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ATE393964T1 - Komponente zur erkennung speziell infraroter elektromagnetischer strahlung - Google Patents

Komponente zur erkennung speziell infraroter elektromagnetischer strahlung

Info

Publication number
ATE393964T1
ATE393964T1 AT05824700T AT05824700T ATE393964T1 AT E393964 T1 ATE393964 T1 AT E393964T1 AT 05824700 T AT05824700 T AT 05824700T AT 05824700 T AT05824700 T AT 05824700T AT E393964 T1 ATE393964 T1 AT E393964T1
Authority
AT
Austria
Prior art keywords
chamber
component
electromagnetic radiation
housing
infrared electromagnetic
Prior art date
Application number
AT05824700T
Other languages
English (en)
Inventor
Sebastien Tinnes
Original Assignee
Ulis
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulis filed Critical Ulis
Application granted granted Critical
Publication of ATE393964T1 publication Critical patent/ATE393964T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
    • G01J5/061—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity by controlling the temperature of the apparatus or parts thereof, e.g. using cooling means or thermostats
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G01J5/041—Mountings in enclosures or in a particular environment
    • G01J5/045—Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
    • G01J5/064—Ambient temperature sensor; Housing temperature sensor; Constructional details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Radiation Pyrometers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AT05824700T 2004-12-21 2005-12-12 Komponente zur erkennung speziell infraroter elektromagnetischer strahlung ATE393964T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0413634A FR2879819B1 (fr) 2004-12-21 2004-12-21 Composant de detection de rayonnements electromagnetiques notamment infrarouges

Publications (1)

Publication Number Publication Date
ATE393964T1 true ATE393964T1 (de) 2008-05-15

Family

ID=34954276

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05824700T ATE393964T1 (de) 2004-12-21 2005-12-12 Komponente zur erkennung speziell infraroter elektromagnetischer strahlung

Country Status (10)

Country Link
US (1) US7642515B2 (de)
EP (1) EP1829097B1 (de)
JP (1) JP4854676B2 (de)
CN (1) CN101084575B (de)
AT (1) ATE393964T1 (de)
CA (1) CA2587774C (de)
DE (1) DE602005006435T2 (de)
FR (1) FR2879819B1 (de)
RU (1) RU2391636C2 (de)
WO (1) WO2006067344A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3547047B1 (de) * 2006-08-22 2021-05-19 Juniper Networks, Inc. Vorrichtung und verfahren zur thermischen stabilisierung von pcb-montierten elektronischen bauteilen innerhalb eines geschlossenen gehäuses
US7890055B1 (en) * 2007-07-09 2011-02-15 Everlokt Corporation Touch field compound field detector personal ID
WO2012027739A2 (en) 2010-08-27 2012-03-01 Milwaukee Electric Tool Corporation Thermal detection systems, methods, and devices
JP5500056B2 (ja) * 2010-12-06 2014-05-21 日本電気株式会社 赤外線センサパッケージおよび該赤外線センサパッケージを搭載した電子機器
WO2012125819A2 (en) 2011-03-15 2012-09-20 Milwaukee Electric Tool Corporation Thermal imager
SE538424C2 (sv) * 2011-09-20 2016-06-21 Drs Network & Imaging Systems Llc Värmeisoleringsanordning för IR-övervakningskamera
CN102564595B (zh) * 2011-12-14 2013-11-13 北京卫星环境工程研究所 用于真空低温环境的红外热波检测系统
DE102012005546A1 (de) * 2012-03-21 2013-09-26 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mikrospiegelanordnung und Verfahren zur Herstellung einer Mikrospiegelanordnung
US10794769B2 (en) * 2012-08-02 2020-10-06 Milwaukee Electric Tool Corporation Thermal detection systems, methods, and devices
EP2950525B1 (de) * 2014-05-28 2020-08-12 ams AG Halbleiter-Bildsensor mit integrierten Pixelaufheizen und Verfahren zu dessen Betrieb
FR3023974B1 (fr) * 2014-07-18 2016-07-22 Ulis Procede de fabrication d'un dispositif comprenant un boitier hermetique sous vide et un getter
CN105890699A (zh) * 2015-01-26 2016-08-24 高准有限公司 能够自适应调节工作温度的流量计及其方法
FR3047842B1 (fr) * 2016-02-12 2018-05-18 Commissariat A L'energie Atomique Et Aux Energies Alternatives Composant electronique a resistance metallique suspendue dans une cavite fermee
FR3056292B1 (fr) * 2016-09-22 2020-11-20 Commissariat Energie Atomique Structure de detection de rayonnements electromagnetiques de type bolometre et procede de fabrication d'une telle structure
EP3568679B1 (de) 2017-01-11 2021-03-10 Koninklijke Philips N.V. Integrierter temperatursensor auf einer blei-selenid-plattendetektoranordnung
CN106872372B (zh) * 2017-03-17 2023-11-17 广西电网有限责任公司电力科学研究院 一种用于气体分析的恒温积分球装置
CN107589463B (zh) * 2017-08-28 2024-02-02 河南理工大学 一种测试煤自燃过程电磁辐射的系统
JP2020536236A (ja) * 2017-10-02 2020-12-10 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 集積温度センシングを備えた赤外線検出器アセンブリ、ガス測定装置及び方法
US20230145676A1 (en) * 2020-08-18 2023-05-11 Mitsubishi Electric Corporation Infrared sensor device

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4743762A (en) * 1984-12-20 1988-05-10 Hughes Aircraft Company Noise immune infrared readout circuitry and technique
GB2207501A (en) * 1987-07-31 1989-02-01 Philips Electronic Associated Radiation detector arrangements and methods using resistors with high positive temperature coefficients
JPH05206423A (ja) * 1992-01-27 1993-08-13 Sony Corp 固体撮像装置
JP2737518B2 (ja) * 1992-03-16 1998-04-08 富士通株式会社 赤外線検知器の冷却構造
JPH05332841A (ja) * 1992-05-27 1993-12-17 Fujitsu Ltd 赤外線検知素子の冷却温度補正回路
WO1994000950A1 (en) * 1992-06-19 1994-01-06 Honeywell Inc. Infrared camera with thermoelectric temperature stabilization
DE4338539A1 (de) * 1993-11-11 1995-05-18 Hoechst Ceram Tec Ag Verfahren zum Herstellen von keramischen Heizelementen
US5423119A (en) * 1994-07-08 1995-06-13 Hualon Microelectronics Corporation Method for manufacturing a hybrid circuit charge-coupled device image sensor
US5763885A (en) * 1995-12-19 1998-06-09 Loral Infrared & Imaging Systems, Inc. Method and apparatus for thermal gradient stabilization of microbolometer focal plane arrays
US5914488A (en) 1996-03-05 1999-06-22 Mitsubishi Denki Kabushiki Kaisha Infrared detector
JP4300305B2 (ja) * 1999-04-02 2009-07-22 日産自動車株式会社 熱型赤外線撮像素子
SE515856C2 (sv) * 1999-05-19 2001-10-22 Ericsson Telefon Ab L M Bärare för elektronikkomponenter
WO2002039508A1 (fr) * 2000-11-08 2002-05-16 Mitsubishi Denki Kabushiki Kaisha Materiau de bolometre, film mince de bolometre, procede de fabrication d'un film mince de bolometre et element de detection infrarouge faisant appel audit film
FR2842022B1 (fr) * 2002-07-03 2005-05-06 Commissariat Energie Atomique Dispositif de maintien d'un objet sous vide et procedes de fabrication de ce dispositif, application aux detecteurs intrarouges non refroidis
US6960741B2 (en) * 2002-08-26 2005-11-01 Lexmark International, Inc. Large area alumina ceramic heater
JP3703480B2 (ja) * 2002-12-27 2005-10-05 松下電器産業株式会社 電子デバイスおよびその製造方法
RU2231759C1 (ru) * 2002-12-30 2004-06-27 Институт физики полупроводников Объединенного института физики полупроводников СО РАН Устройство регистрации теплового излучения
US20040147056A1 (en) * 2003-01-29 2004-07-29 Mckinnell James C. Micro-fabricated device and method of making
JP2004279103A (ja) * 2003-03-13 2004-10-07 Fujitsu Ltd 焦電型赤外線センサおよびそれを用いた赤外撮像装置

Also Published As

Publication number Publication date
DE602005006435T2 (de) 2009-06-04
RU2391636C2 (ru) 2010-06-10
CA2587774A1 (fr) 2006-06-29
JP2008524621A (ja) 2008-07-10
US20090140149A1 (en) 2009-06-04
JP4854676B2 (ja) 2012-01-18
FR2879819A1 (fr) 2006-06-23
FR2879819B1 (fr) 2007-02-23
RU2007123218A (ru) 2008-12-27
CN101084575A (zh) 2007-12-05
CA2587774C (fr) 2014-07-15
EP1829097B1 (de) 2008-04-30
CN101084575B (zh) 2011-06-22
EP1829097A1 (de) 2007-09-05
WO2006067344A1 (fr) 2006-06-29
US7642515B2 (en) 2010-01-05
DE602005006435D1 (de) 2008-06-12

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