MY149475A - Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics - Google Patents
Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronicsInfo
- Publication number
- MY149475A MY149475A MYPI20090622A MY149475A MY 149475 A MY149475 A MY 149475A MY PI20090622 A MYPI20090622 A MY PI20090622A MY 149475 A MY149475 A MY 149475A
- Authority
- MY
- Malaysia
- Prior art keywords
- stretchable
- semiconductors
- nanomembranes
- electronic circuits
- stretchable electronics
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
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- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0067—Mechanical properties
- B81B3/0078—Constitution or structural means for improving mechanical properties not provided for in B81B3/007 - B81B3/0075
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76829—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
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- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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- H05K1/02—Details
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- H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
- H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
- H10D30/472—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having lower bandgap active layer formed on top of wider bandgap layer, e.g. inverted HEMT
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- H10D62/117—Shapes of semiconductor bodies
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- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
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- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
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- H10D62/881—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being a two-dimensional material
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- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
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Abstract
IN AN ASPECT, THE PRESENT INVENTION PROVIDES STRETCHABLE, AND OPTIONALLY PRINTABLE, COMPONENTS SUCH AS SEMICONDUCTORS AND ELECTRONIC CIRCUITS CAPABLE OF PROVIDING GOOD PERFORMANCE WHEN STRETCHED, COMPRESSED, FLEXED OR OTHERWISE DEFORMED, AND RELATE METHODS OF MAKING OR TUNING SUCH STRETCHABLE COMPONENTS. STRETCHABLE SEMICONDUCTORS AND ELECTRONIC CIRCUITS PREFERRED FOR SOME APPLICATIONS ARE FLEXIBLE, IN ADDITION TO BEING STRETCHABLE, AND THUS ARE CAPABLE OF SIGNIFICANT ELONGATION, FLEXING, BENDING OR OTHER DEFORMATION ALONG ONE OR MORE AXES. FURTHER, STRETCHABLE SEMICONDUCTORS AND ELECTRONIC CIRCUITS OF THE PRESENT INVENTION ARE ADAPTED TO A WIDE RANGE OF DEVICE CONFIGURATIONS TO PROVIDE FULLY FLEXIBLE ELECTRONIC AND OPTOELECTRONIC DEVICES.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US82468306P | 2006-09-06 | 2006-09-06 | |
| US94462607P | 2007-06-18 | 2007-06-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY149475A true MY149475A (en) | 2013-08-30 |
Family
ID=39158048
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2012005126A MY172115A (en) | 2006-09-06 | 2007-09-06 | Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics |
| MYPI20090622 MY149475A (en) | 2006-09-06 | 2007-09-06 | Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2012005126A MY172115A (en) | 2006-09-06 | 2007-09-06 | Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP2064710A4 (en) |
| JP (3) | JP5578509B2 (en) |
| KR (5) | KR101453419B1 (en) |
| CN (2) | CN103213935B (en) |
| MY (2) | MY172115A (en) |
| TW (3) | TWI654770B (en) |
| WO (1) | WO2008030960A2 (en) |
Families Citing this family (181)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7557433B2 (en) | 2004-10-25 | 2009-07-07 | Mccain Joseph H | Microelectronic device with integrated energy source |
| US7799699B2 (en) | 2004-06-04 | 2010-09-21 | The Board Of Trustees Of The University Of Illinois | Printable semiconductor structures and related methods of making and assembling |
| US7622367B1 (en) | 2004-06-04 | 2009-11-24 | The Board Of Trustees Of The University Of Illinois | Methods and devices for fabricating and assembling printable semiconductor elements |
