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WO2025239031A1 - Dispositif de formation de film, procédé de formation de film et procédé de fabrication d'article - Google Patents

Dispositif de formation de film, procédé de formation de film et procédé de fabrication d'article

Info

Publication number
WO2025239031A1
WO2025239031A1 PCT/JP2025/011941 JP2025011941W WO2025239031A1 WO 2025239031 A1 WO2025239031 A1 WO 2025239031A1 JP 2025011941 W JP2025011941 W JP 2025011941W WO 2025239031 A1 WO2025239031 A1 WO 2025239031A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
template
curable composition
film
foreign matter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/JP2025/011941
Other languages
English (en)
Japanese (ja)
Inventor
直城 丸山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of WO2025239031A1 publication Critical patent/WO2025239031A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Definitions

  • the present invention relates to a film forming apparatus, a film forming method, and a method for manufacturing an article.
  • An imprinting device that uses the photocuring method forms a pattern on the substrate by using a mold to shape a photocurable material supplied to a shot area on the substrate, irradiating it with light to harden the material, and then separating the mold from the hardened material.
  • Patent Document 1 aims to improve planarization accuracy by dripping a curable material based on the unevenness of the substrate and then curing the curable material while the flat surface of a mold is in contact with the dropped curable material.
  • One of the main performance aspects of a planarization system is minimizing defects and increasing the number of non-defective products.
  • One cause of defects is foreign matter that exists between the mold and substrate that are superimposed. If a foreign matter exists between the mold and substrate, the curable material at the point where the foreign matter is sandwiched will not come into contact with the flat surface of the mold, and the foreign matter may cause a concave shape. This phenomenon will result in a defect in a device that planarizes the top surface of a curable material.
  • Patent Document 2 describes a method for detecting whether a foreign object is sandwiched between the mold and the substrate by examining the degree of disruption of the interference fringes that spread concentrically over the contact area between the mold and the substrate.
  • Patent Document 2 requires a wide observation area and high resolution in a system that flattens the entire substrate surface at once. This poses the problem of difficulty in detecting small foreign objects below the resolution limit of the imaging unit (e.g., 70 ⁇ m) when the mold and substrate are separated by a curable material.
  • the imaging unit e.g. 70 ⁇ m
  • foreign matter can also include impurities contained in the curable material sandwiched between the mold and substrate, and cured curable material that has peeled off from the substrate.
  • the curable material sandwiched between the mold and substrate is photo-cured and released, the curable material usually remains on the substrate, but some of the curable material can peel off from the substrate and adhere to the surface of the mold, becoming foreign matter.
  • the thickness of the cured curable material is on the order of tens to hundreds of nanometers, and if such foreign matter, including other small foreign matter of the same size, adheres to the surface of the mold, it continues to be transferred to the substrate, increasing the number of defective products.
  • an exemplary object of the present invention is to provide an advantageous technology for detecting foreign objects.
  • one aspect of the present invention is a film forming apparatus that forms a film of a curable composition on a substrate, and is characterized by having: a template holding unit that holds a template having an area that comes into contact with the curable composition on the substrate; a substrate holding unit that holds the substrate; and a detection means that detects foreign matter between the template and the substrate while the template is in contact with the substrate or the curable composition on the substrate, after a film formation process that forms a film of the curable composition by curing the curable composition on the substrate while in contact with the template and peeling the template and the curable composition off.
  • the present invention provides an advantageous technology for detecting foreign objects.
  • FIG. 1 is a schematic diagram illustrating a configuration example of a film forming apparatus according to a first embodiment.
  • FIG. 1 is a schematic diagram showing a planarization apparatus with a mold in contact with a curable material on a substrate.
  • 1A and 1B are diagrams illustrating a planarization process in a planarization device.
  • 10A and 10B are diagrams illustrating an example of a state in which a foreign substance exists between a mold and a substrate.
  • 1A and 1B are diagrams illustrating an example in which defects occur due to foreign matter during planarization processing.
  • 3A to 3C are diagrams illustrating foreign object detection according to the first embodiment.
  • FIG. 10 is a diagram showing an example of a foreign matter detection flow in a planarization process according to the first embodiment.
  • FIGS. 10A and 10B are diagrams illustrating foreign object detection according to a second embodiment.
  • FIG. 10 is a diagram showing an example of a foreign matter detection flow in a planarization process according to the second embodiment.
  • 10A and 10B are diagrams illustrating foreign object detection according to a third embodiment.
  • FIG. 13 is a diagram showing an example of a foreign matter detection flow in a planarization process according to the fourth embodiment.
  • 1A to 1C are diagrams for explaining a method for manufacturing an article.
  • FIG. 1 is a schematic diagram showing the configuration of a film forming apparatus according to a first embodiment.
  • directions are indicated in an XYZ coordinate system, with the horizontal plane being the XY plane.
  • a substrate 3 which is the object to be processed, is placed on a substrate holder so that its surface is parallel to the horizontal plane (XY plane).
  • the mutually orthogonal directions in a plane along the surface of the substrate 3 are referred to as the X-axis and Y-axis, and the direction perpendicular to the X-axis and Y-axis is referred to as the Z-axis.
  • the directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are referred to as the X-direction, Y-direction, and Z-direction, respectively
  • the rotation directions around the X-axis, Y-axis, and Z-axis are referred to as the ⁇ X-direction, ⁇ Y-direction, and ⁇ Z-direction, respectively.
  • a planarization apparatus 1 is used as the film formation apparatus.
  • the planarization apparatus 1 is an apparatus that uses a template 2 (also called a mold or superstrate) to planarize a curable material on a substrate 3.
  • the planarization apparatus 1 hardens the curable material on the substrate while it is in contact with the template 2, and then separates the hardened curable material from the template 2 to form a globally or locally flat surface (planarized film) of the curable material on the substrate.
  • Template 2 is a member (film-forming member) that has a flat surface for contacting the curable material on the substrate, and is used to shape the curable material to conform to the contact surface by contacting this flat surface with the curable material. It is preferable to use a mold made of a light-transmitting material as template 2, taking into account the light irradiation process.
  • Specific examples of materials that make up template 2 include glass, quartz, optically transparent resins such as PMMA (Polymethyl methacrylate) and polycarbonate resin, transparent metal vapor deposition films, flexible films such as polydimethylsiloxane, photo-curable films, and metal films.
  • Template 2 is preferably the same size as or larger than the substrate; for example, a circle with a diameter greater than 300 mm and less than 500 mm is preferable, but is not limited to this.
  • the thickness of template 2 is preferably greater than 0.25 mm and less than 2 mm, but is not limited to this.
  • the curable material may be, for example, a curable composition that cures when irradiated with light, such as a UV-curable liquid. Monomers such as acrylates and methacrylates are typically used as UV-curable liquids.
  • the curable material may also be referred to as a curable composition or a formable material.
  • the curable material may contain a polymerizable compound, a photopolymerization initiator, a non-polymerizable compound, or a solvent.
  • the non-polymerizable compound may contain at least one of a sensitizer, a hydrogen donor, an internal mold release agent, a surfactant, an antioxidant, and a polymer component.
  • the curable material of this embodiment cures, for example, when irradiated with light (ultraviolet light) with a wavelength of 200 to 380 nm. It cures when irradiated with ultraviolet light. However, this is not limited to this, and the curable material may also be cured by electromagnetic waves other than ultraviolet light.
  • the planarization apparatus 1 includes a chuck 4 that holds the substrate 3, a substrate stage 6 that holds the chuck 4 and can be driven in the X and Y directions, and a base 12 that supports the substrate stage 6 and serves as the base of the planarization apparatus 1.
  • the planarization apparatus 1 also includes an upper portion, in other words, a contact module 5 (template holding unit, mold holding unit, imprint head) that holds the template 2 in a position that faces the substrate 3 held by the chuck 4 and has a drive unit that moves up and down in the Z direction.
  • the planarization apparatus 1 also includes an imaging unit 7 above the contact module 5 that can capture images of the template 2 and substrate 3.
  • the contact module 5 and imaging unit 7 are supported by a top base 11.
  • the top base 11 also supports a measurement sensor 8 that can measure the template 2 and substrate 3, a curing module 9 that can harden the curable material, and an applicator 10 (supply unit) that applies (supplies) the curable material to the substrate 3.
  • the planarization apparatus 1 also includes a control unit 13 that controls the operation of the planarization apparatus 1.
  • the substrate 3 is carried in from outside the planarization apparatus 1 by a substrate transport unit (not shown) including a transport hand (not shown). After the substrate stage 6 is moved to the substrate loading location within the plane of the base 12, the substrate 3 is handed over from the transport hand and held by the chuck 4.
  • the substrate stage can be driven in at least one direction, either the X or Y axis, and has a drive stroke that allows it to pass under the unit supported by the top base 11. It is desirable for the substrate stage to have a drive unit that can drive in two directions, X and Y. Furthermore, it is even more desirable for the substrate stage 6 to have drive in the Z-axis rotation direction, as this enables cases where rotational alignment between the template 2 and the substrate 3 is required.
  • Examples of drive mechanisms within the substrate stage 6 include an actuator such as a linear motor that serves as the power source for the moving unit, including the chuck 4, an encoder that detects position on the nanometer order, and an air guide that levitates the substrate stage 6 by several microns above the base 12.
  • the chuck 4 adsorbs and holds the substrate 3 using vacuum or electrostatic adsorption.
  • the chuck 4 and substrate stage 6 function as a substrate holder.
  • the contact module 5 has an actuator, such as a linear motor or air cylinder, as a drive unit that moves up and down in the Z direction.
  • the contact module 5 can shift in the Z direction and also tilt the template 2.
  • the contact module 5 may also have an encoder for determining its position and multiple force detection sensors.
  • the contact module 5 may have a space separated by a light-transmitting member (e.g., a quartz plate) and the template 2, and adjusting the pressure within the space can deform the template 2 during contact and separation.
  • the contact module 5 may have a mechanism for increasing air pressure on the surface supporting the template 2 so that, when the template 2 is brought into contact with the curable material on the substrate 3, contact begins at the center of the template 2 and progresses toward the periphery of the template 2.
  • a vacuum suction method is used to hold the template 2 in the contact module 5.
  • a leaf spring or electrostatic suction method may also be used to support the template 2.
  • the imaging unit 7 has an optical system and imaging system for observing the contact area between the template 2 and the curable material on the substrate 3.
  • the imaging unit 7 can be used to observe the spread of the curable material on the substrate 3, and the amount of curable material supplied and the application pattern can be optimized based on the results.
  • the imaging unit 7 also captures an image of the interference colors generated by the light reflected from the template 2 and the light reflected from the substrate 3.
  • the measurement sensor 8 is a sensor that can measure the distance to the upper surface of the transparent template 2, i.e., the surface opposite the surface that comes into contact with the curable material.
  • the measurement sensor 8 can also measure the distance to the surface of the substrate 3 regardless of whether it is in contact with the template 2 or not.
  • the measurement sensor 8 is, for example, a distance sensor with a white LED light source, or a distance sensor that emits multi-color light that can achieve stable, high-brightness emission over a wider wavelength range than a white LED light source and can measure with higher accuracy over a wider range than a white LED.
  • the measurement sensor 8 of this embodiment is, for example, a sensor with a measurement spot diameter of several ⁇ m to several hundred ⁇ m, a measurement resolution of several nm, and a measurement repeatability of several nm. Because the measurement spot diameter of such a distance sensor is relatively small, it can measure even smaller irregularities without missing them.
  • the measurement spot diameter of the measurement sensor 8 is relatively small, so in order to measure the entire area of the substrate 3, the measurement sensor 8 measures the entire surface of the substrate 3 while scanning the substrate stage 6. It is also possible to measure the surface of the substrate 3 locally as a means of shortening the time required compared to measuring the entire area of the substrate 3.
  • the curing module 9 has at least one light source, generates light of a wavelength that cures the curable material, and irradiates the light toward the curable material formed by the template 2. This causes the curable material to cure in accordance with the shape of the template 2.
  • the light source may be a UV lamp, UV LED, or the like.
  • the curing module 9 may have a heat source such as a heater. Note that the curing module 9 may be a unit that has both a light source and a heat source.
  • the applicator 10 has multiple nozzles that eject the curable material toward the substrate 3.
  • the nozzle diameters range from several microns to several tens of microns, and the multiple nozzles within the applicator 10 each eject the curable material onto the substrate 3 in droplets on the order of picoliters or larger.
  • the droplet size and position (arrangement) can be changed.
  • the thickness of the curable material sandwiched between the template 2 and the substrate 3 can be intentionally changed within the surface. By making such adjustments, even if there are pattern steps on the substrate surface, the surface can be made flat by contacting it with the template 2.
  • the thickness of the curable material sandwiched between the template 2 and the substrate 3 can also be set as desired. Note that if a substrate 3 already supplied with curable material is loaded into the planarization device 1 by the substrate transport unit, the applicator 10 does not need to be part of the planarization device 1. In other words, an external device may be used as the applicator 10.
  • the control unit 13 controls the operation of each unit of the planarization apparatus 1. Specifically, the control unit 13 controls, for example, the driving of the substrate stage 6 and contact module 5, the imaging operation of the imaging unit 7, the measurement operation of the measurement sensor 8, and the coating operation by the coater 10.
  • the control unit 13 can be configured, for example, by a computer having a processor such as a CPU (Central Processing Unit) and a storage unit such as a memory.
  • the control unit 13 can also be configured, for example, by a PLD (Programmable Logic Device) such as an FPGA (Field Programmable Gate Array), an ASIC (Application Specific Integrated Circuit), a general-purpose computer with an embedded program, or a combination of all or part of these.
  • PLD Programmable Logic Device
  • FPGA Field Programmable Gate Array
  • ASIC Application Specific Integrated Circuit
  • Figure 2 is a schematic diagram showing the planarization apparatus 1 in contact with the template 2 and the curable material on the substrate 3.
