| Critical evaluation of creep behavior of Sn-Ag-Cu solder alloys over wide range of temperatures A Kanjilal, V Jangid, P Kumar Materials Science and Engineering: A 703, 144-153, 2017 | 19 | 2017 |
| Effect of type of thermo-mechanical excursion on growth of interfacial intermetallic compounds in Cu/Sn-Ag-Cu solder joints R Ghosh, A Kanjilal, P Kumar Microelectronics Reliability 74, 44-51, 2017 | 18 | 2017 |
| Growth of interfacial intermetallic compound layer in diffusion-bonded sac–cu solder joints during different types of thermomechanical excursion A Kanjilal, P Kumar Journal of Electronic Materials 47 (1), 457-469, 2018 | 12 | 2018 |
| Effect of joint size on creep behavior of Sn-Ag-Cu solder-Cu joints A Kanjilal, PR Narayanan, M Agilan, P Kumar Journal of Electronic Materials 52 (2), 739-750, 2023 | 7 | 2023 |
| Transition from necking to cavitation driven tertiary creep with length scale in constrained ductile metal joints A Kanjilal, P Kumar Materials Science and Engineering: A 845, 143205, 2022 | 4 | 2022 |
| Size dependent creep deformation of elastically constrained compliant metallic joints A Kanjilal, P Kumar Materialia 21, 101322, 2022 | 3 | 2022 |
| Effects of an interfacial layer on stress relaxation mechanisms active in the Cu–Si thin film system during thermal cycling N Somaiah, A Kanjilal, P Kumar MRS Communications 10 (1), 164-172, 2020 | 3 | 2020 |
| Role of Cavitation in Necking-Driven Tertiary Stage of Power-Law Creep of Sn and Sn-Ag-Cu Solder Alloy: An Experiment-Inspired Modeling Approach A Kanjilal, P Kumar Journal of Electronic Materials 54 (4), 2638-2656, 2025 | 2 | 2025 |
| Hydrogen Permeation Barrier Layers for the Hydrogen Economy A Kanjilal, MJ Duarte, C Scheu, G Dehm Annual Review of Materials Research 55, 2025 | 2 | 2025 |
| Temperature-driven nanoscale brittle-to-ductile transition of the C15 CaAl2 Laves phase A Kanjilal, A Ahmadian, M Freund, PL Sun, S Korte-Kerzel, G Dehm, ... Materials & Design 244, 113206, 2024 | 2 | 2024 |
| Fracture of the C15 CaAl2 Laves phase at small length scales JP Best, A Kanjilal, A Ghafarollahi, U Rehman, C Tian, H Bishara, ... Journal of Materials Science 59 (27), 12677-12694, 2024 | 2 | 2024 |
| Effect of length scale on high temperature mechanical behavior of Sn-Cu joints: a mechanics and material science based treatment, IISC Bangalore.(2022) A Kanjilal | 2 | |
| Insights into growth behavior of intermetallic compounds in Sn-Ag-Cu solder joints during mechanical and thermo-mechanical deformation processes A Kanjilal, P Kumar 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 48-52, 2019 | 1 | 2019 |
| Investigation of Al2O3 coating deposited on Al alloy by electrochemical oxidation for hydrogen permeation barrier applications A Kanjilal, MK Bhat, MJ Duarte, P Shashkov, S Usov, F Fanicchia, ... SteelyHydrogen Conference, 2025 | | 2025 |
| Microscale deformation of an intermetallic-metal interface in bi-layered film under shear loading A Kanjilal, S Aliramaji, D Neuß, M Hans, JM Schneider, JP Best, G Dehm Scripta Materialia 263, 116665, 2025 | | 2025 |
| Microscale deformation of intermetallic-Mg interface under shear loading A Kanjilal, S Aliramaji, D Neuß, M Hans, JM Schneider, JP Best, G Dehm arXiv preprint arXiv:2412.12913, 2024 | | 2024 |
| Investigation of Intermetallic-Mg interface strength using in-situ microshear testing A Kanjilal, JP Best, G Dehm Nanomechanical Testing in Materials Research and Development IX, 2024 | | 2024 |
| Nanoscale brittle-to-ductile transition of the C15 CaAl Laves phase A Kanjilal, A Ahmadian, M Freund, PL Sun, S Korte-Kerzel, G Dehm, ... arXiv preprint arXiv:2403.12507, 2024 | | 2024 |
| Elevated temperature deformation of intermetallic phases in Mg–Al–Ca alloy at small length scale A Kanjilal, JP Best, G Dehm International conference on creep and fracture of engineering materials and …, 2024 | | 2024 |
| Using in-situ nano-and micromechanical testing to probe the fracture behavior of intermetallic Laves phase materials A Kanjilal, JP Best, G Dehm 7th International Indentation Workshop–IIW7, 2023 | | 2023 |
Praveen KumarIndian Institute of Science, Bangalore, IndiaVerified email at iisc.ac.in