| US8217381B2 (en) | 2004-06-04 | 2012-07-10 | The Board Of Trustees Of The University Of Illinois | Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics |
| US7521292B2 (en) | 2004-06-04 | 2009-04-21 | The Board Of Trustees Of The University Of Illinois | Stretchable form of single crystal silicon for high performance electronics on rubber substrates |
| MY149190A (en) | 2006-09-20 | 2013-07-31 | Univ Illinois | Release strategies for making transferable semiconductor structures, devices and device components |
| CN101617406B (en) | 2007-01-17 | 2011-04-20 | 伊利诺伊大学评议会 | Optical systems fabricated by printing-based assembly |
| KR101755207B1 (en) | 2008-03-05 | 2017-07-19 | 더 보드 오브 트러스티즈 오브 더 유니버시티 오브 일리노이 | Stretchable and foldable electronic devies |
| US8470701B2 (en) | 2008-04-03 | 2013-06-25 | Advanced Diamond Technologies, Inc. | Printable, flexible and stretchable diamond for thermal management |
| US7927976B2 (en) | 2008-07-23 | 2011-04-19 | Semprius, Inc. | Reinforced composite stamp for dry transfer printing of semiconductor elements |
| US8679888B2 (en) | 2008-09-24 | 2014-03-25 | The Board Of Trustees Of The University Of Illinois | Arrays of ultrathin silicon solar microcells |
| US8372726B2 (en) | 2008-10-07 | 2013-02-12 | Mc10, Inc. | Methods and applications of non-planar imaging arrays |
| US8097926B2 (en) | 2008-10-07 | 2012-01-17 | Mc10, Inc. | Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy |
| US9119533B2 (en) | 2008-10-07 | 2015-09-01 | Mc10, Inc. | Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy |
| US8389862B2 (en) | 2008-10-07 | 2013-03-05 | Mc10, Inc. | Extremely stretchable electronics |
| US8886334B2 (en) | 2008-10-07 | 2014-11-11 | Mc10, Inc. | Systems, methods, and devices using stretchable or flexible electronics for medical applications |
| US9545216B2 (en) | 2011-08-05 | 2017-01-17 | Mc10, Inc. | Catheter balloon methods and apparatus employing sensing elements |
| US9123614B2 (en) | 2008-10-07 | 2015-09-01 | Mc10, Inc. | Methods and applications of non-planar imaging arrays |
| EP2349440B1 (en) | 2008-10-07 | 2019-08-21 | Mc10, Inc. | Catheter balloon having stretchable integrated circuitry and sensor array |
| KR101041139B1 (en) * | 2008-11-04 | 2011-06-13 | 삼성모바일디스플레이주식회사 | Thin film transistor, manufacturing method thereof and organic light emitting display device comprising same |
| EP2902293B1 (en) * | 2008-11-12 | 2020-03-04 | Mc10, Inc. | Methods of making extremely stretchable electronics |
| KR101736722B1 (en) | 2008-11-19 | 2017-05-17 | 셈프리어스 아이엔씨. | Printing semiconductor elements by shear-assisted elastomeric stamp transfer |
| WO2010081137A2 (en) * | 2009-01-12 | 2010-07-15 | Mc10, Inc. | Methods and applications of non-planar imaging arrays |
| PL2392196T3 (en) | 2009-01-30 | 2019-05-31 | Imec Vzw | EXTENDED ELECTRONIC DEVICE |
| US8865489B2 (en) | 2009-05-12 | 2014-10-21 | The Board Of Trustees Of The University Of Illinois | Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays |
| FR2947063B1 (en) | 2009-06-19 | 2011-07-01 | Commissariat Energie Atomique | OVERHEAD PROJECTOR |
| US8261660B2 (en) | 2009-07-22 | 2012-09-11 | Semprius, Inc. | Vacuum coupled tool apparatus for dry transfer printing semiconductor elements |
| KR101077789B1 (en) | 2009-08-07 | 2011-10-28 | 한국과학기술원 | LED display manufacturing method and LED display manufactured thereby |
| KR101113692B1 (en) | 2009-09-17 | 2012-02-27 | 한국과학기술원 | A manufacturing method for solar cell and GaN solar cell manufactured by the same |
| WO2011041727A1 (en) | 2009-10-01 | 2011-04-07 | Mc10, Inc. | Protective cases with integrated electronics |
| US9936574B2 (en) | 2009-12-16 | 2018-04-03 | The Board Of Trustees Of The University Of Illinois | Waterproof stretchable optoelectronics |
| EP2513953B1 (en) | 2009-12-16 | 2017-10-18 | The Board of Trustees of the University of Illionis | Electrophysiology using conformal electronics |
| US10441185B2 (en) | 2009-12-16 | 2019-10-15 | The Board Of Trustees Of The University Of Illinois | Flexible and stretchable electronic systems for epidermal electronics |
| WO2011087301A2 (en) | 2010-01-15 | 2011-07-21 | 성균관대학교산학협력단 | Graphene protective film serving as a gas and moisture barrier, method for forming same, and use thereof |
| US8450779B2 (en) * | 2010-03-08 | 2013-05-28 | International Business Machines Corporation | Graphene based three-dimensional integrated circuit device |
| TWI556802B (en) | 2010-03-12 | 2016-11-11 | 美國伊利諾大學理事會 | Implantable biomedical device on a bioresorbable substrate |
| KR101837481B1 (en) | 2010-03-17 | 2018-03-13 | 더 보드 오브 트러스티즈 오브 더 유니버시티 오브 일리노이 | implantable biomedical devices on bioresorbable substrates |
| CN103181025A (en) | 2010-04-12 | 2013-06-26 | 塔夫茨大学 | Silk electronic components |
| JP6284765B2 (en) * | 2010-09-27 | 2018-02-28 | テクトニック プロプライアトリー リミテッドTechtonic Pty Ltd | Wavy structure |
| CN102001622B (en) * | 2010-11-08 | 2013-03-20 | 中国科学技术大学 | Method for preparing air bridge type nano device |
| WO2012097163A1 (en) | 2011-01-14 | 2012-07-19 | The Board Of Trustees Of The University Of Illinois | Optical component array having adjustable curvature |
| WO2012125494A2 (en) | 2011-03-11 | 2012-09-20 | Mc10, Inc. | Integrated devices to facilitate quantitative assays and diagnostics |
| TWI455341B (en) * | 2011-03-21 | 2014-10-01 | Motech Ind Inc | Method for manufacturing solar cells |
| CN107081937A (en) * | 2011-04-18 | 2017-08-22 | 阿迪达斯股份公司 | For continuously encapsulating the method and apparatus of elongated member and the elongated member of the encapsulation obtained |
| WO2012158709A1 (en) | 2011-05-16 | 2012-11-22 | The Board Of Trustees Of The University Of Illinois | Thermally managed led arrays assembled by printing |
| US9159635B2 (en) | 2011-05-27 | 2015-10-13 | Mc10, Inc. | Flexible electronic structure |
| US8934965B2 (en) | 2011-06-03 | 2015-01-13 | The Board Of Trustees Of The University Of Illinois | Conformable actively multiplexed high-density surface electrode array for brain interfacing |
| CN102244015B (en) * | 2011-06-17 | 2012-12-19 | 华中科技大学 | Method for performing flexible electronic patterning on pretensioning elastic base plate |
| US9757050B2 (en) | 2011-08-05 | 2017-09-12 | Mc10, Inc. | Catheter balloon employing force sensing elements |
| JP6129838B2 (en) | 2011-09-01 | 2017-05-17 | エムシー10 インコーポレイテッドMc10,Inc. | Electronic device that detects the condition of the tissue |
| WO2013052919A2 (en) | 2011-10-05 | 2013-04-11 | Mc10, Inc. | Cardiac catheter employing conformal electronics for mapping |
| JP6231489B2 (en) | 2011-12-01 | 2017-11-15 | ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ | Transition devices designed to undergo programmable changes |
| FR2985371A1 (en) * | 2011-12-29 | 2013-07-05 | Commissariat Energie Atomique | METHOD FOR MANUFACTURING A MULTILAYER STRUCTURE ON A SUPPORT |
| US8492208B1 (en) * | 2012-01-05 | 2013-07-23 | International Business Machines Corporation | Compressive (PFET) and tensile (NFET) channel strain in nanowire FETs fabricated with a replacement gate process |
| CN102610534A (en) * | 2012-01-13 | 2012-07-25 | 华中科技大学 | Stretchable RFID (Radio Frequency Identification) electronic tag and manufacturing method thereof |
| CN111554781B (en) | 2012-03-19 | 2024-04-12 | 亮锐控股有限公司 | Singulation of light emitting devices before and after phosphor application |
| CN102610672A (en) * | 2012-03-23 | 2012-07-25 | 合肥工业大学 | Heterojunction type photoelectric detector and manufacturing method thereof |
| KR20150004819A (en) | 2012-03-30 | 2015-01-13 | 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 | Appendage mountable electronic devices conformable to surfaces |
| US9247637B2 (en) | 2012-06-11 | 2016-01-26 | Mc10, Inc. | Strain relief structures for stretchable interconnects |
| US9226402B2 (en) | 2012-06-11 | 2015-12-29 | Mc10, Inc. | Strain isolation structures for stretchable electronics |
| WO2014007871A1 (en) | 2012-07-05 | 2014-01-09 | Mc10, Inc. | Catheter device including flow sensing |
| US9295842B2 (en) | 2012-07-05 | 2016-03-29 | Mc10, Inc. | Catheter or guidewire device including flow sensing and use thereof |
| CN102903841B (en) * | 2012-09-18 | 2015-09-09 | 中国科学院宁波材料技术与工程研究所 | A kind of temperature controlled magnetic electron device, its preparation method and application |
| US9171794B2 (en) | 2012-10-09 | 2015-10-27 | Mc10, Inc. | Embedding thin chips in polymer |
| JP2016500869A (en) | 2012-10-09 | 2016-01-14 | エムシー10 インコーポレイテッドMc10,Inc. | Conformal electronic circuit integrated with clothing |
| CN102983791A (en) * | 2012-10-26 | 2013-03-20 | 苏州大学 | Temperature difference alternating current power generation device and power generation method thereof |
| WO2014104267A1 (en) | 2012-12-28 | 2014-07-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| KR102051519B1 (en) | 2013-02-25 | 2019-12-03 | 삼성전자주식회사 | Thin Film Transistor on Fiber and Manufacturing Method of the same |
| AU2014250792B2 (en) | 2013-04-12 | 2018-05-10 | The Board Of Trustees Of The University Of Illinois | Materials, electronic systems and modes for active and passive transience |
| US9706647B2 (en) * | 2013-05-14 | 2017-07-11 | Mc10, Inc. | Conformal electronics including nested serpentine interconnects |
| CN105723197A (en) | 2013-08-05 | 2016-06-29 | Mc10股份有限公司 | Flexible temperature sensor including conformable electronics |
| CA2925387A1 (en) | 2013-10-07 | 2015-04-16 | Mc10, Inc. | Conformal sensor systems for sensing and analysis |
| CN103560157B (en) * | 2013-11-19 | 2016-02-24 | 中国科学院上海微系统与信息技术研究所 | Strain structure and preparation method thereof |
| CA2930740A1 (en) | 2013-11-22 | 2015-05-28 | Mc10, Inc. | Conformal sensor systems for sensing and analysis of cardiac activity |
| EP3092661A4 (en) | 2014-01-06 | 2017-09-27 | Mc10, Inc. | Encapsulated conformal electronic systems and devices, and methods of making and using the same |
| JP6637896B2 (en) | 2014-03-04 | 2020-01-29 | エムシー10 インコーポレイテッドMc10,Inc. | Conformal IC device with flexible multi-part encapsulated housing for electronic devices |
| WO2015138712A1 (en) | 2014-03-12 | 2015-09-17 | Mc10, Inc. | Quantification of a change in assay |
| CN103869607A (en) * | 2014-03-18 | 2014-06-18 | 无锡中微掩模电子有限公司 | Method for removing chromium metal film from binary mask |
| TWI576715B (en) * | 2014-05-02 | 2017-04-01 | 希諾皮斯股份有限公司 | A non-transitory computer readable medium and a system for simulating integrated circuit processing |
| CN106536403B8 (en) | 2014-05-28 | 2019-08-20 | 3M创新有限公司 | MEMS Devices on Flexible Substrates |
| JP6195399B2 (en) * | 2014-07-11 | 2017-09-13 | インテル・コーポレーション | Bendable and stretchable electronic device and manufacturing method thereof |
| US11472171B2 (en) * | 2014-07-20 | 2022-10-18 | X Display Company Technology Limited | Apparatus and methods for micro-transfer-printing |
| KR102161644B1 (en) | 2014-08-20 | 2020-10-06 | 삼성디스플레이 주식회사 | Stretchable display panel and display device having the same |
| CN104153128B (en) * | 2014-08-26 | 2017-03-08 | 青岛大学 | A kind of preparation method based on ordered arrangement distorted-structure flexible extensible device |
| US9899330B2 (en) | 2014-10-03 | 2018-02-20 | Mc10, Inc. | Flexible electronic circuits with embedded integrated circuit die |
| US10297572B2 (en) | 2014-10-06 | 2019-05-21 | Mc10, Inc. | Discrete flexible interconnects for modules of integrated circuits |
| USD781270S1 (en) | 2014-10-15 | 2017-03-14 | Mc10, Inc. | Electronic device having antenna |
| US9398705B2 (en) * | 2014-12-02 | 2016-07-19 | Flextronics Ap, Llc. | Stretchable printed electronic sheets to electrically connect uneven two dimensional and three dimensional surfaces |
| US9991326B2 (en) | 2015-01-14 | 2018-06-05 | Panasonic Intellectual Property Management Co., Ltd. | Light-emitting device comprising flexible substrate and light-emitting element |
| KR102356697B1 (en) * | 2015-01-15 | 2022-01-27 | 삼성디스플레이 주식회사 | Stretchable display device and manufacturing method of the same |
| KR102456698B1 (en) | 2015-01-15 | 2022-10-19 | 삼성디스플레이 주식회사 | Stretchable display device |
| KR102320382B1 (en) | 2015-01-28 | 2021-11-02 | 삼성디스플레이 주식회사 | Electronic device |
| EP3258837A4 (en) | 2015-02-20 | 2018-10-10 | Mc10, Inc. | Automated detection and configuration of wearable devices based on on-body status, location, and/or orientation |
