ATE401364T1 - Organisches silicatpolymer und dieses umfassender isolierfilm - Google Patents
Organisches silicatpolymer und dieses umfassender isolierfilmInfo
- Publication number
- ATE401364T1 ATE401364T1 AT03713057T AT03713057T ATE401364T1 AT E401364 T1 ATE401364 T1 AT E401364T1 AT 03713057 T AT03713057 T AT 03713057T AT 03713057 T AT03713057 T AT 03713057T AT E401364 T1 ATE401364 T1 AT E401364T1
- Authority
- AT
- Austria
- Prior art keywords
- mixture
- silane
- silicate polymer
- organic silicate
- insulating film
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Polymers & Plastics (AREA)
- Formation Of Insulating Films (AREA)
- Silicon Polymers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2002-0021140A KR100508900B1 (ko) | 2002-04-18 | 2002-04-18 | 유기실리케이트 중합체 및 이를 함유하는 절연막 |
| KR10-2002-0021141A KR100508901B1 (ko) | 2002-04-18 | 2002-04-18 | 유기실리케이트 중합체 및 이를 함유하는 절연막 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE401364T1 true ATE401364T1 (de) | 2008-08-15 |
Family
ID=29738503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT03713057T ATE401364T1 (de) | 2002-04-18 | 2003-03-28 | Organisches silicatpolymer und dieses umfassender isolierfilm |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US7834119B2 (de) |
| EP (1) | EP1495066B1 (de) |
| JP (1) | JP4142643B2 (de) |
| CN (1) | CN100381483C (de) |
| AT (1) | ATE401364T1 (de) |
| AU (1) | AU2003218816A1 (de) |
| DE (1) | DE60322202D1 (de) |
| TW (1) | TWI328017B (de) |
| WO (1) | WO2003104305A1 (de) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100645682B1 (ko) * | 2003-04-17 | 2006-11-13 | 주식회사 엘지화학 | 유기실록산 수지 및 이를 이용한 절연막 |
| JP4465233B2 (ja) * | 2003-06-30 | 2010-05-19 | 三星電子株式会社 | 多官能性環状シロキサン化合物、この化合物から製造されたシロキサン系重合体及びこの重合体を用いた絶縁膜の製造方法 |
| US8053159B2 (en) | 2003-11-18 | 2011-11-08 | Honeywell International Inc. | Antireflective coatings for via fill and photolithography applications and methods of preparation thereof |
| EP1746123A4 (de) * | 2004-05-11 | 2012-03-21 | Jsr Corp | Verfahren zur bildung eines films aus organischem siliciumoxid, film aus organischem siliciumoxid, verdrahtungsstruktur, halbleitervorrichtung und zusammensetzung für die filmbildung |
| JP5110239B2 (ja) * | 2004-05-11 | 2012-12-26 | Jsr株式会社 | 有機シリカ系膜の形成方法、膜形成用組成物 |
| JP5110238B2 (ja) | 2004-05-11 | 2012-12-26 | Jsr株式会社 | 絶縁膜形成用組成物およびその製造方法、ならびにシリカ系絶縁膜およびその形成方法 |
| US8642246B2 (en) | 2007-02-26 | 2014-02-04 | Honeywell International Inc. | Compositions, coatings and films for tri-layer patterning applications and methods of preparation thereof |
| US8557877B2 (en) | 2009-06-10 | 2013-10-15 | Honeywell International Inc. | Anti-reflective coatings for optically transparent substrates |
| US8864898B2 (en) | 2011-05-31 | 2014-10-21 | Honeywell International Inc. | Coating formulations for optical elements |
| JP5814209B2 (ja) * | 2012-10-24 | 2015-11-17 | 信越化学工業株式会社 | コーティング剤組成物、該組成物を含む表面処理剤及び該表面処理剤で表面処理された物品 |
| US10544329B2 (en) | 2015-04-13 | 2020-01-28 | Honeywell International Inc. | Polysiloxane formulations and coatings for optoelectronic applications |
| JP6875063B2 (ja) * | 2015-10-16 | 2021-05-19 | 信越化学工業株式会社 | ヒドロシリル基含有有機ケイ素樹脂の製造方法 |
| US11091506B2 (en) | 2017-08-16 | 2021-08-17 | Asahi Kasei Kabushiki Kaisha | Silanol composition, cured product, adhesive, and method for curing silanol composition |
| JP6844506B2 (ja) * | 2017-11-15 | 2021-03-17 | 信越化学工業株式会社 | ポリシロキサンおよびその製造方法 |
| JP6931324B2 (ja) * | 2017-12-18 | 2021-09-01 | 旭化成株式会社 | 硬化物 |
