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AU2001255248A1 - Low dielectric constant organic dielectrics based on cage-like structures - Google Patents

Low dielectric constant organic dielectrics based on cage-like structures

Info

Publication number
AU2001255248A1
AU2001255248A1 AU2001255248A AU5524801A AU2001255248A1 AU 2001255248 A1 AU2001255248 A1 AU 2001255248A1 AU 2001255248 A AU2001255248 A AU 2001255248A AU 5524801 A AU5524801 A AU 5524801A AU 2001255248 A1 AU2001255248 A1 AU 2001255248A1
Authority
AU
Australia
Prior art keywords
dielectric constant
low dielectric
cage
structures
constant organic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001255248A
Inventor
Emma Brouk
Boris Korolev
Kreisler Lau
Roger Leung
Feng Quan Liu
Ruslan Zherebin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of AU2001255248A1 publication Critical patent/AU2001255248A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/246—Intercrosslinking of at least two polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F257/00—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00
    • C08F257/02—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00 on to polymers of styrene or alkyl-substituted styrenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/003—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/902—Specified use of nanostructure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/963—Miscellaneous

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Formation Of Insulating Films (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Rolling Contact Bearings (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Organic Insulating Materials (AREA)
  • Polyethers (AREA)
  • Micromachines (AREA)
  • Laminated Bodies (AREA)

Abstract

A low dielectric constant material has a first backbone with an aromatic moiety and a first reactive group, and a second backbone with an aromatic moiety and a second reactive group, wherein the first and second backbones are crosslinked via the first and second reactive groups in a crosslinking reaction without an additional crosslinker, and wherein a cage structure having at least 10 atoms is covalently bound to at least one of the first and second backbone.
AU2001255248A 2000-04-07 2001-04-06 Low dielectric constant organic dielectrics based on cage-like structures Abandoned AU2001255248A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/545,058 US6509415B1 (en) 2000-04-07 2000-04-07 Low dielectric constant organic dielectrics based on cage-like structures
US09545058 2000-04-07
PCT/US2001/011273 WO2001078110A2 (en) 2000-04-07 2001-04-06 Low dielectric constant organic dielectrics based on cage-like structures

Publications (1)

Publication Number Publication Date
AU2001255248A1 true AU2001255248A1 (en) 2001-10-23

Family

ID=24174726

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001255248A Abandoned AU2001255248A1 (en) 2000-04-07 2001-04-06 Low dielectric constant organic dielectrics based on cage-like structures

Country Status (10)

Country Link
US (2) US6509415B1 (en)
EP (1) EP1274755B1 (en)
JP (1) JP4795607B2 (en)
KR (1) KR100823777B1 (en)
CN (1) CN1227276C (en)
AT (1) ATE386758T1 (en)
AU (1) AU2001255248A1 (en)
DE (1) DE60132883T2 (en)
HK (1) HK1054398A1 (en)
WO (1) WO2001078110A2 (en)

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EP1373358A4 (en) * 2001-04-06 2005-03-16 Honeywell Int Inc Low dielectric constant materials and methods of preparation thereof
US7141188B2 (en) * 2001-05-30 2006-11-28 Honeywell International Inc. Organic compositions
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US20040247896A1 (en) * 2001-12-31 2004-12-09 Paul Apen Organic compositions
WO2003057755A1 (en) * 2002-01-08 2003-07-17 Honeywell International Inc. Organic composition
CN1643669A (en) * 2002-01-15 2005-07-20 霍尼韦尔国际公司 Organic compositions for low dielectric constant material
US7060204B2 (en) * 2002-04-29 2006-06-13 Honeywell International Inc. Organic compositions
US6855738B2 (en) * 2003-06-06 2005-02-15 Dow Global Technologies Inc. Nanoporous laminates
US7488565B2 (en) * 2003-10-01 2009-02-10 Chevron U.S.A. Inc. Photoresist compositions comprising diamondoid derivatives
US7208243B2 (en) * 2004-12-01 2007-04-24 Toyota Technical Center Usa, Inc. Proton exchange membranes using cycloaddition reaction between azide and alkyne containing components
KR20060090483A (en) * 2005-02-07 2006-08-11 삼성코닝 주식회사 A composition for forming a low dielectric thin film containing fullerene, a method of manufacturing a low dielectric thin film and a low dielectric thin film using the same
US7531209B2 (en) 2005-02-24 2009-05-12 Michael Raymond Ayers Porous films and bodies with enhanced mechanical strength
JP4516857B2 (en) * 2005-02-28 2010-08-04 富士フイルム株式会社 Polymer having cage structure, film-forming composition containing the same, insulating film and electronic device
JP2006253577A (en) * 2005-03-14 2006-09-21 Fuji Photo Film Co Ltd Insulating film, its manufacturing method and device having same
JP4368319B2 (en) * 2005-03-14 2009-11-18 富士フイルム株式会社 Insulating film, method of manufacturing the same, and electronic device using the same
JP2006253573A (en) * 2005-03-14 2006-09-21 Fuji Photo Film Co Ltd Insulating film, method of manufacturing the same, and electronic device using the same
JP2006291160A (en) * 2005-03-14 2006-10-26 Fuji Photo Film Co Ltd Film-forming composition, insulating film and electronic device using the same
JP4542927B2 (en) * 2005-03-17 2010-09-15 富士フイルム株式会社 Film forming composition, insulating film obtained from the composition, and electronic device having the same
US20070090545A1 (en) * 2005-10-24 2007-04-26 Condie Brian W Semiconductor device with improved encapsulation
US7435625B2 (en) * 2005-10-24 2008-10-14 Freescale Semiconductor, Inc. Semiconductor device with reduced package cross-talk and loss
US7432133B2 (en) * 2005-10-24 2008-10-07 Freescale Semiconductor, Inc. Plastic packaged device with die interface layer
JP2007161779A (en) * 2005-12-09 2007-06-28 Fujifilm Corp Film forming composition
KR20090004969A (en) * 2006-03-29 2009-01-12 스미토모 베이클리트 컴퍼니 리미티드 Resin composition, varnish, resin film, and semiconductor device using the same
US7875315B2 (en) 2006-05-31 2011-01-25 Roskilde Semiconductor Llc Porous inorganic solids for use as low dielectric constant materials
WO2007143029A1 (en) 2006-05-31 2007-12-13 Roskilde Semiconductor Llc Porous materials derived from polymer composites
US7790234B2 (en) 2006-05-31 2010-09-07 Michael Raymond Ayers Low dielectric constant materials prepared from soluble fullerene clusters
US7919188B2 (en) 2006-05-31 2011-04-05 Roskilde Semiconductor Llc Linked periodic networks of alternating carbon and inorganic clusters for use as low dielectric constant materials
JP5134233B2 (en) 2006-11-29 2013-01-30 出光興産株式会社 ADAMANTAN DERIVATIVE, PROCESS FOR PRODUCING THE SAME AND RESIN COMPOSITION CONTAINING ADAMANTAN DERIVATIVE
US20080173541A1 (en) * 2007-01-22 2008-07-24 Eal Lee Target designs and related methods for reduced eddy currents, increased resistance and resistivity, and enhanced cooling
US20090026924A1 (en) * 2007-07-23 2009-01-29 Leung Roger Y Methods of making low-refractive index and/or low-k organosilicate coatings
US8702919B2 (en) * 2007-08-13 2014-04-22 Honeywell International Inc. Target designs and related methods for coupled target assemblies, methods of production and uses thereof
CN101219934B (en) * 2008-01-25 2010-06-02 吉林大学 4,8-bis(1-adamantyl)-1,5-naphthalenediol, its preparation method and its use in synthesizing polymer materials
US20130320326A1 (en) * 2011-02-18 2013-12-05 Idemitsu Kosan Co., Ltd. Insulating material forming composition for electronic devices, insulating material for electronic devices, electronic devices and thin film transistor
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CN109294203B (en) * 2018-10-10 2021-04-09 湖南七纬科技有限公司 Flame-retardant fireproof material for new energy automobile power battery and preparation method thereof

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Also Published As

Publication number Publication date
WO2001078110A2 (en) 2001-10-18
EP1274755A2 (en) 2003-01-15
KR100823777B1 (en) 2008-04-21
CN1420899A (en) 2003-05-28
KR20020091181A (en) 2002-12-05
WO2001078110A3 (en) 2002-03-07
EP1274755A4 (en) 2004-05-12
DE60132883T2 (en) 2009-03-05
JP2003530464A (en) 2003-10-14
WO2001078110B1 (en) 2002-05-16
US20030187139A1 (en) 2003-10-02
DE60132883D1 (en) 2008-04-03
CN1227276C (en) 2005-11-16
EP1274755B1 (en) 2008-02-20
US6509415B1 (en) 2003-01-21
JP4795607B2 (en) 2011-10-19
ATE386758T1 (en) 2008-03-15
US6849696B2 (en) 2005-02-01
HK1054398A1 (en) 2003-11-28

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