  • the substrate stage 6 is driven to move the substrate 3 directly below the template 2, and then the contact module 5 brings the template 2 closer to the substrate 3.
  • the substrate 3 may be brought closer to the template 2 by driving the substrate 3, or both the template 2 and the substrate 3 may be driven to bring the template 2 and the substrate 3 closer.
  • air pressure is applied to the side of the template 2 opposite the surface that will come into contact with the curable material on the substrate 3.
  • the contact module 5 continues to bring the template 2 closer to the substrate 3, gradually reducing the air pressure as contact is made.
  • the template 2 comes into contact with the curable material on the substrate 3 in a concentric pattern, and when it reaches the edge of the substrate, the contact module 5 stops descending and the air pressure drops to zero.
  • the contact module 5 stops suctioning the template 2 with air and retracts upward. This action releases the template 2 from the contact module 5, and the flat surface of the template 2 comes into complete contact with the curable material on the substrate 3, resulting in a state in which the flat surface of the template 2 conforms to the surface shape of the substrate 3 (contact state).
  • Figure 3 is a diagram illustrating the planarization process in the planarization device 1.
  • a process is described in which a curable material is dropped onto the entire surface of the substrate, and the curable material is brought into contact with the template 2 to planarize the curable material; however, the curable material on a partial area of the substrate 3 may also be brought into contact with the template 2 to planarize the curable material.
  • FIG. 3(A) shows the state after the curable material 20 has been supplied onto the substrate 3 and before the template 2 (flat surface 2a) is brought into contact with the curable material 20.
  • the substrate 3 is transported by a substrate stage 6 from below the applicator 10 to below the contact module 5.
  • the drive unit of the contact module 5 adjusts the distance between the substrate 3 and the template 2 so that the curable material 20 on the substrate 3 comes into contact with the template 2 (its flat surface 2a) (contact process).
  • Figure 3(B) shows the state in which the template 2 has been released from the contact module 5, with the flat surface 2a of the template 2 in complete contact with the curable material 20 on the substrate 3 and the flat surface 2a of the template 2 following the surface shape of the substrate 3.
  • the substrate stage 6 is driven to the curing position below the curing module 9.
  • the light source of the curing module 9 irradiates the curable material 20 on the substrate with curing energy via the template 2, thereby curing the curable material 20 (curing process).
  • the substrate stage 6 is driven to a position below the contact module 5, and the contact module 5 adjusts the distance between the substrate 3 and template 2 so that the template 2 is separated from the hardened curable material 20 on the substrate 3. Specifically, after the substrate stage 6 returns to below the contact module 5, the contact module 5 descends, and while checking the Z-direction position and force detection, air-sucks the template 2 again, raises the template 2, and peels it off from the substrate 3 (demolding process).
  • the substrate 3 is coated with a coating that prevents the curable material from peeling off, while the template 2 is coated with a coating that makes it easy to peel off the curable material.
  • an assist mechanism (not shown) is also provided from the substrate stage. During demolding, the assist mechanism from the substrate stage 6 pushes the template 2 to peel it off without directly touching the substrate 3.
  • FIG. 3(C) shows the state in which a planarizing layer made of the cured product of the curable material has been formed on substrate 3.
  • FIG. 4 is a diagram illustrating an example of a state in which a foreign object is present between the template 2 and the substrate 3. Specifically, this diagram shows a state in which the template 2 and the substrate 3 are in contact via the curable material 20, with a foreign object 30 also sandwiched between them.
  • the thickness of the curable material 20 at the time of contact is in the range of several tens to several hundreds of nanometers, and the foreign object 30 is, for example, on the order of ⁇ m, or a huge foreign object on the order of 100 ⁇ m.
  • the imaging unit 7 measures the interference fringes caused by contact between the template 2 and the substrate 3, making it possible to check for foreign objects 30 that exist between the template 2 and the substrate 3.
  • the imaging unit 7 may not be detected by foreign object detection using the imaging unit 7.
  • Measurement by the measurement sensor 8 can detect foreign matter that is larger than the thickness of the curable material 20, specifically, for example, several times the thickness of the curable material 20.
  • Foreign matter detection by the measurement sensor 8 involves, for example, measuring a clean (neat) substrate 3 without any foreign matter with the measurement sensor 8, and then measuring a clean (neat) template 2 after cleaning or other similar process in contact with the clean substrate 3, and using this as a reference (standard). Then, the substrate used in the planarization process in the media production process and the substrate used alone to check the quality of the planarization device 1 are measured, and multiple local measurements are taken even when the substrate and template are in contact. Then, by comparing the measurement results with the reference, it is possible to measure local changes, etc.
  • the differences between the undulations, warping, and steps of the substrate being compared and the clean substrate 3, as well as the differences when the substrate is in contact with the template 2, can be confirmed, and information on the presence or absence of foreign matter, its location, and its size can be obtained by confirming the difference between each of these differences.
  • the distance between the substrate being measured and the measurement sensor 8 changes depending on the relative position of the top base 11 and base 12, for example, due to temperature changes within the device, and the value of the measurement sensor 8 changes. Therefore, the change in value over the entire measurement surface is approximated to the first order and used as the difference from the reference.
  • checking the difference check for local changes within the substrate surface, and if necessary, re-measure areas that appear to have changed based on the difference results.
  • the meniscus force of the liquid hardenable material 20 applies a force in a direction that crushes the foreign matter, making it easy for the foreign matter to become smaller than the thickness of the hardenable material 20. If the foreign matter is smaller than the thickness of the hardenable material 20, it may not be detected by the measurement sensor 8.
  • Figure 5 illustrates an example of defects caused by foreign matter during the planarization process.
  • This figure shows the state after the curable material has been hardened in the curing module 9 and released from the mold. After release, the curable material 21 remains on the substrate 3, but foreign matter 30 or pieces of curable material 31 may adhere to the template 2 during release.
  • the area of the pieces of curable material 31 ranges from the sub-micron order to the millimeter order, and their thickness is equivalent to the height of the curable material 21.
  • the foreign matter 30 or pieces of curable material 31 can create recessed shapes 22a and 22b in the curable material 21, resulting in defects that can adversely affect the planarization of the substrate.
  • the foreign matter 30 or pieces of curable material 31 attached to the template 2 can cause similar recessed defects on other substrates 3 during the subsequent planarization process. Unless the foreign matter 30 or pieces of curable material 31 attached to the template 2 are peeled off from the template 2, they can cause defects in the substrate 3. As a result, defects can occur on multiple substrates 3.
  • the term "foreign matter” includes particles and pieces of hardenable material 31.
  • FIG. 6 is a diagram illustrating foreign object detection according to the first embodiment.
  • This figure shows the state in which the substrate stage 6 has been moved from the state shown in Figure 5 and the template 2 has been placed on the substrate 3 again.
  • the movement of the substrate stage 6 is a horizontal (XY) shift or rotational movement, and the amount of movement can be on the order of ⁇ m to several mm.
  • the substrate 3 and the template 2 are shifted relative to each other in the horizontal direction; in other words, the relative horizontal positions of the substrate 3 and the template 2 are changed.
  • This operation allows the positions of the recessed shapes 22a and 22b, which are defects in the curable material 21 caused by the foreign object 30 or the hardenable material piece 31, to be shifted from each other.
  • the hardenable material 21 is solid after curing, and no meniscus force acts on it. Therefore, the amount of deformation of the template 2 caused by the foreign object 30 or the hardenable material piece 31 is greater than when liquid hardenable material 20 is present between them, thereby improving the resolution of foreign object detection by the imaging unit 7. Therefore, for example, foreign matter as small as 100 nm in size can be detected by the imaging unit 7. In addition, detection by the measurement sensor 8 is also facilitated due to the large deformation of the template 2.
  • either the imaging unit 7 or the measurement sensor 8 may be used as the detection means for foreign object detection. Furthermore, after the position of the foreign object is confirmed based on the image captured by the imaging unit 7, the position where the foreign object was confirmed may be measured by the measurement sensor 8 to identify the size of the foreign object. In this case, it is possible to reduce the number of measurement points measured by the measurement sensor 8.
  • FIG. 7 shows an example of a foreign object detection flow during the planarization process according to the first embodiment.
  • Each operation (step) shown in this flowchart can be executed under the control of the control unit 13.
  • the applicator 10 applies (supplies) the curable material 20 to the entire surface of the substrate 3 (S110).
  • the substrate stage 6 then moves the substrate from below the applicator 10 to below the contact module 5, and the contact module 5 is lowered, bringing the curable material 20 on the substrate 3 into contact with the template 2 (its flat surface) (S111).
  • the template 2 and substrate 3 begin to come into contact from the center, and the template 2 is released from the contact module 5.
  • the substrate 3 and template 2 come into contact across the entire surface via the curable material 20, completing filling (S112).
  • the substrate stage 6 is moved to below the curing module 9, and curing energy is irradiated from the curing module 9 to harden the curable material 20 (S113).
  • the substrate stage 6 is moved below the contact module 5, and the template 2 is held by the contact module 5, and the curable material 21 on the template 2 and substrate 3 is peeled off (S114). This series of steps from S110 to S114 is called the planarization process (forming process).
  • the substrate stage 6 is moved slightly in the horizontal direction (X and Y directions) to change the horizontal relative position between the template 2 and the substrate 3 (S115). If the contact module 5 can be driven in the horizontal direction (X and Y directions), the contact module 5, or both the substrate stage 6 and the contact module 5, may be driven to change the horizontal relative position between the template 2 and the substrate 3.
