| Scalable energy-efficient magnetoelectric spin–orbit logic S Manipatruni, DE Nikonov, CC Lin, TA Gosavi, H Liu, B Prasad, ... Nature 565 (7737), 35-42, 2019 | 906 | 2019 |
| International Electron Devices Meeting (IEDM) KW Lee, T Nakamura, T One, Y Yamada, T Mizukusa, H Hasimoto, ... International Electron Devices Meeting (IEDM), 165-168, 2000 | 169 | 2000 |
| Enabling ultra-low-voltage switching in BaTiO3 Y Jiang, E Parsonnet, A Qualls, W Zhao, S Susarla, D Pesquera, ... Nature materials 21 (7), 779-785, 2022 | 135 | 2022 |
| Spin–orbit magnetic state readout in scaled ferromagnetic/heavy metal nanostructures VT Pham, I Groen, S Manipatruni, WY Choi, DE Nikonov, E Sagasta, ... Nature Electronics, 1-7, 2020 | 92 | 2020 |
| Ultralow voltage manipulation of ferromagnetism B Prasad, YL Huang, RV Chopdekar, Z Chen, J Steffes, S Das, Q Li, ... Advanced materials 32 (28), 2001943, 2020 | 87 | 2020 |
| Voltage control of unidirectional anisotropy in ferromagnet-multiferroic system S Manipatruni, DE Nikonov, CC Lin, B Prasad, YL Huang, AR Damodaran, ... Science Advances 4 (11), eaat4229, 2018 | 86 | 2018 |
| Spin–Charge Interconversion in KTaO3 2D Electron Gases LM Vicente‐Arche, J Bréhin, S Varotto, M Cosset‐Cheneau, S Mallik, ... Advanced Materials 33 (43), 2102102, 2021 | 81 | 2021 |
| Manipulating magnetoelectric energy landscape in multiferroics YL Huang, D Nikonov, C Addiego, RV Chopdekar, B Prasad, L Zhang, ... Nature communications 11 (1), 2836, 2020 | 78 | 2020 |
| Spin transfer torque in a graphene lateral spin valve assisted by an external magnetic field CC Lin, AV Penumatcha, Y Gao, VQ Diep, J Appenzeller, Z Chen Nano letters 13 (11), 5177-5181, 2013 | 72 | 2013 |
| Anti-ferroelectric HfxZr1-xO2 Capacitors for High-density 3-D Embedded-DRAM SC Chang, N Haratipour, S Shivaraman, TL Brown-Heft, J Peck, CC Lin, ... 2020 IEEE International Electron Devices Meeting (IEDM), 28.1. 1-28.1. 4, 2020 | 71 | 2020 |
| Toward Intrinsic Ferroelectric Switching in Multiferroic E Parsonnet, YL Huang, T Gosavi, A Qualls, D Nikonov, CC Lin, I Young, ... Physical review letters 125 (6), 067601, 2020 | 66 | 2020 |
| Tunable charge to spin conversion in strontium iridate thin films AS Everhardt, M Dc, X Huang, S Sayed, TA Gosavi, Y Tang, CC Lin, ... Physical Review Materials 3 (5), 051201, 2019 | 66 | 2019 |
| Gate length scaling beyond Si: mono-layer 2D channel FETs robust to short channel effects CJ Dorow, A Penumatcha, A Kitamura, C Rogan, KP O’Brien, S Lee, ... 2022 International Electron Devices Meeting (IEDM), 7.5. 1-7.5. 4, 2022 | 50 | 2022 |
| Voltage-based magnetization switching and reading in magnetoelectric spin-orbit nanodevices DC Vaz, CC Lin, JJ Plombon, WY Choi, I Groen, IC Arango, A Chuvilin, ... Nature Communications 15 (1), 1902, 2024 | 48 | 2024 |
| Ferroelectric or anti-ferroelectric trench capacitor with spacers for sidewall strain engineering N HARATIPOUR, SC Chang, CC Lin, J Kavalieros, U Avci, I Young US Patent 11,063,131, 2021 | 44 | 2021 |
| Improvement of spin transfer torque in asymmetric graphene devices CC Lin, Y Gao, AV Penumatcha, VQ Diep, J Appenzeller, Z Chen ACS nano 8 (4), 3807-3812, 2014 | 33 | 2014 |
| Exploring manufacturability of novel 2D channel materials: 300 mm wafer-scale 2D NMOS & PMOS using MoS2, WS2, & WSe2 CJ Dorow, T Schram, Q Smets, KP O’Brien, K Maxey, CC Lin, L Panarella, ... 2023 International Electron Devices Meeting (IEDM), 1-4, 2023 | 32 | 2023 |
| Metal/ two-dimensional electron gases for spin-to-charge conversion LM Vicente-Arche, S Mallik, M Cosset-Cheneau, P Noël, DC Vaz, F Trier, ... Physical Review Materials 5 (6), 064005, 2021 | 32 | 2021 |
| 300 mm MOCVD 2D CMOS materials for more (than) Moore scaling K Maxey, CH Naylor, KP O'Brien, A Penumatcha, A Oni, C Mokhtarzadeh, ... 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and …, 2022 | 31 | 2022 |
| High mobility TMD NMOS and PMOS transistors and GAA architecture for ultimate CMOS scaling A Penumatcha, KP O’Brien, K Maxey, W Mortelmans, R Steinhardt, ... 2023 International Electron Devices Meeting (IEDM), 1-4, 2023 | 22 | 2023 |
Ashish Verma PenumatchaComponents Research, Intel Corp.Verified email at intel.com