| JP7201430B2 (ja) * | 2018-12-28 | 2023-01-10 | 旭化成株式会社 | 紫外線発光装置用硬化性組成物、紫外線発光装置用部品、及び紫外線発光装置 |
| JP7144331B2 (ja) * | 2019-01-17 | 2022-09-29 | 旭化成株式会社 | シラノール組成物、硬化物、接着剤、複合膜、及び硬化方法 |
| TWI742534B (zh) | 2019-02-20 | 2021-10-11 | 日商旭化成股份有限公司 | 硬化物、硬化物改質體及硬化方法 |
| JP7377765B2 (ja) * | 2020-05-21 | 2023-11-10 | 信越化学工業株式会社 | オルガノポリシロキサン、およびそれを含有する組成物 |
| US20230279030A1 (en) * | 2020-07-24 | 2023-09-07 | Versum Materials Us, Llc | Cyclosiloxanes and films made therewith |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB632955A (en) | 1946-03-21 | 1949-12-05 | British Thomson Houston Co Ltd | Improvements in and relating to polysiloxanes |
| GB627800A (en) | 1946-07-08 | 1949-08-16 | Dow Chemical Co | Improvements in or relating to the manufacture of new organofluoro-siloxane products |
| GB746193A (en) | 1952-11-06 | 1956-03-14 | Metallgesellschaft Ag | Method of producing organo-silicon polymers |
| CA1204527A (en) * | 1982-08-13 | 1986-05-13 | Theodore F. Retajczyk, Jr. | Polymeric films for electronic circuits |
| US4618665A (en) * | 1986-01-13 | 1986-10-21 | Dow Corning Corporation | Process to prepare 2-phenylpropyl containing polydiorganosiloxanes |
| JP3268818B2 (ja) | 1992-04-23 | 2002-03-25 | 住友ベークライト株式会社 | 半導体封止用組成物 |
| US5548053A (en) * | 1992-05-15 | 1996-08-20 | Wacker-Chemie Gmbh | Process for the preparation of organopolysiloxane resin |
| JP3427412B2 (ja) | 1993-02-25 | 2003-07-14 | 富士通株式会社 | 弗素化ポリシロキサン類およびその製造方法 |
| US5656555A (en) | 1995-02-17 | 1997-08-12 | Texas Instruments Incorporated | Modified hydrogen silsesquioxane spin-on glass |
| WO2000012640A1 (fr) * | 1998-09-01 | 2000-03-09 | Catalysts & Chemicals Industries Co., Ltd. | Fluide de revetement pour preparer un film de revetement a base de silice a faible permittivite et substrat avec film de revetement a faible permittivite |
| JP2000309753A (ja) | 1999-04-27 | 2000-11-07 | Jsr Corp | 膜形成用組成物および絶縁膜形成用材料 |
| US6696538B2 (en) | 1999-07-27 | 2004-02-24 | Lg Chemical Ltd. | Semiconductor interlayer dielectric material and a semiconductor device using the same |
| KR100382702B1 (ko) * | 2000-09-18 | 2003-05-09 | 주식회사 엘지화학 | 유기실리케이트 중합체의 제조방법 |
| CA2463584C (en) * | 2001-10-16 | 2011-06-21 | The University Of Akron | Poly(cyclosiloxane) composition and synthesis |
-
2003
- 2003-03-28 CN CNB038087138A patent/CN100381483C/zh not_active Expired - Fee Related
- 2003-03-28 AU AU2003218816A patent/AU2003218816A1/en not_active Abandoned
- 2003-03-28 JP JP2004511371A patent/JP4142643B2/ja not_active Expired - Lifetime
- 2003-03-28 DE DE60322202T patent/DE60322202D1/de not_active Expired - Lifetime
- 2003-03-28 AT AT03713057T patent/ATE401364T1/de not_active IP Right Cessation
- 2003-03-28 EP EP03713057A patent/EP1495066B1/de not_active Expired - Lifetime
- 2003-03-28 WO PCT/KR2003/000634 patent/WO2003104305A1/en not_active Ceased
- 2003-03-28 US US10/511,639 patent/US7834119B2/en not_active Expired - Lifetime
- 2003-04-02 TW TW092107963A patent/TWI328017B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN1646605A (zh) | 2005-07-27 |
| US20070088144A1 (en) | 2007-04-19 |
| US7834119B2 (en) | 2010-11-16 |
| WO2003104305A1 (en) | 2003-12-18 |
| EP1495066A1 (de) | 2005-01-12 |
| AU2003218816A1 (en) | 2003-12-22 |
| EP1495066B1 (de) | 2008-07-16 |
| TWI328017B (en) | 2010-08-01 |
| DE60322202D1 (de) | 2008-08-28 |
| JP4142643B2 (ja) | 2008-09-03 |
| CN100381483C (zh) | 2008-04-16 |
| TW200401795A (en) | 2004-02-01 |
| JP2005523377A (ja) | 2005-08-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |