| Fabrication of multiple through-holes in non-conductive materials by Electrochemical Discharge Machining for RF MEMS Packaging J Arab, DK Mishra, HK Kannojia, P Adhale, P Dixit Journal of Materials Processing Technology 271, 542-553, 2019 | 89 | 2019 |
| Effect of tool electrode roughness on the geometric characteristics of through-holes formed by ECDM J Arab, HK Kannojia, P Dixit Precision Engineering 60, 437-447, 2019 | 82 | 2019 |
| A review of intermetallic compound growth and void formation in electrodeposited Cu–Sn Layers for microsystems packaging HK Kannojia, P Dixit Journal of Materials Science: Materials in Electronics 32 (6), 6742-6777, 2021 | 75 | 2021 |
| Fabrication and characterization of through-glass vias by the ECDM process HK Kannojia, J Arab, BJ Pegu, P Dixit Journal of The Electrochemical Society 166 (13), D531, 2019 | 62 | 2019 |
| Design and fabrication of through-glass via (TGV) based 3D spiral inductors in fused silica substrate HK Kannojia, A Sidhique, AS Shukla, J Pednekar, S Gupta, P Dixit Microsystem Technologies 28 (4), 955-964, 2022 | 19 | 2022 |
| Void Formation and Intermetallic Growth in Pulse Electrodeposited Cu-Sn Layers for MEMS Packaging. HK Kannojia, SK Sharma, P Dixit Journal of Electronic Materials 47 (12), 2018 | 14 | 2018 |
| Fabrication and Characterization of Through-glass vias (TGV) based 3D Spiral and Toroidal Inductors by Cost-effective ECDM Process HK Kannojia, J Arab, A Sidhique, DK Mishra, R Kumar, J Pednekar, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1192-1198, 2020 | 13 | 2020 |
| Effect of Surface Roughness on Void Formation and Intermetallic Growth in Electrodeposited Cu-Sn stacks HK Kannojia, P Dixit Materials Letters 257, 126710, 2019 | 11 | 2019 |
| Challenges in fabrication of high aspect ratio electrostatic comb-drive microactuator using one-step X-ray lithography R Shukla, HK Kannojia, C Mukherjee, PR Sankar, BS Thakur, AK Sinha, ... ISSS Journal of Micro and Smart Systems 9 (2), 173-180, 2020 | 9 | 2020 |
| Experimental investigations in the intermetallic and microvoid formation in sub-200 °C Cu–Sn bonding HK Kannojia, P Dixit Journal of Materials Science: Materials in Electronics 30 (17), 16427-16438, 2019 | 7 | 2019 |
| Innovative Integration of Dual Quantum Cascade Lasers on Silicon Photonics Platform D Wang, HK Kannojia, P Jouy, E Giraud, K Suter, R Maulini, D Gachet, ... Micromachines 15 (8), 1055, 2024 | 6 | 2024 |
| Mid-infrared dual-comb QCLs integrated with beam combiner based on Ge-on-Si platform D Wang, HK Kannojia, P Jouy, E Giraud, G Van Steenberge, B Kuyken 2023 IEEE Silicon Photonics Conference (SiPhotonics), 1-2, 2023 | 5 | 2023 |
| Formation of Through-Wafer 3-D Interconnects in Fused Silica Substrates by Electrochemical Discharge Machining HK Kannojia, J Arab, R Kumar, J Pednekar, P Dixit 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 253-257, 2019 | 5 | 2019 |
| Microlens integration on photonic integrated circuits: a platform for achieving relaxed packaging tolerances and hybrid integration of external functionality J Missinne, R Verplancke, YT Chang, J Van Asch, H Kannojia, V Geudens, ... Silicon Photonics XIX 12891, 83-91, 2024 | 4 | 2024 |
| Laser-Induced Forward Transfer for Assembly of Silicon Micro-Chiplets HK Kannojia, G Van Steenberge 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 170-174, 2022 | 3 | 2022 |
| Void Formation in Low-Temperature Electroplated Cu-Sn Stack for Hermetic Packaging HK Kannojia, P Dixit 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 124-128, 2019 | 3 | 2019 |
| Assembly of Thin Micro-Chiplets using Laser-Induced Forward Transfer HK Kannojia, G Van Steenberge 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 824-828, 2023 | 2 | 2023 |
| Quantum Cascade Laser Integration with Mid-Infrared Photonic Integrated Circuits for Diverse Sensing Applications HK Kannojia, T Zhai, R Maulini, D Gachet, B Kuyken, G Van Steenberge 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC), 271-276, 2024 | 1 | 2024 |
| A modular sensing platform on silicon for the mid-infrared G Van Steenberge, T Zhai, HK Kannojia, D Wang, J Missinne, B Kuyken, ... 2024 IEEE Photonics Conference (IPC), 1-2, 2024 | 1 | 2024 |
| Laser-Induced Forward Transfer of Thin Microchiplets in Quasi-Contact Mode HK Kannojia, G Van Steenberge 2025 IEEE CPMT Symposium Japan (ICSJ), 148-151, 2025 | | 2025 |
Pradeep DixitIIT Bombay India, NTU Singapore, VTT FinlandVerified email at iitb.ac.in