  • the state of S116 is a state in which the template 2 is held by the contact module 5. In this state, an image is acquired by the imaging unit 7, or the template 2 is detached from the contact module 5 and then an image is acquired by the imaging unit 7, or the measurement sensor 8 measures the difference in height within the plane of the template 2 (S117).
  • the control unit 13 determines whether a foreign object has been detected (S118). That is, the control unit 13 acquires information on the presence or absence of a foreign object based on the image acquired by the imaging unit 7 or the measurement results of the measurement sensor 8. Specifically, if a change characteristic of a foreign object is observed in the image acquired by the imaging unit 7, such as interference fringes remaining after filling, or if a convex portion is confirmed from an approximate plane of the in-plane height in the measurement results of the measurement sensor 8, the control unit 13 determines that a foreign object is present (a foreign object has been detected) (Yes).
  • the control unit 13 calculates the foreign object's position and size within the surface of the template 2 to acquire information on the foreign object's position and size (S119). Thereafter, the template 2 is cleaned by removing the template 2 outside the apparatus and cleaning it, or by removing the foreign object from the surface of the template 2 using an adhesive substrate inside the apparatus, or by removing the foreign object using an air blow or air vacuum. Note that cleaning methods are not limited to these. By calculating the size and position of the foreign matter, it is possible to perform localized cleaning based on the calculated position and size of the foreign matter. This reduces the time required for cleaning. Note that cleaning outside the device takes time, so instead of cleaning outside the device, the template may be replaced (S120).
  • foreign matter detection (S115 to S118, detection process) may be performed, for example, at a predetermined interval, or when an abnormality such as a defect occurs during the planarization process. Foreign matter detection may also be performed within the process of checking the quality of the planarization device 1. When foreign matter detection is performed within the process of checking the quality of the planarization device 1, the planarization process is performed at least once before foreign matter detection is performed during the process of checking the quality of the planarization device 1.
  • FIG. 8 is a diagram illustrating foreign matter detection according to the second embodiment.
  • the template 2 and the curable material 21 on the substrate 3 are not brought into direct contact with each other, but are brought into contact via the liquid curable material.
  • FIG. 8 shows a state in which the substrate stage 6 is moved from the state shown in FIG.
  • the applicator 10 applies a curable material 40 onto the planarization layer (curable material 21) formed on the substrate 3, bringing the template 2 and the liquid curable material 40 on the substrate 3 into contact with each other.
  • the curable material 40 has a thickness thinner than the cured curable material 21.
  • the curable material 40 has a thickness of approximately 30 nm, which is preferably less than half the thickness of the cured curable material 21.
  • the height of the pieces of curable material 31 generated when the cured curable material 21 is released from the template can be considered to be the same as the height of the cured curable material 21, and is 100 nm, for example.
  • the template 2 and substrate 3 are in contact with uncured curable material 40, the amount of unevenness is reduced due to the meniscus force described above, so it is desirable to measure the top surface of the template 2 with a measurement sensor 8 that can measure with high precision.
  • FIG. 9 shows an example of a foreign object detection flow in a planarization process according to the second embodiment.
  • Each operation (step) shown in this flowchart can be executed under the control of the control unit 13.
  • Steps S110 to S114 in this embodiment are the same as steps S110 to S114 in FIG. 7 of the first embodiment, and therefore will not be described here.
  • a smaller amount of curable material than S110 is applied to the same substrate 3, i.e., the substrate 3 on which the planarization layer has been formed (S315).
  • the curable material is applied to a thickness thinner than S110.
  • contact (S316) and filling (S317) are performed again.
  • S316 and S317 are similar to S111 and S112, and therefore will not be described here.
  • steps similar to S117 to S120 in Figure 7 of the first embodiment are performed.
  • the template 2 comes into contact with the uncured curable material 40, thereby reducing damage to the template 2.
  • FIG. 10 is a diagram illustrating foreign matter detection according to the third embodiment. Specifically, this figure shows the state in which the substrate 3 in the state shown in FIG. 5 is replaced with another clean substrate 43, the curable material 40 is applied to the substrate 43 by the applicator 10, and the template 2 and the curable material 40 on the substrate 43 are brought into contact. As in FIG. 8 of the second embodiment, the curable material 40 is applied to a thickness thinner than the curable material 21 hardened during the planarization process of the substrate 3.
  • a measurement sensor 8 is used to measure multiple locations on the surface of the substrate 43, and the position and size of the foreign matter are identified from the unevenness within the substrate surface.
  • the foreign object detection flow in this embodiment is the same as in the second embodiment, so only the differences will be explained.
