[go: up one dir, main page]

NO984135D0 - Fremgangsmåte ved fremstilling av et metallag på en overflate av en gjenstand for skjerming mot elektromagnetisk stråling - Google Patents

Fremgangsmåte ved fremstilling av et metallag på en overflate av en gjenstand for skjerming mot elektromagnetisk stråling

Info

Publication number
NO984135D0
NO984135D0 NO984135A NO984135A NO984135D0 NO 984135 D0 NO984135 D0 NO 984135D0 NO 984135 A NO984135 A NO 984135A NO 984135 A NO984135 A NO 984135A NO 984135 D0 NO984135 D0 NO 984135D0
Authority
NO
Norway
Prior art keywords
shielding
producing
metal layer
electromagnetic radiation
electromagnetic
Prior art date
Application number
NO984135A
Other languages
English (en)
Norwegian (no)
Other versions
NO984135L (no
Inventor
Lars Eriksson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from SE9600967A external-priority patent/SE9600967D0/xx
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Publication of NO984135L publication Critical patent/NO984135L/no
Publication of NO984135D0 publication Critical patent/NO984135D0/no

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0092—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive pigments, e.g. paint, ink, tampon printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0534—Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Printing Methods (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Decoration By Transfer Pictures (AREA)
NO984135A 1996-03-13 1998-09-08 Fremgangsmåte ved fremstilling av et metallag på en overflate av en gjenstand for skjerming mot elektromagnetisk stråling NO984135D0 (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9600967A SE9600967D0 (sv) 1995-12-07 1996-03-13 Sätt att åstadkomma ett metalliskt skikt på en detaljs yta för avskärmning mot elektromagnetisk strålning
PCT/SE1997/000372 WO1997034459A2 (fr) 1996-03-13 1997-03-04 Procede de formation d'une couche metallique a la surface d'un element destinee a menager un blindage contre les rayonnements electromagnetiques

Publications (2)

Publication Number Publication Date
NO984135L NO984135L (no) 1998-09-08
NO984135D0 true NO984135D0 (no) 1998-09-08

Family

ID=20401776

Family Applications (1)

Application Number Title Priority Date Filing Date
NO984135A NO984135D0 (no) 1996-03-13 1998-09-08 Fremgangsmåte ved fremstilling av et metallag på en overflate av en gjenstand for skjerming mot elektromagnetisk stråling

Country Status (13)

Country Link
US (1) US6200630B1 (fr)
EP (1) EP0886996B1 (fr)
JP (1) JP4166828B2 (fr)
CN (1) CN1108736C (fr)
AU (1) AU710484B2 (fr)
CA (1) CA2248127A1 (fr)
DE (1) DE69733342D1 (fr)
HU (1) HUP9901571A3 (fr)
NO (1) NO984135D0 (fr)
NZ (1) NZ331662A (fr)
PL (1) PL182631B1 (fr)
RU (1) RU2194376C2 (fr)
WO (1) WO1997034459A2 (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0886996B1 (fr) 1996-03-13 2005-05-25 Telefonaktiebolaget LM Ericsson (publ) Procede de formation d'une couche metallique a la surface d'un element destinee a menager un blindage contre les rayonnements electromagnetiques
DE69838762T2 (de) * 1997-06-24 2008-04-30 Bridgestone Corp. Elektromagnetische Wellen abschirmende lichtdurchlässige Platte
SE9703410D0 (sv) * 1997-09-22 1997-09-22 Ericsson Telefon Ab L M Sätt att överföra en bild på oregelbundna ytor
SE518428C2 (sv) * 1998-04-27 2002-10-08 Ericsson Telefon Ab L M Anpassat ledande skikt
SE518429C2 (sv) * 1998-12-21 2002-10-08 Ericsson Telefon Ab L M Tampodyna samt förfarande vid tampotryckning
SE521347C2 (sv) * 1999-01-22 2003-10-21 Ericsson Telefon Ab L M Förfarande vid påläggning av en bild på en kliché samt en kliché
CA2401168A1 (fr) 2000-02-28 2001-09-07 Amesbury Group, Inc. Procede et dispositif d'antiparasitage
AU2001241847A1 (en) * 2000-02-28 2001-09-12 Amesbury Group, Inc. Methods and apparatus for emi shielding
SE517303C2 (sv) 2000-03-14 2002-05-21 Ericsson Telefon Ab L M Förfarande för att trycka en elektriskt ledande beläggning på en elektronisk enhet
SE0001025D0 (sv) * 2000-03-21 2000-03-21 Lars Eriksson Metod att tampongtrycka på en detalj
NO20014376L (no) * 2001-09-07 2003-03-10 Pe Dev As Fremgangsmåte og anordning for skjerming mot elektromagnetiske felter
WO2007006050A2 (fr) * 2005-07-06 2007-01-11 First Data Corporation Conditionnement securise de dispositifs a identification par radiofrequence (rfid)
DE102005034166A1 (de) * 2005-07-21 2007-02-01 Osram Opto Semiconductors Gmbh Gehäuse für ein elektromagnetische Strahlung emittierendes optoelektronisches Bauelement, elektromagnetische Strahlung emittierendes Bauelement und Verfahren zum Herstellen eines Gehäuses oder eines Bauelements
US7743702B2 (en) * 2006-07-18 2010-06-29 Max Levy Autograph, Inc. Method for applying electronic circuits to curved surfaces
CN101547576A (zh) * 2008-03-25 2009-09-30 深圳富泰宏精密工业有限公司 壳体的制造方法
TWI406715B (zh) * 2008-04-18 2013-09-01 Fih Hong Kong Ltd 殼體之製造方法
WO2021064446A1 (fr) 2019-10-01 2021-04-08 Serov Igor Procédé de protection d'objets biologiques contre l'influence négative d'un rayonnement électromagnétique technogène

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3594490A (en) * 1970-07-17 1971-07-20 Ibm Electronic grounding system
US4670347A (en) * 1986-03-12 1987-06-02 Topflight Corp. RFI/EMI shielding apparatus
US5047260A (en) * 1987-02-06 1991-09-10 Key-Tech, Inc. Method for producing a shielded plastic enclosure to house electronic equipment
US4890199A (en) * 1988-11-04 1989-12-26 Motorola, Inc. Miniature shield with opposing cantilever spring fingers
RU2025058C1 (ru) * 1989-08-25 1994-12-15 Акционерное общество открытого типа "Научно-исследовательский технологический институт" Технологическая подложка для изготовления многоуровневых толстопленочных печатных плат
DE69132237T2 (de) * 1990-03-19 2001-02-22 Asahi Kasei Kogyo K.K., Osaka Paste zum hochtemperaturbrennen
RU2011543C1 (ru) * 1991-03-28 1994-04-30 Анатолий Григорьевич Дворников Способ изготовления гравюрных оттисков
RU2016773C1 (ru) * 1991-12-18 1994-07-30 Виктор Васильевич Хаблученко Устройство для нанесения узора на листовое стекло
DE4319965C3 (de) * 1993-06-14 2000-09-14 Emi Tec Elektronische Material Verfahren zur Herstellung eines Gehäuses mit elektromagnetischer Abschirmung
US5543333A (en) * 1993-09-30 1996-08-06 Siemens Solar Gmbh Method for manufacturing a solar cell having combined metallization
EP0886996B1 (fr) 1996-03-13 2005-05-25 Telefonaktiebolaget LM Ericsson (publ) Procede de formation d'une couche metallique a la surface d'un element destinee a menager un blindage contre les rayonnements electromagnetiques

Also Published As

Publication number Publication date
AU2049297A (en) 1997-10-01
JP2000510650A (ja) 2000-08-15
CN1218605A (zh) 1999-06-02
EP0886996B1 (fr) 2005-05-25
DE69733342D1 (de) 2005-06-30
WO1997034459A3 (fr) 1997-12-04
PL182631B1 (pl) 2002-02-28
US6200630B1 (en) 2001-03-13
NO984135L (no) 1998-09-08
HUP9901571A1 (hu) 1999-08-30
HUP9901571A3 (en) 1999-11-29
WO1997034459A2 (fr) 1997-09-18
NZ331662A (en) 2000-04-28
CN1108736C (zh) 2003-05-14
JP4166828B2 (ja) 2008-10-15
EP0886996A2 (fr) 1998-12-30
AU710484B2 (en) 1999-09-23
PL328805A1 (en) 1999-02-15
CA2248127A1 (fr) 1997-09-18
RU2194376C2 (ru) 2002-12-10

Similar Documents

Publication Publication Date Title
NO984135D0 (no) Fremgangsmåte ved fremstilling av et metallag på en overflate av en gjenstand for skjerming mot elektromagnetisk stråling
US5120381B1 (en) Method of forming a protective coating on metallic pipe
IL124391A0 (en) Apparatus and method for shielding an electronic module from electromagnetic radiation
FI956226L (fi) Menetelmä ja järjestely elektronisen väliaineen sähkömagneettiseksi suojaamiseksi
GB9808827D0 (en) A method for forming a conductive layer using an atomic layer deposition process
GB2245596B (en) A method of forming a metal wiring layer
GB2337145B (en) Method for delegated use of an electronic key
NO934862D0 (no) Fremgangsmaate for aa produsere et termisk barrierebelegg paa et met allsubstrat
DE3364472D1 (en) A method for depositing a metal layer on polyesters
FI942778L (fi) Menetelmä suojuksella sähkömagneettista säteilyä vastaan varustetun kotelon valmistamiseksi
HUP0004103A3 (en) Method for producing a shielding case
GB2307427B (en) Process for removing a protective coating from a surface of an airfoil
BR9501591A (pt) Método de formação de um revestimento protetor de alto brilho em imagens
PT101932A (pt) Metodo de formacao de uma camada protectora sobrs uma camada de metal reflector isento de cobre
EP1025912A4 (fr) Procede de formation d'un film protecteur metallique a deux couches
GB2266002B (en) A method of removing radioactive material from metallic objects
NO944446D0 (no) Fremgangsmåte ved fremstilling av metall
GB9308581D0 (en) A method for induction of antigen-specific suppression of immune-response
GB2306349B (en) A method of coating a surface of an object
AU8481498A (en) A device for improving shielding effectiveness of an electromagnetic interference enclosure
SE9604090D0 (sv) Sätt att åstadkomma ett matalliskt skikt på en på detaljs yta för avskärmning mot elektromagnetisk strålning
SE9504384D0 (sv) Sätt att åstadkomma ett metalliskt skikt på en detaljs yta för avskärmning mot elektromagnetisk strålning
SE9600967D0 (sv) Sätt att åstadkomma ett metalliskt skikt på en detaljs yta för avskärmning mot elektromagnetisk strålning
GB9404738D0 (en) A computer-aided method of designing a carry-lookahead adder
GB9207733D0 (en) Method of manufacturing printed wiring boards having electromagnetic wave shielding

Legal Events

Date Code Title Description
FC2A Withdrawal, rejection or dismissal of laid open patent application