MX2007005597A - Resinas epoxicas endurecidas con copolimero de bloque anfifilico y laminados electricos hechos de las mismas. - Google Patents
Resinas epoxicas endurecidas con copolimero de bloque anfifilico y laminados electricos hechos de las mismas.Info
- Publication number
- MX2007005597A MX2007005597A MX2007005597A MX2007005597A MX2007005597A MX 2007005597 A MX2007005597 A MX 2007005597A MX 2007005597 A MX2007005597 A MX 2007005597A MX 2007005597 A MX2007005597 A MX 2007005597A MX 2007005597 A MX2007005597 A MX 2007005597A
- Authority
- MX
- Mexico
- Prior art keywords
- epoxy resin
- block copolymer
- amphiphilic block
- epoxy resins
- peo
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 6
- 229920000647 polyepoxide Polymers 0.000 title abstract 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 title 1
- 239000004721 Polyphenylene oxide Substances 0.000 abstract 3
- 239000000203 mixture Substances 0.000 abstract 3
- 229920000570 polyether Polymers 0.000 abstract 3
- 229920000469 amphiphilic block copolymer Polymers 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 abstract 1
- 125000002947 alkylene group Chemical group 0.000 abstract 1
- 229920001400 block copolymer Polymers 0.000 abstract 1
- 125000004432 carbon atom Chemical group C* 0.000 abstract 1
- 239000003054 catalyst Substances 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 229920000359 diblock copolymer Polymers 0.000 abstract 1
- 239000000178 monomer Substances 0.000 abstract 1
- 229920000428 triblock copolymer Polymers 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
Se describe una composicion epoxica de laminado curable que comprende: (a) una resina epoxica; (b) un copolimero de bloque anfifilico que contiene por lo menos un segmento de bloque miscible en resina epoxica y por lo menos un segmento de bloque no miscible en resina epoxica; en donde el segmento de bloque no miscible comprende por lo menos una estructura de polieter, siempre que la estructura de polieter de dicho segmento de bloque no miscible contenga por lo menos una o mas unidades de monomero de oxido de alquileno teniendo por lo menos cuatro atomos de carbono; de manera que cuando la composicion de resina epoxica se cura, la rigidez de la composicion de resina epoxica curada resultante se incrementa (c) un agente de curacion; y (d) un catalizador de curacion. El copolimero de bloque anfifilico de preferencia es un copolimero de bloque de polieter, tal como un copolimero de dibloque de PEO-PBO o un copolimero de tribloque de PEO-PBO-PEO.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US62661104P | 2004-11-10 | 2004-11-10 | |
| PCT/US2005/039963 WO2006052727A1 (en) | 2004-11-10 | 2005-11-02 | Amphiphilic block copolymer-toughened epoxy resins and electrical laminates made therefrom |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX2007005597A true MX2007005597A (es) | 2007-05-23 |
Family
ID=35770865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2007005597A MX2007005597A (es) | 2004-11-10 | 2005-11-02 | Resinas epoxicas endurecidas con copolimero de bloque anfifilico y laminados electricos hechos de las mismas. |
Country Status (15)
| Country | Link |
|---|---|
| US (1) | US7923073B2 (es) |
| EP (1) | EP1814948B1 (es) |
| JP (1) | JP5248860B2 (es) |
| KR (1) | KR101227201B1 (es) |
| CN (1) | CN101056933B (es) |
| AT (1) | ATE453688T1 (es) |
| BR (1) | BRPI0516702A (es) |
| CA (1) | CA2582360A1 (es) |
| DE (1) | DE602005018680D1 (es) |
| ES (1) | ES2337598T3 (es) |
| MX (1) | MX2007005597A (es) |
| NO (1) | NO20071727L (es) |
| RU (1) | RU2395545C2 (es) |
| TW (1) | TWI400296B (es) |
| WO (1) | WO2006052727A1 (es) |
Families Citing this family (71)
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|---|---|---|---|---|
| CA2558819A1 (en) * | 2004-04-02 | 2005-10-20 | Dow Global Technologies Inc. | Amphiphilic block copolymer-toughened thermoset resins |
| MX2007005601A (es) * | 2004-11-10 | 2007-05-23 | Dow Global Technologies Inc | Resinas epoxicas endurecidas con copolimero de bloque anfifilico y revestimientos en polvo hechos de las mismas. |
| JP4634856B2 (ja) * | 2005-05-12 | 2011-02-16 | 利昌工業株式会社 | 白色プリプレグ、白色積層板、及び金属箔張り白色積層板 |
| US9096790B2 (en) | 2007-03-22 | 2015-08-04 | Hexion Inc. | Low temperature coated particles comprising a curable liquid and a reactive powder for use as proppants or in gravel packs, methods for making and using the same |
| EP2176348B1 (en) | 2007-08-02 | 2017-01-18 | Dow Global Technologies LLC | Amphiphilic block copolymers and inorganic nanofillers to enhance performance of thermosetting polymers |
| WO2009076069A1 (en) * | 2007-12-10 | 2009-06-18 | Arkema Inc. | Acrylic-based rubber modified thermoset composition |
| BRPI0905387B1 (pt) | 2008-01-08 | 2019-08-06 | Dow Global Technologies Inc. | Composição curável e resina termofixa enrijecida |
| BRPI0907275A2 (pt) | 2008-04-14 | 2015-07-21 | Dow Global Technologies Inc | Processo para formar um catalisador de epóxi-imidazol sólido, catalisador de epóxi-imidazol sólido, composição curável, processo para formar uma composição curável e processo para formar uma composição termofixa |
| EP2110397A1 (de) | 2008-04-16 | 2009-10-21 | Sika Technology AG | Auf amphiphilen Block-Copolymer basierendes Polyurethan-Polymer und dessen Verwendung als Schlagzähigkeitsmodifikator |
| WO2009140087A2 (en) * | 2008-05-16 | 2009-11-19 | Dow Global Technologies Inc. | Windmill propeller blade and method of making same |
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| BRPI0910800A2 (pt) * | 2008-07-17 | 2016-07-12 | Dow Global Technologies Inc | compósito estrutural e processo para preparar um compósito estrutural |
| DE502008000478D1 (de) | 2008-07-17 | 2010-05-06 | Sika Technology Ag | Haftvermittlerverbindungen für beölten Stahl |
| EP2145924A1 (de) | 2008-07-18 | 2010-01-20 | Sika Technology AG | Auf amphiphilen Block-Copolymer basierende Reaktionsprodukte und deren Verwendung als Schlagzähigkeitsmodifikator |
| ATE483751T1 (de) | 2008-10-31 | 2010-10-15 | Sika Technology Ag | Hitzehärtende epoxidharzzusammensetzungen einsetzbar als rohbauklebstoff oder strukturschaum |
| TWI423741B (zh) * | 2009-02-13 | 2014-01-11 | Iteq Corp | An epoxy resin composition and a film and a substrate made of the epoxy resin composition |
| KR20110131222A (ko) | 2009-02-24 | 2011-12-06 | 다우 글로벌 테크놀로지스 엘엘씨 | 경화성 에폭시 수지 조성물 및 이로부터의 경화물 |
| CN102348757A (zh) | 2009-03-09 | 2012-02-08 | 陶氏环球技术有限责任公司 | 含有两亲型嵌段共聚物和多元醇的组合的可热固化组合物及其热固产品 |
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| EP2480586B1 (en) | 2009-09-22 | 2014-11-12 | Dow Global Technologies LLC | Process for preparing episulfide resins |
| CA2770354A1 (en) | 2009-09-25 | 2011-03-31 | Dow Global Technologies Llc | Curable epoxy resin compositions and composites made therefrom |
| JP5584301B2 (ja) | 2009-09-30 | 2014-09-03 | ダウ グローバル テクノロジーズ エルエルシー | エポキシ樹脂組成物 |
| KR20120097511A (ko) | 2009-11-12 | 2012-09-04 | 다우 글로벌 테크놀로지스 엘엘씨 | 폴리옥사졸리돈 수지 |
| SG181485A1 (en) | 2009-12-02 | 2012-07-30 | Dow Global Technologies Llc | Composite compositions |
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| WO2011097009A2 (en) | 2010-02-02 | 2011-08-11 | Dow Global Technologies Llc | Curable epoxy resin compositions |
| EP2365046A1 (de) | 2010-03-02 | 2011-09-14 | Sika Technology AG | Schlagzäher bei Raumtemperatur härtender zwei-komponentiger Strukturklebstoff |
| EP2365011A1 (de) | 2010-03-02 | 2011-09-14 | Sika Technology AG | Aminogruppen - terminierter Schlagzähigkeitsmodifikator und dessen Verwendungen in Epoxidharzzusammensetzungen |
| KR20130062915A (ko) | 2010-03-24 | 2013-06-13 | 다우 글로벌 테크놀로지스 엘엘씨 | 강인화제로서 폴리(프로필렌 옥사이드) 폴리올을 포함하는 에폭시 수지 조성물 |
| TWI506010B (zh) | 2010-05-21 | 2015-11-01 | Dow Global Technologies Llc | 用於可熱固樹脂組成物之硬化劑 |
| CA2803851A1 (en) | 2010-06-25 | 2011-12-29 | Dow Global Technologies Llc | Curable epoxy resin compositions and composites made therefrom |
| EP2585520A2 (en) | 2010-06-25 | 2013-05-01 | Dow Global Technologies LLC | Polymer concrete composition |
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| JP6162698B2 (ja) | 2011-08-18 | 2017-07-12 | ブルー キューブ アイピー エルエルシー | 硬化型樹脂組成物 |
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| CN104159968B (zh) | 2011-12-20 | 2016-11-02 | 陶氏环球技术有限责任公司 | 用于制备固化环氧复合材料的方法 |
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| KR102123710B1 (ko) | 2012-12-14 | 2020-06-16 | 블루 큐브 아이피 엘엘씨 | 개질된 에폭시 수지 |
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| CN103936940B (zh) * | 2014-04-25 | 2016-05-04 | 常州工程职业技术学院 | 不饱和聚酯树脂泡沫保温复合材料及其制备方法 |
| JP5992963B2 (ja) * | 2014-07-04 | 2016-09-14 | ダウ グローバル テクノロジーズ エルエルシー | 両親媒性ブロックコポリマー及びポリオールの組合せを含む熱硬化性組成物並びにそれからの熱硬化生成物 |
| KR20170057239A (ko) | 2014-09-11 | 2017-05-24 | 블루 큐브 아이피 엘엘씨 | 에스터 수지 |
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| BR112017006651B1 (pt) | 2014-10-10 | 2022-09-13 | Dow Global Technologies Llc | Composição surfactante funcionalizada com epóxi, composição de resina epóxi, e, composição de dispersão de epóxi à base de água |
| CN107001897A (zh) | 2014-12-31 | 2017-08-01 | 陶氏环球技术有限责任公司 | 具有改善的低温抗冲击性和耐冲洗性的耐撞击环氧粘合剂组合物 |
| FR3034423B1 (fr) * | 2015-04-03 | 2019-05-31 | Cnrs | Dispersion aqueuse de particules d'au moins un polymere thermoplastique, son procede de preparation et ses applications, notamment pour l'ensimage de fibres de renfort |
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| WO2017179653A1 (ja) | 2016-04-13 | 2017-10-19 | 株式会社カネカ | 強靭化エポキシ樹脂組成物 |
| WO2018080760A1 (en) | 2016-10-28 | 2018-05-03 | Dow Global Technologies Llc | Crash durable epoxy adhesive having improved low-temperature impact resistance |
| EP3585607B1 (en) | 2017-02-26 | 2021-12-15 | Dow Global Technologies, LLC | Fiber composite with reduced surface roughness and method for its manufacture |
| WO2019036189A1 (en) | 2017-08-15 | 2019-02-21 | Covestro Llc | ADDITIVE FOR ENOUGHING EPOXY-BASED RESINS FOR USE IN OIL FIELD APPLICATIONS |
| CN107722316A (zh) * | 2017-09-18 | 2018-02-23 | 乐凯特科技铜陵有限公司 | 一种高强度薄型半固化片及其制备方法 |
| CN109721947A (zh) | 2017-10-27 | 2019-05-07 | 财团法人工业技术研究院 | 环氧树脂组合物 |
| US20190390065A1 (en) | 2018-06-22 | 2019-12-26 | Covestro Llc | Waterborne compositions containing organic ion-exchangers to improve corrosion resistance |
| US20190390063A1 (en) | 2018-06-22 | 2019-12-26 | Covestro Llc | Solventborne compositions containing organic ion-exchangers to improve corrosion resistance |
| US20190390066A1 (en) | 2018-06-22 | 2019-12-26 | Covestro Llc | Waterborne compositions containing inorganic ion-exchangers to improve corrosion resistance |
| US20190390064A1 (en) | 2018-06-22 | 2019-12-26 | Covestro Llc | Solventborne compositions containing inorganic ion-exchangers to improve corrosion resistance |
| WO2020005393A1 (en) | 2018-06-26 | 2020-01-02 | Dow Global Technologies Llc | Fibre-reinforced composite and process of making this composite |
| CN109985530A (zh) * | 2019-02-24 | 2019-07-09 | 海南大学 | 一种制备环氧热固性树脂超滤膜的方法 |
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-
2005
- 2005-11-02 US US11/663,802 patent/US7923073B2/en not_active Expired - Fee Related
- 2005-11-02 KR KR1020077010527A patent/KR101227201B1/ko not_active Expired - Fee Related
- 2005-11-02 JP JP2007541252A patent/JP5248860B2/ja not_active Expired - Fee Related
- 2005-11-02 MX MX2007005597A patent/MX2007005597A/es active IP Right Grant
- 2005-11-02 DE DE602005018680T patent/DE602005018680D1/de not_active Expired - Lifetime
- 2005-11-02 CA CA002582360A patent/CA2582360A1/en not_active Abandoned
- 2005-11-02 ES ES05818062T patent/ES2337598T3/es not_active Expired - Lifetime
- 2005-11-02 RU RU2007121650/04A patent/RU2395545C2/ru not_active IP Right Cessation
- 2005-11-02 CN CN2005800382698A patent/CN101056933B/zh not_active Expired - Fee Related
- 2005-11-02 EP EP05818062A patent/EP1814948B1/en not_active Expired - Lifetime
- 2005-11-02 WO PCT/US2005/039963 patent/WO2006052727A1/en not_active Ceased
- 2005-11-02 AT AT05818062T patent/ATE453688T1/de active
- 2005-11-02 BR BRPI0516702-7A patent/BRPI0516702A/pt not_active IP Right Cessation
- 2005-11-09 TW TW094139243A patent/TWI400296B/zh not_active IP Right Cessation
-
2007
- 2007-04-02 NO NO20071727A patent/NO20071727L/no not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| EP1814948B1 (en) | 2009-12-30 |
| RU2007121650A (ru) | 2008-12-20 |
| US7923073B2 (en) | 2011-04-12 |
| BRPI0516702A (pt) | 2008-09-16 |
| CN101056933A (zh) | 2007-10-17 |
| KR20070084111A (ko) | 2007-08-24 |
| US20080213489A1 (en) | 2008-09-04 |
| CA2582360A1 (en) | 2006-05-18 |
| EP1814948A1 (en) | 2007-08-08 |
| ATE453688T1 (de) | 2010-01-15 |
| JP2008519886A (ja) | 2008-06-12 |
| ES2337598T3 (es) | 2010-04-27 |
| CN101056933B (zh) | 2012-11-21 |
| JP5248860B2 (ja) | 2013-07-31 |
| HK1112930A1 (en) | 2008-09-19 |
| TW200624500A (en) | 2006-07-16 |
| KR101227201B1 (ko) | 2013-01-28 |
| NO20071727L (no) | 2007-08-08 |
| DE602005018680D1 (de) | 2010-02-11 |
| RU2395545C2 (ru) | 2010-07-27 |
| TWI400296B (zh) | 2013-07-01 |
| WO2006052727A1 (en) | 2006-05-18 |
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