| WO2016140961A1 (en) | 2015-03-02 | 2016-09-09 | Mc10, Inc. | Perspiration sensor |
| KR102335807B1 (en) * | 2015-03-10 | 2021-12-08 | 삼성디스플레이 주식회사 | Display device |
| KR102385327B1 (en) * | 2015-04-06 | 2022-04-12 | 삼성디스플레이 주식회사 | Flexible display device and method of manufacturing the same |
| MX2017015587A (en) | 2015-06-01 | 2018-08-23 | Univ Illinois | Alternative approach to uv sensing. |
| CN107851208B (en) | 2015-06-01 | 2021-09-10 | 伊利诺伊大学评议会 | Miniaturized electronic system with wireless power supply and near field communication capability |
| US10026721B2 (en) | 2015-06-30 | 2018-07-17 | Apple Inc. | Electronic devices with soft input-output components |
| US9841548B2 (en) | 2015-06-30 | 2017-12-12 | Apple Inc. | Electronic devices with soft input-output components |
| CN105049033B (en) * | 2015-07-01 | 2017-11-24 | 东南大学 | Nor gate based on GaAs base low-leakage current double cantilever beam switch |
| US10653332B2 (en) | 2015-07-17 | 2020-05-19 | Mc10, Inc. | Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers |
| US10709384B2 (en) | 2015-08-19 | 2020-07-14 | Mc10, Inc. | Wearable heat flux devices and methods of use |
| WO2017059215A1 (en) | 2015-10-01 | 2017-04-06 | Mc10, Inc. | Method and system for interacting with a virtual environment |
| CN108289630A (en) | 2015-10-05 | 2018-07-17 | Mc10股份有限公司 | Method and system for nerve modulation and stimulation |
| DE102015014256B4 (en) | 2015-11-05 | 2020-06-18 | Airbus Defence and Space GmbH | Microelectronic module for cleaning a surface, modular array and method for cleaning a surface |
| US10925543B2 (en) | 2015-11-11 | 2021-02-23 | The Board Of Trustees Of The University Of Illinois | Bioresorbable silicon electronics for transient implants |
| WO2017085849A1 (en) * | 2015-11-19 | 2017-05-26 | 三井金属鉱業株式会社 | Production method for printed wiring board having dielectric layer |
| CN105405983B (en) * | 2015-12-14 | 2017-05-10 | 吉林大学 | Stretchable organic electroluminescent devices with periodic regular wrinkled structures |
| CN106920800B (en) * | 2015-12-25 | 2019-07-23 | 昆山工研院新型平板显示技术中心有限公司 | Flexible display device and forming method thereof |
| US10673280B2 (en) | 2016-02-22 | 2020-06-02 | Mc10, Inc. | System, device, and method for coupled hub and sensor node on-body acquisition of sensor information |
| US10277386B2 (en) | 2016-02-22 | 2019-04-30 | Mc10, Inc. | System, devices, and method for on-body data and power transmission |
| KR102455039B1 (en) * | 2016-03-18 | 2022-10-17 | 삼성디스플레이 주식회사 | Stretchable display device |
| WO2017184705A1 (en) | 2016-04-19 | 2017-10-26 | Mc10, Inc. | Method and system for measuring perspiration |
| ITUA20162943A1 (en) * | 2016-04-27 | 2017-10-27 | Pilegrowth Tech S R L | Method for the industrial manufacture of a semiconductor structure with reduced bowing. |
| CN109073951B (en) * | 2016-05-31 | 2022-05-13 | 伊英克公司 | Stretchable electro-optic displays |
| US10002222B2 (en) * | 2016-07-14 | 2018-06-19 | Arm Limited | System and method for perforating redundant metal in self-aligned multiple patterning |
| US10447347B2 (en) | 2016-08-12 | 2019-10-15 | Mc10, Inc. | Wireless charger and high speed data off-loader |
| CN106229038B (en) * | 2016-09-07 | 2017-10-24 | 东华大学 | A kind of stretchable electrically conducting transparent method for producing elastomers based on multilevel hierarchy graphene |
| JP2018060932A (en) * | 2016-10-06 | 2018-04-12 | ローム株式会社 | LED package |
| EP3529595B1 (en) | 2016-10-20 | 2023-05-31 | Quantum Diamond Technologies Inc. | Methods and apparatus for magnetic particle analysis using wide-field diamond magnetic imaging |
| JP2018078272A (en) * | 2016-10-31 | 2018-05-17 | スリーエム イノベイティブ プロパティズ カンパニー | Three-dimensionally shaped thermally conductive molded body, and manufacturing method thereof |
| CN106601933B (en) * | 2016-12-12 | 2018-02-23 | 吉林大学 | A Fabrication Method of Stretchable Electronic Devices with Regular Wrinkle Structure |
| CA3046849A1 (en) | 2016-12-23 | 2018-06-28 | Quantum Diamond Technologies Inc. | Methods and apparatus for magnetic multi-bead assays |
