| Review: overcoming the paradox of strength and ductility in ultrafine-grained materials at low temperatures P Kumar, M Kawasaki, TG Langdon J Mater Sci 51 (1), 7-18, 2016 | 137 | 2016 |
| Microstructural coarsening in Sn-Ag-based solders and its effects on mechanical properties I Dutta, P Kumar, G Subbarayan JOM Journal of the Minerals, Metals and Materials Society 61 (6), 29-38, 2009 | 133 | 2009 |
| Interfacial Effects During Thermal Cycling of Cu-Filled Through-Silicon Vias (TSV) P Kumar, I Dutta, MS Bakir Journal of electronic materials 41 (2), 322-335, 2012 | 123 | 2012 |
| Harper-Dorn creep ME Kassner, P Kumar, W Blum International journal of plasticity 23 (6), 980-1000, 2007 | 106 | 2007 |
| Mechanical characteristics of a Zn–22% Al alloy processed to very high strains by ECAP P Kumar, C Xu, TG Langdon Materials Science and Engineering: A 429 (1-2), 324-328, 2006 | 79 | 2006 |
| Microstructurally adaptive model for primary and secondary creep of Sn-Ag-based solders P Kumar, Z Huang, SC Chavali, DK Chan, I Dutta, G Subbarayan, V Gupta IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (2 …, 2011 | 70 | 2011 |
| Nano‐and Micro‐Mechanical Properties of Ultrafine‐Grained Materials Processed by Severe Plastic Deformation Techniques M Kawasaki, B Ahn, P Kumar, J Jang, TG Langdon Advanced Engineering Materials, 2017 | 65 | 2017 |
| Solid–state diffusion–controlled growth of the intermediate phases from room temperature to an elevated temperature in the Cu–Sn and the Ni–Sn systems VA Baheti, S Kashyap, P Kumar, K Chattopadhyay, A Paul Journal of Alloys and Compounds 727, 832-840, 2017 | 58 | 2017 |
| The significance of grain boundary sliding in the superplastic Zn–22% Al alloy after processing by ECAP P Kumar, C Xu, TG Langdon Materials Science and Engineering: A 410, 447-450, 2005 | 57 | 2005 |
| Bifurcation of the Kirkendall marker plane and the role of Ni and other impurities on the growth of Kirkendall voids in the Cu–Sn system VA Baheti, S Kashyap, P Kumar, K Chattopadhyay, A Paul Acta Materialia 131, 260-270, 2017 | 56 | 2017 |
| Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates: I. Effects of Loading and Processing Conditions Z Huang, P Kumar, I Dutta, JHL Pang, R Sidhu, M Renavikar, R Mahajan Journal of Electronic Materials, 1-15, 2011 | 56 | 2011 |
| Fifty years of Harper–Dorn creep: a viable creep mechanism or a Californian artifact? P Kumar, ME Kassner, TG Langdon Journal of materials science 42 (2), 409-420, 2007 | 55 | 2007 |
| Interface-related reliability challenges in 3-D interconnect systems with through-silicon vias I Dutta, P Kumar, MS Bakir JOM Journal of the Minerals, Metals and Materials Society 63 (10), 70-77, 2011 | 54 | 2011 |
| Liquid Phase Sintered Solders with Indium as Minority Phase for Next Generation Thermal Interface Material Applications I Dutta, R Raj, P Kumar, T Chen, CM Nagaraj, J Liu, M Renavikar, ... Journal of electronic materials 38 (12), 2735-2745, 2009 | 51 | 2009 |
| The contribution of grain boundary sliding in tensile deformation of an ultrafine-grained aluminum alloy having high strength and high ductility T Mungole, P Kumar, M Kawasaki, TG Langdon Journal of Materials Science 50 (10), 3549-3561, 2015 | 50 | 2015 |
| A critical examination of the paradox of strength and ductility in ultrafine-grained metals T Mungole, P Kumar, M Kawasaki, TG Langdon Journal of Materials Research 29 (21), 2534-2546, 2014 | 46 | 2014 |
| Recrystallization and Ag₃Sn Particle Redistribution During Thermomechanical Treatment of Bulk Sn-Ag-Cu Solder Alloys U Sahaym, B Talebanpour, S Seekins, I Dutta, P Kumar, P Borgesen IEEE Transactions on Components, Packaging and Manufacturing Technology 3 …, 2013 | 46 | 2013 |
| Electric current induced flow of liquid metals: Mechanism and substrate-surface effects P Kumar, J Howarth, I Dutta Journal of Applied Physics 115, 044915, 2014 | 45 | 2014 |
| Electromigration in Metallic Materials and Its Role in Whiskering P Kumar Handbook of Solid State Diffusion, Volume 2, 173-206, 2017 | 43* | 2017 |
| Identification of whisker grain in Sn coatings by analyzing crystallographic micro-texture using electron back-scatter diffraction P Jagtap, A Chakraborty, P Eisenlohr, P Kumar Acta Materialia 134, 346-359, 2017 | 41 | 2017 |
Indranath DuttaWashington State UniversityVerified email at wsu.edu
