| Low-loss integration of high-density polymer waveguides with silicon photonics for co-packaged optics J Van Asch, J Missinne, J He, A Podpod, G Lepage, N Golshani, ... Optica, https://doi.org/10.1364/OPTICA.559260 12 (6), 821-830, 2025 | 7 | 2025 |
| Design of a Broadband Adiabatic Coupler for Interfacing PICs to Optical Redistribution Layers J Van Asch, J He, J Missinne, G Lepage, J Van Campenhout, ... Photonics Benelux Annual Symposium 2022, 4, 2022 | 7 | 2022 |
| A methodical approach to design adiabatic waveguide couplers for heterogeneous integrated photonics J Van Asch, A Kandeel, J He, J Missinne, P Bienstman, D Van Thourhout, ... Journal of Physics: Photonics 6 (4), 045013, 2024 | 6 | 2024 |
| Packaging of ultra-dynamic photonic switches and transceivers for integration into 5G radio access network and datacenter sub-systems G Van Steenberge, G Roelkens, P Ossieur, J Missinne, J Van Asch, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 742-747, 2023 | 6 | 2023 |
| Sub-1 dB loss SiN-to-polymer waveguide coupling: an enabler for co-packaged optics J Van Asch, J Missinne, J He, P Xu, A Podpod, G Lepage, N Golshani, ... 2024 Optical Fiber Communications Conference and Exhibition (OFC), 1-3, 2024 | 5 | 2024 |
| Microlens integration on photonic integrated circuits: a platform for achieving relaxed packaging tolerances and hybrid integration of external functionality J Missinne, R Verplancke, YT Chang, J Van Asch, H Kannojia, V Geudens, ... Silicon Photonics XIX 12891, 83-91, 2024 | 4 | 2024 |
| Interfacing silicon photonics for CPO G Van Steenberge, J Van Asch, V Geudens, T De Baere, N De Moerlooze, ... 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 1161-1165, 2024 | 2 | 2024 |
| Integration Methods for Co-Packaged Optics using Sin-to-Polymer Waveguide Coupling J Van Asch, J Missinne, J He, A Podpod, G Lepage, N Golshani, ... 2025 30th OptoElectronics and Communications Conference (OECC) and 2025 …, 2025 | | 2025 |
| Broadband Chip-to-Fiber Coupling Using Polymer Waveguides: An Alignment-Tolerant Interface for Co-Packaged Optics J Van Asch Ghent University, 2025 | | 2025 |
| FOWLP for Next-Generation Optical Switches: Scalable Packaging Solutions for Photonic-Electronic Integration M Adler, R Gernhardt, M Wöhrmann, T Braun, J Missinne, HK Kannojia, ... IMAPSource Proceedings 2025 (Symposium), 290-296, 2025 | | 2025 |
| Optical gain from organic materials in a liquid crystal J Van Asch Politecnico di Milano, 2016 | | 2016 |
Geert Van SteenbergeVerified email at ugent.be