| DE102017100053A1 (en) | 2017-01-03 | 2018-07-05 | Infineon Technologies Ag | Frame assembly after film expansion |
| US11127778B2 (en) | 2017-02-24 | 2021-09-21 | Flexucell Aps | Light emitting transducer |
| JP2018179501A (en) * | 2017-04-03 | 2018-11-15 | 日本精工株式会社 | Proximity sensor |
| WO2018191516A1 (en) * | 2017-04-12 | 2018-10-18 | Sense Photonics, Inc. | Devices incorporating integrated dectors and ultra-small vertical cavity surface emitting laser emitters |
| US20180323239A1 (en) * | 2017-05-03 | 2018-11-08 | Innolux Corporation | Display device |
| CN107248518B (en) | 2017-05-26 | 2020-04-17 | 京东方科技集团股份有限公司 | Photoelectric sensor, manufacturing method thereof and display device |
| CN110753976B (en) * | 2017-06-12 | 2021-06-08 | 3M创新有限公司 | stretchable conductor |
| EP3652786B1 (en) | 2017-07-14 | 2022-08-03 | King Abdullah University Of Science And Technology | Flexible and stretchable imager, method of making a flexible and stretchable imager |
| JP7204733B2 (en) | 2017-07-31 | 2023-01-16 | クアンタム ダイヤモンド テクノロジーズ インク. | Method and apparatus for sample measurement |
| CN111587149B (en) * | 2017-09-01 | 2022-11-11 | 米罗库鲁斯公司 | Digital microfluidic device and method of use |
| CN107634054A (en) * | 2017-09-18 | 2018-01-26 | 天津大学 | Silicon nanometer film revolution word logic inverter and preparation method thereof in flexible substrate |
| US10205303B1 (en) * | 2017-10-18 | 2019-02-12 | Lumentum Operations Llc | Vertical-cavity surface-emitting laser thin wafer bowing control |
| WO2019093069A1 (en) * | 2017-11-07 | 2019-05-16 | 大日本印刷株式会社 | Stretchable circuit substrate and article |
| CN108009317A (en) * | 2017-11-09 | 2018-05-08 | 武汉大学 | A kind of conductivity studies emulation of composite material and modeling method |
| EP3709943B1 (en) | 2017-11-15 | 2024-07-24 | Smith & Nephew PLC | Integrated sensor enabled wound monitoring and/or therapy dressings and systems |
| CN109859623B (en) * | 2017-11-30 | 2021-05-18 | 云谷(固安)科技有限公司 | Array substrate, preparation method thereof and display screen |
| KR101974575B1 (en) * | 2017-12-01 | 2019-05-02 | 포항공과대학교 산학협력단 | Manufacturing method for microscopic multi-slope sturcutre using synchrotron x-ray |
| CN108417592A (en) * | 2018-02-12 | 2018-08-17 | 中国科学院半导体研究所 | Infrared imaging device and its preparation method, bionic infrared spherical camera |
| KR102077306B1 (en) * | 2018-02-14 | 2020-02-13 | 광운대학교 산학협력단 | Real-time Glucose Monitoring Sensor System and Method of Manufacturing Glucose Sensor Based on Low Temperature Solution Process |
| CN109346504B (en) * | 2018-09-30 | 2021-06-29 | 云谷(固安)科技有限公司 | Flexible display panel and display device |
| CN109437091A (en) * | 2018-10-23 | 2019-03-08 | 中山大学 | A method of preparing micro-nano structure in elastic substrate |
| CN111148364B (en) * | 2018-11-05 | 2021-01-26 | 北京梦之墨科技有限公司 | Flexible stretchable circuit and manufacturing method thereof |
| US12091357B2 (en) | 2021-08-05 | 2024-09-17 | Corning Incorporated | Dynamically bendable automotive interior display systems |
| CN120327244A (en) * | 2018-12-10 | 2025-07-18 | 康宁公司 | Dynamically bendable car interior display system |
| CN109671869B (en) * | 2018-12-12 | 2020-06-16 | 武汉华星光电半导体显示技术有限公司 | Manufacturing method of composite film layer and display device |
| CN109637366B (en) * | 2018-12-28 | 2020-10-09 | 厦门天马微电子有限公司 | Jig and bending method of display module |
| CN111724676B (en) * | 2019-03-21 | 2022-09-02 | 昆山工研院新型平板显示技术中心有限公司 | Stretchable wire, manufacturing method thereof and display device |
| DE102019111964A1 (en) * | 2019-05-08 | 2020-11-12 | Danfoss Silicon Power Gmbh | A semiconductor module having a first substrate, a second substrate and a spacer which separates the substrates from one another |
| CN110393507B (en) * | 2019-08-01 | 2020-12-25 | 清华大学 | Structural design of flexible extensible electronic device and manufacturing method thereof |
| CN110797148B (en) * | 2019-10-08 | 2021-07-30 | 上海交通大学 | Superconducting tape suitable for non-insulated coil, non-insulated coil and preparation method thereof |