  • a separate substrate 43 different from substrate 3, is loaded into the device. Then, from S315 onwards, processing is carried out using substrate 43.
  • substrate 43 may also be an inspection substrate.
  • the template 2 and the substrate 43 are not brought into direct contact with each other, but are brought into contact via the curable material 40 on the substrate 43, thereby reducing damage to the template 2 or the substrate 43 that would otherwise occur if the template 2 and the substrate 43 were to come into direct contact with each other.
  • step S315 may be omitted. That is, the template 2 and the substrate 43 may be brought into direct contact. In this case, the deformation of the template 2 caused by a foreign object will be greater, making it easier to detect even smaller foreign objects.
  • FIG. 11 is a diagram showing an example of a foreign matter detection flow in a planarization process according to the fourth embodiment. Each operation (step) shown in this flowchart can be executed under the control of the control unit 13. Steps S110 to S119 in this embodiment are the same as those in FIG. 7 of the first embodiment.
  • the template 2 is cleaned inside the device. Thereafter, the template 2 is placed again on the substrate 3 that was once released, and foreign matter detection is performed. Specifically, if the location of the foreign matter attached to the template 2 can be identified, the foreign matter is locally removed using, for example, an air vacuum nozzle (not shown) on the substrate stage 6, and then foreign matter detection (S115 to S118) is performed again.
  • an air vacuum nozzle not shown
  • the template 2 can be checked immediately after cleaning, reducing downtime. Furthermore, running costs can be reduced by continuing to use the template 2 without replacing it.
  • the substrate stage 6, with the template 2 still on it, can be moved below the measurement sensor 8 and curing module 9, allowing the unevenness of the top surface of the template 2 to be measured and the curable material between the template 2 and the substrate 3 to be cured.
  • the above-described embodiment can also be applied to an imprinting apparatus that performs an imprinting process in which an imprinting material, which is a composition on a substrate, is brought into contact with a template (also called a mold) having a concave-convex pattern, thereby transferring the pattern of the template to the imprinting material.
  • a template also called a mold
  • the flow of the imprinting process is similar to steps S110 to S114 in Fig. 7, but in the case of the imprinting process, it is necessary to align the template and the substrate before the contact step (S111).
  • a pattern of a curable material may be formed on the substrate.
  • the pattern of the cured product formed using the imprinting apparatus is used permanently on at least a part of various articles, or temporarily when manufacturing various articles.
  • articles include electric circuit elements, optical elements, MEMS, recording elements, sensors, and templates (molds).
  • electric circuit elements include volatile or nonvolatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA.
  • templates include molds for imprinting.
  • the pattern of the cured product is used as is as at least part of the component of the above-mentioned article, or is used temporarily as a resist mask. After etching or ion implantation is performed during the substrate processing process, the resist mask is removed.
  • Figure 12 is a diagram for explaining the method for manufacturing an article.
  • a substrate 3z such as a silicon wafer is prepared on the surface of which a workpiece 2z such as an insulator is formed.
  • an imprint material 3z is applied to the surface of the workpiece 2z by an inkjet method or the like.
  • multiple droplets of the imprint material 3z are shown applied to the substrate.
  • the imprint template 4z is placed with the side on which the concave-convex pattern is formed facing the imprint material 3z on the substrate.
  • the substrate 3z to which the imprint material 3z has been applied is brought into contact with the template 4z, and pressure is applied.
  • the imprint material 3z fills the gap between the template 4z and the workpiece 2z. In this state, when light is irradiated through the template 4z as hardening energy, the imprint material 3z hardens.
  • the template 4z and substrate 3z are separated, forming a pattern of the cured imprint material 3z on the substrate 3z.
  • This cured material pattern has a shape in which the recesses of the template correspond to the protrusions of the cured material, and the protrusions of the template correspond to the recesses of the cured material.
  • the concave-convex pattern of the template 4z has been transferred to the imprint material 3z.
  • the present invention can also be realized by supplying a program that realizes one or more of the functions of the above-described embodiments to a system or device via a network or storage medium, and having one or more processors in the computer of that system or device read and execute the program. It can also be realized by a circuit (e.g., an ASIC) that realizes one or more functions.
  • a circuit e.g., an ASIC
  • a film forming apparatus for forming a film of a curable composition on a substrate, a template holder for holding a template having an area that contacts the curable composition on the substrate; a substrate holder for holding the substrate; a detection means for detecting foreign matter present between the template and the substrate while the template is in contact with the substrate or the curable composition on the substrate, after a film formation process in which the curable composition on the substrate is cured while in contact with the template and the template is peeled off to form a film of the curable composition, and
  • (Configuration 2) a drive unit that drives at least one of the template holding unit and the substrate holding unit; 2.
