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AU2001262326A1 - Electrolysis cell for restoring the concentration of metal ions in processes of electroplating - Google Patents

Electrolysis cell for restoring the concentration of metal ions in processes of electroplating

Info

Publication number
AU2001262326A1
AU2001262326A1 AU2001262326A AU6232601A AU2001262326A1 AU 2001262326 A1 AU2001262326 A1 AU 2001262326A1 AU 2001262326 A AU2001262326 A AU 2001262326A AU 6232601 A AU6232601 A AU 6232601A AU 2001262326 A1 AU2001262326 A1 AU 2001262326A1
Authority
AU
Australia
Prior art keywords
electroplating
restoring
concentration
processes
metal ions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001262326A
Inventor
Gian Nicola Martelli
Ulderico Nevosi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
De Nora Elettrodi SpA
Original Assignee
De Nora Elettrodi SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by De Nora Elettrodi SpA filed Critical De Nora Elettrodi SpA
Publication of AU2001262326A1 publication Critical patent/AU2001262326A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
AU2001262326A 2000-05-31 2001-05-30 Electrolysis cell for restoring the concentration of metal ions in processes of electroplating Abandoned AU2001262326A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IT2000MI001207A IT1318545B1 (en) 2000-05-31 2000-05-31 ELECTROLYSIS CELL FOR THE RESTORATION OF THE CONCENTRATION OF IONIMETALLIC IN ELECTRODEPOSITION PROCESSES.
ITMI200A001207 2000-05-31
PCT/EP2001/006161 WO2001092604A2 (en) 2000-05-31 2001-05-30 Electrolysis cell for restoring the concentration of metal ions in processes of electroplating

Publications (1)

Publication Number Publication Date
AU2001262326A1 true AU2001262326A1 (en) 2001-12-11

Family

ID=11445158

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001262326A Abandoned AU2001262326A1 (en) 2000-05-31 2001-05-30 Electrolysis cell for restoring the concentration of metal ions in processes of electroplating

Country Status (3)

Country Link
AU (1) AU2001262326A1 (en)
IT (1) IT1318545B1 (en)
WO (1) WO2001092604A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMI20011374A1 (en) * 2001-06-29 2002-12-29 De Nora Elettrodi Spa ELECTROLYSIS CELL FOR THE RESTORATION OF THE CONCENTRATION OF METAL IONS IN ELECTRODEPOSITION PROCESSES
DE102010044551A1 (en) * 2010-09-07 2012-03-08 Coventya Gmbh Anode and their use in an alkaline electroplating bath
CN104947173A (en) * 2015-05-22 2015-09-30 北京中冶设备研究设计总院有限公司 Device and method for improving pH value of continuous electronickelling solution
CN104894633A (en) * 2015-05-22 2015-09-09 北京中冶设备研究设计总院有限公司 Continuous nickel electroplating solution supply device
US9920448B2 (en) * 2015-11-18 2018-03-20 Applied Materials, Inc. Inert anode electroplating processor and replenisher with anionic membranes
WO2020042870A1 (en) * 2018-08-27 2020-03-05 叶涛 Plating solution production and regeneration process and device for insoluble anode acid copper electroplating
US11339483B1 (en) 2021-04-05 2022-05-24 Alchemr, Inc. Water electrolyzers employing anion exchange membranes
CN113463156B (en) * 2021-07-23 2022-09-20 中国科学院青海盐湖研究所 Magnesium hydroxide film layer and preparation method and system thereof
WO2024078627A1 (en) * 2022-10-14 2024-04-18 叶涛 Electrolytic copper dissolution-integrated insoluble anode copper plating process optimization method and apparatus

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2479856A1 (en) * 1980-04-04 1981-10-09 Electricite De France Regeneration of metal plating soln. - using cell contg. anodic membrane and soluble metal anode
JP2671013B2 (en) * 1988-06-16 1997-10-29 ディップソール株式会社 Method for supplying nickel ions in alkaline nickel or nickel alloy plating
JPH0270087A (en) * 1988-09-01 1990-03-08 Nippon Kinzoku Co Ltd Method and apparatus for plating tin
JPH0826480B2 (en) * 1989-03-28 1996-03-13 日本エレクトロプレイテイング・エンジニヤース株式会社 Plating device and plating metal supply method
US5082538A (en) * 1991-01-09 1992-01-21 Eltech Systems Corporation Process for replenishing metals in aqueous electrolyte solutions
US5100517A (en) * 1991-04-08 1992-03-31 The Goodyear Tire & Rubber Company Process for applying a copper layer to steel wire
JPH04362199A (en) * 1991-06-06 1992-12-15 Nec Corp Electroplating device
JPH05302199A (en) * 1992-04-24 1993-11-16 Bridgestone Bekaert Steel Code Kk Method for controlling composition of copper plating bath in copper plating using insoluble anode
JPH06158397A (en) * 1992-11-18 1994-06-07 Asahi Glass Co Ltd Metal electroplating method
US6365017B1 (en) * 1998-09-08 2002-04-02 Ebara Corporation Substrate plating device

Also Published As

Publication number Publication date
ITMI20001207A1 (en) 2001-12-01
IT1318545B1 (en) 2003-08-27
WO2001092604A3 (en) 2002-04-25
ITMI20001207A0 (en) 2000-05-31
WO2001092604A2 (en) 2001-12-06

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