| CN110683508B (en) * | 2019-10-18 | 2023-05-23 | 北京元芯碳基集成电路研究院 | Preparation method of carbon nano tube parallel array |
| CN110808295B (en) * | 2019-11-11 | 2021-04-23 | 重庆中易智芯科技有限责任公司 | Semiconductor detector of three-dimensional electrostriction collecting electrode and preparation method thereof |
| CN110697646A (en) * | 2019-11-22 | 2020-01-17 | 上海幂方电子科技有限公司 | Electronic skin and preparation method thereof |
| US11062936B1 (en) | 2019-12-19 | 2021-07-13 | X Display Company Technology Limited | Transfer stamps with multiple separate pedestals |
| CN111063658B (en) * | 2019-12-30 | 2020-09-29 | 清华大学 | Method for producing flexible and extensible electronic device |
| WO2021159214A1 (en) * | 2020-02-12 | 2021-08-19 | Rayleigh Solar Tech Inc. | High performance perovskite solar cells, module design, and manufacturing processes therefor |
| GB2593864B (en) * | 2020-02-28 | 2023-01-04 | X Fab France Sas | Improved transfer printing for RF applications |
| CN112967971B (en) * | 2020-05-27 | 2023-04-18 | 重庆康佳光电技术研究院有限公司 | Micro-LED transfer substrate and preparation method thereof |
| KR102393781B1 (en) * | 2020-07-07 | 2022-05-04 | 서울대학교산학협력단 | Flexible device |
| CN112133198B (en) * | 2020-09-29 | 2022-04-22 | 厦门天马微电子有限公司 | Stretchable display panel and stretchable display device |
| CN112606585B (en) * | 2020-12-02 | 2022-05-31 | 潍坊歌尔微电子有限公司 | Device transfer processing method and transfer processing method of micro-microphone dustproof device |
| KR102591096B1 (en) * | 2020-12-15 | 2023-10-18 | 연세대학교 산학협력단 | Method for manufacturing a photodetector using tensile strain, photodetector manufactured thereby, and device for manufacturing the same |
| KR102412729B1 (en) | 2021-01-18 | 2022-06-23 | 연세대학교 산학협력단 | Stretchable display device |
| KR102553142B1 (en) * | 2021-06-25 | 2023-07-06 | 경희대학교 산학협력단 | Pressure sensor using conductive polymer material including structure to improve sensitivity |
| KR102582188B1 (en) * | 2021-07-22 | 2023-09-26 | 한국과학기술원 | Stretchable oleds using laser patterned plastic substrate and method for manufacturing the same |
| CN113542755B (en) * | 2021-07-27 | 2022-06-21 | 展讯通信(上海)有限公司 | Method and system for generating two-dimensional wedge-shaped mask |
| CN115915816A (en) * | 2021-08-16 | 2023-04-04 | 华为技术有限公司 | Stretchable device and method of making the same |
| CN116034517B (en) * | 2021-08-25 | 2025-09-23 | 京东方科技集团股份有限公司 | RF micro-electromechanical switches, RF devices |
| CN114286513B (en) * | 2021-11-30 | 2024-02-06 | 通元科技(惠州)有限公司 | Asymmetric prestress eliminating type LED backboard and manufacturing method thereof |
| CN114355489B (en) * | 2022-01-13 | 2023-05-16 | 西华大学 | Curved fly-eye lens based on DMD digital lithography and preparation method thereof |
| KR102711952B1 (en) | 2022-01-20 | 2024-09-27 | 국립공주대학교 산학협력단 | Wave-shaped steretchable wiring and its manufacturing method |
| CA3243135A1 (en) * | 2022-01-21 | 2023-07-27 | Raymond DeCorby | Monolithic optical pressure sensors and transducers |
| WO2023187834A1 (en) * | 2022-03-30 | 2023-10-05 | Council Of Scientific And Industrial Research | Method for fabricating silicon chip carriers using wet bulk micromachining for ir detector applications |
| KR102749617B1 (en) * | 2022-07-08 | 2025-01-02 | 국립공주대학교 산학협력단 | Flexible wavy circuit and its manufacturing method |
| CN116313797B (en) * | 2023-03-24 | 2025-08-15 | 厦门市三安集成电路有限公司 | HEMT radio frequency device manufacturing method and HEMT radio frequency device |
| IT202300009687A1 (en) * | 2023-05-15 | 2024-11-15 | Istituto Naz Fisica Nucleare | Container for radiation detector and detector apparatus |
| CN119761127B (en) * | 2024-12-20 | 2025-12-05 | 湖北江城实验室 | Semiconductor structure design methods, design equipment, and computer-readable storage media |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5763864A (en) * | 1980-09-29 | 1982-04-17 | Messerschmitt Boelkow Blohm | Solar battery mechanism |
| US4766670A (en) * | 1987-02-02 | 1988-08-30 | International Business Machines Corporation | Full panel electronic packaging structure and method of making same |
| US5086785A (en) * | 1989-08-10 | 1992-02-11 | Abrams/Gentille Entertainment Inc. | Angular displacement sensors |
