| Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces JJ Ong, WL Chiu, OH Lee, CW Chiang, HH Chang, CH Wang, KC Shie, ... Materials 15 (5), 1888, 2022 | 72 | 2022 |
| Conductive characteristics of indium tin oxide thin film on polymeric substrate under long-term static deformation DP Tran, HI Lu, CK Lin Coatings 8 (6), 212, 2018 | 65 | 2018 |
| Electrodeposition of slanted nanotwinned Cu foils with high strength and ductility DP Tran, KJ Chen, KN Tu, C Chen, YT Chen, S Chung Electrochimica Acta 389, 138640, 2021 | 60 | 2021 |
| Effect of deposition temperature on mechanical properties of nanotwinned Cu fabricated by rotary electroplating HY Cheng, DP Tran, KN Tu, C Chen Materials Science and Engineering: A 811, 141065, 2021 | 58 | 2021 |
| Failure Mechanisms of Cu–Cu Bumps under Thermal Cycling KC Shie, PN Hsu, YJ Li, DP Tran, C Chen Materials 14 (19), 5522, 2021 | 46 | 2021 |
| Effect of Cu Ion Concentration on Microstructures and Mechanical Properties of Nanotwinned Cu Foils Fabricated by Rotary Electroplating YW Hung, DP Tran, C Chen Nanomaterials 11, 213, 2021 | 44 | 2021 |
| Enhancement of electromigration lifetime of copper lines by eliminating nanoscale grains in highly <111>-oriented nanotwinned structures DP Tran, HH Li, IH Tseng, C Chen Journal of Materials Research and Technology 15, 6690-6699, 2021 | 40 | 2021 |
| Effect of oxidation on electromigration in 2-µm Cu redistribution lines capped with polyimide IH Tseng, PN Hsu, WY Hsu, DP Tran, BTH Lin, CC Chang, KN Tu, C Chen Results in Physics 31, 105048, 2021 | 31 | 2021 |
| Hybrid Cu-to-Cu bonding with nano-twinned Cu and non-conductive paste YH Kuo, DP Tran, JJ Ong, KN Tu, C Chen Journal of Materials Research and Technology 18, 859-871, 2022 | 30 | 2022 |
| Effect of Electroplating Current Density on Tensile Properties of Nanotwinned Copper Foils CY Fang, DP Tran, HC Liu, JJ Ong, YQ Lin, WY Hsu, C Chen Journal of The Electrochemical Society, 2022 | 29 | 2022 |
| Low temperature Cu/SiO2 hybrid bonding via< 1 1 1>-oriented nanotwinned Cu with Ar plasma surface modification MH Yu, JJ Ong, DP Tran, WL Chiu, WY Hsu, HE Lin, YA Chen, HH Tseng, ... Applied Surface Science 636, 157854, 2023 | 28 | 2023 |
| Effect of Intermetallic Compound Bridging on the Cracking Resistance of Sn2.3Ag Microbumps with Different UBM Structures under Thermal Cycling CC Mo, DP Tran, JY Juang, C Chen Metals 11 (7), 1065, 2021 | 26 | 2021 |
| Interfacial Characterization of Low-Temperature Cu-to-Cu Direct Bonding with Chemical Mechanical Planarized Nanotwinned Cu Films PF Lin, DP Tran, HC Liu, YY Li, C Chen Materials 15 (3), 937, 2022 | 25 | 2022 |
| Acetamidinium Cation to Confer Ion Immobilization and Structure Stabilization of Organometal Halide Perovskite Toward Long Life and High‐Efficiency p‐i‐n Planar Solar Cell via … KC Hsiao, MH Jao, KY Tian, TH Lin, DP Tran, HC Liao, CH Hou, JJ Shyue, ... Solar Rrl 4 (9), 2000197, 2020 | 24 | 2020 |
| Non-destructive micro analysis of electromigration failures in solder microbumps using 3D X-ray computed tomography DP Tran, TW Lin, KC Shie, C Chen Materials Characterization 194, 112404, 2022 | 22 | 2022 |
| Effects of cyclic deformation on conductive characteristics of indium tin oxide thin film on polyethylene terephthalate substrate DP Tran, HI Lu, CK Lin Surface and Coatings Technology 283, 298-310, 2015 | 22 | 2015 |
| Periodic reverse electrodeposition of (1 1 1)-oriented nanotwinned Cu in small damascene SiO2 vias SC Yang, DP Tran, JJ Ong, WL Chiu, HH Chang, C Chen Journal of Electroanalytical Chemistry 935, 117328, 2023 | 21 | 2023 |
| In-situ measurement of thermal expansion in Cu/SiO2 hybrid structures using atomic force microscopy at elevated temperatures HE Lin, DP Tran, WL Chiu, HH Chang, C Chen Applied Surface Science 662, 160103, 2024 | 19 | 2024 |
| Shearing Characteristics of Cu-Cu Joints Fabricated by Two-Step Process Using Highly <111>-oriented Nanotwinned Cu JJ Ong, DP Tran, SC Yang, KC Shie, C Chen Metals 11 (11), 1864, 2021 | 19 | 2021 |
| Epitaxial growth of (111) nanotwinned Ag on (111) nanotwinned Cu films for low-temperature Cu–Cu bonding HH Tseng, HC Liu, MH Yu, JJ Ong, DP Tran, C Chen Crystal Growth & Design 23 (8), 5519-5527, 2023 | 18 | 2023 |
Chih ChenNational Yang Ming Chiao Tung UniversityVerified email at mail.nctu.edu.tw
