | One-part room temperature curable adhesive composition |
| JPH10182992A (en) * | 1996-11-01 | 1998-07-07 | Kanegafuchi Chem Ind Co Ltd | Curable composition |
| EP0839872B1 (en) * | 1996-11-01 | 2003-03-12 | Kaneka Corporation | Curable polymer having reactive silicon-containing functional groups |
| JPH11293130A (en) * | 1998-04-09 | 1999-10-26 | Yokohama Rubber Co Ltd:The | Composition hardenable at room temperature |
| JP3999876B2 (en) * | 1998-04-27 | 2007-10-31 | 神東塗料株式会社 | Curable resin composition |
| EP1285946B1 (en) * | 2001-08-14 | 2005-05-04 | Kaneka Corporation | Curable resin composition |
-
2001
- 2001-06-22 AU AU2001274593A patent/AU2001274593A1/en not_active Abandoned
- 2001-06-22 US US10/312,741 patent/US20030149152A1/en not_active Abandoned
- 2001-06-22 JP JP2002505902A patent/JP4951839B2/en not_active Expired - Fee Related
- 2001-06-22 EP EP01941187A patent/EP1298169A4/en not_active Withdrawn
- 2001-06-22 CN CN01811794.5A patent/CN1210346C/en not_active Expired - Lifetime
- 2001-06-22 WO PCT/JP2001/005370 patent/WO2002000784A1/en not_active Ceased
- 2001-06-27 TW TW090115589A patent/TW554002B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP1298169A4 (en) | 2006-07-12 |
| EP1298169A1 (en) | 2003-04-02 |
| CN1210346C (en) | 2005-07-13 |
| JP4951839B2 (en) | 2012-06-13 |
| US20030149152A1 (en) | 2003-08-07 |
| CN1439036A (en) | 2003-08-27 |
| WO2002000784A1 (en) | 2002-01-03 |
| TW554002B (en) | 2003-09-21 |
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