| US5475514A (en) | 1990-12-31 | 1995-12-12 | Kopin Corporation | Transferred single crystal arrayed devices including a light shield for projection displays |
| US5375397B1 (en) * | 1993-06-22 | 1998-11-10 | Robert J Ferrand | Curve-conforming sensor array pad and method of measuring saddle pressures on a horse |
| JPH08298334A (en) * | 1995-04-26 | 1996-11-12 | Mitsubishi Electric Corp | Solar cell plate |
| US6784023B2 (en) * | 1996-05-20 | 2004-08-31 | Micron Technology, Inc. | Method of fabrication of stacked semiconductor devices |
| DE19637626A1 (en) * | 1996-09-16 | 1998-03-26 | Bosch Gmbh Robert | Flexible interconnect connection |
| FR2786037B1 (en) * | 1998-11-16 | 2001-01-26 | Alstom Technology | SHIELDED ELECTRICAL CONDUCTION BAR FOR HIGH VOLTAGE ELECTRICAL STATION |
| US6150602A (en) * | 1999-05-25 | 2000-11-21 | Hughes Electronics Corporation | Large area solar cell extended life interconnect |
| WO2001008242A1 (en) * | 1999-07-21 | 2001-02-01 | E Ink Corporation | Preferred methods for producing electrical circuit elements used to control an electronic display |
| JP2001352089A (en) * | 2000-06-08 | 2001-12-21 | Showa Shell Sekiyu Kk | Thermal expansion distortion prevention type solar cell module |
| US6743982B2 (en) * | 2000-11-29 | 2004-06-01 | Xerox Corporation | Stretchable interconnects using stress gradient films |
| GB0029312D0 (en) * | 2000-12-01 | 2001-01-17 | Philips Corp Intellectual Pty | Flexible electronic device |
| WO2002071137A1 (en) * | 2001-03-06 | 2002-09-12 | Koninklijke Philips Electronics N.V. | Display device |
| US7273987B2 (en) * | 2002-03-21 | 2007-09-25 | General Electric Company | Flexible interconnect structures for electrical devices and light sources incorporating the same |
| JP3980918B2 (en) * | 2002-03-28 | 2007-09-26 | 株式会社東芝 | Active matrix substrate, method for manufacturing the same, and display device |
| JP2003323741A (en) | 2002-04-30 | 2003-11-14 | National Institute Of Advanced Industrial & Technology | Optical memory |
| US20050227389A1 (en) * | 2004-04-13 | 2005-10-13 | Rabin Bhattacharya | Deformable organic devices |
| US7491892B2 (en) * | 2003-03-28 | 2009-02-17 | Princeton University | Stretchable and elastic interconnects |
| US7465678B2 (en) * | 2003-03-28 | 2008-12-16 | The Trustees Of Princeton University | Deformable organic devices |
| GB0323285D0 (en) * | 2003-10-04 | 2003-11-05 | Koninkl Philips Electronics Nv | Device and method of making a device having a patterned layer on a flexible substrate |
| WO2005098969A1 (en) * | 2004-04-08 | 2005-10-20 | Sharp Kabushiki Kaisha | Solar battery and solar battery module |
| US7521292B2 (en) * | 2004-06-04 | 2009-04-21 | The Board Of Trustees Of The University Of Illinois | Stretchable form of single crystal silicon for high performance electronics on rubber substrates |
| US7622367B1 (en) * | 2004-06-04 | 2009-11-24 | The Board Of Trustees Of The University Of Illinois | Methods and devices for fabricating and assembling printable semiconductor elements |
| US7629691B2 (en) * | 2004-06-16 | 2009-12-08 | Honeywell International Inc. | Conductor geometry for electronic circuits fabricated on flexible substrates |
| FR2875339B1 (en) * | 2004-09-16 | 2006-12-08 | St Microelectronics Sa | MOS TRANSISTOR WITH DEFORMABLE GRID |
| US20060132025A1 (en) * | 2004-12-22 | 2006-06-22 | Eastman Kodak Company | Flexible display designed for minimal mechanical strain |
| US20060160943A1 (en) * | 2005-01-18 | 2006-07-20 | Weir James P | Water-based flock adhesives for thermoplastic substrates |
| CN2779218Y (en) * | 2005-02-01 | 2006-05-10 | 广德利德照明有限公司 | Connecting line of a tubular LED decorative lamp |
| TWI533459B (en) * | 2005-06-02 | 2016-05-11 | 美國伊利諾大學理事會 | Printable semiconductor structure and related methods of manufacture and assembly |
| JP7099160B2 (en) | 2018-08-10 | 2022-07-12 | 住友電気工業株式会社 | Optical fiber manufacturing method |
| US11394720B2 (en) | 2019-12-30 | 2022-07-19 | Itron, Inc. | Time synchronization using trust aggregation |
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