MX2007015660A - Metodos para producir depositos de aleaciones y controlar la nanoestructura de los mismos usando electro deposicion pulsatil de corriente negativa, y articulos que incorporan esos depositos. - Google Patents
Metodos para producir depositos de aleaciones y controlar la nanoestructura de los mismos usando electro deposicion pulsatil de corriente negativa, y articulos que incorporan esos depositos.Info
- Publication number
- MX2007015660A MX2007015660A MX2007015660A MX2007015660A MX2007015660A MX 2007015660 A MX2007015660 A MX 2007015660A MX 2007015660 A MX2007015660 A MX 2007015660A MX 2007015660 A MX2007015660 A MX 2007015660A MX 2007015660 A MX2007015660 A MX 2007015660A
- Authority
- MX
- Mexico
- Prior art keywords
- grain size
- deposits
- current
- deposit
- polarity
- Prior art date
Links
- 239000000956 alloy Substances 0.000 title abstract 2
- 229910045601 alloy Inorganic materials 0.000 title abstract 2
- 238000004070 electrodeposition Methods 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000002086 nanomaterial Substances 0.000 title 1
- 239000000203 mixture Substances 0.000 abstract 3
- 238000000576 coating method Methods 0.000 abstract 1
- 239000002659 electrodeposit Substances 0.000 abstract 1
- 239000011800 void material Substances 0.000 abstract 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Se usa corriente bipolar (inversion de impulsos), con porciones de corriente positivas y negativas para electrodepositar un deposito de tamano de grano nanocristalino. El tamano del grano puede ser controlado con precision en aleaciones. El deposito exhibe calidad macroscopica superior, siendo relativamente libre de cuarteadora y hueco. Los parametros de densidad de corriente, duracion de las porciones de impulso, y composicion del bano son determinados con referencia a relaciones constitutivas que muestran el tamano de grano como funcion de la composicion de deposito, y la composicion de deposito como funcion de la Relacion de Polaridad. Los parametros pueden utilizarse para seleccionar un tamano de grano especifico. Los recubrimientos pueden estar en capas, teniendo cada una un tamano de grano promedio, el cual puede variar de capa a capa y tambien en una region en una forma gradual.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/147,146 US7425255B2 (en) | 2005-06-07 | 2005-06-07 | Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition |
| PCT/US2006/019830 WO2007046870A2 (en) | 2005-06-07 | 2006-05-23 | Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition, and articles incorporating such deposits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX2007015660A true MX2007015660A (es) | 2008-04-29 |
Family
ID=37493067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2007015660A MX2007015660A (es) | 2005-06-07 | 2006-05-23 | Metodos para producir depositos de aleaciones y controlar la nanoestructura de los mismos usando electro deposicion pulsatil de corriente negativa, y articulos que incorporan esos depositos. |
Country Status (8)
| Country | Link |
|---|---|
| US (5) | US7425255B2 (es) |
| EP (1) | EP1899505B1 (es) |
| JP (1) | JP5134534B2 (es) |
| KR (1) | KR101283883B1 (es) |
| CN (1) | CN101238243B (es) |
| CA (1) | CA2609481C (es) |
| MX (1) | MX2007015660A (es) |
| WO (1) | WO2007046870A2 (es) |
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| US20040011432A1 (en) * | 2002-07-17 | 2004-01-22 | Podlaha Elizabeth J. | Metal alloy electrodeposited microstructures |
| EP1526192A1 (de) * | 2003-10-24 | 2005-04-27 | Siemens Aktiengesellschaft | Elektrolytisches Verfahren zum Abscheiden einer gradierten Schicht auf ein Substrat und Bauteil |
| US7098128B2 (en) * | 2004-09-01 | 2006-08-29 | Micron Technology, Inc. | Method for filling electrically different features |
| JP4894304B2 (ja) * | 2005-03-28 | 2012-03-14 | ソニー株式会社 | 無鉛Snベースめっき膜及び接続部品の接点構造 |
-
2005
- 2005-06-07 US US11/147,146 patent/US7425255B2/en not_active Expired - Lifetime
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2006
- 2006-05-23 KR KR1020077027870A patent/KR101283883B1/ko active Active
- 2006-05-23 EP EP06844106.2A patent/EP1899505B1/en active Active
- 2006-05-23 CA CA2609481A patent/CA2609481C/en not_active Expired - Fee Related
- 2006-05-23 JP JP2008515731A patent/JP5134534B2/ja active Active
- 2006-05-23 CN CN200680028771.5A patent/CN101238243B/zh active Active
- 2006-05-23 MX MX2007015660A patent/MX2007015660A/es active IP Right Grant
- 2006-05-23 WO PCT/US2006/019830 patent/WO2007046870A2/en not_active Ceased
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2008
- 2008-09-08 US US12/231,918 patent/US8906216B2/en active Active
- 2008-12-19 US US12/317,080 patent/US8728630B2/en active Active
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2014
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| Publication number | Publication date |
|---|---|
| US20090057159A1 (en) | 2009-03-05 |
| EP1899505A4 (en) | 2009-12-30 |
| EP1899505B1 (en) | 2017-12-20 |
| CN101238243A (zh) | 2008-08-06 |
| US7425255B2 (en) | 2008-09-16 |
| KR101283883B1 (ko) | 2013-07-08 |
| KR20080015820A (ko) | 2008-02-20 |
| US20140242409A1 (en) | 2014-08-28 |
| US20190145016A1 (en) | 2019-05-16 |
| US8728630B2 (en) | 2014-05-20 |
| WO2007046870A2 (en) | 2007-04-26 |
| US20090130479A1 (en) | 2009-05-21 |
| US20060272949A1 (en) | 2006-12-07 |
| CN101238243B (zh) | 2015-11-25 |
| WO2007046870A3 (en) | 2007-10-11 |
| JP2008542552A (ja) | 2008-11-27 |
| US10179954B2 (en) | 2019-01-15 |
| US8906216B2 (en) | 2014-12-09 |
| EP1899505A2 (en) | 2008-03-19 |
| JP5134534B2 (ja) | 2013-01-30 |
| CA2609481A1 (en) | 2007-04-26 |
| CA2609481C (en) | 2013-12-10 |
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