  • (Configuration 3) The film forming apparatus according to claim 2, wherein the control unit causes the drive unit to change the horizontal relative position between the template and the substrate after the film formation process has been performed at least once, and then causes the template to come into contact with the curable composition on the substrate.
  • (Configuration 4) a supply unit for supplying the curable composition,
  • the detection means includes a distance measuring sensor that measures a distance to a surface of the template opposite to a surface that comes into contact with the curable composition,
  • the film forming apparatus according to any one of configurations 2 to 4, characterized in that the control unit acquires at least one of information on the presence or absence of the foreign matter, information on the size of the foreign matter, and information on the position of the foreign matter based on the measurement results of the distance measuring sensor.
  • the detection means includes an imaging unit that acquires, as an image, an interference color generated by light reflected from the template and light reflected from the substrate;
  • the film forming apparatus according to any one of configurations 2 to 6, characterized in that the control unit acquires at least one of information on the presence or absence of the foreign matter, information on the size of the foreign matter, and information on the position of the foreign matter based on the image acquired by the imaging unit.
  • the region is a flat surface
  • the film forming apparatus according to any one of configurations 1 to 8, wherein the film forming apparatus is a planarization apparatus that forms a planarized film on the substrate by contacting the flat surface of the template with the curable composition on the substrate.
  • the region has a pattern to be transferred to the curable composition on the substrate; 9.
  • the film forming apparatus according to any one of configurations 1 to 8, wherein the film forming apparatus is an imprint apparatus that transfers the pattern to the curable composition on the substrate by bringing the pattern of the template into contact with the curable composition on the substrate.
  • a film-forming method for forming a film of a curable composition on a substrate comprising: a forming step of curing the curable composition on the substrate while the curable composition is in contact with a template, and then peeling the template and the curable composition to form a film of the curable composition; a detection step of detecting foreign matter between the template and the substrate while the template is in contact with the substrate or the curable composition on the substrate after the formation step;
  • a film forming method comprising:

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  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

Le présent dispositif de formation de film forme un film de composition durcissable sur un substrat. Le dispositif de formation de film comprend : une partie de maintien de gabarit qui maintient un gabarit ayant une région qui vient en contact avec une composition durcissable située sur un substrat ; une partie de maintien de substrat qui maintient le substrat ; et un moyen de détection qui détecte, après un processus de formation de film, une matière étrangère présente entre le gabarit et le substrat pendant que le gabarit est en contact avec le substrat ou la composition durcissable sur le substrat, le processus de formation de film consistant à faire durcir la composition durcissable située sur le substrat pendant que la composition durcissable est en contact avec le gabarit et à séparer le gabarit et la composition durcissable l'un de l'autre pour former un film de la composition durcissable.
PCT/JP2025/011941 2024-05-14 2025-03-26 Dispositif de formation de film, procédé de formation de film et procédé de fabrication d'article Pending WO2025239031A1 (fr)

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Citations (7)

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Publication number Priority date Publication date Assignee Title
JP2014033050A (ja) * 2012-08-02 2014-02-20 Toshiba Corp インプリントシステム及びインプリント方法
JP2015056589A (ja) * 2013-09-13 2015-03-23 キヤノン株式会社 インプリント装置、インプリント方法、検出方法及びデバイス製造方法
JP2016201522A (ja) * 2015-04-14 2016-12-01 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP2017050482A (ja) * 2015-09-04 2017-03-09 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP2017069272A (ja) * 2015-09-28 2017-04-06 キヤノン株式会社 インプリント装置、インプリント方法、異物検出方法および物品製造方法
JP2018156986A (ja) * 2017-03-15 2018-10-04 キヤノン株式会社 インプリント装置、欠陥検査方法、パターン形成方法および物品製造方法
JP2019029608A (ja) * 2017-08-03 2019-02-21 キヤノン株式会社 インプリント方法、インプリント装置、プログラム、異物除去方法および異物除去判定方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014033050A (ja) * 2012-08-02 2014-02-20 Toshiba Corp インプリントシステム及びインプリント方法
JP2015056589A (ja) * 2013-09-13 2015-03-23 キヤノン株式会社 インプリント装置、インプリント方法、検出方法及びデバイス製造方法
JP2016201522A (ja) * 2015-04-14 2016-12-01 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP2017050482A (ja) * 2015-09-04 2017-03-09 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP2017069272A (ja) * 2015-09-28 2017-04-06 キヤノン株式会社 インプリント装置、インプリント方法、異物検出方法および物品製造方法
JP2018156986A (ja) * 2017-03-15 2018-10-04 キヤノン株式会社 インプリント装置、欠陥検査方法、パターン形成方法および物品製造方法
JP2019029608A (ja) * 2017-08-03 2019-02-21 キヤノン株式会社 インプリント方法、インプリント装置、プログラム、異物除去方法および異物除去判定方法

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