ATE467664T1 - Harzzusammensetzung - Google Patents
HarzzusammensetzungInfo
- Publication number
- ATE467664T1 ATE467664T1 AT07715349T AT07715349T ATE467664T1 AT E467664 T1 ATE467664 T1 AT E467664T1 AT 07715349 T AT07715349 T AT 07715349T AT 07715349 T AT07715349 T AT 07715349T AT E467664 T1 ATE467664 T1 AT E467664T1
- Authority
- AT
- Austria
- Prior art keywords
- mass
- alkyl group
- carbon atoms
- hydrogen
- atoms
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title abstract 2
- 125000000217 alkyl group Chemical group 0.000 abstract 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 abstract 4
- 125000004432 carbon atom Chemical group C* 0.000 abstract 3
- 229910052731 fluorine Inorganic materials 0.000 abstract 2
- 239000011737 fluorine Substances 0.000 abstract 2
- 239000000178 monomer Substances 0.000 abstract 2
- 229920001187 thermosetting polymer Polymers 0.000 abstract 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 abstract 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 abstract 1
- 239000004721 Polyphenylene oxide Substances 0.000 abstract 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052794 bromium Inorganic materials 0.000 abstract 1
- 229910052801 chlorine Inorganic materials 0.000 abstract 1
- 239000000460 chlorine Substances 0.000 abstract 1
- 229920001577 copolymer Polymers 0.000 abstract 1
- 239000010419 fine particle Substances 0.000 abstract 1
- 125000001153 fluoro group Chemical group F* 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical group II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 239000001301 oxygen Substances 0.000 abstract 1
- 229910052760 oxygen Inorganic materials 0.000 abstract 1
- 229920000570 polyether Polymers 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/47—Levelling agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/65—Additives macromolecular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
- C08L71/03—Polyepihalohydrins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0212—Resin particles
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Materials Engineering (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyurethanes Or Polyureas (AREA)
- Epoxy Resins (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Graft Or Block Polymers (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Paints Or Removers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006074635 | 2006-03-17 | ||
| PCT/JP2007/056131 WO2007108550A1 (en) | 2006-03-17 | 2007-03-16 | Resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE467664T1 true ATE467664T1 (de) | 2010-05-15 |
Family
ID=38169405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT07715349T ATE467664T1 (de) | 2006-03-17 | 2007-03-16 | Harzzusammensetzung |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20090054577A1 (de) |
| EP (1) | EP1996658B1 (de) |
| KR (1) | KR101347637B1 (de) |
| CN (1) | CN101405355B (de) |
| AT (1) | ATE467664T1 (de) |
| DE (1) | DE602007006442D1 (de) |
| TW (1) | TWI429712B (de) |
| WO (1) | WO2007108550A1 (de) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102924998A (zh) * | 2007-07-18 | 2013-02-13 | 昭和电工株式会社 | 热固性树脂组合物 |
| US20110007490A1 (en) * | 2008-03-21 | 2011-01-13 | Showa Denko K.K. | Resin composition and cured film thereof |
| US8319339B2 (en) * | 2009-07-10 | 2012-11-27 | Stmicroelectronics (Tours) Sas | Surface-mounted silicon chip |
| CN101693418B (zh) * | 2009-10-19 | 2012-07-25 | 杭州电子科技大学 | 一种玻璃纤维网与糊状树脂复合增强薄膜的制备方法 |
| US10119035B2 (en) | 2011-07-26 | 2018-11-06 | Virginia Commonwealth University | Abhesive coatings |
| CN108353496B (zh) * | 2015-12-11 | 2021-09-14 | Dic株式会社 | 柔性印刷配线板增强用热固性材料、带有增强部的柔性印刷配线板、其制造方法及电子设备 |
| WO2018022680A1 (en) | 2016-07-28 | 2018-02-01 | 3M Innovative Properties Company | Segmented silicone polyamide block copolymers and articles containing the same |
| CN109476815B (zh) | 2016-07-28 | 2021-05-04 | 3M创新有限公司 | 分段有机硅聚酰胺嵌段共聚物和包含其的制品 |
| US10353083B2 (en) * | 2017-09-12 | 2019-07-16 | Palo Alto Research Center Incorporated | Monolithic digital x-ray detector stack with energy resolution |
| WO2021020542A1 (ja) * | 2019-08-01 | 2021-02-04 | 株式会社カネカ | 熱硬化性樹脂組成物、熱硬化性樹脂膜、熱硬化膜、積層体、ならびにプリント配線板およびその製造方法 |
| CN111638213A (zh) * | 2020-07-14 | 2020-09-08 | 山东京博石油化工有限公司 | 一种乙醇胺脱硫液中热稳盐含量的检测方法 |
| US20230365749A1 (en) * | 2020-10-05 | 2023-11-16 | Pmc Ouvrie | Novel antifoaming agents |
| CN112210193A (zh) * | 2020-11-26 | 2021-01-12 | 武汉市三选科技有限公司 | 一种高光泽度环氧塑封料芯片保护薄膜及其制备方法 |
| CN113861668B (zh) * | 2021-11-17 | 2023-02-28 | 尼伦化学(上海)有限公司 | 一种高折光指数、高耐磨tpu粒子及制备方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3842966A1 (de) * | 1988-12-21 | 1990-06-28 | Bayer Ag | Transparente laminate |
| US5266455A (en) * | 1990-05-23 | 1993-11-30 | Eastman Kodak Company | Photographic elements containing protective overcoat compositions |
| US5179147A (en) * | 1990-05-23 | 1993-01-12 | Eastman Kodak Company | Protective overcoat compositions and photographic elements containing same |
| US5674951A (en) * | 1994-05-20 | 1997-10-07 | Gencorp Inc. | Abrasion-resistant and low friction coating compositions |
| US5824461A (en) * | 1997-09-17 | 1998-10-20 | Eastman Kodak Company | Fluoropolyether containing aqueous coating compositions for an imaging element |
| DE69918815T2 (de) * | 1998-03-05 | 2005-08-18 | Omnova Solutions Inc., Fairlawn | Einfach reinigbare polymere mehrschichtstoffe |
| JP2001059071A (ja) | 1999-08-23 | 2001-03-06 | Mitsui Mining & Smelting Co Ltd | ソルダーレジスト塗布液 |
| US6660828B2 (en) * | 2001-05-14 | 2003-12-09 | Omnova Solutions Inc. | Fluorinated short carbon atom side chain and polar group containing polymer, and flow, or leveling, or wetting agents thereof |
| JP2003212954A (ja) * | 2002-01-21 | 2003-07-30 | Showa Denko Kk | リン含有ウレタン（メタ）アクリレート化合物および感光性組成物 |
| JP2003327913A (ja) | 2002-05-09 | 2003-11-19 | Hitachi Chem Co Ltd | 樹脂ペースト及びその製造方法 |
| JP2004124015A (ja) | 2002-10-07 | 2004-04-22 | Hitachi Chem Co Ltd | 樹脂組成物及びそれを含む被膜形成材料 |
| US20060286382A1 (en) * | 2005-06-16 | 2006-12-21 | Rohm And Haas Electronic Materials Llc | Articles |
-
2007
- 2007-03-16 EP EP07715349A patent/EP1996658B1/de not_active Not-in-force
- 2007-03-16 TW TW096109208A patent/TWI429712B/zh active
- 2007-03-16 CN CN2007800093964A patent/CN101405355B/zh active Active
- 2007-03-16 DE DE602007006442T patent/DE602007006442D1/de active Active
- 2007-03-16 US US12/279,435 patent/US20090054577A1/en not_active Abandoned
- 2007-03-16 KR KR1020087019548A patent/KR101347637B1/ko active Active
- 2007-03-16 WO PCT/JP2007/056131 patent/WO2007108550A1/en not_active Ceased
- 2007-03-16 AT AT07715349T patent/ATE467664T1/de not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| US20090054577A1 (en) | 2009-02-26 |
| KR101347637B1 (ko) | 2014-01-06 |
| TW200804510A (en) | 2008-01-16 |
| CN101405355B (zh) | 2012-12-05 |
| EP1996658A1 (de) | 2008-12-03 |
| EP1996658B1 (de) | 2010-05-12 |
| DE602007006442D1 (de) | 2010-06-24 |
| KR20080108228A (ko) | 2008-12-12 |
| WO2007108550A1 (en) | 2007-09-27 |
| TWI429712B (zh) | 2014-03-11 |
| CN101405355A (zh) | 2009-04-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |