| Mechanical Properties of Nanoporous Gold in Tension N Badwe, X Chen, K Sieradzki Acta Materialia, 2017 | 158 | 2017 |
| Potential-dependent dynamic fracture of nanoporous gold S Sun, X Chen, N Badwe, K Sieradzki Nature materials 14 (9), 894-898, 2015 | 108 | 2015 |
| Decoupling the role of stress and corrosion in the intergranular cracking of noble-metal alloys N Badwe, X Chen, D Schreiber, M Olszta, N Overman, E Karasz, A Tse, ... Nature Materials, 2018 | 99 | 2018 |
| Low temperature solder-a breakthrough technology for surface mounted devices S Sahasrabudhe, S Mokler, M Renavikar, S Sane, K Byrd, E Brigham, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1455-1464, 2018 | 91 | 2018 |
| Dynamic fracture and dealloying induced stress-corrosion cracking X Chen, E Karasz, N Badwe, K Sieradzki Corrosion Science 187, 109503, 2021 | 23 | 2021 |
| Interfacial fracture strength and toughness of copper/epoxy-resin interfaces N Badwe, R Mahajan, K Sieradzki Acta Materialia 103, 512-518, 2016 | 23 | 2016 |
| Influence of pad surface finish on the microstructure evolution and intermetallic compound growth in homogeneous Sn-Bi and Sn-Bi-Ag solder interconnects Y Fan, Y Wu, TF Dale, SAP Lakshminarayana, CV Greene, NU Badwe, ... Journal of Electronic Materials 50 (12), 6615-6628, 2021 | 21 | 2021 |
| Thermal cycling induced interconnect stability degradation mechanism in low melting temperature solder joints K Young, R Aspandiar, N Badwe, S Walwadkar, YW Lee, TK Lee 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1199-1205, 2022 | 12 | 2022 |
| Low temperature lead‐free alloys and solder pastes R Aspandiar, N Badwe, K Byrd Lead‐free Soldering Process Development and Reliability, 95-154, 2020 | 11 | 2020 |
| Chapter 5: Low Temperature Lead-Free Alloys and Solder Pastes R Aspandiar, N Badwe, K Byrd Lead‐free Soldering Process Development and Reliability, Jasbir Bath, editor …, 0 | 10 | |
| Root Cause and Solution to Mitigate the Hot Tear Defect Mode in Hybrid SAC-Low Temp Solder Joints T Harris, K Byrd, N Badwe Proceedings of SMTA International, 2019 | 8 | 2019 |
| Comparative mechanical behavior of Sn-Bi based low temperature solder alloys under different pretest aging conditions SA PL, CV Greene, SY Lai, R Radulescu, H Fowler, J Blendell, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2218-2222, 2023 | 6 | 2023 |
| High-temperature mechanical properties and fatigue of nanocrystalline nickel-cobalt-phosphorous (NiCoP) alloy N Badwe, P Daharwal, T Rawlings, P Diglio, S Wozny, M Khurana, ... Materialia 18, 101136, 2021 | 6 | 2021 |
| Tin-Bismuth Low Temperature Homogeneous Second Level Interconnect Solder Joint Microstructure, Reliability, and Failure Mechanism N Badwe, K Byrd, O Jin, P Goonetilleke Proceedings of SMTA International, 2019 | 6 | 2019 |
| Fracture of nanoporous gold N Badwe Arizona State University, 2014 | 5 | 2014 |
| Thermal Cycle and Drop Shock Performance of Homogeneous SnBi LTS and SAC Solder Joints N Badwe, J Stafford, R Sidhu, J Cook, P Goonetilleke Proceedings of SMTA International, 2020 | 4* | 2020 |
| Microalloying Effects on Intermetallic Compound Growth and Mechanical Reliability of Sn-Bi Solder Joints Y Fan, SAP Lakshminarayana, CV Greene, HN Fowler, TF Dale, Y Wu, ... SMTA International, 2021 | 3 | 2021 |
| High Temperature Mechanical Properties of Nano-twinned Copper G Parween, BY Chen, DP Tran, C Chen, N Badwe 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 1-3, 2024 | 1 | 2024 |
| Intermetallic Compound Growth and Gold Embrittlement Effect in Sn-Bi Low Temperature Solders in Contact with Electroless Nickel Emersion Gold (ENIG) Surface Finish Y Fan, Y Wu, TF Dale, S Achar, NU Badwe, RF Aspandiar, JE Blendell, ... SMTA International 22 (1), 392-400, 2020 | 1 | 2020 |
| Low Temperature Solder Paste Transfer Efficiency Characterization and Area Ratio Limits A Prasad, X Chen, N Badwe, K Byrd Proceedings of SMTA International, 2019 | 1 | 2019 |
Karl SieradzkiArizona State UniversityVerified email at asu.edu
